Intel and Google Cloud today announced a collaboration to develop telco cloud reference architectures and integrated solutions for communication service providers to accelerate 5G deployment across multiple network and edge locations. The partnership spans three main areas focused on:
Accelerating the ability of communications service providers to deploy their virtualized radio access network (RAN) and open RAN solutions with next-generation infrastructure and hardware.
Launching new lab environments to help communications service providers innovate for cloud native-based 5G networks.
Making it easier for communications service providers to deliver business applications to the network edge.
“Communications service providers can adopt cloud-native technologies to harness the potential of 5G both as a connectivity solution and as a business services platform to deliver applications to the network edge,” said Shailesh Shukla, vice president and general manager of networking at Google Cloud. “Expanding on our work with the telecommunications industry, we are excited to work with Intel to help customers plan, test and deploy the technology and infrastructure needed to accelerate the delivery of cloud-native 5G for consumer and enterprise use cases.”
This collaboration marks another important step forward in Intel’s journey to help transform the 5G network with a software-defined, agile and scalable infrastructure. The telco cloud reference architectures and integrated solutions from Intel and Google will help communications service providers further accelerate scalable network and edge deployment as they implement multicloud architectures. This is critical to achieving the full potential of 5G, edge and artificial intelligence across a range of industries, including retail, manufacturing and healthcare.
“The next wave of network transformation is fueled by 5G and is driving a rapid transition to cloud-native technologies. As communications service providers build out their 5G network infrastructure, our efforts with Google and the broader ecosystem will help them deliver agile, scalable solutions for emerging 5G and edge use cases,” said Dan Rodriguez, corporate vice president and general manager of the Network Platforms Group at Intel.
More information on use cases and the full news release can be found on Google’s website.
Martin G. Dixon Intel fellow and Vice President, Intel Security Architecture and Engineering Group
By Martin G. Dixon
For more than 50 years, Intel has played a key role in shaping the future of computing and communications technologies that are the foundation of the world’s innovations. We strive to design, manufacture and sell the world’s most secure technology products. We also understand there is an intersection between innovation and security that requires a sense of trust.
Utilizing the breadth and scale of our reach is not something we take lightly. It takes commitment and a willingness to invest heavily in building systems that are resistant to emerging threats and to strategize for those that are not yet realized.
IDC expects worldwide security spending to reach $174.7 billion in 2024 with a compound annual growth rate of 8.1% over the 2020-2024 forecast period.1
Every year, even as the total investment in cybersecurity grows, vulnerabilities persist with an ever-increasing volume of threats to the confidentiality, integrity and availability of data.
Security doesn’t just happen. At Intel, our success relies on the success of our customers, and it starts with us. We have a clear long-term strategy, and it boils down to our people, our processes and our products.
I am proud that many of the world’s greatest security experts are at Intel. These trusted leaders are embedded across every product group, from architects and designers to technologists and researchers, and help ensure we all operate with a security-first mindset.
It is our people who build new security capabilities, protect against evolving threats and co-engineer security solutions with our partners. Our products are highly complex, and we cannot anticipate the myriad ways in which they will be used nor how sophisticated third parties will seek to undermine their integrity. We work with skilled security researchers across the globe to identify, test and validate the security of Intel products through our Bug Bounty Program and academic programs, including the Side Channel Academic Program.
Beyond what we do for Intel, we also work with the broader community and contribute to industry standards, discussions and think tanks to accelerate industry-level progress in security. Our success depends on executing the best possible products, and for that, we must have a culture where individuals are heard and the best idea wins.
As Nilofer Merchant wrote in the Harvard Business Review, “Culture Trumps Strategy, Every Time.” It is this culture that helps ensure that everything we build is designed to deliver the highest performance and optimal protections.
As we consider who we are and what’s changing in the world, we prioritize innovation, execution, culture and impact. We established the Intel Security Architecture and Engineering Group to lead this effort.
The entirety of a product’s life needs to be secure, and our development practices stem from a security development lifecycle (SDL). Intel SDL is a robust set of processes that integrates security principles and privacy tenets into every step of product development, from concept to support. We take a holistic approach to SDL, customizing the process to address the highly integrated nature of hardware, firmware and software development. This helps to ensure the delivery of a trustworthy product that can be effectively supported from beginning to end of life.
Building security and privacy into products from concept to retirement is not only a strong development practice, but it is also essential to enable customers to truly unleash the power of their data.
Once products are released, we continue to support them and address vulnerabilities. Our SDL process is closely connected to the Intel Product Security Incident Response Team and our internal research efforts that contribute to ongoing security assurance for products both in development and in the field. We feed the learnings of vulnerabilities directly into the concept and architecture stages of our products — constantly learning as threats evolve.
In 2020, 92% of vulnerabilities addressed in our products were a direct result of the proactive investment in our processes. It is our processes that allow us to address threats in a manner that is both comprehensive and maintains high performance, while adapting to new classes of vulnerabilities.
Security is a system-level property rooted in the silicon. Every component in the system — from software to silicon — needs to do its part to help keep data secure.
Today, billions of devices are interconnected and operate in increasingly diverse and complex environments requiring workloads to execute seamlessly between different architectures, with data moving through a multitude of hierarchies. To address these challenges, our product strategy focuses on three areas: foundational security, workload protection and software reliability.
We start with a solid foundation of security to build upon. Intel has delivered security engines being used more than a billion times worldwide. Our platforms have features such as Intel® OS Guard, BIOS Guard and Boot Guard, which help them start up correctly and verify that it is running as expected. These and other technologies are the building blocks that provide ways to verify trustworthiness of devices and data.
Once a platform has started correctly, the next step is to protect workloads. These workloads vary depending on the environment, and to help protect data that moves through them, we continue to build upon silicon-based control schemes that optimize security and performance in foundational technologies. One such example of this is the work Intel is doing to accelerate the use and performance of stronger cryptographic algorithms that encrypt data.
The primary way attackers get into systems continues to be through something they can scale — and that is software. Intel has a history of improving software reliability by building silicon enhancements realized through logic inside the processor. These architectural advancements can result in considerably less execution overhead compared to software-only implementations. A recent example of this work is the release of Intel® Control-flow Enforcement Technology, which helps find the weaknesses that lead to common malware attack methods that have been a challenge to mitigate with software alone.
Security solutions rooted in hardware provide the greatest opportunity to provide security assurance against current and future threats. Intel hardware, and the added assurance and security innovation it brings, helps to harden the layers of the computing stack.
Intel is shaping the future of computing and communications technologies that are the foundation of the world’s innovations. Our success relies on the success of our customers and it is though our ongoing commitment and investment that we earn our customers’ trust.
Martin G. Dixon is an Intel fellow and vice president in the Intel Security Architecture and Engineering Group at Intel Corporation.
1 IDC’s Worldwide Security Spending Guide, 2020V2, July 2020.
We say that every December as we introduce Intel’s yearbook. And it’s always true. But this year it’s especially appropriate. We’ve grappled in our personal and professional lives with a world turned topsy-turvy by the pandemic. Still, it’s been a year of achievements — large and small — as day after day we conceive and craft world-changing technologies that enrich the lives of every person.
Our lives in 2020 have indeed been dominated by COVID-19. But collectively, more than 110,000 of us at Intel have achieved a great deal this year — in spite of its challenges.
The next few years promise to be exciting as analysts predict that by 2023, approximately 75% of data will be created outside the data center – in cities, factories, hospitals and stores. And more than 50% of that data will be processed, stored and analyzed directly at the edge, helping to deliver better latency, bandwidth, reliability, security and privacy.
As artificial intelligence becomes more pervasive and networks transform to deliver 5G, Intel’s leaders expect the edge to drive tremendous business value while also improving daily lives.
Here are their predictions.
Christine Boles Vice President, Internet of Things Group, and General Manager, Industrial Solutions Division, Intel
Accelerating industrial transformation: “The pandemic has greatly accelerated the need for companies to complete their Industry 4.0 transformations with solutions that allow them to have more flexibility, visibility and efficiency in their operations. We’ll see an acceleration of adoption of solutions that help address that need, ranging from AI including machine learning, machine vision and advanced analytics. As the economy bounces back, we’ll continue to see investment in the foundational OT infrastructure with more IT capabilities to allow the broad ecosystem of players to deploy these solutions and will see Industry 4.0 adoption significantly ramp up in 2021.”
Rick Echevarria Vice President, Sales, Marketing, and Communications Group, and General Manager, Olympic Program, Intel
Transforming sports: “In 2021, AI, 5G and edge computing will help athletes improve their athletic performance while transforming the way fans experience their favorite sports in a safe and interactive way, whether virtually, over broadcast or with a safe return to in-person.”
Joe Jensen Vice President, Internet of Things Group, and General Manager, Retail, Banking, Hospitality & Education, Intel
Rethinking education: “In 2021, shifting to Education-as-a-Service will become a priority, and I expect advances in education policy and investment to drive this concept forward. It will be critical to shift funding and allocations to schools to advance this service model, to ensure that affordable and high-quality education is accessible to all students. Longer-term, Education As-A-Service will become the standard for education across the globe.”
Accelerating seamless retail solutions: “Micro-fulfillment centers have enabled smaller retailers to keep up with online retail giants during the pandemic. Over the next year, we will see the ‘warehouse-ization’ of retail – with retailers shifting focus to fulfilling orders, whether they be groceries or consumer goods, at micro-fulfillment locations. This will provide a savings and operational boon especially for smaller retailers, for enabling decreased rents and customer foot traffic.
“In the long-term, retailers will continue to reply on seamless, convenient solutions like dark stores to cost effectively serve delivery customers. To be a ‘winner’ in the changing retail space, retailers must transform production methods in creative ways to meet customer expectations.”
Alex Quach Vice President and General Manager, Wireline and Core Network, Intel
Virtualizing the network: “Virtualization in the core network will hit a tipping point growing from 50%, to more than 80% of core network workloads to be virtualized in 2024, and we also expect the majority of the leading 5G Operators to start 5G standalone Core Deployments in 2021.”
Sameer Sharma General Manager, Smart Cities and Intelligent Transportation, Intel
Making cities smarter: “2021 will be a breakout year for smart and resilient cities, infrastructure and transportation. In the short-term, we’ll see a sharp increase of mid-size cities adopting smart cities technology, which will lead to the democratization of technology outside of the usual tech hubs. Longer-term, smart cities infrastructure will be adopted in more rural areas, as consumers start to see the benefits for quality of life.
“To reach this future, we’ll also see a ramp up in technology investments, from the Edge (AI) to the (5G) network to the cloud. As cities continue to recover from the pandemic, technology will be a key driver in ensuring progress and adoption of new business models, leading to economic growth.”
Stacey Shulman Vice President, Internet of Things Group, and General Manager, Health, Life Sciences and Emerging Technologies, Intel
Improving health outcomes: “One of the things that is currently holding the healthcare industry back is standardizing medical records and data sharing across organizations. Collaboration in the medical industry for the purpose of solving illness and health issues can be critical, especially when it comes to public health crises and tracking population health, as we have seen with the pandemic this year.
“In 2021, we will see improvement in the delivery models for information sharing, as emerging technologies such AI and federated learning become more ubiquitous in healthcare. In addition to powering innovations like telehealth, these technologies will accelerate and streamline the collaboration process, making it easier for healthcare professionals to deliver quality care to their patients as well as stay up to date on new treatment options.”
What’s New:Following a November announcement, Intel today released production of Intel® oneAPI toolkits for developing high-performance, cross-architecture applications for Intel® CPUs, GPUs and FPGAs, collectively described as XPUs. The version 2021.1 toolkits deliver oneAPI, an open, standards-based, unified cross-architecture programming model that provides developers the freedom to choose the best hardware for accelerated computing. In addition to the toolkit release, Lobachevsky University of Nizhni Novgorod announced a new oneAPI Center of Excellence.
“Extending Intel’s software development tools from CPUs to GPUs and FPGAs is a key milestone in our XPU journey. As we promised, the oneAPI industry initiative delivers on bringing an open, unified cross-architecture programming to the ecosystem¾providing an alternative to proprietary programming models. Our oneAPI toolkits, along with the Intel® DevCloud, provide the production tools needed to accelerate our advances into distributed intelligence era.”
–Raja Koduri, Intel senior vice president, chief architect and general manager of Architecture, Graphics and Software
Why oneAPI Matters: Today’s workloads benefit from specialized hardware architectures. However, these architectures have typically required unique languages and tools, which limits code reuse ¾ narrowing hardware choices and hindering adoption of innovative architectures. oneAPI’s heterogeneous programming model delivers performance without proprietary lock-in while interoperating with code written in familiar languages such as C, C++, Fortran and Python, and standards such as MPI and OpenMP.
Building on its rich heritage of proven developer tools, Intel’s oneAPI Base Toolkit includes compilers, performance libraries, analysis and debug tools, and a compatibility tool that aids in migrating code written in CUDA to Data Parallel C++ (DPC++). Additional toolkits for high performance computing (HPC), artificial intelligence (AI), internet of things and rendering provide tools and components to help accelerate specialized workloads.
Intel oneAPI toolkits enable developers to build cross-architecture applications using a single-code base across XPUs that take advantage of unique hardware features and lower software development and maintenance costs. Developers can choose the best architecture for the problem they are trying to solve without needing to rewrite software for the next architecture and platform.
Where to Get the Toolkits: The toolkits are free to download and use locally, or from the Intel® DevCloud, where developers can develop and test code and workloads on a variety of Intel CPUs, GPUs and FPGAs, and where select customers are already developing with oneAPI on the Intel® Iris® Xe-HP development platform. Access options include web download, repositories and containers. The toolkits also offer commercial versions providing worldwide support from Intel technical consulting engineers.
About the New oneAPI Center of Excellence: Lobachevsky University of Nizhni Novgorod (UNN) today announced a new oneAPI Center of Excellence (CoE) to facilitate studies in contemporary physics using the power of CPUs, GPUs and other accelerators with oneAPI cross-architecture programming. The Lobachevsky University oneAPI CoE joins others in place at the Stockholm University, Heidelberg University and the University of Illinois. UNN researchers’ first software to be ported to oneAPI is a high-intensity collisions and interactions open source framework, which is intended for the simulation of high-intensity laser-matter interactions.
About oneAPI Ecosystem Support: Since 2019, oneAPI ecosystem support has steadily grown. More than 60 leading research organizations, companies and universities support the oneAPI initiative and some note their success using Intel oneAPI toolkits. See oneAPI ecosystem support and reviews site for details. A new oneAPI applications catalog details more than 230 applications powered by oneAPI.
About Developer Resources: The following resources are available to help developers build high-performance, cross-architecture applications using oneAPI and the Intel oneAPI Toolkits:
Training: Free training is available via webinars, deep dive workshops, full learning paths, and more. For customers needing assistance accelerating HPC and AI solutions using oneAPI, a group of specially trained companies offer consulting through a new Intel® oneAPI Technology Partner.
Performance results are based on testing as of dates shown in configurations and may not reflect all publicly available updates. See backup for configuration details. No product or component can be absolutely secure.
Intel technologies may require enabled hardware, software or service activation.
No product or component can be absolutely secure.
Your costs and results may vary.
Intel does not control or audit third-party data. You should consult other sources to evaluate accuracy.
All product plans and roadmaps are subject to change without notice.
What’s New: Today, at Intel Labs Day, Intel highlighted industry-leading technological advances toward the realization of the company’s long-standing vision of integrating photonics with low-cost, high-volume silicon. The advancements represent critical progress in the field of optical interconnects, which address growing challenges around the performance scaling of electrical input/output (I/O) as compute-hungry data workloads increasingly overwhelm network traffic in data centers. Intel demonstrated advances in key technology building blocks, including miniaturization, paving the way for tighter integration of optical and silicon technologies.
“We are approaching an I/O power wall and an I/O bandwidth gap that will dramatically hinder performance scaling. The rapid progress Intel is making in integrated photonics will enable the industry to fully re-imagine data center networks and architectures that are connected by light. We have now demonstrated all of the critical optical technology building blocks on one silicon platform, tightly integrated with CMOS silicon. Our research on tightly integrating photonics with CMOS silicon can systematically eliminate barriers across cost, power and size constraints to bring the transformative power of optical interconnects to server packages.”
–James Jaussi, senior principal engineer and director of PHY Lab, Intel Labs
Why it matters: New data-centric workloads are growing every day within the data center, with ever-increasing data movement from server to server that is taxing the capabilities of today’s network infrastructure. The industry is quickly approaching practical limits of electrical I/O performance. As bandwidth demand for compute keeps increasing, electrical I/O isn’t scaling to keep pace, resulting in an “I/O power wall” that limits available power for compute operations. By bringing optical I/O directly into our servers and onto our packages, we can break down this barrier, enabling data to move more efficiently.
About the New Technology Building Blocks: At the Intel Labs virtual event today, Intel demonstrated key progress in critical technology building blocks that are fundamental to the company’s integrated photonics research. These technology building blocks — including light generation, amplification, detection, modulation, complementary metal-oxide semiconductor (CMOS) interface circuits and package integration — are essential to achieve integrated photonics. A prototype shown at the event featured tight coupling of photonics and CMOS technologies, serving as a proof-of-concept of future full integration of optical photonics with core compute silicon. Intel also showcased micro-ring modulators that are 1000x smaller than traditional components. The large size and cost of conventional silicon modulators have been a barrier to bringing optical technology onto server packages, which require the integration of hundreds of these devices. These combined results pave the way for the extended use of silicon photonics beyond the upper layers of the network to inside the server and onto future server packages.
Key technology building blocks showcased:
Micro-ring modulators: Conventional silicon modulators take up too much area and are costly to place on IC packages. By developing micro-ring modulators, Intel has miniaturized the modulator by a factor of more than 1,000, thereby eliminating a key barrier to integrating silicon photonics onto a compute package.
All-silicon photodetector: For decades, the industry has believed silicon has virtually no light detection capability in the 1.3-1.6um wavelength range. Intel showcased research that proves otherwise. Lower cost is one of the main benefits of this breakthrough.
Integrated semiconductor optical amplifier: As the focus turns to reducing total power consumption, integrated semiconductor optical amplifiers are an indispensable technology, made possible with the same material used for the integrated laser.
Integrated multi-wavelength lasers: Using a technique called wavelength division multiplexing, separate wavelengths can be used from the same laser to convey more data in the same beam of light. This enables additional data to be transmitted over a single fiber, increasing bandwidth density.
Integration: By tightly integrating silicon photonics and CMOS silicon through advanced packaging techniques, we can gain three benefits: lower power, higher bandwidth and reduced pin count. Intel is the only company that has demonstrated integrated multi-wavelength lasers and semiconductor optical amplifiers, all-silicon photodetectors, and micro-ring modulators on a single technology platform tightly integrated with CMOS silicon. This research breakthrough paves the path for scaling integrated photonics.
What’s Next: Integrated photonics research demonstrated at the event showcased meaningful progress toward Intel’s ambitious goal initiated many years ago to tap light as the basis of connectivity technology. The new research opens possibilities, including future architectures that are more disaggregated, with multiple functional blocks such as compute, memory, accelerators and peripherals spread throughout the entire network and interconnected via optical and software in high-speed and low-latency links.
What’s New: As the telecommunications industry transitions to 5G, the next wave of network transformation represents a $25 billion silicon opportunity by 2023. To benefit from a perfect storm of 5G, edge buildout and pervasive artificial intelligence (AI), Intel today announced an expanded lineup of hardware, software and solutions for network infrastructure, including: enhancements to Intel’s software reference architecture, FlexRAN; Intel® virtualized radio access network (vRAN) dedicated accelerator; network-optimized next-generation Intel® Xeon® Scalable and D processors (code-named “Ice Lake”); and upgraded Intel® Select Solutions for Network Function Virtualization Infrastructure (NFVI).
“When you consider the collective impact of the proliferation of fully virtualized cloud architectures combined with the commercialization of 5G, the rise of AI and the growth of the edge, it truly has a multiplier effect that makes each more impactful than it would be on its own. It’s an enormous opportunity for us and our customers to not only deliver new experiences but transform entire industries.”
–Dan Rodriguez, Intel corporate vice president and general manager of the Network Platforms Group
Why It Matters: For the past decade, Intel has been on a journey with the communications industry to transform the network with a software-defined, agile and scalable infrastructure. The next wave of network transformation is further fueled by 5G, driven by the need to deliver both network services and new AI-based edge services across multiple network locations. This wave is driving a rapid transition to cloud native technologies and virtualization with an expected 50% of core network deployments transforming to virtualized networks this year1, and virtualization extending to the radio access network (RAN). Implementing a cloud architecture brings the same server economics that transformed the data center and enhances security by allowing networks to be more rapidly repaired, updated and protected. Intel’s full suite of feature-rich silicon, software and tools– and experience in supporting customers transform networks enable quicker deployment across core, access and edge.
Expanded portfolio offerings include:
FlexRAN: Intel’s software reference architecture grew to nearly 100 licensees and added enhancements including optimizations to its massive multiple input, multiple output (MIMO) mid-band pipeline for increased bandwidth and support for ultra-reliable low-latency communication (URLLC.) Amdocs, a licensee, today announced FlexRAN integration with its SmartRAN analytics solution.
Intel® vRAN Dedicated Accelerator ACC100: The low-power and low-cost acceleration solution for vRAN deployments is based on Intel® eASIC technology and is sampling to customers. It offloads and accelerates the computing-intensive process of forward error correction. This frees up more processing power within Intel Xeon processors for channel capacity and edge-based services and applications. To bring the product to market, Intel works with leading service providers including Telefonica and various partners, including Altiostar, ASTRI, Baicells, Comba, H3C, HPE, Mavenir, Nokia, QCT, Radisys, Ruijie, Silicom, Supermicro, and ZT Systems.
Next Generation Intel Xeon processors for network infrastructure: With these processors, customers can use a common architecture across the network for various workloads and performance requirements.
Network-optimized 3rd Generation Intel Xeon Scalable processors (code-named “Ice Lake-SP”) are designed for infrastructure use cases that require higher performance per watt, including wireless core, wireless access and network edge workloads and security appliances. 3rd Generation Intel Xeon Scalable processors will ship to customers at the end of the year.
Next-generation Intel Xeon D processors (code-named “Ice Lake-D”) are designed for form factor-constrained environments at the edge and will offer greater levels of integration like built-in networking IP. Intel expects to start shipping these processors to customers in mid-2021.
Enhanced Intel® Select Solutions for network: To improve application efficiency and network performance for high-performance network workloads, Intel Select Solutions for NFVI Red Hat, NFVI Ubuntu and NFVI Forwarding Platform have been upgraded to support the new Intel® Ethernet 800 Series Network Adapter (code-named “Columbiaville”), which delivers increased performance and Dynamic Device Personalization (DDP) to maximize platform performance. These upgraded solutions are coming soon.
What Customers Are Deploying:
Rakuten Mobile: Rakuten Mobile’s 5G mobile network, launched Sept. 30, is architected with a breadth of Intel technology. “By building a virtualized, cloud native network we realize significant economies of scale that kept the capital and operating costs of the network efficient,” said Tareq Amin, CTO, Rakuten Mobile Inc., and group executive vice president and CAO at Rakuten. “Harnessing proven cloud technologies and underpinning our network with Intel technologies like FlexRAN, Intel processors, field programmable gate arrays (FPGAs), and OpenNESS toolkit, gives us a powerful foundation to deliver immersive experiences and support a variety of edge computing applications.”
SK Telecom: SK Telecom announced a formal collaboration with Hewlett-Packard Enterprise, Intel and Samsung Electronics that will result in more rapid introduction of new hardware and software technologies, like the upcoming 3rd generation Intel Xeon Scalable processors (code-named “Ice Lake”), into SK Telecom’s network. “As a leading chip company, Intel has been securing countless strengths including an extensive product portfolio and a broad ecosystem including hardware, software and application developers,” said Kang Jong-ryeol, vice president and head of ICT Infrastructure Center of SK Telecom. “To drive leadership, we need to be more agile in adopting and deploying innovative technologies and Intel is a critical and strategic partner to work with.”
Verizon: In collaboration with Intel, Samsung and Wind River, Verizon successfully completed the world’s first fully virtualized end-to-end 5G data session to enable faster response to customers’ latency and computing needs.
What’s Next: Intel is the world’s leading network silicon provider. Its diverse network infrastructure and edge-ready product offerings, robust developer tools and global partner ecosystem deliver breakthrough business value across the telecommunications industry. These transformations across the network are critical to achieve the full potential of 5G, edge and AI outcomes across a range of industries, including retail, education, healthcare and more. With more than 15,000 edge deployments, Intel is helping customers deliver better business outcomes today and into the future.
Tom Lantzsch Senior Vice President
General Manager, Internet of Things Group
Dan Rodriguez Corporate Vice President
General Manager, Network Platforms Group
By Tom Lantzsch and Dan Rodriguez
Without a question, we are at a key industry inflection point with the exponential growth of data creating a massive opportunity for new business insight and revenue-generating services.
Cloud workloads are diversifying, networks are transforming to deliver 5G, artificial intelligence (AI) is pervasive and expanding, and more computing performance is moving to the edge.
Industry analysts speak to the expansion of edge computing, noting that by 2023, 75% of the data created will be outside the data center. It will be in factories, hospitals, retail stores and cities and driven by many forms of video. Additionally, more than 50% of that data will be processed, stored and analyzed closer to the creation of the data – at the edge – to deliver the right latency, bandwidth, reliability, security and privacy for a wide variety of uses across many markets.
At Intel, we’ve been transforming computing at the edge for years – delivering customer value across a range of industries from industrial to retail to telecommunications. To meet the significant $65 billion edge silicon opportunity we expect by 2024, we are constantly expanding our suite of edge technology solutions, including purpose-designed, feature-rich silicon, open and optimized software and tools, and hundreds of preconfigured edge-to-cloud solutions.
As an example, Audi uses Intel-based edge analytics and machine learning to automate and enhance critical quality-control processes for the welds on its vehicles. Its factory systems eliminate the need to perform manual inspections. As a result, Audi simultaneously has cut labor costs by 30% to 50% and boosted weld inspections by 100 times with only 18 milliseconds latency using a repeatable, Intel-based platform that it can now extend to automate and optimize other factory processes.
To further deliver the products and solutions our customers need to drive their businesses forward, at the Intel Industrial Summit we introduced two new processors that will bring features such as new AI, security, functional safety and real-time capabilities to edge customers. Developed alongside the silicon are software tools and hardware modules that accelerate time to market for a wide range of vertical solutions so customers can quickly customize their edge applications.
In addition to what we are building, we have cultivated and are engaged with a vast ecosystem of more than 1,200 partners focused on edge computing. Working with our partners, we have more than 15,000 end customer deployments across nearly every industry. It’s a number that is growing rapidly. With Intel’s diverse edge-ready product portfolio, robust developer tools and a global partner ecosystem, we are delivering breakthrough customer value today with such organizations as Accenture, Bosch, ExxonMobil, Lumen Technologies (formerly CenturyLink), Philips, Sensormatic, Verizon and ViewSonic, among others.
At Intel, we have been, and will continue to focus on helping our customers drive better business outcomes at the edge.
Thomas (Tom) P. Lantzsch is senior vice president and general manager of the Internet of Things (IoT) Group at Intel Corporation.
Daniel (Dan) C. Rodriguez is corporate vice president and general manager of the Network Platforms Group at Intel Corporation.
“By 2023, up to 70% of all enterprises will process data at the edge.1 11th Gen Intel Core processors, Intel Atom x6000E series, and Intel Pentium and Celeron N and J series processors represent our most significant step forward yet in enhancements for IoT, bringing features that address our customers’ current needs, while setting the foundation for capabilities with advancements in AI and 5G.”
–John Healy, Intel vice president of the Internet of Things Group and general manager of Platform Management and Customer Engineering
Why It’s Important: Intel works closely with customers to build proofs of concept, optimize solutions and collect feedback along the way. Innovations delivered with 11th Gen Intel Core processors, Intel Atom x6000E series, and Intel Pentium and Celeron N and J series processors are a response to challenges felt across the IoT industry: edge complexity, total cost of ownership and a range of environmental conditions.
Combining a common and seamless developer experience with software and tools like the Edge Software Hub’s Edge Insights for Industrial and the Intel® Distribution of OpenVINO™ toolkit, Intel helps customers and developers get to market faster and deliver more powerful outcomes with optimized, containerized packages to enable sensing, vision, automation and other transformative edge applications. For example, when combined with 11th Gen’s SuperFin process improvements and other enhancements, OpenVINO running on an 11th Gen Core i5 delivers amazing AI performance: up to 2 times faster inferences per second than a prior 8th Gen Core i5-8500 processor when running on just the CPU in each product.2
About 11th Gen Core Processors: Building on the recently announced client processors, 11th Gen Core is enhanced specifically for essential IoT applications that require high-speed processing, computer vision and low-latency deterministic computing. It delivers up to a 23% performance gain in single-thread performance, a 19% gain in multithread performance and up to a 2.95x performance gain in graphics gen on gen.3 New dual-video decode boxes allow the processor to ingest up to 40 simultaneous video streams at 1080p 30 frames per second and output up to four channels of 4K or two channels of 8K video. AI-inferencing algorithms can run on up to 96 graphic execution units (INT8) or run on the CPU with vector neural network instructions (VNNI) built in. With Intel® Time Coordinated Computing (Intel® TCC Technology) and time-sensitive networking (TSN) technologies, 11th Gen processors enable real-time computing demands while delivering deterministic performance across a variety of use cases:
Industrial sector: Mission-critical control systems (PLC, robotics, etc.), industrial PCs and human-machine interfaces.
Retail, banking and hospitality: Intelligent, immersive digital signage, interactive kiosks and automated checkout.
Healthcare: Next-generation medical imaging devices with high-resolution displays and AI-powered diagnostics.
Smart city: Smart network video recorders with onboard AI inferencing and analytics.
Intel’s 11th Gen Core processors already have over 90 partners committed to delivering solutions to meet customers’ demands.
About Intel Atom x6000E Series and Intel Pentium and Celeron N and J Series Processors: These represent Intel’s first processor platform enhanced for IoT. They deliver enhanced real-time performance and efficiency; up to 2 times better 3D graphics;4 a dedicated real-time offload engine; Intel® Programmable Services Engine, which supports out-of-band and in-band remote device management; enhanced I/O and storage options; and integrated 2.5GbE time-sensitive networking. They can support 4Kp60 resolution on up to three simultaneous displays, meet strict functional safety requirements with the Intel® Safety Island and include built-in hardware-based security. These processors5 have a variety of use cases, including:
Industrial: Real-time control systems and devices that meet functional safety requirements for industrial robots and for chemical, oil field and energy grid-control applications.
Transportation: Vehicle controls, fleet monitoring and management systems that synchronize inputs from multiple sensors and direct actions in semiautonomous buses, trains, ships and trucks.
Healthcare: Medical displays, carts, service robots, entry-level ultrasound machines, gateways and kiosks that require AI and computer vision with reduced energy consumption.
Retail and hospitality: Fixed and mobile point-of-sale systems for retail and quick service restaurant with high-resolution graphics.
The Intel Atom x6000E series and Intel Pentium and Celeron N and J series already have over 100 partners committed to delivering solutions.
About the Intel Industrial Summit: Intel is bringing the Industrial IoT (IIoT) ecosystem together to address their specific challenges while expanding what’s possible for tomorrow’s autonomous operations. With over 40 partners and sessions plus nine demos, customers will learn about secure, interoperable, integrated solutions available to transform their business by reducing the time, costs and risks that come with IIoT deployments.
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors.
Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations, and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information, visit http://www.intel.com/benchmarks .
Performance results are based on testing as of dates shown in configurations and may not reflect all publicly available updates. See backup for configuration details. No product or component can be absolutely secure.
Intel’s compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.
Results that are based on systems and components as well as results that have been estimated or simulated using an Intel Reference Platform (an internal example new system), internal Intel analysis or architecture simulation or modeling are provided to you for informational purposes only. Results may vary based on future changes to any systems, components, specifications or configurations.
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3 Source: Intel. Performance claim based on SPEC CPU 2017 metrics estimated by measurements on Intel internal reference platforms completed on August 27, 2020. Graphics claim based on3DMark11_V1.0.4 Graphics Score estimated by measurements on Intel internal reference platforms on August 27, 2020.Testing Configuration:Processor: Intel® Core™ i7 1185G7E PL1=15W TDP, 4C8T Turbo up to 4.4GHzGraphics: Intel Graphics Gen 12 gfxMemory: 16GB DDR4-3200Storage: Intel SSDPEKKW512GB (512 GB, PCI-E 3.0 x4)OS: Windows* 10 Pro (x64) Build 19041.331 (2004/ May 2020 Update). Power policy set to AC/Balanced mode for all benchmarks. All benchmarks run in Admin mode & Tamper Protection Disabled / De-fender Disabled.Bios: Intel Corporation TGLSFWI1.R00.3333.A00.2008122042 OneBKC: tgl_b2b0_up3_pv_up4_qs_ifwi_2020_ww32_4_01 Processor: Intel® Core™ i7 – 8665UE 15W PL1=15W TDP, 4C8T Turbo up to 4.4GHzGraphics: Intel Graphics Gen 9 gfxMemory: 16GB DDR4-2400Storage: Intel SSD 545S (512GB)OS: Windows* 10 Enterprise (x64) Build 18362.175 (1903/ May 2019 Update). Power policy set to AC/Balanced mode for all benchmarks. All benchmarks run in Admin mode & Tamper Protection Dis-abled / Defender Disabled.Bios: CNLSFWR1.R00.X208.B00.1905301319
4 Source: Intel. Claims based on a) SPEC CPU 2006 metric estimates based on Pre-Si projections and b) 3DMark11 estimates based on Pre-Si projections, using Intel® Pentium® J4205 as prior gen.
Performance results are based on projections as of September 1, 2020
Processor: Intel® Pentium® J6425 PL1=10W TDP, 4C4T Turbo up to 3.0GHz
Graphics: Intel Graphics Gen 11 gfx
Memory: 16GB LPDDR4-3200
OS: Windows 10 Pro
Compiler version: IC18
Processor: Intel® Pentium® J4205 PL1=10W TDP, 4C4T Turbo up to 2.6GHz
Graphics: Intel® Graphics Gen 9 gfx
Memory: 16GB LPDDR4-2400
OS: Windows 10 Pro
Compiler version: IC18
Performance numbers are Pre-Si projections and are subject to change. Results reported may need to be revised as additional testing is conducted. The results depend on the specific platform configurations and workloads utilized in the testing, and may not be applicable to any particular users components, computer system or workloads. The results are not necessarily representative of other benchmarks.
What’s New: At Baidu World 2020, Intel announced a series of collaborations with Baidu in artificial intelligence (AI), 5G, data center and cloud computing infrastructure. Intel and Baidu executives discussed the trends of intelligent infrastructure and intelligent computing, and shared details on the two companies’ strategic vision to jointly drive the industry’s intelligent transformation within the cloud, network and edge computing environments.
“In China, the most important thing for developing an industry ecosystem is to truly take root in the local market and its users’ needs. With the full-speed development of ‘new infrastructure’ and 5G, China has entered the stage of accelerated development of the industrial internet. Intel and Baidu will collaborate comprehensively to create infinite possibilities for the future through continuous innovation, so that technology can enrich the lives of everyone.”
– Rui Wang, Intel vice president in the Sales & Marketing Group and PRC country manager
Why It Matters: Zhenyu Hou, corporate vice president of Baidu, said that Baidu and Intel are both extremely focused on technology innovation and have always been committed to promoting intelligent transformation through innovative technology exploration. In the wave of new infrastructure, Baidu continues to deepen its collaboration with Intel to seize opportunities in the AI industry and bring more value to the industry, society and individuals.
A Series of Recent Collaborations:
AI in the Cloud: Intel and Baidu have delivered technological innovations over the past decade, from search and AI to autonomous driving, 5G and cloud services. Recently Baidu and Intel worked on customizing Intel® Xeon® Scalable processors to deliver optimized performance, thermal design power (TDP), temperature and feature sets within Baidu’s cloud infrastructure. With the latest 3rd generation Intel Xeon Scalable processor with built-in BFloat16 instruction set, Intel supports Baidu’s optimization of the PaddlePaddle framework to provide enhanced speech prediction services and multimedia processing support within the Baidu cloud to deliver highly optimized, highlight efficient cloud management, operation and maintenance.
Next-Gen server architecture: Intel and Baidu have designed and carried out the commercial deployment of next-generation 48V rack servers based on Intel Xeon Scalable processors to achieve higher rack power density, reduce power consumption and improve energy efficiency. The two companies are working to drive ecosystem maturity of 48V and promote the full adoption of 48V in the future based on the next-generation Xeon® Scalable processor (code named Sapphire Rapids).
Networking: In an effort to improve virtualization and workload performance, while accelerating data processing speeds and reducing total cost of ownership (TCO) within Baidu infrastructure, Intel and Baidu are deploying Smart NIC (network interface card) innovations based on Intel® SoC FPGAs and Intel® Ethernet 800 Series adapter with Application Device Queues (ADQ) technology. Smart NICs greatly increase port speed, optimize network load, realize large-scale data processing, and create an efficient and scalable bare metal and virtualization environment for the Baidu AICloud.
Baidu Smart NICs are built on the latest Intel Ethernet 800 series, Intel Xeon-D processor and Intel Arria® 10-based FPGAs. From the memory and storage side, Intel and Baidu built a high-performance, ultra-scalable, and unified user space single-node storage engine using Intel® Optane™ persistent memory and Intel Optane NVMe SSDs to enable Baidu to configure multiple storage scenarios through one set of software.
5G and edge computing: In the area of 5G and edge computing, Intel and Baidu have utilized their technology expertise and collaborated on a joint innovation using the capabilities of the OpenNESS (Open Network Edge Services Software) toolkit developed by Intel, and Baidu IME (Intelligent Mobile Edge), to help achieve a highly reliable edge compute solution with AI capabilities for low-latency applications.
What’s Next: Looking forward, Intel will continue to leverage its comprehensive data center portfolio to collaborate with Baidu on a variety of developments including:
Developing a future autonomous vehicle architecture platform and intelligent transportation vehicle-road computing architecture.
Exploring mobile edge computing to provide users with edge resources to connect Baidu AI operator services.
Expanding Baidu Smart Cloud in infrastructure technology.
Improving the optimization of Xeon Scalable processors and PaddlePaddle.
Bringing increased benefits to Baidu online AI businesses, thus creating world-changing technology that truly enriches lives.