Product Fact Sheet: Accelerating 5G Network Infrastructure, from the Core to the Edge

Intel 2nd gen Xeon Scalable

» Download all images (ZIP, 817 KB)

This week, Intel announced an unmatched silicon portfolio for 5G infrastructure with the launch of the Intel Atom® P5900, a 10nm system-on-chip (SoC) for wireless base stations, and the introduction of both a structured ASIC for 5G network processing and a 5G network-optimized Ethernet network adapter, offering high-precision, GPS-based network service synchronization.

More: Intel Announces Unmatched Portfolio for 5G Network Infrastructure (News Release) | Intel Reinforces Data Center Leadership with New 2nd-Gen Intel Xeon Scalable Processors (News Byte) | Intel Announces Unmatched Portfolio for 5G Network Infrastructure (Press Kit)

Additionally, Intel announced the expansion of its 2nd gen Intel® Xeon® Scalable processor lineup as the company continues to deliver workload-optimized performance, integrated artificial intelligence (AI) acceleration and hardened security at the platform level.

Launching Intel Atom P5900 Platform  

In a highly integrated 10nm SoC, the Intel Atom P5900 delivers what customers require for future-ready 5G base stations, including ultra-low latency, accelerated throughput and precise load balancing.

Performance improvements include up to 5.6 times more secured network communication with the Intel Atom® P5952B processor and Intel® QuickAssist Technology (versus software alone)1 and up to 3.7 times more packet processing with the Intel Atom P5952B processor and Intel® Dynamic Load Balancer (versus software alone)2.

Key features include:

  • Up to 24 Intel Atom P5000 processor cores, based on the Tremont microarchitecture, using 10nm process technology.
  • L1 cache of 32KB/core, L2 cache of 4.5MB per 4-core cluster and shared LLC cache up to 15MB.
  • Base frequency support of up to 2.2 GHz, single-thread performance.
  • Memory capacity of up to 128GB of DDR4 up to 2,933 MT/s with server-class reliability, availability and serviceability (RAS) and support for RDIMM, UDIMM, SODIMM and memory down.
  • Up to 100 Gbps throughput with integrated Intel Ethernet 800 series technology.
  • Up to 100 Gbps security processing with Intel QuickAssist Technology.
  • Up to 440 Gbps network switching connectivity support with up to 20 fully integrated Ethernet SerDes.
  • Up to 16 lanes of flexible high-speed IO configured as PCIe, SATA and/or USB 3.0.
  • Up to 16 lanes of PCIe Gen 3.0.
  • Up to 4 USB 2.0 ports, eMMC 5.1, LPC or eSPI.
  • Extended temperature support of minus 40 C to 85 C with full dynamic temperature range.

New 2nd Gen Intel Xeon Scalable Processors  

The new 2nd Gen Intel Xeon Scalable processors launched today deliver an average of 36% more performance and an average of 42% more performance per dollar3 than the prior generation Intel Xeon Gold and increased value for customers across their cloud, network and edge needs.

Updates include:

  • These new processors add more cores, cache and/or frequency, providing more performance and value across a wide range of mainstream price points.
  • Industry-leading frequency, with a new processor featuring base frequency of 3.9 GHz and turbo frequency up to 4.5 GHz.
  • Continued hardware-based mitigations against side-channel attacks, plus built-in encryption acceleration and key protection technologies.
  • Eighteen Intel® Select Solutions will be updated in the coming weeks with new processor options to take advantage of the improved performance and value. Intel Select Solution are workload-optimized configurations for a variety of popular workloads that reduce the guesswork and accelerate time-to-deployment.
  • Find additional information and SKU chart on “Intel Reinforces Data Center Leadership with New 2nd Gen Intel Xeon Scalable Processors.”

Introducing “Diamond Mesa,” Intel’s First Next-Generation Structured ASIC for 5G Network Acceleration

Structured ASICs like “Diamond Mesa” provide a minimum-risk optimization path for workloads that do not require the full programmability of FPGAs, targeting double the performance efficiency versus the prior generation, and uniquely position Intel as the only provider delivering a full silicon platform foundation for network infrastructure.

Key features include:

  • The first eASIC device to leverage all-new IP from the Intel Programmable Solutions Group, a quad-core ARM A53 processor and secure device manager subsystem.
  • Structured ASICs like Diamond Mesa strike a balance between the programmability and fast time-to-market of FPGAs and the efficient performance of purpose-built ASICs.
  • Only Intel offers developers a full range of silicon solutions to optimize platforms for performance, cost, power, flexibility and time-to-market – from Intel Xeon processors to purpose-built ASICs.

Introducing the Intel Ethernet 700 Series Network Adapter with Hardware-Enhanced Precision Time Protocol (code-named “Edgewater Channel”)

Intel introduced the Intel® Ethernet 700 Series network adapter with hardware-enhanced Precision Time Protocol (PTP), which is designed for 5G, edge and other use cases with very tight latency and timing requirements.

Intel Ethernet 700 Series is compliant with the IEEE 1588 PTP standard and increases phase accuracy through a combination of hardware enhancements and software optimizations with within 100 nanoseconds or less.

Key features include:

  • Onboard high-precision oscillator with up to 5,000 times tighter accuracy: Provides greater phase
    accuracy than a standard Ethernet adapter and better holdover between clock interruption. (5000x=20 ppb TCXO oscillator (10 °C to 70 °C) vs. typical 100 ppm crystal)
  • Dual SubMiniature version A (SMA) coaxial connectors: Allow connection to external timing sources, such as GPS signaling devices and to timing sinks/recipients, allowing the NIC to act as
    a grandmaster and as a timing source for other equipment.
  • Software-defined pins (SDPs): User-configurable I/O pins drive the SMAs and provide built-in timing coordination between ports.
  • Standard Linux support: Linux PTP utility provides support for multiple PTP profiles and use of SDPs for sync via 1 pulse per second (PPS) input and output signals.

1 Get up to 5.6X more packet security throughput with Intel QAT and the integrated switch, versus software: Tested by Intel on 1/27/2020, 1x Intel Atom® P5952B processor (Running under A-3 Eng Silicon 20C, 2.2GHz) on Intel internal Frost Creek platform, 16GB DDR4 2933MHz, OS: Ubuntu 18.04 with Kernel: 5.2.10-rt5, BIOS: JBVLCRB1.86B.0011.D44.1909191126, uCode: 0x90010006, Benchmark: DPDK IPSec (using Intel® QAT) (1420B packet size) (1C/1T/1P) (Estimated), Software: DPDK 19.05, Compiler: GCC 7.3.0 with MKL, Network: Onboard 100GbE NIC compared to 1x Intel Atom® P5952B processor (Running under A-3 Eng Silicon 20C, 2.2GHz) on Intel internal Frost Creek platform, 16GB DDR4 2933MHz, OS: Ubuntu 18.04 with Kernel: 5.2.10-rt5, BIOS: JBVLCRB1.86B.0011.D44.1909191126, uCode: 0x90010006, Benchmark: DPDK IPSec (using software cipher algorithm AES-128-CBC) (1420B packet size) (1C/1T/1P) (Estimated), Software: DPDK 19.05, Compiler: GCC 7.3.0 with MKL, Network: Onboard 100GbE NIC.

2 Achieve up to 3.7X more packet balancing throughput versus software queue management: Tested by Intel on 1/27/2020, 1x Intel Atom® P5952B processor (Running under A-3 Eng Silicon 20C, 2.2GHz) on Intel internal Victoria Canyon platform, 16GB DDR4 2933MHz ,OS: Ubuntu 18.04 with Kernel: 5.2.10-rt5, BIOS: JBVLCRB1.86B.0012.D17.1911070324, uCode: 0x90040006, Benchmark: DPDK Event Device Ordered Scheduling (3 stages) (Estimated), Software: RDK19.11, Compiler: GCC 7.3.0 with MKL, Network: 1x Intel® Ethernet Network Adapter X710-DA4 (10GbE) compared to 1x Intel Atom® P5952B processor (Running under A-3 Eng Silicon 20C, 2.2GHz) on Intel internal Victoria Canyon platform, 16GB DDR4 2933MHz, OS: Ubuntu 18.04 with Kernel: 5.2.10-rt5, BIOS: JBVLCRB1.86B.0012.D17.1911070324, uCode: 0x90040006, Benchmark: DPDK Event Device Ordered Scheduling (3 stages) (Estimated), Software: RDK19.11, Compiler: GCC 7.3.0 with MKL, Network: 1x Intel® Ethernet Network Adapter X710-DA4 (10GbE).

3 36% more performance & 42% more performance/dollar: Geomean of Integer Throughput, Floating Point Throughput, Stream Triad, and Linpack across ten new 2-socket 2nd Gen Gold processors vs first generation. 2nd Gen Gold R processors: 1-node, 2x 2nd Gen Intel Xeon Gold cpu on Intel Reference platform with 384 GB (12 slots / 32 GB / 2933)  total memory, ucode 0x500002c, HT on for all except off for Stream, Linpack, Turbo on, with Ubuntu19.10, 5.3.0-24-generic, 6258R/$3950: int=323, fp=262, stream=224, Linpack=3305, 6248R/$2700: int=299, fp=248, stream=224, Linpack=3010, 6246R/$3286: int=238, fp=217, stream=225, Linpack=2394, 6242R/$2529: int=265, fp=231, stream=227, Linpack=2698, 6240R/$2200: int=268, fp=228, stream=223, Linpack=2438, 6238R/$2612: int=287, fp=240, stream=222, Linpack=2545, 6230R/$1894: int=266, fp=227, stream=222, Linpack=2219, 6226R/$1300: int=208, fp=192, stream=200, Linpack=2073, 5220R/$1555: int=257, fp=220, stream=210, Linpack=1610, 5218R/$1273: int=210, fp=188, stream=199, Linpack=1290 test by Intel on 12/25/2019.  First Gen Gold processor: 1-node, 2x Intel Xeon Gold cpu on Intel Reference platform with 384 GB (12 slots / 32 GB / 2933)  total memory, ucode 0x2000065, HT on for all except off for Stream, Linpack, Turbo on, with Ubuntu19.10, 5.3.0-24-generic, 6152/$3655: int=224, fp=198, stream=200, Linpack=19886148/$3072: int=225, fp=198, stream=197, Linpack=2162, 6146/$3286: int=161, fp=175, stream=185, Linpack=1896, 6142/$2946: int=193, fp=176, stream=185, Linpack=1895, 6140/$2445: int=202, fp=183, stream=188, Linpack=1877, 6138/$2612: int=189, fp=195, stream=189, Linpack=1976, 6130/$1894: int=172, fp=165, stream=185, Linpack=1645, 6126/$1776: int=141, fp=157, stream=170, Linpack=1605, 5120/$1555: int=133, fp=148, stream=159, Linpack=924, 5118/$1273: int=134, fp=132, stream=149, Linpack=818 test by Intel on 2/18/2020.

The post Product Fact Sheet: Accelerating 5G Network Infrastructure, from the Core to the Edge appeared first on Intel Newsroom.

Intel Highlights Latest Security Investments at RSA 2020

Intel 2020 RSAC 1

» Download all images (ZIP, 27 MB)

SAN FRANCISCO, Feb. 26, 2020 – At the Intel Security Day event during RSA Conference 2020, Intel underscored its commitment to security with several announcements, including details on security capabilities coming in future products. At Intel, security is a fundamental and foundational element of all aspects of architecture, design and implementation. Together with customers and partners, Intel is building a more trusted foundation in this data-centric world.

“Hardware is the bedrock of any security solution. Just as a physical structure requires a foundation established on bedrock to withstand the forces of nature, security solutions rooted in hardware will provide the greatest opportunity to provide security assurance against current and future threats,” said Tom Garrison, Intel vice president and general manager of Client Security Strategy and Initiatives. “Intel hardware, and the assurance and security technologies it brings, help harden the layers above from attack.”

More: Intel Security News

Intel customers build solutions and services that depend on the breadth and depth of technologies in the silicon, vertical integration and substantive reach from edge to cloud. It is Intel’s mission to provide common security capabilities across all architectures, to help address the ever-increasing sophistication of user experiences.

Data must be protected at rest and in motion. The protection of data is critical to extracting value from it, while delivering uncompromised performance. The next 10 years will see more architecture ​advancements than the past 50 years.

“Intel is uniquely positioned in the industry to create and deliver truly innovative security technologies that span architectures, memory and interconnect,” said John Sell, Intel Fellow and director of Intel Security Architecture and Technology.

Data Platform Protection

As the demand for data-intensive computing grows, there is a need to balance the ease of scaling deployment with the level of data protections. To address customer challenges, new confidential computing capabilities on future data center platforms are expected to offer scale and choice:

  • Application isolation helps protect data in use with a very narrow attack surface. Already deployed for production data centers and solutions, Intel® Software Guard Extensions (Intel SGX) will expand to a broader range of mainstream data-centric platforms, and is expected to provide larger protected enclaves, extended protections to offload accelerators and improved performance. This will further expand the number of usages able to leverage these advanced application isolation capabilities.
  • VM and container isolation helps provide protections in virtualized environments, isolating them from each other and from the hypervisor and cloud provider without requiring application code modifications.
  • Full memory encryption helps better protect against physical memory attacks​ by providing hardware-based encryption transparent to the operating system and software​ layers.
  • Intel® Platform Firmware Resilience is an Intel FPGA-based solution that helps protect the various platform firmware components by monitoring and filtering malicious traffic on the system buses. It also verifies the integrity of platform firmware images before any firmware code is executed and can recover corrupted firmware back to a known good state. When combined with other trusted boot technologies on new platform generations, Intel continues to contribute additional tools to increase resistance against attack and help provide a more trusted foundation for modern cloud and enterprise deployments.

More information can be found on Intel’s IT Peer Network.

Compute Lifecycle Assurance Industry Traction

Since its launch in December, Intel’s Compute Lifecycle Assurance Initiative has gained traction with customers and ecosystem partners, starting with the foundational offering Intel® Transparent Supply Chain (Intel TSC).

Transparency of a device’s origin helps establish the foundation for a trusted supply chain. Intel TSC tools allow platform manufacturers to bind platform information and measurement using the Trusted Computing Group’s (TCG) Trusted Platform Module 2.0 (TPM) standard, also referred to as ISO 11889. This allows customers to gain traceability and accountability for platforms with component-level reporting. More information can be found in a blog by Intel’s Tom Dodson.

Intel TSC is currently available for customers across Intel vPro® platform-based PCs, Intel® NUC, Intel® Xeon® SP systems, Intel® solid-state drives and certain Intel® Core™ commercial PCs.

To demonstrate Intel’s commitment to transparency, measurement and assurance of the supply chain, Intel also enables ecosystem partners with Intel TSC tools. Today, Hyve Solutions, Inspur, Lenovo (client and server), Mitac, Quanta, Supermicro and ZT Systems have enabled Intel TSC tools. In addition, Intel has active deployments of Intel TSC with enterprise IT and cloud service providers.

“This chain of trust process provides essential traceability based on the TPM,” said Thorsten Stremlau, chair of TCG’s Marketing Work Group. “Bringing component-level traceability to platforms and systems increases confidence and reduces the risk of counterfeit electronic parts while also facilitating procurement standards. This is the right direction for the industry.”

It often takes the industry working together to make technological advancements. Intel has a strong legacy of assisting its customers and industry partners in developing new and innovative ways to improve hardware security. Intel shares knowledge of this experience through its participation and contributions to leading industry initiatives and standards bodies, including the Confidential Computing Consortium under the Linux Foundation, the FIDO Alliance’s IoT Technical Workgroup and the newly expanded Common Weakness Enumeration led by MITRE. Such efforts underscore Intel’s unique capacity to build a more trusted foundation for the industry.

Notices & Disclaimers

Intel technologies may require enabled hardware, software or service activation.

No product or component can be absolutely secure.

Your costs and results may vary.

The post Intel Highlights Latest Security Investments at RSA 2020 appeared first on Intel Newsroom.

Intel World Open: Path to Tokyo Kicks off in March

tokyoWhat’s New: Intel is elevating esports for audiences worldwide with the Intel World Open ahead of the Olympic Games Tokyo 2020, giving gamers a chance to compete among the world’s best athletes on a global stage. Anyone from anywhere can register, beginning March 2, for a chance to be crowned the Intel World Open champion.

“We introduced Intel Extreme Masters PyeongChang in 2018 and we’re excited to continue raising the stakes for esports with the Intel World Open in 2020. There are more than 490 million esports fans worldwide and the Intel World Open exemplifies Intel’s global leadership in esports and delivers a pinnacle tournament on the world’s biggest sports stage.”
– Mark Subotnick, Intel director of gaming and esports business development

What It Is: The Intel World Open is an extension of Intel’s Worldwide TOP Partnership with the International Olympic Committee (IOC), and will feature two of the most recognized esports titles: Capcom’s Street Fighter™ V: Champion Edition and Psyonix’s Rocket League. Online qualifiers for Street Fighter V: Champion Edition start March 21 and Rocket League start May 2.

The Path to Tokyo: Any player at any level can compete in the Intel World Open for a chance to join a national, territory or regional team. Live qualifier events in Katowice, Poland, in June will determine which teams advance to the championship esports tournament in Tokyo.

The final event in Tokyo on July 22-24 will host hundreds of fans at the Zepp DiverCity venue – the same area as Olympic venues – where teams will compete for a majority share of the prize pool:

  • $250,000 total prize pool for Street Fighter V: Champion Edition
  • $250,000 total prize pool for Rocket League

For more details and registration, visit the Intel World Open website.

The Street Fighter V: Champion Edition Tournament Format: A force in the fighting genre and esports scene for 32 years, the legendary fighting franchise returns with Street Fighter V: Champion Edition.

Tournament Structure:

  • Territory qualifiers: Territory qualifiers begin March 2 and determine each territory’s three best players who will come together and form the team representing that territory and advance to the live qualifier in Poland. The 12 pre-selected territories include:
    • Brazil
    • China
    • Chinese Taipei
    • Dominican Republic
    • France
    • Hong Kong, China
    • Korea
    • Russia
    • Singapore
    • United Arab Emirates
    • United Kingdom
    • United States
  • Regional qualifiers: Players outside of the 12 pre-selected territory teams can participate through the team-based regional qualifier process that will take place in March through May. The top teams from the eight regions will advance to the live qualifier in Poland. The eight regions include:
    • Europe 1
    • Europe 2
    • Middle East & Africa
    • North America
    • Central America
    • South America
    • Asia
    • Oceania
  • Live qualifier in Katowice, Poland: From June 18-21, the final qualifier brings together the winning teams formed from the territory and regional qualifiers to determine who advances to the final Intel World Open event in Tokyo.
  • Japan qualifier: As the host country, Japan will have the final guaranteed spot at the Intel World Open finals in Tokyo. Japan qualifiers are single-player matches with the winning team being formed from the top players on the Intel World Open leaderboard.
  • Intel World Open finals: The finals take place July 22-24 at the Zepp DiverCity venue in Tokyo, where qualifying teams will compete to claim the majority share of the $250,000 prize pool.

For full qualification rules and details, visit the Intel World Open website.

The Rocket League Tournament Format: Developed by Epic Games’ San Diego-based studio, Psyonix, Rocket League is a high-powered hybrid of arcade-style soccer and vehicular mayhem. The Rocket League Intel World Open will feature 3v3 competitions in Psyonix’s signature game mode, Soccar.

Tournament Structure:

  • National qualifiers: National qualifiers begin May 2 and one team from each of the nine pre-selected countries will advance to the live qualifier in Katowice, Poland. The nine nations include:
    • Australia
    • Brazil
    • Canada
    • China
    • France
    • Germany
    • Japan
    • United Kingdom
    • United States
  • Regional qualifiers: Players outside of the nine pre-selected national team countries can participate through the regional qualifier process, from which eight teams will advance to the semifinals in Poland. Both qualifiers will have a double-elimination format and will not have a team cap. The eight regions include:
    • Africa
    • Asia (Mainland)
    • Asia (Maritime & Oceania)
    • Europe (three European seeds will qualify for the regional final)
    • Latin America (Mexico and southward)
    • Middle East
  • Live qualifier in Katowice, Poland: The final qualifier in Katowice, Poland, features the 16 best teams in the world separated into two groups of eight teams. The teams will compete in a round-robin, with the top two teams from each group automatically advancing to the Intel World Open Finals in Tokyo to join the host country, Japan. After the round-robin stage, the rest of the teams will participate in a double-elimination bracket. The upper bracket winner and both teams from the lower bracket finals will qualify for the Intel World Open finals.
  • Intel World Open finals: The epic culmination of the Intel World Open will be the live final in Tokyo featuring a two-day event showcasing the best eight teams in the world. They will battle through a high-stakes, single-elimination bracket in order to claim the Intel World Open title and majority share of the $250,000 prize pool.

For full qualification rules and details, visit the Intel World Open website.

Intel’s Role in Gaming Technology Leadership: Intel’s gaming technology, led by the Intel® Core™ i7 and i9 processors, has powered the best esports experiences for more than 15 years. Intel inspires fans and players by supporting a vibrant community that brings together committed partners in the industry to deliver best-in-class technology that pushes the boundaries of the sport. Intel’s leadership in end-to-end solutions will power the future of gaming and grow the esports market for the next billion fans.

More Context: Intel and the Olympic Games Tokyo 2020

The Small Print: Capcom and the Capcom logo are registered trademarks of Capcom Co. Ltd. in the U.S. or other countries. Street Fighter is a trademark and/or registered trademark of Capcom U.S.A. Inc. in the U.S. and/or other countries.

The post Intel World Open: Path to Tokyo Kicks off in March appeared first on Intel Newsroom.

Intel Announces Unmatched Portfolio for 5G Network Infrastructure

SANTA CLARA, Calif., Feb. 24, 2020 – Unlocking the full potential of 5G requires transforming network infrastructure from core to edge. As the world’s leading network silicon provider, Intel is at the forefront of driving this transformation. Today, the company made a sweeping set of hardware and software announcements, including the launch of the new Intel Atom™ P5900, a 10nm system-on-chip (SoC) for wireless base stations, which is a critical early deployment target for 5G networks.

More: Intel Announces Unmatched Portfolio for 5G Network Infrastructure (Press Kit) | Intel Reinforces Data Center Leadership with New 2nd-Gen Intel Xeon Scalable Processors

“As the industry makes the transition to 5G, we continue to see network infrastructure as the most significant opportunity, representing a $25 billion silicon opportunity by 2023,” said Navin Shenoy, executive vice president and general manager of the Data Platforms Group at Intel. “By offering customers the fastest and most effective path to design, deliver and deploy 5G solutions across core, edge and access, we are poised to expand our leading silicon position in this growing market.”

intel ethernet 700 series xxv710 da2t

» Download all images (ZIP, 817 KB)

Unmatched Portfolio for 5G Infrastructure

As the promise of 5G takes hold, customers are demanding the increased performance and flexibility they need to rapidly deliver services with lower latency where they are needed most. In this light, Intel announced a number of firsts today, including:

  • Launching the Intel Atom P5900 platform, the first Intel architecture-based 10nm SoC for wireless base stations: With the launch of the Intel Atom P5900, the company is extending Intel architecture from the core to access and all the way to the farthest edge of the network. Intel now expects to be the leading silicon provider in base stations by 2021, a year earlier than first predicted. As a highly integrated 10nm SoC, the Intel Atom P5900 is designed to meet critical 5G network needs, including high bandwidth and low latency to deliver what’s required for 5G base stations today and in the future. The product augments Intel’s rich silicon portfolio for network environments and introduces Intel silicon as the foundation for the wireless base stations market, with 6 million 5G base stations forecasted through 2024. Intel is working with leading providers to deliver this product as part of their future-differentiated solutions in market.
  • New 2nd Gen Intel® Xeon® Scalable processors: As the foundation for data platform infrastructure with over 30 million units sold, Intel Xeon Scalable processors have led the transformation of the network. This year, 50% of core network deployments are transforming to virtualized networks, with the expectation to grow beyond 80% by 2024¹, fueled by 5G. The new 2nd Gen Intel Xeon Scalable processors launched today deliver an average of 36% more performance and an average of 42% more performance per dollar² than the prior generation Intel® Xeon® Gold and increased value for customers across their cloud, network and edge needs. In addition, Intel Xeon Scalable helps protect the integrity of the data and the platform with hardware-enhanced security and built-in encryption accelerators. In conjunction, Intel introduced 18 updated Select Solutions supporting these new processors across customer-prioritized workloads.
  • Introducing “Diamond Mesa,” Intel’s first next-generation structured ASIC for 5G network acceleration: “Diamond Mesa” (code name) is designed to complement Intel’s unmatched portfolio of processors and FPGAs delivering the high performance and low latency required for 5G networks. Structured ASICs like Diamond Mesa provide a minimum-risk optimization path for workloads that do not require the full programmability of FPGAs, targeting double the performance efficiency versus the prior generation, and uniquely position Intel as the only provider delivering a full silicon platform foundation for network infrastructure. Diamond Mesa is open to early access customers.
  • Introducing the Intel® Ethernet 700 Series Network Adapter with hardware-enhanced Precision Time Protocol, the first 5G network-optimized Ethernet NIC: The Ethernet 700 series (code-named “Edgewater Channel”) is Intel’s first 5G-optimized network adapter, offering GPS-based cross-network service synchronization with hardware-enhanced Precision Time Protocol (PTP). Latency requirements across 5G network implementations have challenged existing Ethernet technology, especially in edge servers. Maintaining accurate time synchronization across the network at a cost-effective price point, however, is one avenue to help address application latency. The Ethernet 700 series adapter increases the timing precision required for 5G networks through a combination of hardware and software enhancements. Edgewater Channel is sampling now and will enter production in 2020’s second quarter.

New Software Investments

Intel expands its industry-leading edge computing software toolkits to accelerate time-to-market innovation for its customers and partners with new capabilities integrated into the Open Network Edge Services Software (OpenNESS) toolkit. OpenNESS now supports standalone 5GNR and Enhanced Platform Awareness (EPA) deployments, giving customers the flexibility to easily deploy their choice of cloud-native edge microservices. Intel is delivering customized OpenNESS experience kits to accelerate custom 5G deployments. OpenNESS complements Intel’s OpenVINO™ and Open Visual Cloud for edge computing development needs.

Unrivaled Ecosystem Collaborations

Technology innovation requires deep collaboration across industry innovators that build on each other’s contributions. Given its rich heritage in leading technology transitions, Intel is in a unique position to accelerate collaboration across its customers and partners. Intel has announced strategic collaborations with industry leaders, including Altiostar, Dell, Deutsche Telecom, HPE, Lenovo, QCT, Rakuten, VMware and ZTE to advance network infrastructure capability and speed edge solutions in the market.

Intel has been at the forefront of technology innovation for 51 years. By delivering the broadest silicon portfolio for 5G network infrastructure, the company continues to open a world of opportunity for its customers and partners.

¹Source: Dell’Oro Mobile Core Network 5 Year Forecast Report, Dell’Oro Group, 01/2020

²Geomean of Integer Throughput, Floating Point Throughput, Stream Triad, and Linpack across ten new 2-socket 2nd Gen Gold processors vs first generation. 2nd Gen Gold R processors: 1-node, 2x 2nd Gen Intel Xeon Gold cpu on Intel Reference platform with 384 GB (12 slots / 32 GB / 2933)  total memory, ucode 0x500002c, HT on for all except off for Stream, Linpack, Turbo on, with Ubuntu19.10, 5.3.0-24-generic, 6258R/$3950: int=323, fp=262, stream=224, Linpack=3305, 6248R/$2700: int=299, fp=248, stream=224, Linpack=3010, 6246R/$3286: int=238, fp=217, stream=225, Linpack=2394, 6242R/$2529: int=265, fp=231, stream=227, Linpack=2698, 6240R/$2200: int=268, fp=228, stream=223, Linpack=2438, 6238R/$2612: int=287, fp=240, stream=222, Linpack=2545, 6230R/$1894: int=266, fp=227, stream=222, Linpack=2219, 6226R/$1300: int=208, fp=192, stream=200, Linpack=2073, 5220R/$1555: int=257, fp=220, stream=210, Linpack=1610, 5218R/$1273: int=210, fp=188, stream=199, Linpack=1290 test by Intel on 12/25/2019.  First Gen Gold processor: 1-node, 2x Intel Xeon Gold cpu on Intel Reference platform with 384 GB (12 slots / 32 GB / 2933)  total memory, ucode 0x2000065, HT on for all except off for Stream, Linpack, Turbo on, with Ubuntu19.10, 5.3.0-24-generic, 6152/$3655: int=224, fp=198, stream=200, Linpack=19886148/$3072: int=225, fp=198, stream=197, Linpack=2162, 6146/$3286: int=161, fp=175, stream=185, Linpack=1896, 6142/$2946: int=193, fp=176, stream=185, Linpack=1895, 6140/$2445: int=202, fp=183, stream=188, Linpack=1877, 6138/$2612: int=189, fp=195, stream=189, Linpack=1976, 6130/$1894: int=172, fp=165, stream=185, Linpack=1645, 6126/$1776: int=141, fp=157, stream=170, Linpack=1605, 5120/$1555: int=133, fp=148, stream=159, Linpack=924, 5118/$1273: int=134, fp=132, stream=149, Linpack=818 test by Intel on 2/18/2020.

The post Intel Announces Unmatched Portfolio for 5G Network Infrastructure appeared first on Intel Newsroom.

Intel Reinforces Data Center Leadership with New 2nd Gen Intel Xeon Scalable Processors

2nd Gen Xeon Scalable Portfolio Enhancements
» Click for full image

Intel today announced the addition of new performance and performance-per-dollar-optimized processors to the Intel® Xeon® Scalable platform, the industry’s most widely deployed server platform with more than 30 million units sold. The addition of these new processors targets the majority of Intel’s mainstream Xeon Scalable customers across cloud, network and edge. With broad availability starting today from leading OxMs, these new 2nd Gen Intel Xeon Scalable processors reinforce Intel’s data center leadership by providing greater performance and performance-per-dollar choices for customers.

“Intel’s data-centric platforms offer the broadest market coverage of any server processor platform -– from the cloud, through the network, to the intelligent edge,” said Lisa Spelman, corporate vice president and general manager of the Xeon and Memory Group within Intel’s Data Platform Group. “Working closely with our customers, we are delivering these new server processors to address their performance and pricing needs across a broad range of markets and workloads.”

More: 5G Network Portfolio Launch (press kit)

The new 2nd Gen Intel Xeon Gold processors deliver an average of 1.36-times higher performance1 and 1.42-times better performance-per-dollar1 compared with the 1st Gen Intel Xeon Gold processors.

To deliver this level of performance and value, Intel has optimized these new server processors in several areas, including adding more cores, increasing cache sizes or by boosting processor frequency. The new processors — labeled with an “R,” “T” or “U” suffix — are designed for dual- and single-socket mainstream and entry-level server systems. The addition of more cores and increased cache in these processors are targeted at workloads where capacity-per-server is critical, such as virtualized clouds, hyper-converged infrastructure (HCI) and network function virtualization (NFV).

Intel also announced today two new processors (Intel Xeon Gold 6256 and 6250) that feature the industry’s highest server processor frequency, delivering a base and turbo frequency up to 3.9 GHz and 4.5 GHz, respectively. These high-frequency processors are optimized for workloads that scale with clock frequency, such as financial trading, simulation and modeling, high-performance computing, and databases.

The new 2nd Gen Intel Xeon Scalable processors target three broad customer use cases:

  • Industry-leading frequencies for high-performance usages: New Intel Xeon Gold 6200 processors deliver up to 4.5 GHz processor frequency with Intel Turbo Boost Technology and up to 33% more processor cache, offering customers breakthrough performance for frequency-fueled workloads.
  • Enhanced performance for mainstream usages: New Intel Xeon Gold 6200R and 5200R processors deliver built-in value through a combination of higher base and Intel Turbo Boost Technology frequencies, in addition to increased processor cache.
  • Increased value and capability for entry-level, edge, networking and IoT usages: New Intel Xeon Gold 6200U, Silver 4200R, Sliver 4210T and Bronze 3200R processors deliver increased value for single-socket entry-level servers, as well as edge, networking and internet of things (IoT) usages.

Intel’s broad ecosystem partners are taking advantage of the additional Xeon Scalable processor value now. Hundreds of systems featuring the new 2nd Gen Intel Xeon Scalable processors are offered through leading OEMs and ODMs. Systems are available today, with more in the coming weeks.

With these new processors, Intel continues to reinforce its data center leadership by delivering the performance and value customers require. The 2nd Gen Intel Xeon Scalable processors support the broadest market coverage of any server processor platform. Today’s Intel Xeon Scalable processors remain the only mainstream server processor with built-in artificial intelligence (AI) acceleration, with Intel DL Boost technology and with support for Intel® Optane™ persistent memory, which offers a large and persistent memory tier at affordable costs.

2nd Gen Xeon Scalable SKU Stack
» Click for full image

1 Performance results are based on testing as of dates in configuration and may not reflect all publicly available security updates. See configuration disclosure for details. No product can be absolutely secure.  For more complete information about performance and benchmark results, visitwww.intel.com/benchmarks. Refer to http://software.intel.com/en-us/articles/optimization-notice for more information regarding performance and optimization choices in Intel software products. Results have been estimated or simulated.

36% more performance & 42% more performance/dollar: Geomean of Integer Throughput, Floating Point Throughput, Stream Triad, and Linpack across ten new 2-socket 2nd Gen Gold processors vs first generation. 2nd Gen Gold R processors: 1-node, 2x 2nd Gen Intel Xeon Gold cpu on Intel Reference platform with 384 GB (12 slots / 32 GB / 2933)  total memory, ucode 0x500002c, HT on for all except off for Stream, Linpack, Turbo on, with Ubuntu19.10, 5.3.0-24-generic, 6258R/$3950: int=323, fp=262, stream=224, Linpack=3305, 6248R/$2700: int=299, fp=248, stream=224, Linpack=3010, 6246R/$3286: int=238, fp=217, stream=225, Linpack=2394, 6242R/$2529: int=265, fp=231, stream=227, Linpack=2698, 6240R/$2200: int=268, fp=228, stream=223, Linpack=2438, 6238R/$2612: int=287, fp=240, stream=222, Linpack=2545, 6230R/$1894: int=266, fp=227, stream=222, Linpack=2219, 6226R/$1300: int=208, fp=192, stream=200, Linpack=2073, 5220R/$1555: int=257, fp=220, stream=210, Linpack=1610, 5218R/$1273: int=210, fp=188, stream=199, Linpack=1290 test by Intel on 12/25/2019.  First Gen Gold processor: 1-node, 2x Intel Xeon Gold cpu on Intel Reference platform with 384 GB (12 slots / 32 GB / 2933)  total memory, ucode 0x2000065, HT on for all except off for Stream, Linpack, Turbo on, with Ubuntu19.10, 5.3.0-24-generic, 6152/$3655: int=224, fp=198, stream=200, Linpack=19886148/$3072: int=225, fp=198, stream=197, Linpack=2162, 6146/$3286: int=161, fp=175, stream=185, Linpack=1896, 6142/$2946: int=193, fp=176, stream=185, Linpack=1895, 6140/$2445: int=202, fp=183, stream=188, Linpack=1877, 6138/$2612: int=189, fp=195, stream=189, Linpack=1976, 6130/$1894: int=172, fp=165, stream=185, Linpack=1645, 6126/$1776: int=141, fp=157, stream=170, Linpack=1605, 5120/$1555: int=133, fp=148, stream=159, Linpack=924, 5118/$1273: int=134, fp=132, stream=149, Linpack=818 test by Intel on 2/18/2020.

The post Intel Reinforces Data Center Leadership with New 2nd Gen Intel Xeon Scalable Processors appeared first on Intel Newsroom.

Navin Shenoy Introduces Intel’s 5G Network Portfolio

Navin Shenoy, Intel executive vice president and general manager of the Data Platforms Group, introduces the newest additions to Intel’s robust portfolio for 5G network infrastructure.

Read more about Intel’s 5G network transformation:

The post Navin Shenoy Introduces Intel’s 5G Network Portfolio appeared first on Intel Newsroom.

How Does Intel Make Chips? A New Video Shows You.

Microprocessors.

These “chips” let you game on your PC, navigate a car or improve your daily life with artificial intelligence algorithms.

They’re the most complex devices manufactured. And it takes the world’s most advanced manufacturing technologies and the expertise of thousands of engineers, technicians and architects to create them.

A new animated video, “How Intel Makes Chips: Concept to Customer,” offers a simple overview of the manufacturing process – from design engineering through mask operations and assembly and testing – to create these tiny but fiendishly complex devices.

More: Manufacturing at Intel | All Intel Images

The post How Does Intel Make Chips? A New Video Shows You. appeared first on Intel Newsroom.

Intel and QuTech Unveil Details of First Cryogenic Quantum Computing Control Chip, ‘Horse Ridge’

intel quantum horse ridge
Stefano Pellerano, principal engineer at Intel Labs, holds Horse Ridge. The new cryogenic control chip will speed development of full-stack quantum computing systems, marking a milestone in the development of a commercially viable quantum computer. (Credit: Walden Kirsch/Intel Corporation)
» Click for full image

What’s New: Intel Labs, in collaboration with QuTech ‑ a partnership between TU Delft and TNO (Netherlands Organization for Applied Scientific Research) ‑ outlines key technical features of its new cryogenic quantum control chip “Horse Ridge” in a research paper released at the 2020 International Solid-State Circuits Conference (ISSCC) in San Francisco. The paper unveils key technical capabilities of Horse Ridge that address fundamental challenges in building a quantum system powerful enough to demonstrate quantum practicality: scalability, flexibility and fidelity.

“Today, quantum researchers work with just a small number of qubits, using smaller, custom-designed systems surrounded by complex control and interconnect mechanisms. Intel’s Horse Ridge greatly minimizes this complexity. By systematically working to scale to thousands of qubits required for quantum practicality, we’re continuing to make steady progress toward making commercially viable quantum computing a reality in our future.”
–Jim Clarke, director of quantum hardware, Intel Labs

Why It’s Important: The quantum research community is at mile one of a marathon toward demonstrating quantum practicality. Applying quantum computing to practical problems hinges on the ability to scale to, and control, thousands of qubits at the same time with high levels of fidelity. Horse Ridge greatly simplifies today’s complex control electronics required to operate such a quantum system by using a highly integrated system-on-chip (SoC) for faster setup time, improved qubit performance and efficient scaling to larger qubit counts required for quantum computing to solve practical, real-world applications.

Key technical details included in the research paper:

Scalability: The integrated SoC design, implemented using Intel’s 22nm FFL (FinFET Low Power) CMOS technology, integrates four radio frequency (RF) channels into a single device. Each channel is able to control up to 32 qubits leveraging “frequency multiplexing” – a technique that divides the total bandwidth available into a series of non-overlapping frequency bands, each of which is used to carry a separate signal.

Leveraging these four channels, Horse Ridge can potentially control up to 128 qubits with a single device, substantially reducing the number of cables and rack instrumentations previously required.

Fidelity: Increases in qubit count trigger other issues that challenge the capacity and operation of the quantum system. One such potential impact is a decline in qubit fidelity and performance. In developing Horse Ridge, Intel optimized the multiplexing technology that enables the system to scale and reduce errors from “phase shift” – a phenomenon that can occur when controlling many qubits at different frequencies, resulting in crosstalk among qubits.

The various frequencies leveraged with Horse Ridge can be “tuned” with high levels of precision, enabling the quantum system to adapt and automatically correct for phase shift when controlling multiple qubits with the same RF line, improving qubit gate fidelity.

Flexibility: Horse Ridge can cover a wide frequency range, enabling control of both superconducting qubits (known as transmons) and spin qubits. Transmons typically operate around 6 to 7 GHz, while spin qubits operate around 13 to 20 GHz.

Intel is exploring silicon spin qubits, which have the potential to operate at temperatures as high as 1 kelvin. This research paves the way for integrating silicon spin qubit devices and the cryogenic controls of Horse Ridge to create a solution that delivers the qubits and controls in one streamlined package.

Intel at ISSCC: Intel and QuTech will be presenting findings from their collaborative research in a paper “A Scalable Cryo-CMOS 2-to-20GHz Digitally Intensive Controller for 4×32 Frequency Multiplexed Spin Qubits/Transmons in 22nm FinFET Technology for Quantum Computers” during Session 19 of ISSCC at 1:30 p.m. PT, Tuesday, Feb 18.

More Context: Horse Ridge Fact SheetQuantum Computing at Intel | Intel Labs

The post Intel and QuTech Unveil Details of First Cryogenic Quantum Computing Control Chip, ‘Horse Ridge’ appeared first on Intel Newsroom.

Up Close with Lakefield – Intel’s Chip with Award-Winning Foveros 3D Tech

The fingernail-size Intel chip with Foveros technology is a first-of-its kind.

With Foveros, processors are built in a totally new way: not with the various IPs spread out flat in two dimensions, but with them stacked in three dimensions. Think of a chip designed as a layer cake (a 1-millimeter-thick layer cake) versus a chip with a more-traditional pancake-like design. Intel’s Foveros advanced packaging technology allows Intel to “mix and match” technology IP blocks with various memory and I/O elements – all in a small physical package for significantly reduced board size. The first product designed this way is “Lakefield,” the Intel® Core™ processor with Intel hybrid technology.

Industry analyst firm The Linley Group recently named Intel’s Foveros 3D-stacking technology as “Best Technology” in its 2019 Analysts’ Choice Awards. “Our awards program not only recognizes excellence in chip design and innovation, but also acknowledges the products that our analysts believe will have an impact on future designs,” said Linley Gwennap, of The Linley Group.

For its part, Lakefield represents an entirely new class of chip. It delivers an optimal balance of performance and efficiency with best-in-class connectivity in a small footprint – Lakefield’s package area measures just 12-by-12-by-1 millimeters. Its hybrid CPU architecture combines power-efficient “Tremont” cores with a performance scalable 10nm “Sunny Cove” core to intelligently deliver productivity performance when needed and power-sipping efficiency when not needed for long battery life.

These benefits offer original equipment manufacturers more flexibility for thin-and-light form factor PCs, including the emerging dual-screen and foldable screen PC categories.

Recently, three designs have been announced that are powered by Lakefield and were co-engineered with Intel. In October 2019, Microsoft previewed the Surface Neo, a dual-screen device. And later that month at its developer conference, Samsung announced the Galaxy Book S. Unveiled at CES 2020 and expected to ship midyear is the Lenovo ThinkPad X1 Fold.

More: Lakefield: Hybrid CPU with Foveros Technology (Press Kit) | All Intel Images

Intel Lakefield Foveros
Intel Fellow Wilfred Gomes, a member of Intel’s Silicon Engineering Group, holds a processor with the advanced packaging technology called Foveros. It combines unique three-dimensional stacking with a hybrid computing architecture that mixes and matches multiple types of cores for different functions. (Credit: Walden Kirsch/Intel Corporation)
» Click for full image

The post Up Close with Lakefield – Intel’s Chip with Award-Winning Foveros 3D Tech appeared first on Intel Newsroom.

A Visit to The Sinclair, an All-Digital Tech Hotel

A visit to The Sinclair, Autograph Collection, in Fort Worth, Texas, is a step back in time. With the green marble entryway, the original elevator doors and the cigar boxes on display, it’s 1929 again and this is a new office building.

On check-in, the experience is anything but vintage.

Using a smartphone app, a hotel guest at The Sinclair can adjust the temperature of the room, the light settings in the bedroom and bathroom, the window shades, and even the shower temperature to the exact degree. And once The Sinclair’s technology is added in hotels around the world, guests can count on their preferred settings personalizing their next hotel room before they ever step foot into it.

More: Intel and Sinclair Holdings Build First All-Digital Hotel for a Greener and More Personal Experience | Tour the High-Tech Hotel of the Future (Today Show) | Intel partnered with the Sinclair Hotel to create the “hotel of the future” (Fortune) | Sinclair Hotel Spotlight | Internet of Things News

Intel’s internet of things (IoT) technology weaves through the DNA of The Sinclair, which markets itself as the first all-digital hotel. Features include in-room sensors, IoT gateways, dashboards, and IoT-based restaurant sinks and appliances. Together, they create more sustainable and efficient building operations to in-room environments personalized for guests.

Intel-based technologies enable the hotel from the smart features to the reservation systems, point of sale, networking infrastructure back office, and guest services, such as mobile key and wireless charging. Intel is also providing NUCs to support the gateways, controllers, data aggregation and edge computing.

Sinclair Intel 1

» Download all images (ZIP, 116 MB)

Farukh Aslam, CEO and president of Sinclair Holdings LLC, came up with the idea for the smart hotel when he had issues with an LED lighting system in a different building. He wanted a system for lights that didn’t need to be connected by an electrician and didn’t require  proprietary software. He chose Voltserver’s Power over Ethernet (PoE) to power Cisco switches. The system controls The Sinclair’s more than 2,000 light fixtures, minibars and automated window shades. Each device has its own IP address and can be remotely controlled by staff and guests. The Sinclair is the first hotel to utilize this PoE technology, which is projected to cut energy consumption by 40%.

“We are great ecosystem builders and connectors, and so when we engage in a project like this, we bring that level of expertise to the table around who’s the best partner to bring in to solve your business problem,” says Stacey Shulman, chief innovation officer at Intel’s IoT Retail Solutions Division.

High-tech interactions with hotel guests don’t end in the room.

Cisco’s Meraki smart Wi-Fi cloud networking solution with SAS data analytics integration offers location-based analytics and personalized guest messaging. Guests who opt-in receive location-based text messages as they move around the hotel. For example, when a guest passes the bar, he may be sent a coupon for a free drink.

This technology also makes the hotel staff more efficient and improves the guest’s quality of service. Mobile devices allow hotel staff to connect to reservation and property management software, so guests can check in or get their questions answered anywhere on the premises. Guests can also order food and drinks anywhere on the property through wireless point of sale systems. And for the meeting rooms, Intel Unite® wireless collaboration technology allows guests and meeting attendees to collaborate on content from any of their devices.

Intel has not only provided the IoT technology, but also acted as a matchmaker for The Sinclair and other technology partners. “I love the fact that Intel has a pool of partners and they put you all together that has been amazing. It feels like you’re part of a family of innovators,” Aslam says.

This is just the beginning of IoT technology modernizing the hotel industry. Using the data collected by the IoT sensors and gateways, advanced analytics will provide the ultimate guest, associate and operational experience. Sending guests personalized messages, making buildings more environmentally friendly, and having guest preferences saved so that any hotel room feels like home will all be commonplace in the hotel of the future.

The post A Visit to The Sinclair, an All-Digital Tech Hotel appeared first on Intel Newsroom.