Intel, Baidu Drive Intelligent Infrastructure Transformation

Intel and Baidu
Baidu World 2020: Rui Wang (right), Intel vice president in the Sales and Marketing Group and PRC country manager, and Zhenyu Hou, corporate vice president of Baidu, discuss the two companies’ on-going strategic collaboration to bring intelligent infrastructure and intelligent computing to Baidu and its customers.

What’s New: At Baidu World 2020, Intel announced a series of collaborations with Baidu in artificial intelligence (AI), 5G, data center and cloud computing infrastructure. Intel and Baidu executives discussed the trends of intelligent infrastructure and intelligent computing, and shared details on the two companies’ strategic vision to jointly drive the industry’s intelligent transformation within the cloud, network and edge computing environments.

“In China, the most important thing for developing an industry ecosystem is to truly take root in the local market and its users’ needs. With the full-speed development of ‘new infrastructure’ and 5G, China has entered the stage of accelerated development of the industrial internet. Intel and Baidu will collaborate comprehensively to create infinite possibilities for the future through continuous innovation, so that technology can enrich the lives of everyone.”
– Rui Wang, Intel vice president in the Sales & Marketing Group and PRC country manager

Why It Matters: Zhenyu Hou, corporate vice president of Baidu, said that Baidu and Intel are both extremely focused on technology innovation and have always been committed to promoting intelligent transformation through innovative technology exploration. In the wave of new infrastructure, Baidu continues to deepen its collaboration with Intel to seize opportunities in the AI industry and bring more value to the industry, society and individuals.

A Series of Recent Collaborations:

  • AI in the Cloud: Intel and Baidu have delivered technological innovations over the past decade, from search and AI to autonomous driving, 5G and cloud services. Recently Baidu and Intel worked on customizing Intel® Xeon® Scalable processors to deliver optimized performance, thermal design power (TDP), temperature and feature sets within Baidu’s cloud infrastructure. With the latest 3rd generation Intel Xeon Scalable processor with built-in BFloat16 instruction set, Intel supports Baidu’s optimization of the PaddlePaddle framework to provide enhanced speech prediction services and multimedia processing support within the Baidu cloud to deliver highly optimized, highlight efficient cloud management, operation and maintenance.
  • Next-Gen server architecture: Intel and Baidu have designed and carried out the commercial deployment of next-generation 48V rack servers based on Intel Xeon Scalable processors to achieve higher rack power density, reduce power consumption and improve energy efficiency. The two companies are working to drive ecosystem maturity of 48V and promote the full adoption of 48V in the future based on the next-generation Xeon® Scalable processor (code named Sapphire Rapids).
  • Networking: In an effort to improve virtualization and workload performance, while accelerating data processing speeds and reducing total cost of ownership (TCO) within Baidu infrastructure, Intel and Baidu are deploying Smart NIC (network interface card) innovations based on Intel® SoC FPGAs and Intel® Ethernet 800 Series adapter with Application Device Queues (ADQ) technology. Smart NICs greatly increase port speed, optimize network load, realize large-scale data processing, and create an efficient and scalable bare metal and virtualization environment for the Baidu AICloud.
  • Baidu Smart NICs are built on the latest Intel Ethernet 800 series, Intel Xeon-D processor and Intel Arria® 10-based FPGAs. From the memory and storage side, Intel and Baidu built a high-performance, ultra-scalable, and unified user space single-node storage engine using Intel® Optane™ persistent memory and Intel Optane NVMe SSDs to enable Baidu to configure multiple storage scenarios through one set of software.
  • 5G and edge computing: In the area of 5G and edge computing, Intel and Baidu have utilized their technology expertise and collaborated on a joint innovation using the capabilities of the OpenNESS (Open Network Edge Services Software) toolkit developed by Intel, and Baidu IME (Intelligent Mobile Edge), to help achieve a highly reliable edge compute solution with AI capabilities for low-latency applications.

What’s Next: Looking forward, Intel will continue to leverage its comprehensive data center portfolio to collaborate with Baidu on a variety of developments including:

  • Developing a future autonomous vehicle architecture platform and intelligent transportation vehicle-road computing architecture.
  • Exploring mobile edge computing to provide users with edge resources to connect Baidu AI operator services.
  • Expanding Baidu Smart Cloud in infrastructure technology.
  • Improving the optimization of Xeon Scalable processors and PaddlePaddle.
  • Bringing increased benefits to Baidu online AI businesses, thus creating world-changing technology that truly enriches lives.

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Intel and VMware Extend Virtualization to Radio Access Network for 5G

vmware 2x1 1Intel and VMware Inc. today announced a collaboration on an integrated software platform for virtualized radio access networks (RAN) to accelerate the rollout of both existing LTE and future 5G networks.

More: 5G & Wireless Communications News

As communications service providers (CoSPs) evolve their networks to support the rollout of future 5G networks, they are increasingly adopting a software-defined, virtualized infrastructure. Virtualization of the core network enables CoSPs to improve operational costs and bring services to market faster.

“Many CoSPs are choosing to extend the benefits of network virtualization into the RAN for increased agility as they roll out new 5G services, but the software integration can be rather complex. With the integrated vRAN platform, combined with leading technology and expertise from Intel and VMware, CoSPs are positioned to benefit from accelerated time to deployment of innovative services at the edge of their network,” said Dan Rodriguez, corporate vice president and general manager of the Network Platforms Group at Intel.

Specific use cases and the full news release can be found on VMware’s website.

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Intel and National Science Foundation Invest in Wireless-Specific Machine Learning Edge Research

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What’s New: Today, Intel and the National Science Foundation (NSF) announced award recipients of joint funding for research into the development of future wireless systems. The Machine Learning for Wireless Networking Systems (MLWiNS) program is the latest in a series of joint efforts between the two partners to support research that accelerates innovation with the focus of enabling ultra-dense wireless systems and architectures that meet the throughput, latency and reliability requirements of future applications. In parallel, the program will target research on distributed machine learning computations over wireless edge networks, to enable a broad range of new applications.

“Since 2015, Intel and NSF have collectively contributed more than $30 million to support science and engineering research in emerging areas of technology. MLWiNS is the next step in this collaboration and has the promise to enable future wireless systems that serve the world’s rising demand for pervasive, intelligent devices.”
– Gabriela Cruz Thompson, director of university research and collaborations at Intel Labs

Why It’s Important: As demand for advanced connected services and devices grows, future wireless networks will need to meet the challenging density, latency, throughput and security requirements these applications will require. Machine learning shows great potential to manage the size and complexity of such networks – addressing the demand for capacity and coverage while maintaining the stringent and diverse quality of service expected from network users. At the same time, sophisticated networks and devices create an opportunity for machine learning services and computation to be deployed closer to where the data is generated, which alleviates bandwidth, privacy, latency and scalability concerns to move data to the cloud.

“5G and Beyond networks need to support throughput, density and latency requirements that are orders of magnitudes higher than what current wireless networks can support, and they also need to be secure and energy-efficient,” said Margaret Martonosi, assistant director for computer and information science and engineering at NSF. “The MLWiNS program was designed to stimulate novel machine learning research that can help meet these requirements – the awards announced today seek to apply innovative machine learning techniques to future wireless network designs to enable such advances and capabilities.”

What Will Be Researched: Through MLWiNS, Intel and NSF will fund research with the goal of driving new wireless system and architecture design, increasing the utilization of sparse spectrum resources and enhancing distributed machine learning computation over wireless edge networks. Grant winners will conduct research across multiple areas of machine learning and wireless networking. Key focus areas and project examples include:

Reinforcement learning for wireless networks: Research teams from the University of Virginia and Penn State University will study reinforcement learning for optimizing wireless network operation, focusing on tackling convergence issues, leveraging knowledge-transfer methods to reduce the amount of training data necessary, and bridging the gap between model-based and model-free reinforcement learning through an episodic approach.

Federated learning for edge computing:

  • Researchers from the University of North Carolina at Charlotte will explore methods to speed up multi-hop federated learning over wireless communications, allowing multiple groups of devices to collaboratively train a shared global model while keeping their data local and private. Unlike classical federated learning systems that utilize single-hop wireless communications, multi-hop system updates need to go through multiple noisy and interference-rich wireless links, which can result in slower updates. Researchers aim to overcome this challenge by developing a novel wireless multi-hop federated learning system with guaranteed stability, high accuracy and a fast convergence speed by systematically addressing the challenges of communication latency, and system and data heterogeneity.
  • Researchers from the Georgia Institute of Technology will analyze and design federated and collaborative machine-learning training and inference schemes for edge computing, with the goal of increasing efficiency over wireless networks. The team will address challenges with real-time deep learning at the edge, including limited and dynamic wireless channel bandwidth, unevenly distributed data across edge devices and on-device resource constraints.
  • Research from the University of Southern California and the University of California, Berkeley will focus on a coding-centric approach to enhance federated learning over wireless communications. Specifically, researchers will work to tackle the challenges of dealing with non-independent and identically distributed data, and heterogeneous resources at the wireless edge, and minimizing upload bandwidth costs from users, while emphasizing issues of privacy and security when learning from distributed data.

Distributed training across multiple edge devices: Rice University researchers will work to train large-scale centralized neural networks by separating them into a set of independent sub-networks that can be trained on different devices at the edge. This can reduce training time and complexity, while limiting the impact on model accuracy.

Leveraging information theory and machine learning to improve wireless network performance: Research teams from the Massachusetts Institute of Technology and Virginia Polytechnic Institute and State University will collaborate to explore the use of deep neural networks to address physical layer problems of a wireless network. They will exploit information theoretic tools in order to develop new algorithms that can better address non-linear distortions and relax simplifying assumptions on the noise and impairments encountered in wireless networks.

Deep learning from radio frequency signatures: Researchers at Oregon State University will investigate cross-layer techniques that leverage the combined capabilities of transceiver hardware, wireless radio frequency (RF) domain knowledge and deep learning to enable efficient wireless device classification. Specifically, the focus will be on exploiting RF signal knowledge and transceiver hardware impairments to develop efficient deep learning-based device classification techniques that are scalable with the massive and diverse numbers of emerging wireless devices, robust against device signature cloning and replication, and agnostic to environment and system distortions.

About Award Winners and Project Descriptions: A full list of award winners and project descriptions can be found in “Intel and National Science Foundation Announce Future Wireless Systems Research Award Recipients.

More Context: NSF/Intel Partnership on Machine Learning for Wireless Networking Systems (MLWiNS) | Intel Labs (Press Kit) | Artificial Intelligence at Intel (Press Kit)

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Intel Announces 2020 US Partner of the Year Awards for Excellence in Accelerating Innovation

IPC
What’s New: Today Intel recognized the outstanding achievements of 30 partners with the distinction of Partner of the Year at its Intel Partner Connect 2020 virtual conference. The Partner of the Year awards honor Intel partners demonstrating excellence in technology innovation, go-to-market strategizing, sales growth and marketing.

“We appreciate each of our partners for their continued collaboration to bring new technologies to life for our customers. The shared results from 2019 demonstrate our strong partnerships and collective mission to bring innovative solutions to businesses and organizations across the world.”
– Greg Ernst, Intel vice president in the Sales and Marketing Group and general manager of U.S. Sales

Why It’s Important: The title of Partner of the Year is awarded to companies achieving the highest standards of design, development, integration and technology deployment to accelerate innovation, growth and go-to-market strategies. They represent great examples of what’s possible when we, as an ecosystem, work together.

Partner Program Winners:

Global Innovation

  • Accenture – Global Innovation Partner – Globally deploying innovative solutions across artificial intelligence (AI), analytics, blockchain and device-as-a-service leveraging Intel technologies: Intel® OpenVINO™, Intel® Arria® 10 FPGA, Intel® Movidius™ Myriad™ X VPU, Intel® Connected Logistics platform and the Intel vPro® platform.

LOEM

  • AIS – Growth – Continuously grew integration of Intel® NUC product to enhance video collaboration solutions in enterprise and education.
  • Colfax International – Go-to-Market – For successfully deploying Intel® Optane™ persistent memory DIMMS at launch and strategizing a cohesive pricing model.
  • Crystal Group – Growth – Delivered innovative, ruggedized systems tailored to specific customer needs for oil and gas, and power substation/micro grid market-ready solutions for Intel’s common substation platform.
  • Eluktronics – Innovation – Leading channel whitebook GTM strategy with SPG and executing TTM launch of Queen’s County, selling 1.2ku in first quarter.
  • IBuyPower – Go-to-Market – Set its sights on TAM expansion with Intel technology through a bold, creative and unique partnership with Toyota Racing Development. With this program, it unveiled a state-of-the-art gaming and training zone at Toyota Performance Center, remastered its Pro Series of workstation PCs for professionals, launched a series of TRD-approved systems for gamers, and broadcasted a video series designed to award-winning college students with gaming room makeovers, all with Intel branding and powered by Intel-based PCs.
  • Penguin Computing – Innovation – An innovative Linux solution for high-performance computing on-premise and in the cloud with Penguin Computing professional and managed services.
  • Razer – Growth – Razer saw exceptional growth in 2019, in part by bringing the latest Intel technologies to market, including Intel® Core™ i7 processors, Intel® Iris® Plus graphics, Thunderbolt™ 3 and Wi-Fi 6, to deliver high-performance thin-and-light gaming laptops.
  • Simply NUC – Go-to-Market – Dedicated to expanding the use cases of mini PCs into new growth segments such as digital signage, academic collaboration and AI. Simply NUC is your one-stop shop for systems, solutions and accessories.
  • Vast Data – Innovation – For close collaboration and partnership in creating Intel Optane technology-based storage solutions for new applications, such as analytics and AI, machine learning and deep learning. Uniquely integrated key Intel technologies to simplify the data center stack, eliminate storage complexity and tiers, and enable all-flash performance with archive economics.

National

  • CDW – Growth – Expanding Intel client, data center, storage and networking infrastructure solutions across over 150 countries.
  • Connection – Go-to-Market – For their dedication to selling devices consistently across SMB, public sector and enterprise segments.
  • Insight – Innovation – For simplifying complex solutions in emerging technologies like the internet of Things (IoT) and machine learning – including the Connected Platform for Detection and Prevention of the spread of viruses – to accelerate our clients’ time to value, drive efficiency in their workplaces and create positive customer experiences through partnerships and solution aggregation at scale.
  • Logicalis – Go-to-Market – Intel pre-validated, and pre-integrated IoT solutions across markets, such as asset management in healthcare, machine vision in industrial, and smart city applications.
  • Pivot – Go-to-Market – Edge secure connectivity, computing and collaboration solutions that continue to advance and scale Smart Edge’s software. Pivot signed a three-year preferred partnership agreement with Intel to continue investing in and drive the Intel® Smart Edge/Edge solution (branded Pivot Intelligent Edge) to market and support its future growth. Pivot has integrated Smart Edge to be a foundational component of Pivot’s Intelligent Edge Solution and Services that provide best-in-class secure connectivity across multiple wireless protocols (CBRS, LTE, Wifi, Lora, Zigbee, etc.).
  • Presidio – Growth – Deployed Intel-based solutions around HCI, SDS and Hybrid Cloud across its middle market, enterprise and government clients.
  • SHI International Corp. – Innovation – Leads the way with its cutting-edge Zero Touch, which streamlines configuration, deployment and management of Intel processor-based Win 10 client devices.
  • World Wide Technology – Growth – Designed, built, and deployed transformational solutions for multicloud, AI/analytics, IoT and 5G, supporting our largest enterprise, public sector, and service provider customers.
  • Zones – Innovation – For its leadership in solution development and deployment of the Intel Unite®

ISA

  • BCM – Highest IOT Growth at Associate/Affiliate Level – Provided medical equipment OEMs with a viable IoT data collection and aggregation device using Intel Core technology. Understands multiple vertical markets and embedded life cycle management, and reduces time to market with a quality product.
  • Crestron – Most Engaged Co-Marketing – The Creston Collaboration solution is an Intel® IoT Market Ready Solution built on Intel technologies (Intel Core i7, Movidius and Intel Arria FPGA). Creston engaged in a multifaceted Intel IoT Solutions Alliance co-marketing campaign (event, collateral, demos, digital), insight.tech content marketing platform, and the Intel® Solutions Marketplace to develop leads, accelerate its business and drive revenue and deployments.
  • Dell OEM – Largest IoT Co-sell Partner +Biggest IOT Growth Partner – Dell Technologies Original Equipment Manufacturer (OEM) Embedded & Edge Solutions delivers customized infrastructure, services and a secure supply chain designed for your vision and business goals – all from one trusted, sustainable and secure vendor. Dell OEM offers solutions for IoT, communications, medical, retail and more than 40 additional verticals.
  • Noodle.ai – Most impactful MRS – Noodle.ai is a mature startup software company with deep heritage and expertise of AI/ML analytics for factory/industrial environments. With the support from Intel and Dell, Noodle.ai will continue to pioneer the Smart Factories initiative, as part of the Industry 4.0 rollout.

Distributor

  • Synnex CorporationData Center Group Distributor of the Year – Grew its overall data center business with a companywide focus on growing this segment, which resulted in overall data center growth, and Intel adjacencies and Intel® Data Center Blocks.
  • Ingram MicroClient Computing Group Distributor of the Year – Grew its client computing business through a sales and marketing strategy focused on growth areas, like solutions-based on Intel NUC products.
  • ArrowInternet of Things Group Distributor of the Year – Drove an overall IoT silicon, systems, solution strategy that led to expanding its overall business and evolving its IoT go-to-market strategy.
  • ASINon-Volatile Memory Solutions Group Distributor of the Year – Exceptional growth year-over-year through a very focused effort across the entire company.
  • Tech DataBranded Systems Distributor of the Year – Strong growth results on both end-point products and data center through a variety of companywide initiatives.
  • Tech DataPartner Enablement Distributor of the Year – Delivered innovative solutions to help its Intel partners grow their Intel business through Tech Data’s Propel ITP program.
  • Computech InternationalChannel Innovation Award – Brought Intel nonvolatile memory solutions to new markets, expanding Intel’s channel presence and customer base.

More Context: Intel’s Partner Program Page

The Small Print: Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. No product or component can be absolutely secure. Check with your system manufacturer or retailer or learn more at intel.com.

Cost reduction scenarios described are intended as examples of how a given Intel-based product, in the specified circumstances and configurations, may affect future costs and provide cost savings. Circumstances will vary. Intel does not guarantee any costs or cost reduction.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors.

Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit www.intel.com/benchmarks.

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Intel Acquires Rivet Networks, Boosting Intel’s Wi-Fi Offerings for PC Platforms

By Chris Walker

Wi-Fi connectivity has become more essential than ever as we rely on it to work, teach, learn and stay connected to colleagues and loved ones. Fast, reliable and secure Wi-Fi connectivity is a necessity for keeping up as we add more connected devices and higher bandwidth applications for gaming, video streaming and content creation, as well as for processing increasingly larger file sizes.

In today’s homes there are an average of 11 Wi-Fi-enabled devices. Over the past few months, Comcast has reported that Wi-Fi-connected video calls and video conferencing have increased over 283%, and Charter Communications reports that over 90% of the traffic on its ISP network is Wi-Fi-based. Even in the case of your phone, more than 70% of your mobile (cellular) data traffic runs on Wi-Fi.

Intel has been investing and contributing to the evolution of Wi-Fi for more than 20 years, and today we’re excited to announce another leap forward. We are acquiring Rivet Networks, a leader in software and cloud-based technologies for networking connectivity.

More: Client Computing News

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Intel and Rivet Networks have partnered to build the Killer AX1650 Wi-Fi solution, which delivers immersive entertainment and gaming experiences along with powerful Wi-Fi 6 technology. Rivet Networks’ capabilities, including its software, are complementary to Intel’s wireless products and capabilities. (Credit: Rivet Networks)
Rivet Networks is a terrific complement to our existing Wi-Fi products and helps us further our vision of delivering PC platforms that power every person’s greatest contribution. Rivet Networks’ products deliver speed, intelligence and control for gamers and performance users. Its products maximize Wi-Fi bandwidth utilization and optimize the wireless network connection on your platform. In addition, Rivet Networks’ products can also utilize the combination of Ethernet and Wi-Fi to prioritize traffic over both connections.

Its team will join our Wireless Solutions Group within the Client Computing Group. Rivet Networks’ key products, including its Killer brand, will integrate into Intel’s broader PC Wi-Fi portfolio. With the addition of Rivet Networks’ software, we will license its software to customers and develop new solutions for broader PC connectivity enhancement. With Rivet Networks’ and Intel’s leading Wi-Fi products, we can scale our PC Wi-Fi portfolio to better serve our customers, ecosystem and channel partners.

In addition to an expanding portfolio of Wi-Fi solutions for PC Platforms, we continue to advocate for Wi-Fi standards, contribute to the developer ecosystem and deliver new value for our PC OEM customers. More specifically:

  • Leading the development and testing of 801.11ax (Wi-Fi 6): Intel took a lead role in the industry to define and deliver Wi-Fi 6 to the market. Our products were ahead of the competition and were selected as the “test bed” for Wi-Fi 6 certification. We also delivered the world’s first Wi-Fi 6 client for PCs, delivering over 1.2 Gbps throughput. But even more important, Intel led the ecosystem in conducting interoperability testing with Cisco, Aruba, Broadcom, Qualcomm and Microsoft to ensure great user experiences in new Wi-Fi 6 and legacy network implementations.
  • Advocating for Wi-Fi Standards: We are strong advocates for Wi-Fi 6 and beyond, having worked closely with the FCC, ecosystem and standards bodies to ensure interoperability, to drive new and innovative capabilities into the standards, and to advocate for spectrum and certification policy issues. Most recently, the FCC opened 1200 MHz of 6 GHz spectrum to unlicensed Wi-Fi use, which will significantly improve Wi-Fi for all Americans. Opening this band will enable significant new capacity and ensure more opportunities for the Wi-Fi ecosystem that is relied on by millions of people and businesses.
  • Developing the Best PC and Connectivity Experiences:
  • Wi-Fi 6 Desktop Developer Kit: We launched an Intel Wi-Fi 6 Desktop developer kit to bring Gigabit+ wireless speeds to new and existing desktop PCs. The kit can be installed in less than 10 minutes and provides a max wireless speed of 2.4 Gbps, which is nearly three times faster than the standard AC 2×2 module with 80 MHz channels and 75 percent lower latency for gaming and video conferencing. It also allows for four times greater capacity of devices on a network. This kit was designed with DIYers and small- to medium-size businesses.
  • Project Athena: Project Athena is a multiyear innovation program designed to deliver a new class of advanced laptops. The program is rooted in user insights and real-life situations. Together with our OEM partners, we’ve leveraged these insights to build PCs that fit at least six criteria that enable the most seamless PC experiences. One of the central features of Project Athena is to create devices that include a fast and persistent connection with Intel® Wi-Fi 6 (Gig+) and optional Gigabit LTE. We have verified more than 40 devices that meet the Project Athena specification.

We are committed to enabling our customers to deliver the best PC experiences, especially when we have become more reliant on technology. We know how important connectivity is in enriching our lives. We will keep you updated on our progress and look forward to having the Rivet Networks team as part of the Intel family, developing technologies that matter to you.

Chris Walker is corporate vice president and general manager of the Mobile Client Platforms Group at Intel Corporation.

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New Intel vPro Platform Enables Uncompromised Productivity and Performance for the Modern Workforce

What’s New: Intel today introduced its new 10th Gen Intel® Core™ vPro® processors, built to power the next generation of business computing innovation for the increasingly remote workforce. The new mobile and desktop PC processors deliver increased productivity improvements, connectivity, security features and remote manageability – all to empower IT to deliver amazing experiences, helping employees stay connected, more productive, more secure and in the flow with minimal interruptions.

“Built for business, the Intel vPro platform is a comprehensive PC foundation for performance, hardware-enhanced security, manageability and stability. With our new 10th Gen Intel Core vPro processors, we’ve enhanced that solid PC foundation to help tackle not only today’s challenges, but also those of future work environments across the PC lifecycle.”
– Stephanie Hallford, Intel vice president of the Client Computing Group and general manager of Business Client Platforms

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Intel Corporation on May 13, 20202, introduce its 10th Gen Intel Core vPro processors. The family of processors is designed to power the next generation of business computing innovation for the increasingly remote workforce. New mobile and desktop PC processors deliver increased productivity improvements, connectivity, security features and remote manageability. (Credit: Intel Corporation)
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How it Enables the Modern Workforce: For more than a decade, the Intel vPro platform has empowered IT to help businesses, large and small, keep employees productive, help secure company assets and simplify fleet management. That dedication continues to expand through the latest Intel vPro® platform, powered by 10th Gen Intel Core vPro processors, to deliver uncompromised productivity, hardware-based security features and a foundation for computing innovation.

Systems powered by the latest Intel vPro processors give workers the business-class performance and responsiveness they need to be productive, plus integrated Wi-Fi 6 (Gig+) connectivity, which is the best Wi-Fi technology for video conferencing1; more reliable performance; and manageability technologies to address new and emerging challenges for IT and users. All of this can be delivered on a range of form factors: from sleek, powerful and modern devices based on Intel’s Project Athena innovation program to high-performing desktop designs.

“For more than a decade, Cisco and Intel have partnered to deliver an unrivaled wireless experience, helping to elevate Wi-Fi’s business relevance and impact,” said Matt MacPherson, Wireless CTO at Cisco. “This close partnership provides early and extensive testing that ensures, as new industry standards and innovations emerge, Cisco and Intel customers can quickly and confidently embrace the latest technology. We’re excited for customers to experience the more reliable connections, faster downloads and improved application performance of the new 10th Gen Intel Core vPro processors and Cisco’s latest Wi-Fi 6 certified access points.”

Improvements in this generation include:

  • Up to 40% better overall application performance compared with a 3-year-old laptop2.
  • Up to 36% better office productivity compared with a 3-year-old laptop3.
  • Analyze and visualize data up to 44% faster compared with a 5-year-old desktop4.
  • Nearly 3 times faster5 Gigabit speeds and improved performance in dense environments with integrated Intel® Wi-Fi 6 (Gig+) for the best Wi-Fi technology for video conferencing1.
  • Rapid responsiveness, worry-free battery life and instant resume with Project Athena-based laptops.

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For Internet of Things (IoT) developers, 10th Gen Intel Core vPro processors and Intel® Xeon® W-1200E series based on the Intel vPro platform provide business-class performance, remote management and more – ideal for applications in retail, banking, hospitality, education, healthcare, manufacturing and more.

About Key Features and Capabilities: Additional new 10th Gen Intel Core vPro processor developments for enhanced security, lifecycle management and operational stability include:

A More Secure Foundation:

  • Intel Hardware Shield provides built-in hardware-enhanced security features to help prevent cyber-attacks – now with advanced threat detection and extended below-the-OS protection features to help safeguard system memory critical resources.
  • Intel Trusted Supply Chain helps enable the traceability and authenticity of PC components for greater peace of mind.

Modern Lifecycle Management:

  • Intel® Active Management Technology and Intel® Endpoint Management Assistance can help businesses save time and money on deskside support, PC maintenance and employee downtime with remote manageability of devices, whether on-premises or in the cloud.

PCs built with the new 10th Gen Intel Core vPro mobile and desktop processors are expected to be available from PC manufacturers over the next several months.

More Context: Intel 10th Gen Core vPro Platform Product Brief | Intel 10th Gen Core vPro Processor Product Brief | Internet of Things Platform Brief | Intel Xeon W-1200 Workstation Processors Product Brief

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» Click for full infographic

The Small Print:

All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel product specifications, roadmaps, and related information.

Testing concluded May 4, 2020, and may not reflect all publicly available updates. See configuration disclosure for details. No product can be absolutely secure.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors.

Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information about performance and benchmark results, visit http://www.intel.com/benchmarks

Your costs and results may vary.

Intel technologies may require enabled hardware, software or service activation.

Intel contributes to the development of benchmarks by participating in, sponsoring, and/or contributing technical support to various benchmarking groups, including the BenchmarkXPRT Development Community administered by Principled Technologies.

Battery life may vary substantially by use, system configurations, and settings. Among other things, battery life depends on the size and age of your battery, what your power settings are, how bright your screen is, what applications you are running, and whether you are using wireless or Bluetooth functions while mobile. Battery life also depends on system design, including the memory, processor, and operating system installed on your computer, and how your use your computer (e.g., playing a game or watching a video online consumes more power than word processing).  In addition, actual battery life may not match the theoretical battery life reported by a benchmark for other reasons as well. Benchmark testing is normally done on new computers with fully charged, properly conditioned batteries, yet batteries lose capacity over time and after repeated use.

1 As measured by by OTA (Over the Air) Wi-Fi 6 (802.11ax) vs. Wi-Fi 5 (802.11ac) NB client Skype video conferencing test data, obtained in standard corporate IT 20 MHz and 40 MHz network deployment scenarios.

Wi-Fi networks consist of 8 NB clients with 7 clients generating 10-20 Mbps Wi-Fi traffic (using iChariot traffic simulator) while 1 client conducts a 5 min Skype video conference session with a 9th client connected via 10/100/1000 Ethernet to a local server.  Skype data obtained via Skype reporting application.

8 NB Wi-Fi network client specifications: Dell XPS 13 (10th Gen), Killer AX1650, Driver 21.90.0.9; OS: Win 10 19H1 64-bit,  9th NB Callee (wired) = Dell G7 15 7588, Killer E2400, Driver: 9.0.0.42, OS: Win 10 19H1 64-bit; Enterprise APs: (AC) Wi-Fi 5: Cisco 3800, FW: 8.10.128.91;  (AX) Wi-Fi 6: Cisco 9130, FW: 8.10.128.91

Wi-Fi 6 performance benefits require use of similarly configured Wi-Fi 6 networking infrastructure (routers & APs) based on the IEEE 802.11ax wireless standard specification.

Test data represents best case results through a controlled local network to show relative Wi-Fi 6 vs. Wi-Fi 5 technology differences.  Actual real-world corporate results may vary and are expected to be higher due to 1) greater number of diverse clients, 2) higher network traffic levels, and 3) greater physical client distance from Skype server.

2 As measured by SYSmark 2018 Overall Score on pre-production 10th Gen Intel® Core™  i7-10810U vs. 8/15/19 testing of 7th Gen Intel® Core™ i7-7600U.

3 As measured by SYSmark 2018 Productivity Subtest Score on pre-production 10th Gen Intel® Core™  i7-10810U vs. 8/15/19 testing of 7th Gen Intel® Core™ i7-7600U.

4 As measured by MS PowerBI Workload on pre-production 10th Gen Intel® Core™ i7-10700 vs. 6th Gen Intel® Core™ i7-6700. This workload measures the time it takes to change the data source for a Power BI Dashboard, and update the dashboard with the new data.

5 Nearly 3X Faster: 802.11ax 2×2 160 MHz enables 2402 Mbps maximum theoretical data rates, ~3X (2.8X) faster than standard 802.11ac 2×2 80 MHz (867 Mbps) as documented in IEEE 802.11 wireless standard specifications and require the use of similarly configured 802.11ax wireless network routers. Nearly 40% higher peak data rates” Intel® Wireless-AX claims are based on the comparison (39%) of the expected maximum theoretical data rates for dual spatial stream 802.11ax 80 MHz (1201 Mbps) vs. dual spatial stream 802.11ac 80 MHz (867 Mbps) Wi-Fi solutions as documented in IEEE 802.11ax draft 2.0 spec and IEEE 802.11 wireless standard specifications, and require the use of similarly configured 802.11ax wireless network routers.

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Intel’s 2020 Inventor of the Year Pushes Past Limits for Next-Gen Wireless

Gary Xiong Intel
Gary Xiong, a wireless standards engineer and Intel’s 2020 Inventor of the Year, works in Hillsboro, Oregon. With a team from Intel’s Next Generation and Standards Group, Xiong is helping invent technologies that will underpin future wireless networks. (Photos Courtesty of Gary Xiong)

Our expert: Gary Xiong and his Intel teammates across the world from the Next Generation and Standards Group are figuring out how advanced 5G and 6G will carry even more throughput and responsiveness compared with today’s wireless standards. In recognition of Xiong’s work to invent the technologies that will underpin future wireless networks, the wireless standards engineer was named Intel’s 2020 Inventor of the Year.

More: Future of Technology Series | 5G at Intel

‘A crazy idea that bumps against the ceiling of material physics’: Today, Xiong and his team are focused on overcoming some of the limitations of 5G bands and getting ready for 6G. “We’re always pushing the boundary of what is physically possible by going back to basics and coming up with new ideas to overcome current obstacles,” he says. One idea Xiong and team are working on is changing the waveforms of future wireless signals, which could significantly affect how base station silicon is designed. “We’re imagining super wideband spectrums at perhaps 10 GHz or more that will mean at least 10x more throughput and 10x less latency than today’s 5G,” Xiong explains. “It’s a crazy idea that bumps against the ceiling of material physics, but we’ve already started early research and we’re confident we can pull this off.” If successful, this project – known in the industry as “terahertz communications” – will cement the groundwork for 6G and beyond.

Persistence pays off: Every telecommunications carrier adopts the same wireless blueprint, which is why Xiong spends a lot of time extending Intel’s leadership and amplifying Intel’s voice in the 3rd Generation Partnership Project (3GPP) – a worldwide consortium established in 1998 that sets unified protocols for mobile telecommunications. At these 3GPP meetings, “Intel, alongside our fellow travelers in the industry, will make our case for why our solutions are better,” he explains. In one memorable 3GPP meeting that ran five days with minimal breaks, Gary was able to win over a tough crowd. “We finally got Intel’s proposals adopted in advanced 5G specifications, which was immensely gratifying and very cool to see,” Xiong says.

‘We’ve only scratched the surface’: Despite working with invisible elements – wireless connectivity, waveforms and standards – Xiong remains passionate about his work. “We’ve only scratched the surface of what is possible,” he says, “and Intel has a ton more to contribute in this space.”

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Intel Demonstrates Industry-First Co-Packaged Optics Ethernet Switch

Intel Co Packaged Optics Ethernet Switch 2

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What’s New: Intel today announced it has successfully integrated its 1.6 Tbps silicon photonics engine with its 12.8 Tbps programmable Ethernet switch. This co-packaged solution brings together the essential technology building blocks from Intel and its Barefoot Networks Division for integrated optics on an Ethernet switch.

“Our co-packaged optics demonstration is the first step to making optical I/O with silicon photonics a reality. We share the industry belief that co-packaged optics offers power and density advantages for switches at 25 Tbps and higher, and ultimately is a necessary and enabling technology for bandwidth scalability in future networks. The timing of this demonstration shows the technology is ready to support our customers’ requirements.”
–Hong Hou, Intel corporate vice president and general manager of the Silicon Photonics Products Division

Who It Helps: The co-packaged switch is optimized for hyperscale data centers, where demand for cost-effective interconnect and bandwidth is limitless. Intel is currently demonstrating this technology to customers.

Why It Matters: Today’s data center switches depend on pluggable optics installed in the switch faceplate that are connected to switch serializer/deserializer (SerDes) ports using an electrical trace. But as data center switch bandwidth grows, connecting the SerDes to pluggable optics electrically will be more complex and require more power. With co-packaged optics, the optical port is placed near the switch within the same package, thus reducing power and enabling continued switch bandwidth scalability.

What is Being Demonstrated: This demonstration brings together the best of Barefoot Networks’ programmable Ethernet switch technology and Intel’s silicon photonics technology. The integrated switch package in this demonstration uses a P4-programmable Barefoot Tofino™ 2 switch ASIC co-packaged with 1.6 Tbps silicon photonics engines from Intel’s Silicon Photonics Product Division.

More about Barefoot Networks Ethernet Switch: Barefoot Tofino 2 is a P4-programmable Ethernet switch that delivers up to 12.8 Tbps throughput and is based on the company’s Protocol Independent Switch Architecture (PISA). PISA is programmed using the open source P4 programming language for data planes. With the P4 data plane, Tofino switches’ forwarding capability can be adapted via software to new needs in the network or to new protocols that are supported by P4. The performance and programmability of Tofino 2 are designed to meet the needs of hyperscale data centers and cloud and service provider networks.

For co-packaged optics, the Barefoot Tofino 2 switch ships in a multi-die package that makes it easier to co-package the optical engine and to upgrade the SerDes for lower power or higher throughput.

“As switch chips scale to meet requirements for demand of limitless bandwidth in cloud-scale data centers, the need for power- and cost-effective interconnect is critical,” said Ed Doe, vice president and general manager of the Barefoot Division. “We have designed our Tofino 2 switch series using leading edge multi-die technology that enables interface flexibility, making it easier for us to integrate and create a scalable co-packaged solution with our silicon photonics products.  This has empowered us to deliver an industry-first solution that will greatly advance the future of data center infrastructure and architectures.”

More about the Silicon Photonics Engine: The silicon photonics interconnect platform features 1.6 Tbps photonic engines realized as 4 ports of 400GBase-DR4 interfaces, designed and manufactured in the Intel silicon photonics platform. The engines are modular arrays of transceivers built around integrated silicon photonics chips with on-chip lasers and high-speed modulators and detectors, representing the evolution of the silicon photonics platform that has shipped in more than 3 million units of 100G pluggable transceivers and powers the 200G and 400G pluggable modules ramping to volume this year. Highlighting the modularity and flexibility of the co-packaged switch platform developed by Intel, the integrated switch package features a combination of co-packaged optical ports and copper ports supporting front-plate cages for optical modules or copper cables.

What Barefoot Networks is: Intel acquired Barefoot Networks in 2019 to accelerate its delivery of Ethernet-based fabrics. Barefoot Networks is an emerging leader in Ethernet switch silicon and software for use in the data center, specializing in the programmability and flexibility necessary to meet the performance and ever-changing needs of the hyperscale cloud. Barefoot empowers network owners and their infrastructure partners to design, optimize and innovate to meet their specific requirements and gain competitive advantage. In combining the P4 programming language with fast programmable switches, Barefoot has also created an ecosystem for compilers, tools and P4 programs to make P4 accessible to anybody.

More Context: Data Center News | 5G News

The Small Print: Intel technologies may require enabled hardware, software or service activation.

No product or component can be absolutely secure.

Your costs and results may vary.

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Product Fact Sheet: Accelerating 5G Network Infrastructure, from the Core to the Edge

Intel 2nd gen Xeon Scalable

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This week, Intel announced an unmatched silicon portfolio for 5G infrastructure with the launch of the Intel Atom® P5900, a 10nm system-on-chip (SoC) for wireless base stations, and the introduction of both a structured ASIC for 5G network processing and a 5G network-optimized Ethernet network adapter, offering high-precision, GPS-based network service synchronization.

More: Intel Announces Unmatched Portfolio for 5G Network Infrastructure (News Release) | Intel Reinforces Data Center Leadership with New 2nd-Gen Intel Xeon Scalable Processors (News Byte) | Intel Announces Unmatched Portfolio for 5G Network Infrastructure (Press Kit)

Additionally, Intel announced the expansion of its 2nd gen Intel® Xeon® Scalable processor lineup as the company continues to deliver workload-optimized performance, integrated artificial intelligence (AI) acceleration and hardened security at the platform level.

Launching Intel Atom P5900 Platform  

In a highly integrated 10nm SoC, the Intel Atom P5900 delivers what customers require for future-ready 5G base stations, including ultra-low latency, accelerated throughput and precise load balancing.

Performance improvements include up to 5.6 times more secured network communication with the Intel Atom® P5952B processor and Intel® QuickAssist Technology (versus software alone)1 and up to 3.7 times more packet processing with the Intel Atom P5952B processor and Intel® Dynamic Load Balancer (versus software alone)2.

Key features include:

  • Up to 24 Intel Atom P5000 processor cores, based on the Tremont microarchitecture, using 10nm process technology.
  • L1 cache of 32KB/core, L2 cache of 4.5MB per 4-core cluster and shared LLC cache up to 15MB.
  • Base frequency support of up to 2.2 GHz, single-thread performance.
  • Memory capacity of up to 128GB of DDR4 up to 2,933 MT/s with server-class reliability, availability and serviceability (RAS) and support for RDIMM, UDIMM, SODIMM and memory down.
  • Up to 100 Gbps throughput with integrated Intel Ethernet 800 series technology.
  • Up to 100 Gbps security processing with Intel QuickAssist Technology.
  • Up to 440 Gbps network switching connectivity support with up to 20 fully integrated Ethernet SerDes.
  • Up to 16 lanes of flexible high-speed IO configured as PCIe, SATA and/or USB 3.0.
  • Up to 16 lanes of PCIe Gen 3.0.
  • Up to 4 USB 2.0 ports, eMMC 5.1, LPC or eSPI.
  • Extended temperature support of minus 40 C to 85 C with full dynamic temperature range.

New 2nd Gen Intel Xeon Scalable Processors  

The new 2nd Gen Intel Xeon Scalable processors launched today deliver an average of 36% more performance and an average of 42% more performance per dollar3 than the prior generation Intel Xeon Gold and increased value for customers across their cloud, network and edge needs.

Updates include:

  • These new processors add more cores, cache and/or frequency, providing more performance and value across a wide range of mainstream price points.
  • Industry-leading frequency, with a new processor featuring base frequency of 3.9 GHz and turbo frequency up to 4.5 GHz.
  • Continued hardware-based mitigations against side-channel attacks, plus built-in encryption acceleration and key protection technologies.
  • Eighteen Intel® Select Solutions will be updated in the coming weeks with new processor options to take advantage of the improved performance and value. Intel Select Solution are workload-optimized configurations for a variety of popular workloads that reduce the guesswork and accelerate time-to-deployment.
  • Find additional information and SKU chart on “Intel Reinforces Data Center Leadership with New 2nd Gen Intel Xeon Scalable Processors.”

Introducing “Diamond Mesa,” Intel’s First Next-Generation Structured ASIC for 5G Network Acceleration

Structured ASICs like “Diamond Mesa” provide a minimum-risk optimization path for workloads that do not require the full programmability of FPGAs, targeting double the performance efficiency versus the prior generation, and uniquely position Intel as the only provider delivering a full silicon platform foundation for network infrastructure.

Key features include:

  • The first eASIC device to leverage all-new IP from the Intel Programmable Solutions Group, a quad-core ARM A53 processor and secure device manager subsystem.
  • Structured ASICs like Diamond Mesa strike a balance between the programmability and fast time-to-market of FPGAs and the efficient performance of purpose-built ASICs.
  • Only Intel offers developers a full range of silicon solutions to optimize platforms for performance, cost, power, flexibility and time-to-market – from Intel Xeon processors to purpose-built ASICs.

Introducing the Intel Ethernet 700 Series Network Adapter with Hardware-Enhanced Precision Time Protocol (code-named “Edgewater Channel”)

Intel introduced the Intel® Ethernet 700 Series network adapter with hardware-enhanced Precision Time Protocol (PTP), which is designed for 5G, edge and other use cases with very tight latency and timing requirements.

Intel Ethernet 700 Series is compliant with the IEEE 1588 PTP standard and increases phase accuracy through a combination of hardware enhancements and software optimizations with within 100 nanoseconds or less.

Key features include:

  • Onboard high-precision oscillator with up to 5,000 times tighter accuracy: Provides greater phase
    accuracy than a standard Ethernet adapter and better holdover between clock interruption. (5000x=20 ppb TCXO oscillator (10 °C to 70 °C) vs. typical 100 ppm crystal)
  • Dual SubMiniature version A (SMA) coaxial connectors: Allow connection to external timing sources, such as GPS signaling devices and to timing sinks/recipients, allowing the NIC to act as
    a grandmaster and as a timing source for other equipment.
  • Software-defined pins (SDPs): User-configurable I/O pins drive the SMAs and provide built-in timing coordination between ports.
  • Standard Linux support: Linux PTP utility provides support for multiple PTP profiles and use of SDPs for sync via 1 pulse per second (PPS) input and output signals.

1 Get up to 5.6X more packet security throughput with Intel QAT and the integrated switch, versus software: Tested by Intel on 1/27/2020, 1x Intel Atom® P5952B processor (Running under A-3 Eng Silicon 20C, 2.2GHz) on Intel internal Frost Creek platform, 16GB DDR4 2933MHz, OS: Ubuntu 18.04 with Kernel: 5.2.10-rt5, BIOS: JBVLCRB1.86B.0011.D44.1909191126, uCode: 0x90010006, Benchmark: DPDK IPSec (using Intel® QAT) (1420B packet size) (1C/1T/1P) (Estimated), Software: DPDK 19.05, Compiler: GCC 7.3.0 with MKL, Network: Onboard 100GbE NIC compared to 1x Intel Atom® P5952B processor (Running under A-3 Eng Silicon 20C, 2.2GHz) on Intel internal Frost Creek platform, 16GB DDR4 2933MHz, OS: Ubuntu 18.04 with Kernel: 5.2.10-rt5, BIOS: JBVLCRB1.86B.0011.D44.1909191126, uCode: 0x90010006, Benchmark: DPDK IPSec (using software cipher algorithm AES-128-CBC) (1420B packet size) (1C/1T/1P) (Estimated), Software: DPDK 19.05, Compiler: GCC 7.3.0 with MKL, Network: Onboard 100GbE NIC.

2 Achieve up to 3.7X more packet balancing throughput versus software queue management: Tested by Intel on 1/27/2020, 1x Intel Atom® P5952B processor (Running under A-3 Eng Silicon 20C, 2.2GHz) on Intel internal Victoria Canyon platform, 16GB DDR4 2933MHz ,OS: Ubuntu 18.04 with Kernel: 5.2.10-rt5, BIOS: JBVLCRB1.86B.0012.D17.1911070324, uCode: 0x90040006, Benchmark: DPDK Event Device Ordered Scheduling (3 stages) (Estimated), Software: RDK19.11, Compiler: GCC 7.3.0 with MKL, Network: 1x Intel® Ethernet Network Adapter X710-DA4 (10GbE) compared to 1x Intel Atom® P5952B processor (Running under A-3 Eng Silicon 20C, 2.2GHz) on Intel internal Victoria Canyon platform, 16GB DDR4 2933MHz, OS: Ubuntu 18.04 with Kernel: 5.2.10-rt5, BIOS: JBVLCRB1.86B.0012.D17.1911070324, uCode: 0x90040006, Benchmark: DPDK Event Device Ordered Scheduling (3 stages) (Estimated), Software: RDK19.11, Compiler: GCC 7.3.0 with MKL, Network: 1x Intel® Ethernet Network Adapter X710-DA4 (10GbE).

3 36% more performance & 42% more performance/dollar: Geomean of Integer Throughput, Floating Point Throughput, Stream Triad, and Linpack across ten new 2-socket 2nd Gen Gold processors vs first generation. 2nd Gen Gold R processors: 1-node, 2x 2nd Gen Intel Xeon Gold cpu on Intel Reference platform with 384 GB (12 slots / 32 GB / 2933)  total memory, ucode 0x500002c, HT on for all except off for Stream, Linpack, Turbo on, with Ubuntu19.10, 5.3.0-24-generic, 6258R/$3950: int=323, fp=262, stream=224, Linpack=3305, 6248R/$2700: int=299, fp=248, stream=224, Linpack=3010, 6246R/$3286: int=238, fp=217, stream=225, Linpack=2394, 6242R/$2529: int=265, fp=231, stream=227, Linpack=2698, 6240R/$2200: int=268, fp=228, stream=223, Linpack=2438, 6238R/$2612: int=287, fp=240, stream=222, Linpack=2545, 6230R/$1894: int=266, fp=227, stream=222, Linpack=2219, 6226R/$1300: int=208, fp=192, stream=200, Linpack=2073, 5220R/$1555: int=257, fp=220, stream=210, Linpack=1610, 5218R/$1273: int=210, fp=188, stream=199, Linpack=1290 test by Intel on 12/25/2019.  First Gen Gold processor: 1-node, 2x Intel Xeon Gold cpu on Intel Reference platform with 384 GB (12 slots / 32 GB / 2933)  total memory, ucode 0x2000065, HT on for all except off for Stream, Linpack, Turbo on, with Ubuntu19.10, 5.3.0-24-generic, 6152/$3655: int=224, fp=198, stream=200, Linpack=19886148/$3072: int=225, fp=198, stream=197, Linpack=2162, 6146/$3286: int=161, fp=175, stream=185, Linpack=1896, 6142/$2946: int=193, fp=176, stream=185, Linpack=1895, 6140/$2445: int=202, fp=183, stream=188, Linpack=1877, 6138/$2612: int=189, fp=195, stream=189, Linpack=1976, 6130/$1894: int=172, fp=165, stream=185, Linpack=1645, 6126/$1776: int=141, fp=157, stream=170, Linpack=1605, 5120/$1555: int=133, fp=148, stream=159, Linpack=924, 5118/$1273: int=134, fp=132, stream=149, Linpack=818 test by Intel on 2/18/2020.

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Intel Announces Unmatched Portfolio for 5G Network Infrastructure

SANTA CLARA, Calif., Feb. 24, 2020 – Unlocking the full potential of 5G requires transforming network infrastructure from core to edge. As the world’s leading network silicon provider, Intel is at the forefront of driving this transformation. Today, the company made a sweeping set of hardware and software announcements, including the launch of the new Intel Atom™ P5900, a 10nm system-on-chip (SoC) for wireless base stations, which is a critical early deployment target for 5G networks.

More: Intel Announces Unmatched Portfolio for 5G Network Infrastructure (Press Kit) | Intel Reinforces Data Center Leadership with New 2nd-Gen Intel Xeon Scalable Processors

“As the industry makes the transition to 5G, we continue to see network infrastructure as the most significant opportunity, representing a $25 billion silicon opportunity by 2023,” said Navin Shenoy, executive vice president and general manager of the Data Platforms Group at Intel. “By offering customers the fastest and most effective path to design, deliver and deploy 5G solutions across core, edge and access, we are poised to expand our leading silicon position in this growing market.”

intel ethernet 700 series xxv710 da2t

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Unmatched Portfolio for 5G Infrastructure

As the promise of 5G takes hold, customers are demanding the increased performance and flexibility they need to rapidly deliver services with lower latency where they are needed most. In this light, Intel announced a number of firsts today, including:

  • Launching the Intel Atom P5900 platform, the first Intel architecture-based 10nm SoC for wireless base stations: With the launch of the Intel Atom P5900, the company is extending Intel architecture from the core to access and all the way to the farthest edge of the network. Intel now expects to be the leading silicon provider in base stations by 2021, a year earlier than first predicted. As a highly integrated 10nm SoC, the Intel Atom P5900 is designed to meet critical 5G network needs, including high bandwidth and low latency to deliver what’s required for 5G base stations today and in the future. The product augments Intel’s rich silicon portfolio for network environments and introduces Intel silicon as the foundation for the wireless base stations market, with 6 million 5G base stations forecasted through 2024. Intel is working with leading providers to deliver this product as part of their future-differentiated solutions in market.
  • New 2nd Gen Intel® Xeon® Scalable processors: As the foundation for data platform infrastructure with over 30 million units sold, Intel Xeon Scalable processors have led the transformation of the network. This year, 50% of core network deployments are transforming to virtualized networks, with the expectation to grow beyond 80% by 2024¹, fueled by 5G. The new 2nd Gen Intel Xeon Scalable processors launched today deliver an average of 36% more performance and an average of 42% more performance per dollar² than the prior generation Intel® Xeon® Gold and increased value for customers across their cloud, network and edge needs. In addition, Intel Xeon Scalable helps protect the integrity of the data and the platform with hardware-enhanced security and built-in encryption accelerators. In conjunction, Intel introduced 18 updated Select Solutions supporting these new processors across customer-prioritized workloads.
  • Introducing “Diamond Mesa,” Intel’s first next-generation structured ASIC for 5G network acceleration: “Diamond Mesa” (code name) is designed to complement Intel’s unmatched portfolio of processors and FPGAs delivering the high performance and low latency required for 5G networks. Structured ASICs like Diamond Mesa provide a minimum-risk optimization path for workloads that do not require the full programmability of FPGAs, targeting double the performance efficiency versus the prior generation, and uniquely position Intel as the only provider delivering a full silicon platform foundation for network infrastructure. Diamond Mesa is open to early access customers.
  • Introducing the Intel® Ethernet 700 Series Network Adapter with hardware-enhanced Precision Time Protocol, the first 5G network-optimized Ethernet NIC: The Ethernet 700 series (code-named “Edgewater Channel”) is Intel’s first 5G-optimized network adapter, offering GPS-based cross-network service synchronization with hardware-enhanced Precision Time Protocol (PTP). Latency requirements across 5G network implementations have challenged existing Ethernet technology, especially in edge servers. Maintaining accurate time synchronization across the network at a cost-effective price point, however, is one avenue to help address application latency. The Ethernet 700 series adapter increases the timing precision required for 5G networks through a combination of hardware and software enhancements. Edgewater Channel is sampling now and will enter production in 2020’s second quarter.

New Software Investments

Intel expands its industry-leading edge computing software toolkits to accelerate time-to-market innovation for its customers and partners with new capabilities integrated into the Open Network Edge Services Software (OpenNESS) toolkit. OpenNESS now supports standalone 5GNR and Enhanced Platform Awareness (EPA) deployments, giving customers the flexibility to easily deploy their choice of cloud-native edge microservices. Intel is delivering customized OpenNESS experience kits to accelerate custom 5G deployments. OpenNESS complements Intel’s OpenVINO™ and Open Visual Cloud for edge computing development needs.

Unrivaled Ecosystem Collaborations

Technology innovation requires deep collaboration across industry innovators that build on each other’s contributions. Given its rich heritage in leading technology transitions, Intel is in a unique position to accelerate collaboration across its customers and partners. Intel has announced strategic collaborations with industry leaders, including Altiostar, Dell, Deutsche Telecom, HPE, Lenovo, QCT, Rakuten, VMware and ZTE to advance network infrastructure capability and speed edge solutions in the market.

Intel has been at the forefront of technology innovation for 51 years. By delivering the broadest silicon portfolio for 5G network infrastructure, the company continues to open a world of opportunity for its customers and partners.

¹Source: Dell’Oro Mobile Core Network 5 Year Forecast Report, Dell’Oro Group, 01/2020

²Geomean of Integer Throughput, Floating Point Throughput, Stream Triad, and Linpack across ten new 2-socket 2nd Gen Gold processors vs first generation. 2nd Gen Gold R processors: 1-node, 2x 2nd Gen Intel Xeon Gold cpu on Intel Reference platform with 384 GB (12 slots / 32 GB / 2933)  total memory, ucode 0x500002c, HT on for all except off for Stream, Linpack, Turbo on, with Ubuntu19.10, 5.3.0-24-generic, 6258R/$3950: int=323, fp=262, stream=224, Linpack=3305, 6248R/$2700: int=299, fp=248, stream=224, Linpack=3010, 6246R/$3286: int=238, fp=217, stream=225, Linpack=2394, 6242R/$2529: int=265, fp=231, stream=227, Linpack=2698, 6240R/$2200: int=268, fp=228, stream=223, Linpack=2438, 6238R/$2612: int=287, fp=240, stream=222, Linpack=2545, 6230R/$1894: int=266, fp=227, stream=222, Linpack=2219, 6226R/$1300: int=208, fp=192, stream=200, Linpack=2073, 5220R/$1555: int=257, fp=220, stream=210, Linpack=1610, 5218R/$1273: int=210, fp=188, stream=199, Linpack=1290 test by Intel on 12/25/2019.  First Gen Gold processor: 1-node, 2x Intel Xeon Gold cpu on Intel Reference platform with 384 GB (12 slots / 32 GB / 2933)  total memory, ucode 0x2000065, HT on for all except off for Stream, Linpack, Turbo on, with Ubuntu19.10, 5.3.0-24-generic, 6152/$3655: int=224, fp=198, stream=200, Linpack=19886148/$3072: int=225, fp=198, stream=197, Linpack=2162, 6146/$3286: int=161, fp=175, stream=185, Linpack=1896, 6142/$2946: int=193, fp=176, stream=185, Linpack=1895, 6140/$2445: int=202, fp=183, stream=188, Linpack=1877, 6138/$2612: int=189, fp=195, stream=189, Linpack=1976, 6130/$1894: int=172, fp=165, stream=185, Linpack=1645, 6126/$1776: int=141, fp=157, stream=170, Linpack=1605, 5120/$1555: int=133, fp=148, stream=159, Linpack=924, 5118/$1273: int=134, fp=132, stream=149, Linpack=818 test by Intel on 2/18/2020.

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