Happy syspatching, and don't forget to show your appreciation by donating to the project.
Intel today unveiled “Intel AI: In Production,” a new program that makes it easier for developers to bring their artificial intelligence prototypes to market. Since its introduction last July, the Intel® Movidius™ Neural Compute Stick (NCS) has gained a developer base in the tens of thousands.
Press Kit: Intel Movidius
Once developers have a prototype, the next step is to take it into production, which can be challenging and costly for small companies and entrepreneurs. To make it easier, Intel selected AAEON Technologies*, a leading manufacturer of advanced industrial and embedded computing platforms, as the first Intel AI: In Production partner. Through the program, AAEON provides two streamlined production paths for developers integrating the low-power Intel® Movidius ™ Myriad™ 2 Vision Processing Unit (VPU) into their product designs.
The first option is the new AI Core from AAEON’s UP Bridge the Gap. It is a mini-PCIe module that features an Intel Movidius Myriad 2 VPU designed to work with a wide range of x86 host platforms. The AI Core delivers the low-power, high-performance capabilities of the Intel Movidius Myriad 2 VPU deep neural networks accelerator. It is also compatible with the Intel® Movidius™ Neural Compute SDK software suite already used by thousands of machine learning developers and companies worldwide.
For companies requiring further customization, AAEON offers development and board manufacturing services that will allow companies to move from Neural Compute Stick-based prototypes to custom boards in a streamlined manner.
“Intel AI: In Production means we can expect many more innovative AI-centric products coming to market from the diverse and growing segment of technologies utilizing Intel technology for low-power inference at the edge,” said Remi El-Ouazzane, Intel vice president and general manager of Intel Movidius.
“Intel Movidius Myriad 2 technology makes AI Core one of the most powerful and versatile AI hardware accelerators for edge computing,” said Fabrizio Del Maffeo, AAEON vice president, managing director of AAEON Technology Europe and founder of UP Bridge the Gap. “AI Core bridges the gap between the lab and volume production, allowing the innovators who adopted the Intel Movidius Neural Compute Stick to roll out a field deployment.”
Intel customers already are building products through the Intel AI: In Production program. The first is by CONEX*, a Diam International company and global leader in the design and creation of point-of-sale display systems for the cosmetics industry.
“Our innovation team started prototyping advanced retail deep learning algorithms and tested the Intel Movidius Neural Compute Stick,” said Nicolas Lorin, president of CONEX. “Now through the Intel AI: In Production program, CONEX will be able to rapidly go from our validated prototypes to actual end products. Thanks to this new path to production, we will be deploying an AI-enhanced, point-of-sale retail device to some of the largest cosmetic goods retailers as soon as this spring.”
Intel, the Intel logo, Movidius and Myriad are trademarks of Intel Corporation in the United States and other countries.
We have one message for IoT developers and integrators at this year’s Embedded World 2018: We are doing everything we can to help you prototype and develop your ideas faster and get your solutions to market sooner.
The Intel Internet of Things Group has been talking to a lot of developers and partners in the IoT ecosystem – and listening carefully. The result is we’ve completely revamped our roadmaps for developer tools and IoT solution resources to create a more seamless experience across the ecosystem.
Here is what we mean:
Intel will showcase Intel® FPGAs and Movidius™ Myriad™ 2 VPUs, components that provide power-efficient acceleration to critical edge applications. Our Exor Smart Factory 4.0 demo models an entire working industrial system using Intel FPGA devices for device control in edge-compatible formats. Myriad 2 gives developers immediate access to its advanced vision processing core, while allowing them to develop proprietary capabilities that provide true differentiation.
Richer Tools, Kits and SDKs
We have consolidated our tool offerings to streamline the development path from prototype to production by integrating new features and capabilities into Intel® System Studio 2018. This includes 400 sensors, enhanced debugger workflows, more libraries and code samples, improved data compression, and optimizations for small matrix multiplication. This new tool is a cross-platform system and IoT development tool suite to help simplify system bring-up, boost performance and power efficiency, and strengthen system reliability.
We worked with Arduino* to streamline commercial application prototypes based on Intel® architecture using Arduino Create* and added Intel-based hardware capabilities into its development suite. For professional capabilities, there is a bridge from Arduino Create directly into Intel System Studio 2018 for a seamless development experience, leveraging advanced functionality provided by Intel’s tools.
You can also accelerate designs with the UP Squared* Grove* IoT Development Kit. Easy to use and versatile, the kit offers a rapid prototyping platform for applications, including media encode/decode, signal and data processing, and machine learning.
Accelerating Development with Intel IoT RFP-Ready Kits
Request for proposal (RFP)-ready kits bundle hardware, middleware, software, sensors and support. These kits contain the core essentials an integrator needs to prototype quickly. They just require any unique differentiating features.
RFP-ready kits are focused on specific use cases, like visual retail, smart buildings, security surveillance and remote health care. The Advantech* RFP Kit, a solar panel that demonstrates Advantech’s UTX-3117 gateway combined with Wind River® Helix Device Cloud and Pulsar™ Linux*. This enables next-generation systems to process high volumes of data with low latency, high bandwidth and low power consumption.
Intel IoT Market-Ready Solutions
For fast deployments that are end user-ready, there are built-to-scale Market-Ready Solutions (MRS). Through our ecosystem partners, we are providing an extensive portfolio of proven, integrated and already-deployed MRSs. We are showing the new Dell* V5 Solution, a self-powered, portable artificial intelligence security solution that provides ongoing video monitoring and advanced analytics. The Hayward Police Department in California rapidly deployed these units to significantly reduce the number of downtown thefts and other downtown street crimes by over 60 percent.1
Connect with Intel at Embedded World 2018
Join us at the Intel booth at Embedded World (#338, Hall 1, Nuremberg Exhibition Center, Nuremberg, Germany) and learn how Intel will help drive innovation for the IoT through new hardware, software and tools for developers. Visit our Intel Developer Zone for IoT or the IoT Solutions Alliance for other resources and to get a jump-start on your next project.
Jonathan Luse is general manager of IoT Planning and Product Line Management at Intel Corporation.
Intel today announced it has begun shipping its Intel® Stratix® 10 TX FPGAs, the industry’s only field programmable gate array (FPGA) with 58G PAM4 transceiver technology. By integrating the FPGA with 58G PAM4 technology, Intel Stratix 10 TX FPGAs can double the transceiver bandwidth performance when compared to traditional solutions. This exceptional bandwidth performance makes the Intel Stratix 10 TX FPGAs the essential connectivity solution for next-generation use cases: optical transport networks, network function virtualization (NFV), enterprise networking, cloud service providers and 5G networks applications where high bandwidth is paramount.
More: Intel Stratix 10 TX FPGA
» Download all images (ZIP, 14 MB)
To facilitate the future of networking, NFV and optical transport solutions, Intel Stratix 10 TX FPGAs provide up to 144 transceiver lanes with serial data rates of 1 to 58 Gbps. This combination delivers a higher aggregate bandwidth than any current FPGA, enabling architects to scale to 100G, 200G and 400G delivery speeds. By supporting dual-mode modulation, 58G PAM4 and 30G NRZ, new infrastructure can reach 58G data rates while staying backward-compatible with existing network infrastructure. A wide range of hardened intellectual property (IP) cores, including 100GE MAC and FEC, deliver optimized performance, latency and power.
“In this smart and connected world, billions of devices are creating massive amounts of data that need faster, flexible and scalable connectivity solutions,” said Reynette Au, vice president of marketing, Intel Programmable Solutions Group. “With Stratix 10 TX FPGAs, Intel continues to provide architects with higher transceiver bandwidth and hardened IP to address the insatiable demand for faster and higher-density connectivity.”
Intel is shipping all Intel Stratix 10 FPGA family variants: Intel Stratix 10 GX FPGAs (with 28G transceivers), Intel Stratix 10 SX FPGAs (with embedded quad-core ARM* processor), Intel Stratix 10 MX FPGAs (with HBM memory) and the Stratix 10 TX FPGAs (with 58G transceivers). The Intel Stratix 10 FPGA family utilizes Intel’s 14 nm FinFET manufacturing process and incorporates state-of-the-art packaging technology, including EMIB.
Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. Check with your system manufacturer or retailer or learn more at www.intel.com.
Intel, the Intel logo and Stratix are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.