Intel Demonstrates Industry-First Co-Packaged Optics Ethernet Switch

Intel Co Packaged Optics Ethernet Switch 2

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What’s New: Intel today announced it has successfully integrated its 1.6 Tbps silicon photonics engine with its 12.8 Tbps programmable Ethernet switch. This co-packaged solution brings together the essential technology building blocks from Intel and its Barefoot Networks Division for integrated optics on an Ethernet switch.

“Our co-packaged optics demonstration is the first step to making optical I/O with silicon photonics a reality. We share the industry belief that co-packaged optics offers power and density advantages for switches at 25 Tbps and higher, and ultimately is a necessary and enabling technology for bandwidth scalability in future networks. The timing of this demonstration shows the technology is ready to support our customers’ requirements.”
–Hong Hou, Intel corporate vice president and general manager of the Silicon Photonics Products Division

Who It Helps: The co-packaged switch is optimized for hyperscale data centers, where demand for cost-effective interconnect and bandwidth is limitless. Intel is currently demonstrating this technology to customers.

Why It Matters: Today’s data center switches depend on pluggable optics installed in the switch faceplate that are connected to switch serializer/deserializer (SerDes) ports using an electrical trace. But as data center switch bandwidth grows, connecting the SerDes to pluggable optics electrically will be more complex and require more power. With co-packaged optics, the optical port is placed near the switch within the same package, thus reducing power and enabling continued switch bandwidth scalability.

What is Being Demonstrated: This demonstration brings together the best of Barefoot Networks’ programmable Ethernet switch technology and Intel’s silicon photonics technology. The integrated switch package in this demonstration uses a P4-programmable Barefoot Tofino™ 2 switch ASIC co-packaged with 1.6 Tbps silicon photonics engines from Intel’s Silicon Photonics Product Division.

More about Barefoot Networks Ethernet Switch: Barefoot Tofino 2 is a P4-programmable Ethernet switch that delivers up to 12.8 Tbps throughput and is based on the company’s Protocol Independent Switch Architecture (PISA). PISA is programmed using the open source P4 programming language for data planes. With the P4 data plane, Tofino switches’ forwarding capability can be adapted via software to new needs in the network or to new protocols that are supported by P4. The performance and programmability of Tofino 2 are designed to meet the needs of hyperscale data centers and cloud and service provider networks.

For co-packaged optics, the Barefoot Tofino 2 switch ships in a multi-die package that makes it easier to co-package the optical engine and to upgrade the SerDes for lower power or higher throughput.

“As switch chips scale to meet requirements for demand of limitless bandwidth in cloud-scale data centers, the need for power- and cost-effective interconnect is critical,” said Ed Doe, vice president and general manager of the Barefoot Division. “We have designed our Tofino 2 switch series using leading edge multi-die technology that enables interface flexibility, making it easier for us to integrate and create a scalable co-packaged solution with our silicon photonics products.  This has empowered us to deliver an industry-first solution that will greatly advance the future of data center infrastructure and architectures.”

More about the Silicon Photonics Engine: The silicon photonics interconnect platform features 1.6 Tbps photonic engines realized as 4 ports of 400GBase-DR4 interfaces, designed and manufactured in the Intel silicon photonics platform. The engines are modular arrays of transceivers built around integrated silicon photonics chips with on-chip lasers and high-speed modulators and detectors, representing the evolution of the silicon photonics platform that has shipped in more than 3 million units of 100G pluggable transceivers and powers the 200G and 400G pluggable modules ramping to volume this year. Highlighting the modularity and flexibility of the co-packaged switch platform developed by Intel, the integrated switch package features a combination of co-packaged optical ports and copper ports supporting front-plate cages for optical modules or copper cables.

What Barefoot Networks is: Intel acquired Barefoot Networks in 2019 to accelerate its delivery of Ethernet-based fabrics. Barefoot Networks is an emerging leader in Ethernet switch silicon and software for use in the data center, specializing in the programmability and flexibility necessary to meet the performance and ever-changing needs of the hyperscale cloud. Barefoot empowers network owners and their infrastructure partners to design, optimize and innovate to meet their specific requirements and gain competitive advantage. In combining the P4 programming language with fast programmable switches, Barefoot has also created an ecosystem for compilers, tools and P4 programs to make P4 accessible to anybody.

More Context: Data Center News | 5G News

The Small Print: Intel technologies may require enabled hardware, software or service activation.

No product or component can be absolutely secure.

Your costs and results may vary.

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GTC 2020: Gain Practical Insights from AI Business Leaders

Deciding whether or not to adopt AI within an enterprise isn’t always an obvious choice. And figuring out when and how to implement key AI strategies can leave more questions than answers.

Businesses faced with these choices need to identify the problems they want to solve. They have to consider many important factors, such as the quality of data, types of data, which deep learning models to use, and how to build the right teams to implement strategies.

Executives can get answers to questions like these during AI for Business sessions at GTC, taking place March 22-26 in San Jose. These talks and discussions will address the most pressing issues for those leading AI adoption within businesses and other organizations.

From initial strategies to enterprise-wide implementations, leaders from the U.S. Congress, Accenture, PayPal and Wells Fargo Bank, among others, will explore real-world use cases that tackle concerns across all industries.

AI for Business talks were packed at last year’s event, so don’t delay in registering for GTC — and plan on showing up early to these must-attend sessions.

AI for Business audience at GTC

Highlights from the AI for Business Agenda

Day One: Monday, March 23

What Enterprises Can Expect from Congress

Get insight into how Congress views and prioritizes AI from U.S. Representative Jerry McNerney, of California’s 9th District, and Ned Finkle, vice president of External Affairs at NVIDIA.

Trusted AI: Effective Data Management and Communication Strategies

Hear leaders in AI from Jones Day, Hewlett Packard Enterprise and NVIDIA discuss best practices and practical steps in mitigating bias, developing trusted systems and strategies, and communicating outcomes.

Modernizing Your Workforce for an AI-Enabled World 

Athina Kanioura, chief analytics officer and global lead of Applied Intelligence at Accenture, shares how to evolve workforces to effectively manage new AI business strategies and implementations.

Day Two: Tuesday, March 24

Leveraging Conversational AI in Your Enterprise

Join panelists from Wells Fargo, Expedia, Cisco and NVIDIA to discover how to maximize the impact of conversational AI, a tool that can help organizations across industries decrease costs, increase revenue and connect with customers in unparalleled ways.

AI Deployments in Action: Lessons from the Front Lines

Business leaders from Intuit, PayPal and NVIDIA explain obstacles they faced when implementing AI projects into their workflows and provide key tips on how to overcome them.

AI Implementers Panel 

Learn from speakers from PayPal, Domino’s and NVIDIA on how to set up your AI projects for success by matching the right technology options to use cases and operational needs.

Beyond Proof of Concept: Scaling AI to Deliver Value Across Large Enterprises

Dan Diasio and Monika Wilczak, principal investigators from EY, aim to demystify the process of taking a successful proof of concept to production and tie the outcomes with business value.

How Business Insights Can Drive Business Outcomes 

Business leaders from Square, Capital One and NVIDIA discuss how data science is expanding the types of business insights available and how industry leaders are using this source of knowledge to drive action.

The Convergence of IoT and AI at the Edge

AI was previously run in data centers and now it’s moving to the edge. Hear from business leaders from MobiledgeX and Verizon who have started this transition and are tackling this challenge.

Join us at GTC 2020 to receive training, insights and direct access to experts on the hottest topics in computing. Register for GTC today.

The post GTC 2020: Gain Practical Insights from AI Business Leaders appeared first on The Official NVIDIA Blog.

Product Fact Sheet: Accelerating 5G Network Infrastructure, from the Core to the Edge

Intel 2nd gen Xeon Scalable

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This week, Intel announced an unmatched silicon portfolio for 5G infrastructure with the launch of the Intel Atom® P5900, a 10nm system-on-chip (SoC) for wireless base stations, and the introduction of both a structured ASIC for 5G network processing and a 5G network-optimized Ethernet network adapter, offering high-precision, GPS-based network service synchronization.

More: Intel Announces Unmatched Portfolio for 5G Network Infrastructure (News Release) | Intel Reinforces Data Center Leadership with New 2nd-Gen Intel Xeon Scalable Processors (News Byte) | Intel Announces Unmatched Portfolio for 5G Network Infrastructure (Press Kit)

Additionally, Intel announced the expansion of its 2nd gen Intel® Xeon® Scalable processor lineup as the company continues to deliver workload-optimized performance, integrated artificial intelligence (AI) acceleration and hardened security at the platform level.

Launching Intel Atom P5900 Platform  

In a highly integrated 10nm SoC, the Intel Atom P5900 delivers what customers require for future-ready 5G base stations, including ultra-low latency, accelerated throughput and precise load balancing.

Performance improvements include up to 5.6 times more secured network communication with the Intel Atom® P5952B processor and Intel® QuickAssist Technology (versus software alone)1 and up to 3.7 times more packet processing with the Intel Atom P5952B processor and Intel® Dynamic Load Balancer (versus software alone)2.

Key features include:

  • Up to 24 Intel Atom P5000 processor cores, based on the Tremont microarchitecture, using 10nm process technology.
  • L1 cache of 32KB/core, L2 cache of 4.5MB per 4-core cluster and shared LLC cache up to 15MB.
  • Base frequency support of up to 2.2 GHz, single-thread performance.
  • Memory capacity of up to 128GB of DDR4 up to 2,933 MT/s with server-class reliability, availability and serviceability (RAS) and support for RDIMM, UDIMM, SODIMM and memory down.
  • Up to 100 Gbps throughput with integrated Intel Ethernet 800 series technology.
  • Up to 100 Gbps security processing with Intel QuickAssist Technology.
  • Up to 440 Gbps network switching connectivity support with up to 20 fully integrated Ethernet SerDes.
  • Up to 16 lanes of flexible high-speed IO configured as PCIe, SATA and/or USB 3.0.
  • Up to 16 lanes of PCIe Gen 3.0.
  • Up to 4 USB 2.0 ports, eMMC 5.1, LPC or eSPI.
  • Extended temperature support of minus 40 C to 85 C with full dynamic temperature range.

New 2nd Gen Intel Xeon Scalable Processors  

The new 2nd Gen Intel Xeon Scalable processors launched today deliver an average of 36% more performance and an average of 42% more performance per dollar3 than the prior generation Intel Xeon Gold and increased value for customers across their cloud, network and edge needs.

Updates include:

  • These new processors add more cores, cache and/or frequency, providing more performance and value across a wide range of mainstream price points.
  • Industry-leading frequency, with a new processor featuring base frequency of 3.9 GHz and turbo frequency up to 4.5 GHz.
  • Continued hardware-based mitigations against side-channel attacks, plus built-in encryption acceleration and key protection technologies.
  • Eighteen Intel® Select Solutions will be updated in the coming weeks with new processor options to take advantage of the improved performance and value. Intel Select Solution are workload-optimized configurations for a variety of popular workloads that reduce the guesswork and accelerate time-to-deployment.
  • Find additional information and SKU chart on “Intel Reinforces Data Center Leadership with New 2nd Gen Intel Xeon Scalable Processors.”

Introducing “Diamond Mesa,” Intel’s First Next-Generation Structured ASIC for 5G Network Acceleration

Structured ASICs like “Diamond Mesa” provide a minimum-risk optimization path for workloads that do not require the full programmability of FPGAs, targeting double the performance efficiency versus the prior generation, and uniquely position Intel as the only provider delivering a full silicon platform foundation for network infrastructure.

Key features include:

  • The first eASIC device to leverage all-new IP from the Intel Programmable Solutions Group, a quad-core ARM A53 processor and secure device manager subsystem.
  • Structured ASICs like Diamond Mesa strike a balance between the programmability and fast time-to-market of FPGAs and the efficient performance of purpose-built ASICs.
  • Only Intel offers developers a full range of silicon solutions to optimize platforms for performance, cost, power, flexibility and time-to-market – from Intel Xeon processors to purpose-built ASICs.

Introducing the Intel Ethernet 700 Series Network Adapter with Hardware-Enhanced Precision Time Protocol (code-named “Edgewater Channel”)

Intel introduced the Intel® Ethernet 700 Series network adapter with hardware-enhanced Precision Time Protocol (PTP), which is designed for 5G, edge and other use cases with very tight latency and timing requirements.

Intel Ethernet 700 Series is compliant with the IEEE 1588 PTP standard and increases phase accuracy through a combination of hardware enhancements and software optimizations with within 100 nanoseconds or less.

Key features include:

  • Onboard high-precision oscillator with up to 5,000 times tighter accuracy: Provides greater phase
    accuracy than a standard Ethernet adapter and better holdover between clock interruption. (5000x=20 ppb TCXO oscillator (10 °C to 70 °C) vs. typical 100 ppm crystal)
  • Dual SubMiniature version A (SMA) coaxial connectors: Allow connection to external timing sources, such as GPS signaling devices and to timing sinks/recipients, allowing the NIC to act as
    a grandmaster and as a timing source for other equipment.
  • Software-defined pins (SDPs): User-configurable I/O pins drive the SMAs and provide built-in timing coordination between ports.
  • Standard Linux support: Linux PTP utility provides support for multiple PTP profiles and use of SDPs for sync via 1 pulse per second (PPS) input and output signals.

1 Get up to 5.6X more packet security throughput with Intel QAT and the integrated switch, versus software: Tested by Intel on 1/27/2020, 1x Intel Atom® P5952B processor (Running under A-3 Eng Silicon 20C, 2.2GHz) on Intel internal Frost Creek platform, 16GB DDR4 2933MHz, OS: Ubuntu 18.04 with Kernel: 5.2.10-rt5, BIOS: JBVLCRB1.86B.0011.D44.1909191126, uCode: 0x90010006, Benchmark: DPDK IPSec (using Intel® QAT) (1420B packet size) (1C/1T/1P) (Estimated), Software: DPDK 19.05, Compiler: GCC 7.3.0 with MKL, Network: Onboard 100GbE NIC compared to 1x Intel Atom® P5952B processor (Running under A-3 Eng Silicon 20C, 2.2GHz) on Intel internal Frost Creek platform, 16GB DDR4 2933MHz, OS: Ubuntu 18.04 with Kernel: 5.2.10-rt5, BIOS: JBVLCRB1.86B.0011.D44.1909191126, uCode: 0x90010006, Benchmark: DPDK IPSec (using software cipher algorithm AES-128-CBC) (1420B packet size) (1C/1T/1P) (Estimated), Software: DPDK 19.05, Compiler: GCC 7.3.0 with MKL, Network: Onboard 100GbE NIC.

2 Achieve up to 3.7X more packet balancing throughput versus software queue management: Tested by Intel on 1/27/2020, 1x Intel Atom® P5952B processor (Running under A-3 Eng Silicon 20C, 2.2GHz) on Intel internal Victoria Canyon platform, 16GB DDR4 2933MHz ,OS: Ubuntu 18.04 with Kernel: 5.2.10-rt5, BIOS: JBVLCRB1.86B.0012.D17.1911070324, uCode: 0x90040006, Benchmark: DPDK Event Device Ordered Scheduling (3 stages) (Estimated), Software: RDK19.11, Compiler: GCC 7.3.0 with MKL, Network: 1x Intel® Ethernet Network Adapter X710-DA4 (10GbE) compared to 1x Intel Atom® P5952B processor (Running under A-3 Eng Silicon 20C, 2.2GHz) on Intel internal Victoria Canyon platform, 16GB DDR4 2933MHz, OS: Ubuntu 18.04 with Kernel: 5.2.10-rt5, BIOS: JBVLCRB1.86B.0012.D17.1911070324, uCode: 0x90040006, Benchmark: DPDK Event Device Ordered Scheduling (3 stages) (Estimated), Software: RDK19.11, Compiler: GCC 7.3.0 with MKL, Network: 1x Intel® Ethernet Network Adapter X710-DA4 (10GbE).

3 36% more performance & 42% more performance/dollar: Geomean of Integer Throughput, Floating Point Throughput, Stream Triad, and Linpack across ten new 2-socket 2nd Gen Gold processors vs first generation. 2nd Gen Gold R processors: 1-node, 2x 2nd Gen Intel Xeon Gold cpu on Intel Reference platform with 384 GB (12 slots / 32 GB / 2933)  total memory, ucode 0x500002c, HT on for all except off for Stream, Linpack, Turbo on, with Ubuntu19.10, 5.3.0-24-generic, 6258R/$3950: int=323, fp=262, stream=224, Linpack=3305, 6248R/$2700: int=299, fp=248, stream=224, Linpack=3010, 6246R/$3286: int=238, fp=217, stream=225, Linpack=2394, 6242R/$2529: int=265, fp=231, stream=227, Linpack=2698, 6240R/$2200: int=268, fp=228, stream=223, Linpack=2438, 6238R/$2612: int=287, fp=240, stream=222, Linpack=2545, 6230R/$1894: int=266, fp=227, stream=222, Linpack=2219, 6226R/$1300: int=208, fp=192, stream=200, Linpack=2073, 5220R/$1555: int=257, fp=220, stream=210, Linpack=1610, 5218R/$1273: int=210, fp=188, stream=199, Linpack=1290 test by Intel on 12/25/2019.  First Gen Gold processor: 1-node, 2x Intel Xeon Gold cpu on Intel Reference platform with 384 GB (12 slots / 32 GB / 2933)  total memory, ucode 0x2000065, HT on for all except off for Stream, Linpack, Turbo on, with Ubuntu19.10, 5.3.0-24-generic, 6152/$3655: int=224, fp=198, stream=200, Linpack=19886148/$3072: int=225, fp=198, stream=197, Linpack=2162, 6146/$3286: int=161, fp=175, stream=185, Linpack=1896, 6142/$2946: int=193, fp=176, stream=185, Linpack=1895, 6140/$2445: int=202, fp=183, stream=188, Linpack=1877, 6138/$2612: int=189, fp=195, stream=189, Linpack=1976, 6130/$1894: int=172, fp=165, stream=185, Linpack=1645, 6126/$1776: int=141, fp=157, stream=170, Linpack=1605, 5120/$1555: int=133, fp=148, stream=159, Linpack=924, 5118/$1273: int=134, fp=132, stream=149, Linpack=818 test by Intel on 2/18/2020.

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Intel Highlights Latest Security Investments at RSA 2020

Intel 2020 RSAC 1

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SAN FRANCISCO, Feb. 26, 2020 – At the Intel Security Day event during RSA Conference 2020, Intel underscored its commitment to security with several announcements, including details on security capabilities coming in future products. At Intel, security is a fundamental and foundational element of all aspects of architecture, design and implementation. Together with customers and partners, Intel is building a more trusted foundation in this data-centric world.

“Hardware is the bedrock of any security solution. Just as a physical structure requires a foundation established on bedrock to withstand the forces of nature, security solutions rooted in hardware will provide the greatest opportunity to provide security assurance against current and future threats,” said Tom Garrison, Intel vice president and general manager of Client Security Strategy and Initiatives. “Intel hardware, and the assurance and security technologies it brings, help harden the layers above from attack.”

More: Intel Security News

Intel customers build solutions and services that depend on the breadth and depth of technologies in the silicon, vertical integration and substantive reach from edge to cloud. It is Intel’s mission to provide common security capabilities across all architectures, to help address the ever-increasing sophistication of user experiences.

Data must be protected at rest and in motion. The protection of data is critical to extracting value from it, while delivering uncompromised performance. The next 10 years will see more architecture ​advancements than the past 50 years.

“Intel is uniquely positioned in the industry to create and deliver truly innovative security technologies that span architectures, memory and interconnect,” said John Sell, Intel Fellow and director of Intel Security Architecture and Technology.

Data Platform Protection

As the demand for data-intensive computing grows, there is a need to balance the ease of scaling deployment with the level of data protections. To address customer challenges, new confidential computing capabilities on future data center platforms are expected to offer scale and choice:

  • Application isolation helps protect data in use with a very narrow attack surface. Already deployed for production data centers and solutions, Intel® Software Guard Extensions (Intel SGX) will expand to a broader range of mainstream data-centric platforms, and is expected to provide larger protected enclaves, extended protections to offload accelerators and improved performance. This will further expand the number of usages able to leverage these advanced application isolation capabilities.
  • VM and container isolation helps provide protections in virtualized environments, isolating them from each other and from the hypervisor and cloud provider without requiring application code modifications.
  • Full memory encryption helps better protect against physical memory attacks​ by providing hardware-based encryption transparent to the operating system and software​ layers.
  • Intel® Platform Firmware Resilience is an Intel FPGA-based solution that helps protect the various platform firmware components by monitoring and filtering malicious traffic on the system buses. It also verifies the integrity of platform firmware images before any firmware code is executed and can recover corrupted firmware back to a known good state. When combined with other trusted boot technologies on new platform generations, Intel continues to contribute additional tools to increase resistance against attack and help provide a more trusted foundation for modern cloud and enterprise deployments.

More information can be found on Intel’s IT Peer Network.

Compute Lifecycle Assurance Industry Traction

Since its launch in December, Intel’s Compute Lifecycle Assurance Initiative has gained traction with customers and ecosystem partners, starting with the foundational offering Intel® Transparent Supply Chain (Intel TSC).

Transparency of a device’s origin helps establish the foundation for a trusted supply chain. Intel TSC tools allow platform manufacturers to bind platform information and measurement using the Trusted Computing Group’s (TCG) Trusted Platform Module 2.0 (TPM) standard, also referred to as ISO 11889. This allows customers to gain traceability and accountability for platforms with component-level reporting. More information can be found in a blog by Intel’s Tom Dodson.

Intel TSC is currently available for customers across Intel vPro® platform-based PCs, Intel® NUC, Intel® Xeon® SP systems, Intel® solid-state drives and certain Intel® Core™ commercial PCs.

To demonstrate Intel’s commitment to transparency, measurement and assurance of the supply chain, Intel also enables ecosystem partners with Intel TSC tools. Today, Hyve Solutions, Inspur, Lenovo (client and server), Mitac, Quanta, Supermicro and ZT Systems have enabled Intel TSC tools. In addition, Intel has active deployments of Intel TSC with enterprise IT and cloud service providers.

“This chain of trust process provides essential traceability based on the TPM,” said Thorsten Stremlau, chair of TCG’s Marketing Work Group. “Bringing component-level traceability to platforms and systems increases confidence and reduces the risk of counterfeit electronic parts while also facilitating procurement standards. This is the right direction for the industry.”

It often takes the industry working together to make technological advancements. Intel has a strong legacy of assisting its customers and industry partners in developing new and innovative ways to improve hardware security. Intel shares knowledge of this experience through its participation and contributions to leading industry initiatives and standards bodies, including the Confidential Computing Consortium under the Linux Foundation, the FIDO Alliance’s IoT Technical Workgroup and the newly expanded Common Weakness Enumeration led by MITRE. Such efforts underscore Intel’s unique capacity to build a more trusted foundation for the industry.

Notices & Disclaimers

Intel technologies may require enabled hardware, software or service activation.

No product or component can be absolutely secure.

Your costs and results may vary.

The post Intel Highlights Latest Security Investments at RSA 2020 appeared first on Intel Newsroom.

Intel Announces Unmatched Portfolio for 5G Network Infrastructure

SANTA CLARA, Calif., Feb. 24, 2020 – Unlocking the full potential of 5G requires transforming network infrastructure from core to edge. As the world’s leading network silicon provider, Intel is at the forefront of driving this transformation. Today, the company made a sweeping set of hardware and software announcements, including the launch of the new Intel Atom™ P5900, a 10nm system-on-chip (SoC) for wireless base stations, which is a critical early deployment target for 5G networks.

More: Intel Announces Unmatched Portfolio for 5G Network Infrastructure (Press Kit) | Intel Reinforces Data Center Leadership with New 2nd-Gen Intel Xeon Scalable Processors

“As the industry makes the transition to 5G, we continue to see network infrastructure as the most significant opportunity, representing a $25 billion silicon opportunity by 2023,” said Navin Shenoy, executive vice president and general manager of the Data Platforms Group at Intel. “By offering customers the fastest and most effective path to design, deliver and deploy 5G solutions across core, edge and access, we are poised to expand our leading silicon position in this growing market.”

intel ethernet 700 series xxv710 da2t

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Unmatched Portfolio for 5G Infrastructure

As the promise of 5G takes hold, customers are demanding the increased performance and flexibility they need to rapidly deliver services with lower latency where they are needed most. In this light, Intel announced a number of firsts today, including:

  • Launching the Intel Atom P5900 platform, the first Intel architecture-based 10nm SoC for wireless base stations: With the launch of the Intel Atom P5900, the company is extending Intel architecture from the core to access and all the way to the farthest edge of the network. Intel now expects to be the leading silicon provider in base stations by 2021, a year earlier than first predicted. As a highly integrated 10nm SoC, the Intel Atom P5900 is designed to meet critical 5G network needs, including high bandwidth and low latency to deliver what’s required for 5G base stations today and in the future. The product augments Intel’s rich silicon portfolio for network environments and introduces Intel silicon as the foundation for the wireless base stations market, with 6 million 5G base stations forecasted through 2024. Intel is working with leading providers to deliver this product as part of their future-differentiated solutions in market.
  • New 2nd Gen Intel® Xeon® Scalable processors: As the foundation for data platform infrastructure with over 30 million units sold, Intel Xeon Scalable processors have led the transformation of the network. This year, 50% of core network deployments are transforming to virtualized networks, with the expectation to grow beyond 80% by 2024¹, fueled by 5G. The new 2nd Gen Intel Xeon Scalable processors launched today deliver an average of 36% more performance and an average of 42% more performance per dollar² than the prior generation Intel® Xeon® Gold and increased value for customers across their cloud, network and edge needs. In addition, Intel Xeon Scalable helps protect the integrity of the data and the platform with hardware-enhanced security and built-in encryption accelerators. In conjunction, Intel introduced 18 updated Select Solutions supporting these new processors across customer-prioritized workloads.
  • Introducing “Diamond Mesa,” Intel’s first next-generation structured ASIC for 5G network acceleration: “Diamond Mesa” (code name) is designed to complement Intel’s unmatched portfolio of processors and FPGAs delivering the high performance and low latency required for 5G networks. Structured ASICs like Diamond Mesa provide a minimum-risk optimization path for workloads that do not require the full programmability of FPGAs, targeting double the performance efficiency versus the prior generation, and uniquely position Intel as the only provider delivering a full silicon platform foundation for network infrastructure. Diamond Mesa is open to early access customers.
  • Introducing the Intel® Ethernet 700 Series Network Adapter with hardware-enhanced Precision Time Protocol, the first 5G network-optimized Ethernet NIC: The Ethernet 700 series (code-named “Edgewater Channel”) is Intel’s first 5G-optimized network adapter, offering GPS-based cross-network service synchronization with hardware-enhanced Precision Time Protocol (PTP). Latency requirements across 5G network implementations have challenged existing Ethernet technology, especially in edge servers. Maintaining accurate time synchronization across the network at a cost-effective price point, however, is one avenue to help address application latency. The Ethernet 700 series adapter increases the timing precision required for 5G networks through a combination of hardware and software enhancements. Edgewater Channel is sampling now and will enter production in 2020’s second quarter.

New Software Investments

Intel expands its industry-leading edge computing software toolkits to accelerate time-to-market innovation for its customers and partners with new capabilities integrated into the Open Network Edge Services Software (OpenNESS) toolkit. OpenNESS now supports standalone 5GNR and Enhanced Platform Awareness (EPA) deployments, giving customers the flexibility to easily deploy their choice of cloud-native edge microservices. Intel is delivering customized OpenNESS experience kits to accelerate custom 5G deployments. OpenNESS complements Intel’s OpenVINO™ and Open Visual Cloud for edge computing development needs.

Unrivaled Ecosystem Collaborations

Technology innovation requires deep collaboration across industry innovators that build on each other’s contributions. Given its rich heritage in leading technology transitions, Intel is in a unique position to accelerate collaboration across its customers and partners. Intel has announced strategic collaborations with industry leaders, including Altiostar, Dell, Deutsche Telecom, HPE, Lenovo, QCT, Rakuten, VMware and ZTE to advance network infrastructure capability and speed edge solutions in the market.

Intel has been at the forefront of technology innovation for 51 years. By delivering the broadest silicon portfolio for 5G network infrastructure, the company continues to open a world of opportunity for its customers and partners.

¹Source: Dell’Oro Mobile Core Network 5 Year Forecast Report, Dell’Oro Group, 01/2020

²Geomean of Integer Throughput, Floating Point Throughput, Stream Triad, and Linpack across ten new 2-socket 2nd Gen Gold processors vs first generation. 2nd Gen Gold R processors: 1-node, 2x 2nd Gen Intel Xeon Gold cpu on Intel Reference platform with 384 GB (12 slots / 32 GB / 2933)  total memory, ucode 0x500002c, HT on for all except off for Stream, Linpack, Turbo on, with Ubuntu19.10, 5.3.0-24-generic, 6258R/$3950: int=323, fp=262, stream=224, Linpack=3305, 6248R/$2700: int=299, fp=248, stream=224, Linpack=3010, 6246R/$3286: int=238, fp=217, stream=225, Linpack=2394, 6242R/$2529: int=265, fp=231, stream=227, Linpack=2698, 6240R/$2200: int=268, fp=228, stream=223, Linpack=2438, 6238R/$2612: int=287, fp=240, stream=222, Linpack=2545, 6230R/$1894: int=266, fp=227, stream=222, Linpack=2219, 6226R/$1300: int=208, fp=192, stream=200, Linpack=2073, 5220R/$1555: int=257, fp=220, stream=210, Linpack=1610, 5218R/$1273: int=210, fp=188, stream=199, Linpack=1290 test by Intel on 12/25/2019.  First Gen Gold processor: 1-node, 2x Intel Xeon Gold cpu on Intel Reference platform with 384 GB (12 slots / 32 GB / 2933)  total memory, ucode 0x2000065, HT on for all except off for Stream, Linpack, Turbo on, with Ubuntu19.10, 5.3.0-24-generic, 6152/$3655: int=224, fp=198, stream=200, Linpack=19886148/$3072: int=225, fp=198, stream=197, Linpack=2162, 6146/$3286: int=161, fp=175, stream=185, Linpack=1896, 6142/$2946: int=193, fp=176, stream=185, Linpack=1895, 6140/$2445: int=202, fp=183, stream=188, Linpack=1877, 6138/$2612: int=189, fp=195, stream=189, Linpack=1976, 6130/$1894: int=172, fp=165, stream=185, Linpack=1645, 6126/$1776: int=141, fp=157, stream=170, Linpack=1605, 5120/$1555: int=133, fp=148, stream=159, Linpack=924, 5118/$1273: int=134, fp=132, stream=149, Linpack=818 test by Intel on 2/18/2020.

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Intel Reinforces Data Center Leadership with New 2nd Gen Intel Xeon Scalable Processors

2nd Gen Xeon Scalable Portfolio Enhancements
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Intel today announced the addition of new performance and performance-per-dollar-optimized processors to the Intel® Xeon® Scalable platform, the industry’s most widely deployed server platform with more than 30 million units sold. The addition of these new processors targets the majority of Intel’s mainstream Xeon Scalable customers across cloud, network and edge. With broad availability starting today from leading OxMs, these new 2nd Gen Intel Xeon Scalable processors reinforce Intel’s data center leadership by providing greater performance and performance-per-dollar choices for customers.

“Intel’s data-centric platforms offer the broadest market coverage of any server processor platform -– from the cloud, through the network, to the intelligent edge,” said Lisa Spelman, corporate vice president and general manager of the Xeon and Memory Group within Intel’s Data Platform Group. “Working closely with our customers, we are delivering these new server processors to address their performance and pricing needs across a broad range of markets and workloads.”

More: 5G Network Portfolio Launch (press kit)

The new 2nd Gen Intel Xeon Gold processors deliver an average of 1.36-times higher performance1 and 1.42-times better performance-per-dollar1 compared with the 1st Gen Intel Xeon Gold processors.

To deliver this level of performance and value, Intel has optimized these new server processors in several areas, including adding more cores, increasing cache sizes or by boosting processor frequency. The new processors — labeled with an “R,” “T” or “U” suffix — are designed for dual- and single-socket mainstream and entry-level server systems. The addition of more cores and increased cache in these processors are targeted at workloads where capacity-per-server is critical, such as virtualized clouds, hyper-converged infrastructure (HCI) and network function virtualization (NFV).

Intel also announced today two new processors (Intel Xeon Gold 6256 and 6250) that feature the industry’s highest server processor frequency, delivering a base and turbo frequency up to 3.9 GHz and 4.5 GHz, respectively. These high-frequency processors are optimized for workloads that scale with clock frequency, such as financial trading, simulation and modeling, high-performance computing, and databases.

The new 2nd Gen Intel Xeon Scalable processors target three broad customer use cases:

  • Industry-leading frequencies for high-performance usages: New Intel Xeon Gold 6200 processors deliver up to 4.5 GHz processor frequency with Intel Turbo Boost Technology and up to 33% more processor cache, offering customers breakthrough performance for frequency-fueled workloads.
  • Enhanced performance for mainstream usages: New Intel Xeon Gold 6200R and 5200R processors deliver built-in value through a combination of higher base and Intel Turbo Boost Technology frequencies, in addition to increased processor cache.
  • Increased value and capability for entry-level, edge, networking and IoT usages: New Intel Xeon Gold 6200U, Silver 4200R, Sliver 4210T and Bronze 3200R processors deliver increased value for single-socket entry-level servers, as well as edge, networking and internet of things (IoT) usages.

Intel’s broad ecosystem partners are taking advantage of the additional Xeon Scalable processor value now. Hundreds of systems featuring the new 2nd Gen Intel Xeon Scalable processors are offered through leading OEMs and ODMs. Systems are available today, with more in the coming weeks.

With these new processors, Intel continues to reinforce its data center leadership by delivering the performance and value customers require. The 2nd Gen Intel Xeon Scalable processors support the broadest market coverage of any server processor platform. Today’s Intel Xeon Scalable processors remain the only mainstream server processor with built-in artificial intelligence (AI) acceleration, with Intel DL Boost technology and with support for Intel® Optane™ persistent memory, which offers a large and persistent memory tier at affordable costs.

2nd Gen Xeon Scalable SKU Stack
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1 Performance results are based on testing as of dates in configuration and may not reflect all publicly available security updates. See configuration disclosure for details. No product can be absolutely secure.  For more complete information about performance and benchmark results, visitwww.intel.com/benchmarks. Refer to http://software.intel.com/en-us/articles/optimization-notice for more information regarding performance and optimization choices in Intel software products. Results have been estimated or simulated.

36% more performance & 42% more performance/dollar: Geomean of Integer Throughput, Floating Point Throughput, Stream Triad, and Linpack across ten new 2-socket 2nd Gen Gold processors vs first generation. 2nd Gen Gold R processors: 1-node, 2x 2nd Gen Intel Xeon Gold cpu on Intel Reference platform with 384 GB (12 slots / 32 GB / 2933)  total memory, ucode 0x500002c, HT on for all except off for Stream, Linpack, Turbo on, with Ubuntu19.10, 5.3.0-24-generic, 6258R/$3950: int=323, fp=262, stream=224, Linpack=3305, 6248R/$2700: int=299, fp=248, stream=224, Linpack=3010, 6246R/$3286: int=238, fp=217, stream=225, Linpack=2394, 6242R/$2529: int=265, fp=231, stream=227, Linpack=2698, 6240R/$2200: int=268, fp=228, stream=223, Linpack=2438, 6238R/$2612: int=287, fp=240, stream=222, Linpack=2545, 6230R/$1894: int=266, fp=227, stream=222, Linpack=2219, 6226R/$1300: int=208, fp=192, stream=200, Linpack=2073, 5220R/$1555: int=257, fp=220, stream=210, Linpack=1610, 5218R/$1273: int=210, fp=188, stream=199, Linpack=1290 test by Intel on 12/25/2019.  First Gen Gold processor: 1-node, 2x Intel Xeon Gold cpu on Intel Reference platform with 384 GB (12 slots / 32 GB / 2933)  total memory, ucode 0x2000065, HT on for all except off for Stream, Linpack, Turbo on, with Ubuntu19.10, 5.3.0-24-generic, 6152/$3655: int=224, fp=198, stream=200, Linpack=19886148/$3072: int=225, fp=198, stream=197, Linpack=2162, 6146/$3286: int=161, fp=175, stream=185, Linpack=1896, 6142/$2946: int=193, fp=176, stream=185, Linpack=1895, 6140/$2445: int=202, fp=183, stream=188, Linpack=1877, 6138/$2612: int=189, fp=195, stream=189, Linpack=1976, 6130/$1894: int=172, fp=165, stream=185, Linpack=1645, 6126/$1776: int=141, fp=157, stream=170, Linpack=1605, 5120/$1555: int=133, fp=148, stream=159, Linpack=924, 5118/$1273: int=134, fp=132, stream=149, Linpack=818 test by Intel on 2/18/2020.

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Navin Shenoy Introduces Intel’s 5G Network Portfolio

Navin Shenoy, Intel executive vice president and general manager of the Data Platforms Group, introduces the newest additions to Intel’s robust portfolio for 5G network infrastructure.

Read more about Intel’s 5G network transformation:

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How Evo’s AI Keeps Fashion Forward

Imagine if fashion houses knew that teal blue was going to replace orange as the new black. Or if retailers knew that tie dye was going to be the wave to ride when swimsuit season rolls in this summer.

So far, there hasn’t been an efficient way of getting ahead of consumer and market trends like these. But Italy-based startup Evo is helping retailers and fashion houses get a jump on changing tastes and a whole lot more.

The company’s deep-learning pricing and supply chain systems, powered by NVIDIA GPUs, let organizations quickly respond to changes — whether in markets, weather, inventory, customers, or competitor moves — by recommending optimal pricing, inventory and promotions in stores.

Evo is also a member of the NVIDIA Inception program, a virtual accelerator that offers startups in AI and data science go-to-market support, expertise and technology assistance.

The AI Show Stopper

Evo was born from a Ph.D. thesis by its founder, Fabrizio Fantini, while he was at Harvard.

Now the company’s CEO, Fantini discovered new algorithms that could outperform even the most complex and expensive commercial pricing systems in use at the time.

“Our research was shocking, as we measured an immediate 30 percent reduction in the average forecast error rate, and then continuous improvement thereafter,” Fantini said. “We realized that the ability to ingest more data, and to self-learn, was going to be of strategic importance to any player with any intention of remaining commercially viable.”

The software, developed in the I3P incubator at the Polytechnic University of Turin, examines patterns in fashion choices and draws data that anticipates market demand.

Last year, Evo’s systems managed goods worth over 10 billion euros from more than 2,000 retail stores. Its algorithms changed over 1 million prices and physically moved over 15 million items, while generating more than 100 million euros in additional profit for customers, according to the company.

Nearly three dozen companies, including grocers and other retailers, as well as fashion houses, have already benefited from these predictions.

“Our pilot clients showed a 10 percent improvement in margin within the first 12 months,” Fantini said. “And longer term, they achieved up to 5.5 points of EBITDA margin expansion, which was unprecedented.”

GPUs in Vogue 

Evo uses NVIDIA GPUs to run neural network models that transform data into predictive signals of market trends. This allows clients to make systematic and profitable decisions.

Using a combination of advanced machine learning methods and statistics, the system transforms products into “functional attributes,” such as type of sleeve or neckline, and into “style attributes,” such as the color or silhouette.

It works off a database that maps the social media, internet patterns and purchase behaviors of over 1.3 billion consumers, which is a fully representative sample of the entire world population.

Then the system uses multiple algorithms and approaches, including meta-modeling, to process market data that is tagged automatically based on the clients, prices, products and characteristics of a company’s main competitors.

This makes the data directly comparable across different companies and geographies, which is one of the key ingredients required for success.

“It’s a bit like Google Translate,” said Fantini. “Learning from its corpus of translations to make each new request smarter, we use our growing body of data to help each new prediction become more accurate, but we work directly on transaction data rather than images, text or voice as others do.”

These insights help retailers understand how to manage their supply chains and how to plan pricing and production even when facing rapid changes in demand.

In the future, Evo plans to use AI to help design fashion collections and forecast trends at increasingly earlier stages.

Resources:

Image by Pexels.

The post How Evo’s AI Keeps Fashion Forward appeared first on The Official NVIDIA Blog.

Laika’s Oscar-nominated ‘Missing Link’ Comes to Life with Intel Technology

As moviemaking — and even the actors themselves — goes increasingly digital, Laika studios in Oregon is a unique hybrid. Most movies today are live action with visual effects added later — or they’re fully digital. Laika starts with the century-old craft of stop motion — 24 handcrafted frames per second — and uses visual effects not only to clean up those frames but to add backgrounds and characters.

“We’re dedicated to pushing the boundaries and trying to expand what you can do in a stop motion film,” says Jeff Stringer, director of production technology at Laika. “We want to try and get as much as we can in-camera, but using visual effects allows us to scale it up and do more.”

That’s exactly what Laika did with its latest feature, “Missing Link,” the company’s fifth-straight movie to be nominated for an Academy Award for best animated feature, and its first to win a Golden Globe. “The scope of this movie is huge,” the film’s writer-director, Chris Butler, told the Los Angeles Times. According to Animation World Network, the computational requirements of the film’s digital backgrounds and characters topped a petabyte of storage, and rendering the entire movie took 112 million processor hours — or 12,785 years.

Like most motion picture content today, Laika rendered “Missing Link” on Intel® Xeon® Scalable processors.  Intel and Laika engineers are working together to apply AI to further automate and speed the company’s articulate process. “Our biggest metric is, is the performance believable and beautiful?” Stringer asks. “Our ethos is to not let the craft limit the storytelling but try to push the craft as far as the story wants to go.”

Voting for the 2020 Academy Awards ends Tuesday, Feb. 4, and the Oscars will be awarded Sunday, Feb. 9.

More: Go behind the scenes and explore a special interactive booklet celebrating the world-class artists who brought “Missing Link” to life. | All Intel Images

Laika Intel Newsroom 1

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2020 CES: Intel Brings Innovation to Life with Intelligent Tech Spanning the Cloud, Network, Edge and PC

ASUS Chromebook Flip Intel Project Athena

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LAS VEGAS, Jan. 6, 2020 – Breakthroughs in artificial intelligence (AI) that pave the way for autonomous driving. A new era of mobile computing innovation. The future of immersive sports and entertainment. Intel demonstrated all of these and more today at CES 2020, showcasing how the company is infusing intelligence across the cloud, network, edge and PC, and driving positive impact for people, business and society.

Intel CEO Bob Swan kicked off today’s news conference by sharing updates from its Mobileye business, including a demonstration of its self-driving robocar navigating traffic in a natural manner. The drive demonstrated Mobileye’s unique and innovative approach to deliver safer mobility for all with a combination of artificial intelligence, computer vision, the regulatory science model of RSS and true redundancy through independent sensing systems.

Swan also highlighted Intel’s work with the American Red Cross and its Missing Maps project to improve disaster preparedness. Using integrated AI acceleration on 2nd Generation Intel® Xeon® Scalable processors, Intel is helping the American Red Cross and its Missing Maps project to build highly accurate maps with bridges and roads for remote regions of the world, which helps emergency responders in the event of a disaster.

“At Intel, our ambition is to help customers make the most of technology inflections like AI, 5G and the intelligent edge so that together we can enrich lives and shape the world for decades to come. As we highlighted today, our drive to infuse intelligence into every aspect of computing can have positive impact at unprecedented scale,” Swan said.

Intelligence-Driven Mobile Computing

Mobile computing was an area of emphasis, as Intel made announcements spanning new products, partnerships and exciting platform-level innovations that will transform the way people focus, create and engage. Intel Executive Vice President Gregory Bryant announced the following:

  • First look and demonstration of the newest Intel® Core™ mobile processors, code-named “Tiger Lake”: Tiger Lake is designed to bring Intel’s bold, people-led vision for mobile computing to life, with groundbreaking advances in every vector and experience that matters. With optimizations spanning the CPU, AI accelerators and discrete-level integrated graphics based on the new Intel Xe graphics architecture, Tiger Lake will deliver double-digit performance gains1, massive AI performance improvements, a huge leap in graphics performance and 4x the throughput of USB 3 with the new integrated Thunderbolt 4. Built on Intel’s 10nm+ process, the first Tiger Lake systems are expected to ship this year.
  • Preview of first Xe-based discrete GPU: Intel Vice President of Architecture for Graphics and Software Lisa Pearce provided insight into the progress on the new Intel Xe graphics architecture, which will provide huge performance gains in Tiger Lake, and previewed Intel’s first Xe-based discrete GPU, code-named “DG1.”
  • Significant updates on Intel’s “Project Athena” innovation program, including the first Project Athena-verified Chromebooks: Project Athena-verified designs have been tuned, tested and verified to deliver fantastic system-level innovation and benefits spanning battery life, consistent responsiveness, instant wake, application compatibility and more. Intel has verified 25 Project Athena designs to date, and Bryant announced an expanded partnership with Google that has already resulted in the first two Project Athena-verified Chromebooks, the ASUS Chromebook Flip (C436) and the Samsung Galaxy Chromebook. Intel expects to verify approximately 50 more designs across Windows and Chrome this year and deliver a target specification for dual-screen PCs.
  • Form factor innovation, including dual screens and a revolutionary foldable design: Through deepened co-engineering efforts with OEM partners, Intel helps deliver category-defining devices based on Intel Core processors. This includes new dual-screen and foldable designs like the Lenovo ThinkPad X1 Fold, which leverages the Intel Core processor with Intel Hybrid Technology (code-named “Lakefield”) expected to ship midyear, and the Dell Concept Duet. Bryant also previewed Intel’s latest concept device, a foldable OLED display form factor, code-named “Horseshoe Bend.” Based on Intel’s upcoming Tiger Lake mobile processors, the design is similar in size to a 12-inch laptop with a folding touchscreen display that can be opened up to more than 17 inches.

Intelligence-Driven Business Transformation
The data center is the force that delivers intelligence to businesses around the world and Intel Xeon Scalable processors continue to be the foundation of the data center. Intel Executive Vice President Navin Shenoy announced that 3rd Generation Intel Xeon Scalable processors, coming in the first half of 2020, will include new Intel® DL Boost extensions for built-in AI training acceleration, providing up to a 60% increase in training performance over the previous family.

Shenoy highlighted several ways Intel is threading intelligence into data platforms across cloud, network and edge and how this is transforming sports and entertainment:

  • Netflix optimizes and accelerates media streaming services: Netflix has utilized the latest video compression technology, AV1, to enhance Netflix’s media streaming services and bring content to life across the globe, with up to 60% compression efficiency over the previous compression technology (AVC). Intel’s and Netflix’s joint efforts continue with the development of an open-source high-performance encoder (SVT-AV1), optimized on 2nd Gen Intel Xeon Scalable processors, that delivers significant quality and performance gains making it viable for commercial deployment.
  • Enhanced athlete and viewer experiences at Tokyo 2020 with 3D Athlete Tracking: A first-of-its-kind computer vision solution, 3D Athlete Tracking (3DAT) uses AI to enhance the viewing experience with near real-time insights and visualizations. 3DAT uses highly mobile cameras to capture the form and motion of athletes, then applies algorithms optimized with Intel DL Boost and powered by Intel Xeon Scalable processors to analyze the biomechanics of athletes’ movements. Shenoy announced that this technology will enhance replays of the 100-meter and other sprinting events at the Olympic Games Tokyo 2020.
  • Large-scale volumetric video streaming: Intel and the sports industry are transforming the sports viewing experience with volumetric video, an important progression toward enabling sports viewing without limitations. Intel® True View synthesizes the entire volume of the stadiums’ field to provide endless angles that allow fans to choose any vantage point and player perspective and stream from their devices. Intel and the NFL showcased the power of streaming volumetric video with a play from Week 15’s Cleveland Browns-Arizona Cardinals game. The data produced from the first quarter of an NFL game alone reaches beyond 3TB per minute – an exponential increase requiring tremendous computing power.

More information on all of these announcements, including visual assets from the event, is available in the CES press kit on the Intel Newsroom.

1Based on Intel testing and configurations.

Forward-Looking Statements

Statements in this news summary that refer to future plans and expectations, including with respect to Intel’s future products and the expected availability and benefits of such products, are forward-looking statements that involve a number of risks and uncertainties. Words such as “anticipates,” “expects,” “intends,” “goals,” “plans,” “believes,” “seeks,” “estimates,” “continues,” “may,” “will,” “would,” “should,” “could,” and variations of such words and similar expressions are intended to identify such forward-looking statements. Statements that refer to or are based on estimates, forecasts, projections, uncertain events or assumptions, including statements relating to total addressable market (TAM) or market opportunity and anticipated trends in our businesses or the markets relevant to them, also identify forward-looking statements. Such statements are based on the company’s current expectations and involve many risks and uncertainties that could cause actual results to differ materially from those expressed or implied in these forward-looking statements. Important factors that could cause actual results to differ materially from the company’s expectations are set forth in Intel’s earnings release dated October 25, 2018, which is included as an exhibit to Intel’s Form 8-K furnished to the SEC on such date. Additional information regarding these and other factors that could affect Intel’s results is included in Intel’s SEC filings, including the company’s most recent reports on Forms 10-K and 10-Q. Copies of Intel’s Form 10-K, 10-Q and 8-K reports may be obtained by visiting our Investor Relations website at www.intc.com or the SEC’s website at www.sec.gov.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors.

Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit www.intel.com/benchmarks.

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