Navigating Intel’s Future in Technology and Computing

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Rich Uhlig, Intel senior fellow and managing director of Intel Labs, is shown in an Intel Labs workspace where neuromorphic computing is studied in Hillsboro, Oregon. (Credit: Walden Kirsch/Intel Corporation)
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Rich Uhlig, Intel senior fellow and managing director of Intel Labs, is shown with Intel Labs icon Robby the Robot in an Intel Labs workspace in Hillsboro, Oregon. (Credit: Walden Kirsch/Intel Corporation)
How he’d describe his job to a 10-year-old: “We explore the future.”

Digging out promising leads: Rich says the experts at Intel Labs – “We recruit the smartest people in key areas” – discover and research disruptive new forms of technology and computing, often through Intel’s academic investments. Rich and the 750 employees around the world who work with him then incubate the best ideas using Intel’s internal research and align them through a technology-transfer process to Intel’s business objectives. “We also alert the company when it’s time to pay attention to certain technology trends,” says Rich, whose areas of oversight include groundbreaking work on quantum, neuromorphic and probabilistic computing. “You need to have some kind of a disciplined way of teasing out the signal from the noise.”

More: Read about all Intel Innovators | Intel Labs (Press Kit)

Supporting customers inside and outside Intel’s walls: Inside Intel, Intel Labs experts provide business units and product teams with advanced technologies. Outside Intel, Rich says, experts from the labs often work with customers to lend expertise in specific technical areas. “This may help to secure a design win or to build confidence with customers that Intel has a deep technology pipeline out into the future,” he says. But Intel Labs’ outside work is more than just an added level of support. “We are also keen to play an active role in identifying new business opportunities for Intel,” he says. “As an example, we have a great collaboration with Intel Capital that we call ‘Start-up Pathfinding.’ The concept is that the labs identifies very early stage start-up companies that originate out of university research. When we find a promising start-up, we bring the opportunity to Intel Capital for early seed funding.”

Tapping a new kind of data: For years, Intel Labs researchers have recognized that data is not only exploding in quantity, but also changing in nature. “Data for many years has been about productivity data – spreadsheets, databases, Word docs, that kind of thing,” Rich says. “Then we went through a period of data increasingly becoming media-oriented and getting streamed out from centralized data centers.” But a few years ago, an entirely new class of data emerged. “We call it natural data. It’s getting collected out in the world from all the sensors that are blanketing the planet. We are carrying sensors in our pockets with our smart phones; cameras and microphones are getting embedded in the environments that we live and work. All that data collection creates new opportunities if we can manage to derive meaning and value from that data.”

His pro tip for a technology career: Rich, who has been at Intel for 23 years, offers this guidance for people moving into a tech career: “Most innovation comes at the intersection of domains. If you are an expert just in one specific area, the space is likely to be well explored. But if you work at the intersection of two or three areas, the probability that you’ll find something new is higher simply because there aren’t as many people or teams out there that can do the same.”

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16-Year-Old Engineer Works to Improve Spinal Surgery Using Machine Learning and Computer Vision

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PHOENIX, May 17, 2019 – Krithik Ramesh, 16, of Greenwood Village, Colorado, was awarded first place for developing a machine learning technology for orthopedic surgeons at this year’s Intel International Science and Engineering Fair (ISEF), a program of Society for Science & the Public. Intel ISEF is the world’s largest international pre-college science competition. The competition featured over 1,800 young scientists selected from 423 affiliate fairs in more than 80 countries, regions and territories.

Using machine learning and computer vision, the project helps orthopedic surgeons achieve greater accuracy for screw placement during spinal surgery. Based on Ramesh’s tests, this method has the potential to decrease operating time by at least 30 minutes, reduce physical therapy recovery time by four weeks and diminish the negative side effects associated with traditional medical imaging. Ramesh received the $75,000 Gordon E. Moore Award, named in honor of the Intel co-founder and fellow scientist.

Press Kit: Intel International Science and Engineering Fair 2019: Inspiring the Next Generation of Innovators

Allison Jia, 17, of San Jose, California, received one of two Intel Foundation Young Scientist Awards of $50,000 for her investigation into toxic tau protein aggregates, which spread in neurons in the human brain and are associated with neurodegenerative diseases such as Alzheimer’s.

Rachel Seevers, 17, of Lexington, Kentucky, received the other Intel Foundation Young Scientist Award of $50,000 for designing, building and testing a rigid, energy-efficient prototype of an underwater propulsion device that mimics the way jellyfish move through the water. This could allow for greater access to the world’s unexplored oceans.

Shriya Reddy, 15, of Northville, Michigan, received the newly announced $10,000 Craig R. Barrett Award for Innovation, funded through Society for Science and the Public, for her novel, noninvasive approach for rapidly diagnosing melanoma lesions.

“Intel is proud to honor Krithik Ramesh, Rachel Seevers, Allison Jia, Shriya Reddy and all of the ISEF finalists on their innovative work, which is helping to advance key research areas and provide solutions to global challenges that are critical today. The work they are doing has the potential to make a better tomorrow for all of us,” said Pia Wilson-Body, president of the Intel Foundation. “And I would be remiss if I didn’t highlight the communities of support surrounding these students every day: parents, teachers, mentors, administrators, supporters and organizations like SSP who provide opportunities for students to engage and explore the world of STEM, and ultimately reach their full potential.”

In addition to the top winners, approximately 600 finalists received awards and prizes for their innovative research, including 22 “Best of Category” winners, who each received a $5,000 prize in addition to their $3,000 first-place award. The Intel Foundation also awarded a $1,000 grant to each winner’s school and to the affiliated fair they represent.

The following lists the 22 Best of Category winners, from which the top three were chosen:

  • Animal Sciences: Dylan Bagnall and Richard Beattie, Dublin, Ireland
  • Behavioral and Social Sciences: Giovanni Santucci, Ossining, New York
  • Biochemistry: Annika Morgan, Redding, Connecticut
  • Biomedical and Health Sciences: Shriya Reddy, Northville, Michigan
  • Biomedical Engineering: Krithik Ramesh, Greenwood Village, Colorado
  • Cellular and Molecular Biology: Allison Jia, San Jose, California
  • Chemistry: Helena Jiang, Gainesville, Florida
  • Computational Biology and Bioinformatics: Jason Ping, Hackensack, New Jersey
  • Earth and Environmental Sciences: Katie Lu, Springfield, Missouri
  • Embedded Systems: Max von Wolff, Mayen, Germany
  • Energy: Chemical: Shicheng Hu, Shanghai, China
  • Energy: Physical: Joonyoung Lee and Mincheol Park, Busan, South Korea
  • Engineering Mechanics: Rachel Seevers, Lexington, Kentucky
  • Environmental Engineering: Adyant Shankar, Nashua, New Hampshire
  • Materials Science: Adrien Jathe, Frankfurt, Germany
  • Mathematics: AnaMaria Perez, Albuquerque, New Mexico
  • Microbiology: Poojan Pandya and Leo Takemaru, Dix Hills and East Setauket, New York
  • Physics and Astronomy: Kaylie Hausknecht, Lynbrook, New York
  • Plant Sciences: Amara Ifeji, Bangor, Maine
  • Robotics and Intelligent Machines: Kevin Meng, Plano, Texas
  • Systems Software: Adam Kelly, Dublin, Ireland
  • Translational Medical Science: Hannah Herbst, Boca Raton, Florida

“The Intel International Science and Engineering Fair is the world’s most powerful STEM talent pipeline and I am inspired by all of the ingenuity on display this week,” said Maya Ajmera, president and CEO of Society for Science & the Public and publisher of Science News. “Congratulations to our winners and all our finalists who are demonstrating that world-changing ideas can come from anywhere in the world.”

The Intel International Science and Engineering Fair provides opportunities for students to explore their passion for developing innovations that improve the way we work and live. All finalists are selected by an affiliated, local competition and receive an all-expenses-paid trip to the Intel International Science and Engineering Fair in Phoenix. At the competition, finalists are judged by hundreds of science, engineering and industry professionals who have a Ph.D. or equivalent (six years of related professional experience) or are senior graduate students with doctoral-level research in one of the 22 scientific disciplines above.

A full listing of finalists is available in the event program. The Intel International Science and Engineering Fair 2019 is funded jointly by Intel and the Intel Foundation with additional support from dozens of corporate, academic, government and science-focused sponsors. This year, approximately $5 million was awarded.

About the Society
Society for Science & the Public is dedicated to the achievement of young scientists in independent research and to public engagement in science. Established in 1921, Society is a nonprofit whose vision is to promote the understanding and appreciation of science and the vital role it plays in human advancement. Through its world-class competitions, including the Regeneron Science Talent Search, the Intel International Science and Engineering Fair, and the Broadcom MASTERS, and its award-winning magazine, Science News and Science News for Students, Society for Science & the Public is committed to inform, educate, and inspire. Learn more at www.societyforscience.org and follow us on Facebook, Twitter, Instagram and Snapchat (Society4Science).

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DUG Selects Intel to Build Its Latest Cloud-Based Supercomputer Tailored for Oil and Gas Exploration

DownUnder GeoSolutions* (DUG) on Thursday announced its new Intel-based high-performance computing (HPC) system tailored for the geophysics community. The system was unveiled in a ceremony that took place at the Skybox* Houston data center, where the supercomputer will be housed.

Harnessing the power of Intel technology, the 250 petaflop (single-precision) supercomputer, known as “Bubba,” will join other DUG data centers around the world to form DUG’s McCloud service — a global network of cloud-based high-performance computing systems used by the oil and gas industry for geophysics research and exploration.

The supercomputers that make up the DUG McCloud global network feature over 40,000 Intel® Xeon® processor-based nodes, and are some of the most powerful, energy-efficient HPC systems in the world that are optimized for geophysical research. Geophysical research relies heavily on advanced computing resources to obtain a more detailed picture of the earth’s subsurface. Intel Xeon processors deliver companies like DUG highly optimized computing, artificial intelligence and analytics capabilities for advanced simulation and modeling.

Like other supercomputers in the DUG McCloud global network, Bubba is housed in a purpose-built facility that leverages immersive cooling technology. The computing nodes are submerged in more than 700 specially designed tanks filled with polyalphaolefin dielectric fluid. The facility features 10 20-foot tall cooling towers with over 13 miles of pipes to cool the system.

More: All Intel Images | High-Performance Computing (Intel.com)

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2018-19 Intel Corporate Responsibility Report: Creating Value through Transparency

suzanne fallender 01By Suzanne Fallender

In the two decades that Intel has been releasing environmental and corporate social responsibility (CSR) reports, the CSR reporting landscape has changed dramatically. Once a topic reserved for specialists, today 85% of S&P 500 companies1 regularly publish CSR reports and many reporters cover CSR for major media organizations.

Today, Intel released its latest CSR report, highlighting the progress made over the past year toward our 2020 goals. But do these reports really matter?

Intel’s Corporate Responsibility Report: Highlights (Fact Sheet) | Full Report (Intel.com)

We at Intel think they do – more than ever, in fact – because of how important they are to our stakeholders, including investors, customers and employees. These groups demand more accountability than ever, and companies have an obligation to be transparent with them.

Investors

Investors are increasingly focused on environmental, social and governance (ESG) issues. From 2016 to 2018, sustainable investment assets – including portfolios screened for ESG issues, investors integrating ESG factors into their investment and/or engaging in shareholder advocacy activities – grew 38 percent in the U.S. As of 2018, such assets totaled $12 trillion, accounting for $1 of every $4 under professional management.2 This increase is largely driven by mainstream investors integrating ESG issues into their strategies.

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At Intel, we have expanded our year-round outreach to investors on ESG issues to obtain regular feedback on our reporting and performance. In response, we aligned our reporting to new external frameworks used most by investors, further increased integration across our annual report/10-K, proxy statement and corporate responsibility report and expanded disclosure on how our approach affects our financial results. For example, since 2012 we have invested more than $200 million in energy conservation projects in our global operations, resulting in more than 4 billion kilowatt-hours conserved and approximately $500 million saved through the end of 2018.

Customers

More companies are driving responsibility programs throughout their global supply chains and looking for improved data to help them evaluate supplier performance. Intel’s major customers are other large global companies that have their own commitments to corporate responsibility and sustainability, including formal supplier expectations. Our report helps them quantify their indirect environmental footprint and better understand how possible labor risks are assessed in the extended supply chain. We earned a leadership score in CDP’s 2018 Supplier Engagement Rating for our work to encourage improved climate and water reporting by our suppliers. We also made significant progress toward our goal to restore 100 percent of our global water use by 2025, and we’re on track to achieve our 2020 water-use reduction goal. Also, as a result of our work to prevent forced and bonded labor in our supply chain, our suppliers have returned over $14 million in fees to workers since 2014.

Employees

Research indicates that an employer’s corporate responsibility reputation and programs are often very important to employees. Intel’s success depends on our ability to attract and retain top talent by making Intel an employer of choice and fostering a strong and inclusive culture. In 2018, we reached full representation in our U.S. workforce, two years ahead of our original goal. And in early 2019, Intel achieved global gender pay equity. Eighty-five percent of our employees surveyed reported that Intel’s corporate responsibility efforts contribute to their pride in the company. And our employees are more involved in their communities than ever, with 68,000 employees volunteering 1.5 million hours last year.

For CSR reporting to serve our investors, customers and employees well, we must get the right data to the right audiences at the right time. This requires use of technology to enable real-time data collection, insights and reporting, and it requires processes such as independent report assurance, to improve data quality, reliability and comparability. It requires further integration with financial reporting teams to ensure alignment to the business and relevance to investors. And, most importantly, it requires ongoing conversations with stakeholders as their needs evolve.

Intel’s leaders believe in the value of transparency to our key stakeholders, and these reports are a critical part of that transparency. As we work toward our next generation of corporate responsibility and sustainability goals, we will continue to work to make our CSR reporting better, timelier and more useful, and we hope that others companies do the same.

Suzanne Fallender is director of Corporate Responsibility at Intel Corporation.

1 Governance and Accountability Institute

2 US SIF Foundation, Report on U.S. Sustainable, Responsible, and Impact Investing Trends 2018.

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Intel Drives Innovation across the Software Stack with Open Source for AI and Cloud

osts 19 logoWhat’s New: Intel is hosting the annual Open Source Technology Summit (OSTS) May 14-16. What started as an internal conference in 2004 with a few dozen engineers now brings together 500 participants. This year is the most open yet, with leaders from Alibaba*, Amazon*, AT&T*, Google*, Huawei*, JD.com*, Microsoft*, MontaVista*, Red Hat*, SUSE* and Wind River* taking part in discussions of open source software that is optimized for Intel hardware and will drive the next generation of data-centric technology in areas such as containers, artificial intelligence (AI), machine learning and other cloud to edge to device workloads.

“OSTS is at its heart a technology conference, and it’s the depth of technical content, engineering engagement and community focus that make the summit so valuable. This year we’re open-sourcing our open source summit, inviting customers, partners and industry stakeholders for the first time. I’m excited by the opportunity to connect the community with the amazing people who are driving open source at Intel.”
–Imad Sousou, Intel corporate vice president and general manager of System Software Products

The Details: The latest contributions Intel is sharing at OSTS represent critical advances in:

  • Modernizing core infrastructure for uses well-suited to Intel architecture
  • ModernFW Initiative has the goal to remove legacy code and modularize design for scalability and security. By delivering just enough code to boot the kernel, this approach can help reduce exposure to security risks and help ensure management is easier for users.
  • rust-vmm offers a set of common hypervisor components, developed by Intel with industry leaders including Alibaba, Amazon, Google and Red Hat to deliver use-case specific hypervisors. Intel has released a special-purpose cloud hypervisor based on rust-vmm with partners to provide a more secure, higher performance container technology designed for cloud native environments.
  • Intel is also committing to advancing critical system infrastructure projects by assigning developers to contribute code, as well as incorporating our “0-day Continuous Integration” best practices to technologies beyond the Linux* kernel. Projects Intel plans to contribute to include (but are not limited to) bash*, chrony*, the Fuzzing Project*, GnuPG*, libffi*, the Linux Kernel Self Protection Project*, OpenSSH*, OpenSSL* and the R* programming language.
  • Enhancing Intel Linux-based solutions for developers and partners: Intel’s Clear Linux* Distribution is adding Clear Linux Developer Edition, which includes a new installer and store, bringing together toolkits to give developers an operating system with all Intel hardware features already enabled. Additionally, Clear Linux usages are expanding to provide end-to-end integration and optimization for Intel hardware features and key workloads supporting the Deep Learning and Data Analytics software stacks. The performance, security, ease-of-use and customization advantages make Clear Linux a great choice for Linux developers.
    • The Deep Learning Reference Stack is an integrated, highly-performant open source stack optimized for Intel® Xeon® Scalable Processors. This stack includes Intel® Deep Learning Boost (Intel DL Boost) and is designed to accelerate AI use cases such as image recognition, object detection, speech recognition and language translation.
    • The Data Analytics Reference Stack was developed to help enterprises analyze, classify, recognize and process large amounts of data built on Intel® Xeon® Scalable platforms using Apache Hadoop and Apache Spark*.
  • Enabling new usages across automotive and industrial automation: In a world where functional safety is increasingly important, workload consolidation is both complex and critical. And with the growing reliance on software-defined systems, virtualization has never been more important. Intel is working to transform the software-defined environment to support a mix of safety critical, non-safety critical and time critical workloads to help support automotive, industrial automation and robotics uses.
    • Fusion Edge Stacks support the consolidated workloads that today’s connected devices demand using the ACRN* device hypervisor, Clear Linux OS, Zephyr Project* and Android*.
    • The Intel Robot SDKbrings together the best of Intel hardware and software in one resource, simplifying the process of creating AI-enabled robotics and automation solutions, with an optimized computer vision stack.

    Why It Matters: Open source powers the software-defined infrastructure that transformed the modern data center and ushered in the data-centric era. Today, the vast majority of the public cloud runs on open source software; new contributions by Intel are poised to drive a future where everything is software-defined, including new areas such as automotive, industrial and retail.

    With more than 15,000 software engineers, Intel invests in software and the work on standards initiatives to optimize the workload and to unlock the performance of our processors. In addition to significant contributions to the Linux kernel, Chromium OS* and OpenStack*, Intel’s leadership in the open source community drives industry advancement that fuel new models for hardware and software interaction in emerging workloads.

    Intel is in a unique position to bring together key industry players to address the complexity of building for diverse architectures and workloads and enable faster deployments of new innovations at scale. Software is a key technology pillar for Intel to fully realize the advancements in architecture, process, memory, interconnect and security.

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    Media Alert: Student Innovators Compete at Intel ISEF for More Than $5 Million in Awards and Scholarships

    ISEF Parikh

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    WHAT: The Intel International Science and Engineering Fair (Intel ISEF), a program of Society for Science & the Public and the world’s largest international pre-college science competition, will take place in Phoenix from May 12 to 17.
    • More than 1,800 high school students selected from 423 affiliate fairs in 80 countries, regions and territories will showcase cuttingedge research and inventions.
    • Finalists will compete for approximately $5 million in awards and scholarships.
    • The full list of finalists is available in the event program. This year, 21 finalists are from the local Phoenix area.

    Media must be registered to attend. To register, reach out to the contact listed below.

    WHEN: Public Exhibition of Projects

    Thursday, May 16, from 9 a.m.-1 p.m. MST

    This is the best opportunity for registered media to see, interview, film and photograph students from across the country and the world who are working to find solutions to global challenges through science, technology, engineering and math research. This year, research topics range from autonomous vehicles to 3D printing to machine learning.

    Awards Ceremony

    Friday, May 17, from 9 a.m.-11:30 a.m. MST

    Registered media representatives are invited to attend the awards ceremony where the winners will be announced. The top prizes awarded by the Intel Foundation include the $75,000 Gordon E. Moore Award, named after the Intel co-founder and fellow scientist. Two additional top winning projects will receive Intel Foundation Young Scientist Awards of $50,000 each.

    WHO: Maya Ajmera, president and CEO of Society for Science & the Public and publisher of Science News

    Pia Wilson-Body, president of the Intel Foundation

    WHERE: Phoenix Convention Center
    100 N. 3rd St., Phoenix, AZ 85004
    QUOTES: “Overcoming the challenges facing our world requires a variety of perspectives – including young minds that understand the value of curiosity and have a deep passion for learning,” said Pia Wilson-Body, president of the Intel Foundation. “By using science and innovation to further our collective understanding of the world, the students at the Intel International Science and Engineering Fair are building the foundation for a brighter tomorrow.”

    “The Intel International Science and Engineering Fair brings together students from different backgrounds, geographic locations and life experiences, demonstrating how these unique perspectives are essential to uncovering solutions to our world’s most intractable challenges,” said Maya Ajmera, president and CEO of Society for Science & the Public and publisher of Science News. “The amazing ideas showcased here are a testament to the power of science and education to make the world a better place.”

    MORE: For information on Intel’s commitment to education, visit Intel’s Corporate Social Responsibility page and join the conversation on Facebook and Twitter.

    To learn more about Society for Science & the Public, visit its website, and follow the group on Facebook, Twitter, Instagram and Snapchat at Society4Science.

    Find images, videos and other news from the 2019 Intel ISEF on the Intel Newsroom’s 2019 ISEF Press Kit.

    CONTACT: To schedule interviews, contact Jill Nishida, AxiCom for Intel, 415-430-8279, Jill.Nishida@axicom.com; or Gayle Kansagor, Society for Science & the Public, 703-489-1131. To register for the event, contact Aparna Paul, Society for Science & the Public, apaul@societyforscience.org.

     

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    Intel CEO Commits to Lead Tech Inflections, Play Bigger Role in Customer Success, Focus on Profitability

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    Wall Street analysts gathered at Intel headquarters in Santa Clara, California, today for the company’s 2019 Investor Meeting, which featured executive keynotes by Intel CEO Bob Swan and business unit leaders.

    Swan said demand for the analysis, transmission and storage of data is growing at a faster rate than at any time in history. He cited Intel’s unmatched collection of assets as key to winning share in a nearly $300 billion total addressable market (TAM) for silicon by 2023.Intel estimates the creation of data is increasing 25 percent each year, driving a 50 percent compound annual growth rate (CAGR) in demand for computing.

    “We are very focused on leading technology inflections that will accelerate and create demand for data – AI, 5G and autonomous,” Swan said. “We believe in an expanded market opportunity we can play a bigger role in the success of our customers. Our emphasis is on improving execution, accelerating innovation and evolving our strong culture while making disciplined investments in pursuit of profitable growth.”

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    “We believe in an expanded market opportunity we can play a bigger role in the success of our customers,” says Intel CEO Bob Swan at the 2019 Intel Investor Meeting on Wednesday, May 8, 2019, in Santa Clara, California. “Our emphasis is on improving execution, accelerating innovation and evolving our strong culture while making disciplined investments in pursuit of profitable growth.” (Credit: Intel Corporation)
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    Extending Product leadership for the Data-centric Era: Intel has redefined its product innovation model for the data-centric era of computing, which requires workload-optimized platforms and effortless customer and developer innovation. Intel discussed products like the 2019 “Lakefield” hybrid CPU that showcases Intel’s differentiated design capabilities, and said the company’s pace of innovation was increasing.

    Intel’s Data Center Group expects to introduce a new Intel® Xeon® product every four to five quarters with plans to ship a 10nm-based “Ice Lake” server CPU in the first half of 2020. In the PC-centric business, Intel discussed several products in flight including “Tiger Lake,” a 10nm-based CPU planned for 2020 that will feature a new CPU core architecture, an Intel Xe graphics engine, support for the latest display technology and more.

    With a range of 10nm-based products planned for 2019 and 2020, Intel’s 7nm process is also well underway. Intel’s first 7nm-based product, an Intel XArchitecture-based GP-GPU for data center artificial intelligence (AI) and high-performance computing (HPC), is expected to launch in 2021.

    » 2019 Investor Meeting: Intel Previews Design Innovation; 10nm CPU Ships in June; 7nm Product in 2021

    Leading Technology Inflections: The opportunity to turn data into business value is driving key technology inflections that Intel aims to lead like AI, 5G network infrastructure and autonomous driving.

    • AI is a fast-growing workload, especially in the data center. Intel estimates the TAM for AI silicon in the data center is growing at a 25 percent CAGR and is expected to reach $10 billion by 2023. In 2018, Intel captured roughly 40 percent of the current estimated $4 billion data center AI silicon opportunity, achieving $1.7 billion in AI revenue. The company aims to expand its prospects with an exciting range of AI-optimized products including the new 2nd Gen Intel® Xeon® Scalable processor, programmable solutions and purpose-built chips like the forthcoming Intel® Nervana™ Neural Network Processors.
    • 5G will usher in the convergence of computing and communications in the network and at the network edge. Intel estimates the TAM for silicon in the network and edge (including network silicon, internet of things and autonomous cars) will grow to $65 billion by 2023. In 2018, Intel’s revenue associated with this grew more than 20% to $9.5 billion.
    • Autonomous driving is another major tech inflection that Intel is poised to lead by building on Mobileye’s strong momentum in advanced driver-assistance systems (ADAS). Mobileye CEO Professor Amnon Shashua told investors that in addition to providing the technology to safely power autonomous cars, Mobileye is pursuing new revenue streams including the monetization of mapping dataand mobility-as-a-service. Shashua said, “Transportation as a service, enabled by robotaxis, is a game changer for mobility, and I’m here to tell you that we plan to go all in on the global robotaxi opportunity.” You can learn more in this video:

    Additional Investor Meeting Information: Intel described a three-year financial plan to achieve 2021 total revenue between $76 billion and $78 billion while growing free cash flow and reducing spending. The company also signaled its ambition to achieve $85 billion in total revenue by 2022-2023.

    Presentations from today’s meeting will be posted on Intel’s Investor Relations website.

    The Small Print:

    1Intel calculated 2023 total addressable market opportunities derived from industry analyst reports and internal estimates.

    Forward-Looking Statements: Intel’s financial plan and other statements in this release that refer to future plans and expectations, including with respect to Intel’s future technologies and the expected benefits of such technologies, are forward-looking statements that involve a number of risks and uncertainties. Words such as “anticipates,” “expects,” “intends,” “goals,” “plans,” “believes,” “seeks,” “estimates,” “continues,” “may,” “will,” “would,” “should,” “could,” and variations of such words and similar expressions are intended to identify such forward-looking statements. Statements that refer to or are based on estimates, forecasts, projections, uncertain events or assumptions, including statements relating to total addressable market (TAM) or market opportunity, future products and the expected availability and benefits of such products, and anticipated trends in our businesses or the markets relevant to them, also identify forward-looking statements. Such statements are based on current expectations and involve many risks and uncertainties that could cause actual results to differ materially from those expressed or implied in these forward-looking statements. Important factors that could cause actual results to differ materially from the company’s expectations are set forth in Intel’s most recent earnings release dated April 25, 2019, which is included as an exhibit to Intel’s Form 8-K furnished to the SEC on such date. Additional information regarding these and other factors that could affect Intel’s results is included in Intel’s SEC filings, including the company’s most recent reports on Forms 10-K and 10-Q. Copies of Intel’s Form 10-K, 10-Q and 8-K reports may be obtained by visiting our Investor Relations website at www.intc.comor the SEC’s website at www.sec.gov.

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    2019 Investor Meeting: Intel Previews Design Innovation; 10nm CPU Ships in June; 7nm Product in 2021

    intel investors renduchintala
    Dr. Murthy Renduchintala, Intel’s chief engineering officer and group president of the Technology, Systems Architecture and Client Group, speaks at the 2019 Intel Investor Meeting on Wednesday, May 8, 2019, in Santa Clara, California. (Credit: Intel Corporation)
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    Today, Wall Street analysts are gathered at Intel headquarters in Santa Clara for the company’s 2019 Investor Meeting, which features executive keynotes by Intel CEO Bob Swan and business unit leaders. At the meeting, Dr. Murthy Renduchintala, Intel’s chief engineering officer and group president of the Technology, Systems Architecture and Client Group, announced that Intel will start shipping its volume 10nm client processor in June and shared first details on the company’s 7nm process technology. Renduchintala said Intel has redefined its product innovation model for the data-centric era of computing, which “requires workload-optimized platforms and effortless customer and developer innovation.” He shared expected performance gains resulting from a combination of technical innovations across six pillars – process and packaging, architecture, memory, interconnect, security and software – giving insight into the design and engineering model steering the company’s product development.

    More: Intel Investor Relations Website

    “While process and CPU leadership remain fundamentally important, an extraordinary rate of innovation is required across a combination of foundational building blocks that also include architecture, memory, interconnect, security and software, to take full advantage of the opportunities created by the explosion of data,” Renduchintala said. “Only Intel has the R&D, talent, world-class portfolio of technologies and intellectual property to deliver leadership products across the breadth of architectures and workloads required to meet the demands of the expanding data-centric market.”

    10nm Process Technology: Intel’s first volume 10nm processor, a mobile PC platform code-named “Ice Lake,” will begin shipping in June. The Ice Lake platform will take full advantage of 10nm along with architecture innovations. It is expected to deliver approximately 3 times faster wireless speeds, 2 times faster video transcode speeds, 2 times faster graphics performance, and 2.5 to 3 times faster artificial intelligence (AI) performance over previous generation products1. As announced, Ice Lake-based devices from Intel OEM partners will be on shelves for the 2019 holiday season. Intel also plans to launch multiple 10nm products across the portfolio through 2019 and 2020, including additional CPUs for client and server, the Intel® Agilex™ family of FPGAs, the Intel® Nervana™ NNP-I (AI inference processor), a general-purpose GPU and the “Snow Ridge” 5G-ready network system-on-chip (SOC).

    Building on a model proven with 14nm that included optimizations in 14+ nm and 14++ nm, the company will drive sustained process advancement between nodes and within a node, continuing to lead the scaling of process technology according to Moore’s Law. The company plans to effectively deliver performance and scaling at the beginning of a node, plus another performance improvement within the node through multiple intra-node optimizations within the technology generation.

    7nm Status:  Renduchintala provided first updates on Intel’s 7nm process technology that will deliver 2 times scaling and is expected to provide approximately 20 percent increase in performance per watt with a 4 times reduction in design rule complexity. It will mark the company’s first commercial use of extreme ultraviolet (EUV) lithography, a technology that will help drive scaling for multiple node generations.

    The lead 7nm product is expected to be an Intel Xe architecture-based, general-purpose GPU for data center AI and high-performance computing. It will embody a heterogeneous approach to product construction using advanced packaging technology. On the heels of Intel’s first discrete GPU coming in 2020, the 7nm general purpose GPU is expected to launch in 2021.

    renduchintala presentation 1 1

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    Heterogeneous Integration for Data-Centric Era: Renduchintala previewed new chip designs that leverage advanced 2D and 3D packaging technology to integrate multiple intellectual property (IP), each on its own optimized process technology, into a single package. The heterogeneous approach allows new process technologies to be leveraged earlier by interconnecting multiple smaller chiplets, and larger platforms to be built with unprecedented levels of performance when compared to non-monolithic alternatives.

    Renduchintala unveiled the performance gains that resulted from innovative development of the client platform code-named “Lakefield”.  The approach is symbolic of the strategic shift in the company’s design and engineering model that underpins Intel’s future product roadmaps. To meet customer specifications, a breadth of technical innovations including a hybrid CPU architecture and Foveros 3D packaging technology were used to meet always-on, always-connected and form-factor requirements while simultaneously delivering to power and performance targets. Lakefield is projected to deliver approximately 10 times SOC standby power improvement and 1.5 to 2 times active SOC power improvement relative to 14nm predecessors, 2 times graphics performance increases2, and 2 times reduction in printed-circuit-board (PCB) area, enabling OEMs to have more flexibility for thin and light form factor designs.

    Performance results are based on testing as of dates shown in configuration and may not reflect all publicly available security updates.  See configuration disclosure for details.  No product or component can be absolutely secure.  Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.   For more complete information visit www.intel.com/benchmarks.  

    Optimization Notice: Intel’s compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.

    Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. Check with your system manufacturer or retailer or learn more at intel.com.

    1Ice Lake configuration disclosures:

    Approximately 3x Ice Lake Wireless Speeds: 802.11ax 2×2 160MHz enables 2402Mbps maximum theoretical data rates, ~3X (2.8X) faster than standard 802.11ac 2×2 80MHz (867Mbps) as documented in IEEE 802.11 wireless standard specifications and require the use of similarly configured 802.11ax wireless network routers.

    Approximately 2x Ice Lake Video Encode: Based on 4k HEVC to 4k HEVC transcode (8bit). Intel preproduction system, ICL 15w compared to WHL 15w.  

    Approximately 2x Ice Lake Graphics Performance:  Workload: 3DMark11 v 1.0.132. Intel PreProduction ICL U4+2 15W Configuration (Assumptions):, Processor: Intel® Core™ i7 (ICL-U 4+2) PL1=15W TDP, 4C8T, Memory: 2x8GB LPDDR4-3733 2Rx8, Storage: Intel® 760p m.2 PCIe NVMe SSD with AHCI Microsoft driver, Display Resolution: 3840×2160 eDP Panel 12.5”, OS: Windows* 10 RS5-17763.316, Graphics driver: PROD-H-RELEASES_ICL-PV-2019-04-09-1006832. Vs config – Intel PreProduction WHL U4+2 15W Configuration (Measured), Processor: Intel® Core™ i7-8565U (WHL-U4+2) PL1=15W TDP, 4C8T, Turbo up to 4.6Ghz, Memory: 2x8GB DDR4-2400 2Rx8, Storage: Intel® 760p m.2 PCIe NVMe SSD with AHCI Microsoft driver, Display Resolution: 3840×2160 eDP Panel 12.5”, OS: Windows* 10 RS4-17134.112., Graphics driver: 100.6195

    Approximately 2.5x-3x Ice Lake AI Performance: Workload: images per second using AIXPRT Community Preview 2 with Int8 precision on ResNet-50 and SSD-Mobilenet-v1 models. Intel preproduction system, ICL-U, PL1 15w, 4C/8T, Turbo TBD, Intel Gen11 Graphics, GFX driver preproduction, Memory 8GB LPDDR4X-3733, Storage Intel SSD Pro 760P 256GB, OS Microsoft Windows 10, RS5 Build 475, preprod bios. Vs. Config – HP spectre x360 13t 13-ap0038nr, Intel® Core™ i7-8565U, PL1 20w, 4C/8T, Turbo up to 4.6Ghz, Intel UHD Graphics 620, Gfx driver 26.20.100.6709, Memory 16GB DDR4-2400, Storage Intel SSD 760p 512GB, OS – Microsoft Windows 10 RS5 Build 475 Bios F.26.

    2Lakefield configuration disclosures:

    Approximately 10x Lakefield Standby SoC Power Improvement: Estimated or simulated as of April 2019 using Intel internal analysis or architecture simulation or modeling. Vs. Amber Lake.

    Approximately 1.5x-2x Lakefield Active SoC Power Improvement:  Estimated or simulated as of April 2019 using Intel internal analysis or architecture simulation or modeling. Workload:  1080p video playback. Vs. Amber Lake next-gen product.

    Approximately 2x Lakefield Graphics Performance: Estimated or simulated as of April 2019 using Intel internal analysis or architecture simulation or modeling. Workload:  GfxBENCH. LKF 5W & 7W Configuration (Assumptions):,Processor: LKF PL1=5W & 7W TDP, 5C5T, Memory: 2X4GB LPDDR4x – 4267MHz, Storage: Intel® 760p m.2 PCIe NVMe SSD; LKF Optimized Power configuration uses UFS, Display Resolution: 1920×1080 for Performance; 25×14 eDP 13.3” and 19×12 MIPI 8.0” for Power, OS: Windows* 10 RS5. Power policy set to AC/Balanced mode for all benchmarks except SYSmark 2014 SE which is measured in AC/BAPCo mode for Performance. Power policy set to DC/Balanced mode for power. All benchmarks run in Admin mode., Graphics driver: X.X Vs. Configuration Data: Intel® Core™ AML Y2+2 5W measurements: Processor: Intel® Core™ i7-8500Y processor, PL1=5.0W TDP, 2C4T, Turbo up to 4.2GHz/3.6GHz, Memory: 2x4GB LPDDR3-1866MHz, Storage: Intel® 760p m.2 PCIe NVMe SSD, Display Resolution: 1920×1080 for Performance; 25×14 eDP 13.3” for Power, OS: Windows 10 Build RS3 17134.112. SYSmark 2014 SE is measured in BAPCo power plan. Power policy set to DC/Balanced mode for power. All benchmarks run in Admin mode, Graphics driver: driver:whl.1006167-v2.

    Forward-Looking Statements: Statements in this release that refer to future plans and expectations, including with respect to Intel’s future technologies and the expected benefits of such technologies, are forward-looking statements that involve a number of risks and uncertainties. Words such as “anticipates,” “expects,” “intends,” “goals,” “plans,” “believes,” “seeks,” “estimates,” “continues,” “may,” “will,” “would,” “should,” “could,” and variations of such words and similar expressions are intended to identify such forward-looking statements. Statements that refer to or are based on estimates, forecasts, projections, uncertain events or assumptions, including statements relating to total addressable market (TAM) or market opportunity, future products and the expected availability and benefits of such products, and anticipated trends in our businesses or the markets relevant to them, also identify forward-looking statements. Such statements are based on current expectations and involve many risks and uncertainties that could cause actual results to differ materially from those expressed or implied in these forward-looking statements. Important factors that could cause actual results to differ materially from the company’s expectations are set forth in Intel’s most recent earnings release dated April 25, 2019, which is included as an exhibit to Intel’s Form 8-K furnished to the SEC on such date. Additional information regarding these and other factors that could affect Intel’s results is included in Intel’s SEC filings, including the company’s most recent reports on Forms 10-K and 10-Q. Copies of Intel’s Form 10-K, 10-Q and 8-K reports may be obtained by visiting our Investor Relations website at www.intc.com or the SEC’s website at www.sec.gov.

    The post 2019 Investor Meeting: Intel Previews Design Innovation; 10nm CPU Ships in June; 7nm Product in 2021 appeared first on Intel Newsroom.

    Intel Unveils Project Athena Open Labs, Expands Ecosystem Integration to Optimize Laptop Components

    newman intel project athena
    Josh Newman, Intel vice president and general manager of PC Innovation Segments in the Client Computing Group, shares details of Project Athena to 500 members of the PC ecosystem at the Project Athena Symposium and Workshop on May 8, 2019, in Taiwan. (Credit: Intel Corporation)
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    What’s New: Intel today revealed plans for Project Athena Open Labs in Taipei, Shanghai and Folsom, California, to support performance and low-power optimization of vendor components for laptops built to Project Athena design specifications and target experiences in 2020. Located in key ecosystem hubs and operated by teams of Intel engineers with system-on-chip (SOC) and platform power optimization expertise, the three Open Labs sites will begin operating in June 2019 to enable and optimize components.

    “Across the industry, we each play an important role in delivering the advanced laptops of today and the future. Project Athena Open Labs are a critical step in enabling more extensive, day-to-day collaboration with the components ecosystem to continuously raise the bar for innovation across the platform.”
    –Josh Newman, Intel vice president and general manager of PC Innovation Segments, Client Computing Group

    What It Means: Intel’s expanded level of integration with the PC ecosystem will accelerate the development of advanced laptop designs and capabilities by adding greater efficiency to the component selection process for OEMs, and by enabling a continuous cycle of tuning and testing based on real workloads and usage models.

    Why It’s Important: This week, more than 500 members of the PC ecosystem gathered in Taiwan for the Project Athena Ecosystem Symposium to ready the first wave of Project Athena designs. Announced at CES 2019, Intel’s innovation program, code-named “Project Athena,” was developed to help bring to market a new class of advanced laptops. Co-engineered with partners across the ecosystem, the first Project Athena devices will be available in the second half of this year.

    project athena open labs execution flowWith Project Athena, Intel has fundamentally changed its approach to innovation. Rooted in extensive research to understand how people use their devices and the challenges they face, Intel engineers and social scientists have developed a set of predefined key experience requirements designed to enable new experiences and capitalize on next-generation technologies, such as 5G and artificial intelligence, across the full PC platform.

    Every component within a laptop affects the user experience, from power consumption to responsiveness and beyond. Enabling component vendor assessment, tuning and compliance at the Open Labs will help drive consistency in delivering the best technologies without compromise. Early alignment and enablement at the component level sets a strong foundation for OEM design readiness and implementation to help ensure systems meet Project Athena experience targets.

    How It Works: Project Athena Open Labs will be the first step in readying the next wave of Project Athena designs for 2020 and beyond. Independent hardware vendors (IHVs) will have the opportunity to submit parts for compliance assessment via Project Athena Open Labs, and Intel’s OEM partners can also nominate preferred component vendors for participation.

    Each lab is supported by experienced engineers to test, tune and provide recommendations to improve power and performance capabilities across a broad range of laptop components and categories, such as audio, display, embedded controllers, haptics, SSDs and wireless. The state-of-the-art facilities are located in regional hubs, so ODMs and IHVs can come into the labs year-round for component assessment and solution pathfinding aligned to the Project Athena vision. Following assessment, a list of optimized components will be made available to OEMs for consideration throughout product development cycles.

    OEMs, ODMs and IHVs will begin to submit components to the Open Labs over the coming weeks.

    More Context: Intel at 2019 Computex (Press Kit) | Intel at Computex 2019 (Media Alert) | Client Computing News

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    Ordnance Survey and Mobileye Begin Trials to Map Britain’s Roadside Infrastructure

    Mobileye Ordnance Survey 3

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    LONDON, May 7, 2019 – Ordnance Survey (OS), Great Britain’s national mapping agency, and Mobileye, an Intel company, have launched trials to create the first detailed roadside infrastructure dataset of Britain for a new, accurate and customisable location information service.

    To support the trials, Northumbrian Water Group has become the first utility company in the UK to join the project. The new service from Mobileye and OS, which will deliver high-precision roadside asset location data to companies across multiple sectors, was first announced by the companies at CES 2019. The collaboration will unlock the innovation of artificial intelligence-powered automotive technology for an array of markets.

    MORE: Mobileye-Ordnance Survey Mapping (Press Kit) | Mobileye News

    Fleets of vans and cars fitted with Mobileye’s automotive camera-based mapping technology are set to capture a street-level (worms-eye) view of the nation’s road network. Retrofitted with the Mobileye® 8 Connect™, the vehicles are detecting, processing and sending data to the cloud for aggregation before the information is provided to OS. OS, a world-leading geospatial data and technology organization, cross-references the data with its existing datasets. The level of detail recognized and classified includes road markings, network boxes, traffic lights, road signs, lamp and telegraph posts, bollards, manhole covers, and drainage grates. The data is updated constantly as vehicles capture information on the roads they travel.

    mobileye ordnance 2x1Professor Amnon Shashua, president and CEO of Mobileye, said: “A future of smart cities and safe streets is within reach when we equip governments and businesses with high-precision mapping data. We look forward to seeing the continuing progress of our trials.”

    Initially tested in selected areas of the country, the trials included London, Manchester and the North East. The trials are already helping produce a dataset of Britain’s road network characteristics and street furniture at an unprecedented level of accuracy. The trials will lay the groundwork for new data and infrastructure asset monitoring services from Mobileye and OS for customers across many markets, ranging from the energy and infrastructure sectors to emerging tech markets including connected and autonomous vehicles (CAV) and 5G.

    Neil Ackroyd, OS interim CEO, said: “At OS we strive to create environments that support new technologies and data services across the public and private sector. The OS collaboration with Mobileye further enhances our commitment to supporting Britain as a world-leading centre for digital and tech excellence. The initial trials are already delivering a deeper and richer level of data capture which we are confident will bring added value to our customers and become an important dataset for emerging markets, and a building block for Britain’s infrastructure for many years.”

    The utility sector will be among the first markets to take advantage of new data services from Mobileye and OS. Utility businesses will be able to enhance the quality of their existing asset data, making it faster and simpler to identify and link above-ground and underground assets. Companies can monitor the condition of their assets, saving them money and time when planning asset maintenance programs.

    As part of the trials, Northumbrian Water Group vehicles will be retrofitted with the Mobileye solution to help capture data across the North East of England.

    Clive Surman-Wells, Northumbrian Water Group operations solutions manager, added: “We’re really excited and proud to be the first utility company to have the opportunity to try this new technology. There are so many benefits that have the potential to really change the game when it comes to helping manage our networks and keep our customers’ water flowing.”

    As the global leader in the development of vision technology for advanced driver assistance systems (ADAS) and autonomous driving, Mobileye also empowers fleets with a higher standard of safety and helps reduce traffic injuries and fatalities. The Mobileye 8 Connect system, which is powered by Mobileye’s EyeQ®4 processor, brings several advanced collision avoidance features in addition to providing alerts and warnings that can improve driver behavior and create safer roads.

    OS and Mobileye expect trials to continue over the summer.

    About Ordnance Survey
    Ordnance Survey (OS) is the national mapping agency for Great Britain, and a world-leading geospatial data and technology organisation. As a reliable partner to government, business and citizens across Britain and the world, OS helps its customers in virtually all sectors improve quality of life. OS expertise and data supports efficient public services and infrastructure, new technologies in transport and communications, national security and emergency services and exploring the great outdoors. By being at the forefront of geospatial capability for more than 225 years, we’ve built a reputation as the world’s most trusted geospatial partner.

    About Mobileye, an Intel Company
    Mobileye, an Intel Company, is the global leader in the development of computer vision and machine learning, data analysis, localisation and mapping for advanced driver assistance systems and autonomous driving. Our technology keeps passengers safer on the roads, reduces the risks of traffic accidents, saves lives and has the potential to revolutionise the driving experience by enabling autonomous driving. Our proprietary software algorithms and EyeQ® chips perform detailed interpretations of the visual field in order to anticipate possible collisions with other vehicles, pedestrians, cyclists, animals, debris and other obstacles. Mobileye’s products are also able to detect roadway markings such as lanes, road boundaries, barriers and similar items; identify and read traffic signs, directional signs and traffic lights; create a RoadBook™ of localised drivable paths and visual landmarks using REM™; and provide mapping for autonomous driving. Our products are or will be integrated into car models from more than 25 global automakers. Our products are also available in the aftermarket.

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