Navigating Intel’s Future in Technology and Computing

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Rich Uhlig, Intel senior fellow and managing director of Intel Labs, is shown in an Intel Labs workspace where neuromorphic computing is studied in Hillsboro, Oregon. (Credit: Walden Kirsch/Intel Corporation)
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Intel Uhlig Robby
Rich Uhlig, Intel senior fellow and managing director of Intel Labs, is shown with Intel Labs icon Robby the Robot in an Intel Labs workspace in Hillsboro, Oregon. (Credit: Walden Kirsch/Intel Corporation)
How he’d describe his job to a 10-year-old: “We explore the future.”

Digging out promising leads: Rich says the experts at Intel Labs – “We recruit the smartest people in key areas” – discover and research disruptive new forms of technology and computing, often through Intel’s academic investments. Rich and the 750 employees around the world who work with him then incubate the best ideas using Intel’s internal research and align them through a technology-transfer process to Intel’s business objectives. “We also alert the company when it’s time to pay attention to certain technology trends,” says Rich, whose areas of oversight include groundbreaking work on quantum, neuromorphic and probabilistic computing. “You need to have some kind of a disciplined way of teasing out the signal from the noise.”

More: Read about all Intel Innovators | Intel Labs (Press Kit)

Supporting customers inside and outside Intel’s walls: Inside Intel, Intel Labs experts provide business units and product teams with advanced technologies. Outside Intel, Rich says, experts from the labs often work with customers to lend expertise in specific technical areas. “This may help to secure a design win or to build confidence with customers that Intel has a deep technology pipeline out into the future,” he says. But Intel Labs’ outside work is more than just an added level of support. “We are also keen to play an active role in identifying new business opportunities for Intel,” he says. “As an example, we have a great collaboration with Intel Capital that we call ‘Start-up Pathfinding.’ The concept is that the labs identifies very early stage start-up companies that originate out of university research. When we find a promising start-up, we bring the opportunity to Intel Capital for early seed funding.”

Tapping a new kind of data: For years, Intel Labs researchers have recognized that data is not only exploding in quantity, but also changing in nature. “Data for many years has been about productivity data – spreadsheets, databases, Word docs, that kind of thing,” Rich says. “Then we went through a period of data increasingly becoming media-oriented and getting streamed out from centralized data centers.” But a few years ago, an entirely new class of data emerged. “We call it natural data. It’s getting collected out in the world from all the sensors that are blanketing the planet. We are carrying sensors in our pockets with our smart phones; cameras and microphones are getting embedded in the environments that we live and work. All that data collection creates new opportunities if we can manage to derive meaning and value from that data.”

His pro tip for a technology career: Rich, who has been at Intel for 23 years, offers this guidance for people moving into a tech career: “Most innovation comes at the intersection of domains. If you are an expert just in one specific area, the space is likely to be well explored. But if you work at the intersection of two or three areas, the probability that you’ll find something new is higher simply because there aren’t as many people or teams out there that can do the same.”

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New Intel vPro Platform Maximizes IT and Worker Productivity in a Mobile-Centric World

stephanie halfordBy Stephanie Hallford

The emerging workplace is more mobile than ever and rapidly evolving as office walls disintegrate. In fact, 70% of people globally work remotely at least once a week1. From the road warrior to the heavy data-crunching office worker, the PC, as the primary tool for getting work done, has to adapt to their diverse needs.

Information technology (IT) managers face critical decisions to ensure their organizations’ IT health and employee satisfaction. From data security to deploying the latest Windows 10* version, IT managers face internal and external challenges to keep their technology fleet up to date. Add to that their need to manage a heterogeneous device environment and there are many issues to potentially hinder end-user productivity.

To help combat these challenges, Intel is driving PC platforms built for business. These help deliver the connectivity, built-in security features and performance — even when unplugged — that mobile workers require.

Introducing 8th Gen Intel Core vPro processors

Today, we are announcing new 8th Gen Intel® Core™ vPro mobile processors2, based on Intel’s Whiskey Lake architecture.

Intel is helping to usher in a new era of WLAN connectivity for workers on the go. Intel vPro clients configured with Intel® Wi-Fi 6 (Gig+) solutions will be some of the first available in the marketplace to enable faster Wi-Fi 63 connections. This allows people to not only work from anywhere, but enjoy a premium experience – with best-in-class performance for the most demanding mobile applications like video conferencing, real-time collaboration and content-sharing.

More: Intel vPro Processor Brief | Client Computing News

Intel 8th gen vPro 5

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With this launch, Intel brings its new Intel® Hardware Shield technology, which delivers out-of-the-box protection to help defend against firmware attacks. Intel Hardware Shield helps ensure your OS runs on legitimate hardware and provides hardware to software security visibility, enabling the OS to enforce a more complete security policy. Importantly, no additional IT infrastructure is required.

Now with the availability of 8th Gen Intel Core vPro mobile devices for businesses, there is no trade-off of performance even when unplugged. Compared to a 3-year-old PC, the latest 8th Gen Intel Core vPro i7-8665U processor delivers up to 65% faster overall performance4 and up to 11 hours5 of battery life. These advancements allow employees to leave the charger behind and stay productive throughout their work day.

New Intel® Optane™ memory H10 with solid-state storage enables two times faster launch of documents, spreadsheets and presentations while transferring large files – and that’s compared to the same system with a traditional SSD alone. This minimizes the frustration of waiting for apps to load while multitasking. Intel Optane memory H10 delivers the responsiveness to work efficiently and spend less time waiting.

We are excited to be working with OEMs like Dell*, HP*, Lenovo*, Panasonic* and other industry leaders to bring new sleek and beautiful corporate designs to market. PCs built on the 8th Gen Intel Core vPro mobile processors will be rolling out over the next several months.

Why building a platform matters for businesses

The Intel vPro platform is our foundation for business computing. It offers best-in-class performance to drive employee productivity, built-in security technologies to help protect businesses, remote manageability to help lower operational costs and better stability to help decrease computing disruptions. With each new processor generation, Intel builds upon the Intel vPro platform to deliver:

  • Business end-user experience – Increased satisfaction and productivity with enhanced system responsiveness and extended battery life.
  • Hardware enhanced security features – Built-in Intel Hardware Shield for a more trusted foundation for computing.
  • Modern manageability – Allows IT to manage devices remotely and more securely, driving down cost and complexity.
  • Platform stability – With the Intel® Stable Image Platform Program (SIPP), delivering a consistent platform by minimizing platform component updates to help maximize device uptime. Rigorous testing is done by Intel and our OEM partners, which helps yield better quality, reliability and compatibility of system components for our customers.

The Intel vPro platform is built for business. As an established leader in business PC computing, Intel is committed to solving complex customer pain points in an ever-changing work environment.

Stephanie Hallford is vice president in the Client Computing Group and general manager of Business Client Platforms at Intel Corporation.

Performance results are based on testing as March 21, 2019 and may not reflect all publicly available security updates. See configuration disclosure for details. No product or component can be absolutely secure.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark* and MobileMark*, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information about performance and benchmark results, visit intel.com/benchmarks

Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. No product or component can be absolutely secure. Check with your system manufacturer or retailer or learn more at intel.com.

Cost reduction scenarios described are intended as examples of how a given Intel- based product, in the specified circumstances and configurations, may affect future costs and provide cost savings.  Circumstances will vary. Intel does not guarantee any costs or cost reduction.

IWG Study, “70% of people globally work remotely at least once a week” May 30, 2018.

2 8th Gen Intel® Core™ vPro™ i7-8665U processors and Intel® Core™ vPro™ i5-8365U processors

3 Intel® Wi-Fi 6 claims are based on the comparison (39%) of the expected maximum theoretical data rates for dual spatial stream 802.11ax 80Mhz (1201 Mbps) vs. dual spatial stream 802.11ac 80Mhz (867 Mbps) Wi-Fi solutions as documented in IEEE 802.11ax draft 2.0 spec and IEEE 802.11 wireless standard specifications, and require the use of similarly configured 802.11ax wireless network routers.

4 Up to 65% better overall system performance with an 8th Gen Intel® Core™ i7-8665U vs. 3 YO PC as measured by SYSmark* 2018 Overall on an Intel Reference Platform with: Intel® Core™ i7-8665U Processor, PL1= 15W TDP, 4C8T, Turbo up to 4.8GHz, Graphics: Intel® UHD Graphics 620, Memory: 2x4GB DDR4-2400, Storage: 512GB Intel 760p SSD, OS: Microsoft Windows* 10 RS5 Build Version 1809 (Build 1763v1), BIOS: x177, MCU: A8  VS. OEM system with Intel® Core™ i7-6600U Processor, PL1=15W TDP, 2C4T, Turbo up to 3.9GHz, Intel HD Graphics 620, Display: 14” screen with 1920×1080 resolution, Memory: 8GB DDR4, Storage: 256GB SSD, Battery size: 36 WHr, OS: Microsoft Windows* 10 Pro RS5 Build Version 1809 (Build 1763v292), BIOS: v1.0.1, MCU: C2

5 Up to 11 hours battery life for a productive work day with an 8th Gen Intel® Core™ i7-8665U Processor as measured by MobileMark 2018 workload on Pre-production OEM system with Intel® Core™ i7-8665U Processor, PL1= 15W TDP, 4C8T, Turbo up to 4.8GHz, Graphics: Intel® UHD Graphics 620, Display: 14” screen with 1920×1080 resolution, Memory: 16GB, Storage: Hynix 256GB, Battery size: 52 WHr, OS: Windows 10 Pro, BIOS: v.1.0.1, MCU: AA Display brightness is set to 150 nits on DC power.   System’s wireless network adapter is turned on and associated to a wireless network that is not connected to the internet.

6 Up to 2X faster launch of documents, spreadsheets and presentation while transferring large files with an 8th Gen Intel® Core™ i7-8665U with an 512GB Intel® Optane™ memory H10 with solid state storage vs. SSD alone as measured by Microsoft* Word*, Excel and PowerPoint launch workloads. Intel® Core™ i7-8665U Processor, PL1= 15W TDP, 4C8T, Turbo up to 4.8GHz, Graphics: Intel® UHD Graphics 620, Memory: 2x4GB DDR4-2400, Storage: 512GB Intel 760p SSD, OS: Microsoft Windows* 10 RS5 Build Version 1809 (Build 1763v1), BIOS: x177, MCU: A8   VS.  Intel® Core™ i7-8665U Processor, PL1= 15W TDP, 4C8T, Turbo up to 4.8GHz, Graphics: Intel® UHD Graphics 620, Memory: 2x4GB DDR4-2400, Storage: 512GB Intel® Optane™ memory H10 with solid state storage, OS: Microsoft Windows* 10 RS5 Build Version 1809 (Build 1763v1), BIOS: x177, MCU: A8

Intel, the Intel logo, Intel® Optane ™ and Intel Core are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.

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Intel Announces 2019 Partner of the Year Awards for Excellence in Accelerating Innovation

intel 2019 partner of yearWhat’s New: Today Intel recognized the outstanding achievements of 24 partners with the distinction of Partner of the Year at its Intel Partner Connect 2019 conference for the Americas region. The Partner of the Year award honors companies that employ Intel technologies and solutions while demonstrating excellence in technology platform design and integrated solutions sales, marketing and training.

“Our partners are helping their customers deploy computing and memory technologies efficiently to accelerate innovation by providing new services. Intel’s partner program enables full-spectrum market readiness to win in today’s emerging and high-growth markets. We are grateful for the daily collaboration from our customers and industry partners, and I am excited about the shared results from 2018 and eager to bring our upcoming solutions to businesses and organizations across the U.S. in 2019.”
–Greg Ernst, Intel vice president in the Sales and Marketing Group and general manager of United States Sales

Why It Matters: The title of Partner of the Year is awarded to companies achieving the highest standards of design, development, integration and technology deployment to accelerate innovation in PC computing, data center, storage, vertical solutions and marketing.

Partner Program Winners: The companies recognized with Intel’s 2019 Partner of the Year award:

Client Computing

  • ByteSpeed*: PC Client Solution – a virtual reality solution bringing up-and-coming technology to students across the U.S. in a portable, customizable and affordable cart system.
  • Corsair*: Enthusiast Platform – an innovative cooling solution enabling the performance of a full-size creator workstation yet housed in a chassis less than 12 liters in volume.
  • Network Allies, LLC*: NUC Solution – an integrated eDP emulator that enables three displays in a custom NUC conferencing solution, delivering an inexpensive enterprise-class collaboration platform.

Data Center

  • Ace Computers*: Data Center Solution – a 176-node HPC cluster that is one of the first implementations using direct-to-chip hot water liquid cooling technology.
  • Colfax International*: AI Solution – uniquely designed cloud services for developer enablement and software vendor engagement demonstrating the value of Intel Architecture for machine learning and artificial intelligence.
  • Nutanix*: Hybrid Cloud Solution – an Intel datacenter block solution based on server products from the Intel Data Center Solutions Group, available for channel partners to resell, preconfigure and preload Nutanix HCI solutions.
  • Penguin*: HPC Technical Solution – an innovative Linux solution for HPC (high-performance computing) on-premise and in the cloud (Intel CPU, Intel SSDs and Omnipath) with Penguin Computing professional and managed services.

Storage

  • Cohesity*: Enterprise Storage Platform – consolidated data protection, target storage and SQL protection on a single platform that uses Intel NVMe SSDs, resulting in a 50 percent reduction in overall backup windows, improved replication between data centers and substantially improved recovery times.
  • CyberPowerPC*: Optane Innovation – Memory – an Intel® Optane™ technology go-to-market strategy, particularly as the first local OEM to offer Intel® Optane™ technology in retail.
  • RAVE Computer*: Optane Innovation – Storage – a data acquisition and storage solution for U.S. Department of Defense intelligence applications employed on military aircraft in incredibly challenging 55 degrees celsius operating environments and tight space constraints.

Vertical

  • Atos*: Digital Transformation Solution – Global SI – more than four million devices under management and executed the largest Intel® Active Management Technology deployment at a Fortune 100 company.
  • CDW*: Data Center Solution – National Solution Provider – In 2018, CDW drove a comprehensive IT modernization campaign resulting in more than 2,000 CDW sellers being trained on the value of selling Intel® Xeon® Scalable processors to help customers move to a software defined data center environment.
  • Insight*: IoT Solution – IoT solutions that leverage Intel-enabled sensors, gateways and deployment tools, such as OpenVino*, providing a framework as Insight scales its IoT business across multiple verticals.
  • KGPCo*: Network Communications Solution – KGPCo’s premier portfolio is the launch partner platform for Intel Select Branded solutions, including a portfolio of uCPE solutions on Intel technologies, including Intel Select (Intel® Xeon®-D), as well as Denverton-based platforms.
  • Smart Edge*, a wholly owned Pivot* company: Network Communications Innovation – an intelligent edge MEC solution harnessing Intel capabilities across all levels (compute, network, storage and memory) along with advanced software from Intel (NFF-go, QAT and DPDK).
  • Red Hat*: Digital Transformation Solution – Global ISV – automation and private/hybrid cloud solutions delivered increased customer business agility by enabling faster application development and process optimization.
  • SHI International Corp*: Client Solution – National Solution Provider – deployed 8th Generation Intel® Core™ processors and Microsoft* Windows 10 mobile devices with no images required at a lower cost than traditional deployments.
  • Sogeti, Part of Capgemini*: Digital Transformation Innovation – Global SI/ISV – deployed one million Windows 10 seats and 300,000 Intel devices in 2018, collaborating on digital enterprise, IT transformation and emerging technologies projects.
  • World Wide Technology*: Public Sector Solution – designed, built, demonstrated and deployed integrated solutions that delivered transformational outcomes to support the armed forces and federal civilian agencies.

Marketing

  • iBUYPOWER*: Marketing – the company’s College Tour program is a vehicle to engage, educate and cultivate core demographics first-hand through authentic and engaging experiences.
  • PCM*: Marketing Excellence – National Solution Provider – a custom marketing campaign targeting small and medium businesses titled “What New Can Do,” resulting in nearly one million pageviews and more than 230 million impressions.
  • Presidio Networked Solutions*: Training for Results – Technical – ramped Intel® Core™ processors by increasing training and education for pre-sales and solution architects in 2018.
  • SHI International Corp*: Training for Results – Sales – with the challenge of reaching almost 1,500 sales representatives, SHI used Reseller Edge online training and used Intel rangers to engage engineers and solutions architects.
  • Xidax*: Channel Cares – spent hundreds of hours and nearly $40,000 giving PCs to less privileged people in the gaming community, including providing a military veteran with what he needed to become a gaming streamer and to start a PTSD gaming therapy support group.

More Context: For additional information, visit Intel’s Partner Program page.

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Driving the New Memory and Storage Frontier in 2019

Robert CrookeBy Rob Crooke

Intel is not a company that simply dabbles in memory and storage; it’s a company focused on data-centric transformation, of disrupting the memory and storage market with key technologies that bridge cost and performance gaps in the memory and storage hierarchy. We’re building the future for a smart, connected, data-centric world — and the future is now.

Consider this: Memory and storage is vital to the computing experience. Computing advances would not be possible without the evolution of memory and storage. And in today’s data-driven world, the need for moving, storing and processing data requires forward-thinking storage capabilities and cutting-edge innovation in the memory and storage space.

More: Storage and Memory News | U.S. Department of Energy and Intel to Deliver First Exascale Supercomputer

Data is being created everywhere at a frantic pace, pushing new frontiers in industries from healthcare and manufacturing to transportation and finance. This data deluge is also creating new challenges in memory and storage across platform architectures, underscoring the need for real-time or near-real-time data analysis and faster access to ever-growing amounts of data — some of which is stored offline.

DRAM is not big enough to solve today’s problem of real-time data analysis — and traditional storage isn’t fast enough. In addition, we need a high-capacity storage solution that is connected and online to access offline data. This is where Intel’s memory and storage technology leadership comes into play. Intel® Optane™ technology drives improvements in real-time data analysis, while Intel® 3D NAND delivers faster access to large amounts of data. These two technologies are the dynamic duo of memory and storage, fighting through bottlenecks with an industry-leading combination of factors, including responsiveness and large-capacity storage.

Intel’s memory and storage technologies are changing the game for our customers and helping them address the massive increase in data they face on a daily basis. Our business strategy is driven by being technology-driven, customer-inspired and platform-connected.

Technology-Driven

We’ve come a long way in a short time. In 2015, we touted the invention of a new memory technology — Intel Optane memory — the first in 25 years. Since then, we’ve delivered our growing Intel Optane technology line of products. Last year, we introduced the industry’s first PCIe-based QLC solid state drive. We grew our Intel Optane technology and NAND product lines with a focus on new densities and innovative form factors in 2018. As a result, more than half of our 2018 memory and storage sales volume is based on 64L products.

We’re also excited about soon-to-be released Intel Optane DC Persistent Memory that will be available on next-generation Intel® Xeon® processors for data centers. This is redefining the memory and storage hierarchy and bringing persistent, large-scale memory closer to the processor.

We’re not just creating new memory and storage technologies, we’re disrupting the market.

Customer-Inspired

Being customer-inspired means helping them solve their challenges with our latest technologies. Let me share a few stories and examples.

  • When SAP leaders were looking at ways to improve their reboot times for system reloads, they considered persistent memory as one way they could improve. Reboot and recovery times are important for SAP customers. When we approached SAP about our new Intel Optane DC Persistent Memory technology, SAP leaders were interested in understanding how this might help their business challenge of reducing overall total cost of ownership and improving downtime for maintenance updates. After spending time with this new product, SAP called it a revolutionary change for SAP HANA. SAP HANA 2.0 SPS03 and Intel Optane DC Persistent Memory will help deliver lower TCO through larger in-memory capacity, faster start times and simplified data-tiering while moving more data closer to the processor for faster time to insights.
  • VMware’s leaders engaged with their customers and had clear marching orders — to improve VMware’s hybrid cloud solution to be more responsive and agile from the cloud to the edge. In their pursuit to improve responsiveness, VMware leaders evaluated Intel Optane SSDs and realized that by modifying their VMware vSAN offering or rewriting their code, they could benefit from the attributes of Intel Optane SSDs and deliver on that customer expectation of improved responsiveness. This became available last year, and we now have many OEM vSAN-ready node product offerings that provide increased performance and support for more virtual machines per server.
  • Cisco has transformed its product offerings along the lines of the latest architectural change for “hyper converged infrastructure.” Working with Cisco, we put together a combined caching and storage option tuned for its environment. As a result, Cisco recently announced its Hyperflex* 4.0 all-NVMe solution with Intel Optane SSDs. What’s also interesting is that Cisco showcased its Hyperflex Edge solutions, again using Intel Optane SSDs as part of the Intel® Distribution of OpenVino™ toolkit for the internet of things. (More: Hyperflex 4.0 | Hyperflex Edge solution )

Data-Centric

Intel’s data-centric approach improves not only our memory and storage products, but our overall platform to unleash the full power of our CPUs. In the PC client space, we address responsiveness and space constraints by combining Intel Optane memory media and Intel® QLC 3D NAND on a single M.2 device. Our data center CPUs have new features like VROC/VMD for raid solutions and memory controller supporting our latest Intel Optane DC Persistent Memory.

A New Frontier

Our new innovative solutions are continuing to disrupt the memory and storage tier. Our ecosystem partners see that and realize that they too will benefit from this new approach. As such, they are actively engaged in rewriting their applications, redesigning their storage and memory solutions, and qualifying platforms for delivery to their customers.

Indeed, it is a new frontier on the memory and storage front in 2019, and we at Intel believe we have the right set of technologies and solutions to help our customers win in the data-centric transition.

Rob Crooke is senior vice president and general manager of the Non-Volatile Memory Solutions Group at Intel Corporation.

Photo: Intel Optane DC persistent memory represents a new class of memory and storage technology designed specifically for data center usage. (Credit: Intel Corporation)
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US Department of Energy and Intel to Deliver First Exascale Supercomputer

CHICAGO, March 18, 2019 – Intel Corporation and the U.S. Department of Energy (DOE) will deliver the first supercomputer with a performance of one exaFLOP in the United States. The system being developed at DOE’s Argonne National Laboratory* in Chicago, named “Aurora,” will be used to dramatically advance scientific research and discovery. The contract is valued at more than $500 million and will be delivered to Argonne National Laboratory by Intel and sub-contractor Cray Inc.* in 2021.

The Aurora system’s exaFLOP of performance – equal to a “quintillion” floating point computations per second – combined with an ability to handle both traditional high-performance computing (HPC) and artificial intelligence (AI) will give researchers an unprecedented set of tools to address scientific problems at exascale. These breakthrough research projects range from developing extreme-scale cosmological simulations, discovering new approaches for drug response prediction and discovering materials for the creation of more efficient organic solar cells. The Aurora system will foster new scientific innovation and usher in new technological capabilities, furthering the United States’ scientific leadership position globally.

More: The Exascale Opportunity (Blog)

“Achieving exascale is imperative, not only to better the scientific community, but also to better the lives of everyday Americans,” said U.S. Secretary of Energy Rick Perry. “Aurora and the next generation of exascale supercomputers will apply HPC and AI technologies to areas such as cancer research, climate modeling and veterans’ health treatments. The innovative advancements that will be made with exascale will have an incredibly significant impact on our society.”

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Intel will deliver the Aurora supercomputer, the United States’ first exascale system, to Argonne National Laboratory in 2021. Aurora will incorporate a future Intel Xeon Scalable processor, Intel Optane DC Persistent memory, Intel’s Xe compute architecture and Intel OneAPI programming framework — all anchored to Intel’s six key pillars of innovation. (Credit: Argonne National Laboratory)
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“Today is an important day not only for the team of technologists and scientists who have come together to build our first exascale computer – but also for all of us who are committed to American innovation and manufacturing,” said Bob Swan, Intel CEO. “The convergence of AI and high-performance computing is an enormous opportunity to address some of the world’s biggest challenges and an important catalyst for economic opportunity.”

“There is tremendous scientific benefit to our nation that comes from collaborations like this one with the Department of Energy, Argonne National Laboratory, and industry partners Intel and Cray,” said Argonne National Laboratory Director Paul Kearns. “Argonne’s Aurora system is built for next-generation artificial intelligence and will accelerate scientific discovery by combining high-performance computing and artificial intelligence to address real world problems, such as improving extreme weather forecasting, accelerating medical treatments, mapping the human brain, developing new materials and further understanding the universe – and that is just the beginning.”

The foundation of the Aurora supercomputer will be new Intel technologies designed specifically for the convergence of artificial intelligence and high-performance computing at extreme computing scale. These include a future generation of the Intel® Xeon® Scalable processor, Intel’s Xcompute architecture, a future generation of Intel® Optane™ DC Persistent Memory, and Intel’s One API software. Aurora will use Cray’s next-generation supercomputer system, code-named “Shasta,” which will comprise more than 200 cabinets and include Cray’s SlingshotTM high-performance scalable interconnect and the Shasta software stack optimized for Intel architecture.

“Cray is proud to be partnering with Intel and Argonne to accelerate the pace of discovery and innovation across a broad range of disciplines,” said Peter Ungaro, president and CEO of Cray. “We are excited that Shasta will be the foundation for the upcoming exascale-era characterized by extreme performance capability, new data-centric workloads and heterogeneous computing.”

For information about the work at DOE’s Argonne National Laboratory visit its website.

About Intel

Intel (NASDAQ: INTC), a leader in the semiconductor industry, is shaping the data-centric future with computing and communications technology that is the foundation of the world’s innovations. The company’s engineering expertise is helping address the world’s greatest challenges as well as helping secure, power and connect billions of devices and the infrastructure of the smart, connected world – from the cloud to the network to the edge and everything in between. Find more information about Intel at newsroom.intel.com and intel.com.

About Argonne National Laboratory

Argonne National Laboratory seeks solutions to pressing national problems in science and technology. The nation’s first national laboratory, Argonne conducts leading-edge basic and applied scientific research in virtually every scientific discipline. Argonne researchers work closely with researchers from hundreds of companies, universities, and federal, state and municipal agencies to help them solve their specific problems, advance America’s scientific leadership and prepare the nation for a better future. With employees from more than 60 nations, Argonne is managed by UChicago Argonne, LLC for the U.S. Department of Energy’s Office of Science.

About Cray Inc.

Cray Inc. (Nasdaq:CRAY) combines computation and creativity so visionaries can keep asking questions that challenge the limits of possibility. Drawing on more than 45 years of experience, Cray develops the world’s most advanced supercomputers, pushing the boundaries of performance, efficiency and scalability. Cray continues to innovate today at the convergence of data and discovery, offering a comprehensive portfolio of supercomputers, high-performance storage, data analytics and artificial intelligence solutions.  Go to www.cray.com for more information.

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Intel Spotlights Research in Silicon Spin Qubits and Quantum Applications Development at American Physical Society

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A 2018 photo shows Intel’s new quantum computing chip balanced on a pencil eraser. Researchers started testing this “spin qubit chip” at the extremely low temperatures necessary for quantum computing: about 460 degrees below zero Fahrenheit. Intel projects that qubit-based quantum computers, which operate based on the behaviors of single electrons, could someday be more powerful than today’s supercomputers. (Credit: Walden Kirsch/Intel Corporation)

During the American Physical Society (APS) March Meeting in Boston, researchers from Intel Labs demonstrated the progress they are making toward developing a commercially viable quantum computing system, including breakthroughs in hardware and software development for the quantum computing stack and development of a tool that will rapidly speed the research and optimization of silicon spin qubit technologies. Since establishing its collaborative research program with QuTech in 2015, Intel has been driving research to realize the promise of quantum computing, delivering advancements spanning the entire quantum stack — from qubit devices to the hardware and software architecture required to control these devices as well as quantum applications.

More: Intel Labs

Mode Hybridization Analysis of Bus Resonators for a Superconducting Multi-Qubit Chip

Presentation Details: 10:12-10:24 a.m. EST, Monday, March 4, 2019, Session A42: Multi-Qubit Characterizations and Cross-talk for Superconducting Qubits, Room: 201A

Abstract: Researchers present an effective numerical method to analyze the mode hybridization in a superconducting multi-qubit chip. Surface code, a promising architecture for fault-tolerant quantum computing, requires qubits with connectivity to all nearest neighbors. This extensive interconnectivity together with a strong coupling coefficient among the qubits and resonators causes mode hybridization. A complete analysis of the chip is needed in these conditions to accurately predict the loaded frequency of the bus resonators and thereby also the gate time. We present and experimentally verify a simulation method for analyzing the complete chip where finite-element electromagnetic simulation is combined with a numerical circuit simulation for accurate and fast computation.

Authors: Nadia Haider (QuTech and Netherlands Organisation for Scientific Research (TNO), Delft, The Netherlands); Jonathan Gnanadhas (QuTech, Netherlands Organisation for Applied Scientific Research (TNO) and Delft University of Technology, Delft, The Netherlands); Marc Beekman (QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands); Rene Vollmer (QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands); Nandini Muthusubramanian (QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands); Roman Caudillo (Intel); Alessandro Bruno (QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands); David Michalak (Intel); Filip Malinowski (QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands); Cornelis Christiaan Bultink (QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands); Adel A Elsherbini (Intel); Lester Lampert (Intel); Alexander Yarovoy (Microwave Sensing, Signals and Systems, Delft University of Technology, Delft, The Netherlands); Jim Clarke (Intel) Leonardo DiCarlo (QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands)

Spin Qubits at Intel

Presentation Details:11:15-11:51 a.m. EST, Monday, March 4, 2019, Session B35: Silicon Spin Qubits, Room: 205B

Abstract: Intel is developing a 300mm process line for spin qubit devices using state-of-the-art immersion lithography and isotopically pure epitaxial silicon layers. Both Si-MOS and Si/SiGe devices are being evaluated in this multi-layer integration scheme. In this talk, researchers will be sharing current progress toward spin qubits starting with substrate characterization. Transistors and quantum dot devices are then co-fabricated on the same wafer and allow calibration to Intel’s internal transistor processes. Electrical characterization and feedback is accomplished through wafer scale testing at both room temperature and 1.6K prior to milli-kelvin testing. Accelerated testing across a 300mm wafer provides a vast amount of data that can be used for continuous improvement in both performance and variability. This removes one of the bottlenecks toward a large-scale system: trying to deliver an exponentially fast compute technology with a slow and linear characterization scheme using only dilution refrigerators.

Author: Jim Clarke (Intel)

A Quantum Solution for Efficient Use of Symmetries in Exact Diagonalization of Many-Body Systems

Presentation Details: 9-9:12 a.m. EST, Wednesday, March 6, 2019, Session K42: Applications of Noisy Intermediate Scale Quantum Computers IV, Room: 201A

Abstract: The use of symmetries allows the block-diagonalization of the Hamiltonian of a many-body system, allowing it to be expressed in terms of symmetry-adapted basis states. The problem of finding the group representatives of these basis states and their corresponding symmetries is currently a memory/computational bottleneck on classical computers. We apply Grover’s search in the form of a minimization procedure to solve this problem, improving upon the existing technique present in the literature to reduce the number of qubits and oracle calls. Our quantum solution provides an exponential reduction in computational memory, and a quadratic speedup in time. We discuss explicitly the full circuit implementation of Grover minimization as applied to this problem, finding that the oracle only scales as poly-log in the size of the search space. Further, we design an error mitigation scheme that significantly reduces the effects of noise on the computation, showing how it can be run in the Noisy Intermediate Scale Quantum era.

Authors: Albert Schmitz (University of Colorado, Boulder); Sonika Johri (Intel)

Impact of Qubit Connectivity on Quantum Algorithm Performance

Presentation Details: 1:27-1:39 p.m. EST, Wednesday, March 6, 2019, Session L28: Distributed Quantum Computation, Networking and Information Security, Room: 161

Abstract: Quantum computing hardware is undergoing rapid development from proof-of-principle devices to scalable machines that could eventually challenge classical supercomputers on specific tasks. On platforms with local connectivity, the transition from one- to two-dimensional arrays of qubits is seen as a natural technological step to increase the density of computing power and to reduce the routing cost of limited connectivity. Here researchers map and schedule representative algorithmic workloads – the Quantum Fourier Transform (QFT) relevant to factoring, the Grover diffusion operator relevant to quantum search, and Jordan-Wigner parity rotations relevant to simulations of quantum chemistry and materials science – to qubit arrays with varying connectivity. In particular, we investigate the impact of restricting the ideal all-to-all connectivity to a square grid, a ladder and a linear array of qubits. Our schedule for the QFT on a ladder results in running time close to that of a system with all-to-all connectivity. Our results suggest that some common quantum algorithm primitives can be optimized to have execution times on systems with limited connectivities, such as a ladder and linear array, that are competitive with systems that have all-to-all connectivity.

Authors: Adam Holmes (Intel); Sonika Johri (Intel); Gian Giacomo Guerreschi (Intel); Jim Clarke (Intel); Anne Matsuura (Intel)

Full 300mm Fin Based QD Device Characterization

Presentation Details: 2:30-2:42 p.m. EST, Wednesday, March 6, 2019, Session P29: Semiconducting QC Architectures and Quantum Photonics, Room 162A

Abstract: Intel’s efforts toward the fabrication of spin qubit devices have required a comprehensive device characterization, from transistors and quantum dots, to qubits, which have been co-fabricated in the same die/wafer. In this talk, researchers present an in-depth device characterization, and the results from quantum dot devices manufactured in a full 300mm line. We will give details of the fin based process flow, which yields high-charging energy devices (>35meV). The extraction of QD related figures of merit from room and low temperature testing (1.6K) are part of the method to rapidly screen 300mm wafers with thousands of devices that are used to determine the spin qubit devices that will be taken to the milli-kelvin measurements; keeping up with the pace of the 300mm fab output.

Authors: Hubert C George (Intel); Nicole Thomas (Intel); Ravi Pillarisetty (Intel); Lester Lampert (Intel); Thomas Watson (Intel); Jeanette Marie Roberts (Intel); Stephanie Bojarski (Intel); Payam Amin (Intel); Jessica Torres (Intel); Matthew Metz (Intel); Guoji Zheng (QuTech and Kavli Institute of Nanoscience, TU Delft); Anne-Marije Zwerver (QuTech and Kavli Institute of Nanoscience, TU Delft); Jelmer Boter (QuTech and Kavli Institute of Nanoscience, TU Delft); Juan Pablo Dehollain (QuTech and Kavli Institute of Nanoscience, TU Delft); GertJan Eenink (QuTech and Kavli Institute of Nanoscience, TU Delft); Leonardo Massa (QuTech and Kavli Institute of Nanoscience, TU Delft); Diego Sabbagh (QuTech and Kavli Institute of Nanoscience, TU Delft); Nodar Samkharadze (QuTech and Kavli Institute of Nanoscience, TU Delft); Christian Volk (QuTech and Kavli Institute of Nanoscience, TU Delft); Brian Paquelet Wütz (QuTech and Kavli Institute of Nanoscience, TU Delft); Menno Veldhorst (QuTech and Kavli Institute of Nanoscience, TU Delft); Giordano Scappucci (QuTech and Kavli Institute of Nanoscience, TU Delft); Lieven Vandersypen (QuTech and Kavli Institute of Nanoscience, TU Delft); Jim Clarke (Intel)

Intel Superconducting Qubits, Part 1: Performance Improvements towards Enabling Quantum Applications

Presentation Details: 1:39-1:51 p.m. EST, Thursday, March 7, 2019, Session S35: 3D Integration for Superconducting Qubits, Room: 205B

Abstract: Quantum processors based on superconducting materials with flux-tunable transmon qubits present many challenges, including minimizing flux and microwave xtalk, improving qubit frequency targeting, extending T1/T2 times, and ultimately maximizing gate fidelities. Here we present our fabrication capabilities addressing some of these challenges with die sizes ranging from small laterally wire-bonded 2-qubit chips to larger flip-chip BGA-bonded 7-qubit and 17-qubit chips. Through improved die processing, including improvements to materials interfaces, integration of air bridges, and Josephson Junction fabrication improvements, we demonstrate low flux and microwave cross talk and qubit performance improvements resulting in 1Q and 2Q gate fidelities that enable algorithm exploration and execution.

Authors: Roman Caudillo (Intel); David Michalak (Intel); Lester Lampert (Intel); Adel A Elsherbini (Intel); Javier A Falcon (Intel); Ye Seul Ashley Nam (Intel); Preston T Myers (Intel); Sonika Johri (Intel); Xiang Chris Zou (Intel); Jeanette Marie Roberts (Intel); Alessandro Bruno (QuTech and Kavli Institute of Nanoscience, Delft University of Technology); Nandini Muthusubramanian (QuTech and Kavli Institute of Nanoscience, Delft University of Technology); Cornelis Christiaan Bultink (QuTech and Kavli Institute of Nanoscience, Delft University of Technology); Filip Malinowski (QuTech and Kavli Institute of Nanoscience, Delft University of Technology); Nadia Haider (QuTech and TNO); Leonardo DiCarlo (QuTech and Kavli Institute of Nanoscience, Delft University of Technology); Jim Clarke (Intel)

Intel Superconducting Qubits, Part 2: Integration on Through-Silicon-Via (TSV) Substrates

Presentation Details: 1:51-2:03 p.m. EST, Thursday, March 7, 2019, Session S35: 3D Integration for Superconducting Qubits, Room: 205 B

Abstract: Quantum computing holds the potential for significantly improving computing speed relative to classical computing for selected algorithms and applications. Many researchers using the transmon-style of circuit QED are producing chips with ever-increasing numbers of qubits. While higher numbers of qubits can increase the usefulness of algorithms that can be performed, the increase in chip size correspondingly shifts cavity and drum modes into a range where the qubits could be adversely affected. One solution is to implement through-silicon-vias (TSVs) and chip/cavity fuzz buttons to supply more ground connections. We present recent microwave modeling and fabrication results on “flip-chips” containing TSVs for grounding and a ball-grid array die-package interface for electrical signals.

Authors: David Michalak (Intel); Roman Caudillo (Intel); Lester Lampert (Intel); Adel A Elsherbini (Intel); Javier A Falcon (Intel); Ye Seul Ashley Nam (Intel); Preston T Myers (Intel); Jeanette Marie Roberts (Intel); Alessandro Bruno (QuTech and Kavli Institute of Nanoscience, Delft University of Technology); Nandini Muthusubramanian (QuTech and Kavli Institute of Nanoscience, Delft University of Technology); Cornelis Christiaan Bultink (QuTech and Kavli Institute of Nanoscience, Delft University of Technology); Filip Malinowski (QuTech and Kavli Institute of Nanoscience, Delft University of Technology); Nadia Haider (QuTech and TNO); Leonardo DiCarlo (QuTech and Kavli Institute of Nanoscience, Delft University of Technology); Jim Clarke (Intel)

The post Intel Spotlights Research in Silicon Spin Qubits and Quantum Applications Development at American Physical Society appeared first on Intel Newsroom.

Intel Drives Development of Quantum Cryoprober with Bluefors and Afore to Accelerate Quantum Computing

Intel Cryogenic Wafer Prober
Built by Intel, Bluefors and Afore, the first Cryogenic Wafer Prober is a cryoprober tool designed to test and validate qubits needed for quantum computing. The Cryogenic Wafer Prober allows researchers to test qubits on 300mm wafers down to temperatures of a few kelvins, making it a first-of-its-kind testing tool for quantum computing. The first Cryogenic Wafer Prober will be located at Intel’s Oregon campus. (Credit: Intel Corporation)
» Click for full image

What’s New: Intel, Bluefors* and  Afore* have introduced the first cryoprober, a quantum testing device named the Cryogenic Wafer Prober, developed specifically to speed the development of quantum computing solutions. Intel identified the need for a quantum testing tool to collect more data about quantum chips called “qubits.”

“Building on our expertise in transistor process technology, we saw the need to create a 300mm high-volume fabrication and test line for semiconductor spin qubits. We are focused on the manufacturability and scaling issues for quantum, and a fast feedback through the cryoprober allows Intel to accelerate our scientific learning.”
–Dr. Jim Clarke, director of Quantum Hardware, Intel

Why It Matters: One of the biggest challenges with quantum computing is data collection and access to data. Today, each quantum processor is tested for months in a low-temperature dilution refrigerator to determine what works and what doesn’t work.

Conventional transistors are very different, and with the right tools, Intel can characterize a large subset of these transistors on a 300mm wafer in about an hour and rapidly inform the feedback loop back to the fabrication line. For quantum computing, however, the turn-on characteristics of qubits must be measured at low temperatures of less than a few kelvins above absolute zero. Until now, the electrical characterization of qubits was very slow compared with traditional transistors, often taking days to collect even small subsets of data.

How It Works: Intel approached Bluefors, a leader in building cryogen-free dilution refrigerator systems with a strong focus on quantum computing, who partnered with Afore, a leading micro-electro-mechanical systems (MEMS) test solutions provider based in Finland, to design and manufacture the device. The Cryogenic Wafer Prober allows researchers to test qubits on 300mm wafers down to temperatures of a few kelvins, making it a first-of-its-kind testing tool for quantum computing. The first Cryogenic Wafer Prober will be located at Intel’s Oregon campus next to several quantum computing dilution refrigerators.

Intel Cryogenic Wafer Prober Graph
Initial data characterizing multiple Intel qubit devices from the Cryogenic Wafer Prober illustrate the increased voltage required for qubit gate “turn-on” at cryogenic temperatures when compared with room temperatures across a 300mm wafer. (Credit: Intel Corporation)
» Click for full image

“So far the past year, Intel has worked with Bluefors and Afore to combine our expertise and build a fast, electrical characterization tool that can operate in the quantum regime. We hope that by designing this tool, the industry can use it to accelerate the progress of quantum computing,” Clarke said of the project.

“Intel approached us more than a year ago, looking for a tool with the possibility to probe 300mm wafers at temperatures of only a few kelvins,” said Dr. David Gunnarsson, Bluefors chief sales officer and principal scientist. “This was indeed a challenge, and to be able to take on a tool like this, we reached out to another Finnish company, Afore, which has long experience in specialized wafer probe systems. Together we came up with a design for a tool, the cryogenic wafer prober, which we now have constructed and assembled. We are looking forward in excitement to see the advances this tool will bring to the future of quantum computing.”

This tool allows Intel to automate and collect information on spin qubits, including sources of quantum noise, the quality of quantum dots and the materials that matter in building spin qubits in a matter of minutes versus weeks.

What Early Testing Data Show: In a first demonstration of the utility of the Cryogenic Wafer Prober, Intel measured the electrical turn-on characteristic for more than 100 qubit structures across a wafer fabricated at Intel’s silicon qubit fabrication flow on its 300mm processing line in Oregon. The attached graphic illustrates the tool’s novel ability to collect high-volume cryogenic data and create a statistical correlation of the increase in turn-on voltage between room temperature and cryogenic temperature. With this tool, Intel will be able to speed feedback into the silicon spin qubit fabrication line and accelerate quantum computing research and development.

 More Context: The Cryogenic Wafer Prober | Quantum Computing at Intel | Intel Labs

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Intel Shows Collaborative Mini-Bots, 5G Innovations and Brain-Inspired Computers at ISSCC 2019

intel 2019 isscc 3

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What’s New: This week, Intel is presenting a series of innovations that have the potential to enable real-time, low-energy computation for an increasingly connected and data-driven world – from 5G networks to intelligent edge systems and robotic systems. These innovations in integrated circuits and systems-on-chip will be presented during the International Solid-State Circuits Conference (ISSCC), the leading forum on advanced circuit research, in San Francisco from Feb. 17-21. Intel will present 17 scientific papers and accompanying demonstrations that could have a transformative impact on a wide range of applications for the future of technology – including developments in 5G and memory.

“The research underway at Intel is varied in its focus but unified in a vision for the future of technology – one where anyone and everything can communicate with data. To achieve this vision, we recognize the need for computational systems capable of tackling problems conventional computers simply cannot handle, and – as we are showcasing this year at ISSCC – Intel is committed to furthering research and development of the technologies with the potential to carry us to that future.”
–Dr. Rich Uhlig, managing director, Intel Labs

RESEARCH PRESENTED THIS WEEK INCLUDES:

Distributed Autonomous and Collaborative Multi-Robot System Featuring a Low-Power Robot SoC in 22nm CMOS for Integrated Battery-Powered Minibots

Abstract: In this paper, Intel demonstrates a distributed, autonomous and collaborative multi-robot system featuring integrated, battery-powered, crawling and jumping minibots. For example, in a search and rescue application, four minibots collaboratively navigate and map an unknown area without a central server or human intervention, detecting obstacles and finding paths around them, avoiding collisions, communicating among themselves, and delivering messages to a base station when a human is detected.

Each minibot platform integrates: (i) a camera, LIDAR and audio sensors for real-time perception and navigation; (ii) a low-power custom robot SoC for sensor data fusion, localization and mapping, multi-robot collaborative intelligent decision-making, object detection and recognition, collision avoidance, path planning, and motion control; (iii) low-power ultra-wideband (UWB) radio for anchorless dynamic ranging and inter-robot information exchange; (iv) long-range radio (LoRa) for robot-to-base-station critical message delivery; (v) battery and PMIC for platform power delivery and management; (vi) 64MB pseudo-SRAM (PSRAM) and 1GB flash memory; and (vii) actuators for crawling and jumping motions.

Why It Matters: Multi-robot systems, working collectively to accomplish complex missions beyond the capability of a single robot, have the potential to disrupt a wide range of applications ranging from search and rescue missions to precision agriculture and farming. The multi-bot systems can dramatically speed the time to perform a single task. For example, shortening time and latency for first responders during an emergency. However, advanced robotics and artificial intelligence have, to date, required large investment and intensive computational power. The development of these distributed, autonomous and collaborative minibots, which are operated by a system-on-chip that delivers efficiencies orders of magnitude beyond what was previously possible, represents the first step toward enabling the development of energy- and cost-efficient multi-robot systems.

5G Wireless Communication: An Inflection Point

Abstract: The 5G era is upon us, ushering in new opportunities for technology innovation across the computing and connectivity landscape. 5G presents an inflection point where wireless communication technology is driven by application and expected use cases, and where the network will set the stage for data-rich services and sophisticated cloud apps, delivered faster and with lower latency. This paper will highlight the disruptive architectures and technology innovations required to make 5G and beyond a reality.

Why It Matters: Whereas 4G was about moving data faster, 5G will bring more powerful wireless networks that connect “things” to each other, to people and to the cloud. The 5G network will set the stage for data-rich services and sophisticated cloud apps, delivered faster and with lower latency than ever. It will transform our lives by helping deliver a smart and connected society with smart cities, self-driving cars and new industrial efficiencies. For this to happen, networks must become faster, smarter and more agile to handle the unprecedented increase in volume and complexity of data traffic as more devices become connected and new digital services are offered.


» Download video: “Intel Demonstrates Multi-Robot System (B-Roll)”

Applying Principles of Neural Computation for Efficient Learning in Silicon

Abstract: Intel’s Loihi novel processor implements a microcode-programmable learning architecture supporting a wide range of neuroplasticity mechanisms under study at the forefront of computational neuroscience. By applying many of the fundamental principles of neural computation found in nature, Loihi promises to provide highly efficient and scalable learning performance for supervised, unsupervised, reinforcement-based and one-shot paradigms. This talk describes these principles as applied to the Loihi architecture and shares our preliminary results toward the vision of low-power, real-time on-chip learning.

Why It Matters: Deep learning algorithms mainly used today in machine learning (ML) applications are very costly in terms of energy consumption, due to their large amount of required computations and large model sizes. Many issues, such as connectivity to the cloud, latency, privacy and public safety, could be resolved by establishing intelligent computing at the edge. By applying principles of neural computation to architecture, circuit and integrated design solutions, we could minimize the energy consumption and computational demand of edge learning systems.

Novel Memory/Storage Solutions for Memory-Centric Computing

Abstract: The exponential growth in connected devices and systems is generating a staggering amount of digital records. These records not only need to be stored but also need to be mined for useful information. This era of big data is driving fundamental changes in both memory and storage hierarchy. Data and compute need to be brought closer together to avoid networking and storage protocol inefficiencies. This drives the demand for larger memory capacity, which is currently hindered by memory subsystem cost. In addition, the need for memory persistency will not only streamline storage protocols but will also significantly reduce bring-up time after system failure. In this presentation, novel solutions for memory-centric architecture will be discussed, with a focus on their value, performance and power efficiency.

Why It Matters: Memory-centric computing has the potential to enable energy-efficient, high-performance AI/ML applications. With the explosive growth of memory-intensive workloads like machine learning, video capture/playback and language translation, there is tremendous interest in preforming some compute near memory, by placing logic inside the DRAM/NVM main-memory die (aka near-memory compute), or even doing the compute within the memory array, embedded within the compute die (aka in-memory compute). In either case, the motivation is to reduce the significant data movement between main/embedded memory and compute units, as well as to reduce latency by preforming many operations in parallel, inside the array.

More: Intel presentations at ISSCC | Intel Labs (Press Kit)

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Arsenal FC, Liverpool FC and Manchester City Bring Immersive Experiences to Fans with Intel True View

fc true view 2x1

LONDON, Feb. 7, 2019 – Imagine watching a season-defining moment, then reliving it from any angle including from the perspective of your favourite player as they run up to take a penalty or make an improbable goal-line clearance.

In partnership with Arsenal FC*, Liverpool FC* and Manchester City*, Intel will deliver immersive experiences via Intel® True View at Emirates Stadium, Anfield and the Etihad Stadium. Now their fans worldwide can enjoy the biggest moments of the match from every angle, whether they’re watching the Rights Holders’ live broadcast and highlights or reliving the action post-match from their favourite clubs’ official website, mobile app or social media.

As three of the most recognisable and innovative football clubs in the world, Arsenal FC, Liverpool FC and Premier League* champions Manchester City will leverage Intel True View to capture every match element from every angle. Intel True View re-creates the action on the pitch and presents that from an ideal vantage point or player’s perspective, using Intel’s unmatched data-processing capability to deliver the experience to fans.

Beginning March 10, Intel’s leading volumetric technology will bring fans as close to the action on the pitch as the starting XI from the world’s most iconic football clubs. With dedicated supporters across the globe, football fans are passionate about the tactics as much as the goals scored, and Intel True View will highlight the immersive experiences unique to the style and skill of football.

The partnerships will introduce features that include:

  • Multi-angle views of a play: Intel Sports’ industry-leading volumetric video process creates thrilling 360-degree replays and highlight reels from every conceivable angle, using 38 5K ultra-high-definition cameras.
  • Laser wall: A virtual plane giving viewers a clear picture as to where players are positioned on the pitch.
  • Be the player capabilities: Intel True View freezes a moment in the match to let fans see the pitch from the eyes of a player. This also enables presenters and pundits to share a new level of insight into the tactics and decisions made by players to provide an entirely new perspective to fans.

Intersection of Sports and Technology: The sports industry is undergoing a period of significant change as consumer behavior is shifting, driving technology, leagues and brands to address the expectations of fans. In 2018, technology investments into sports reached nearly $1 billion, continuing to drive the intersection of sports and technology. With smart and connected tools, Intel is uniquely positioned to enable the sports industry to capture, analyse and respond to new levels of insight in real time and create amazing new experiences for fans.

How Intel True View Works: The process begins with volumetric video, the capture and rendering technique behind Intel True View. Using the volumetric capture method, footage is recorded from 38 5K ultra-high-definition cameras that includes height, width and depth of data to produce voxels (pixels with volume). After content is captured, a substantial amount of data is processed with servers powered by Intel® Core™ i7 and Intel® Xeon® processors. The software then re-creates all the viewpoints of a fully volumetric 3D person or object. That information renders a virtual environment in spectacular, multi-perspective 3D that enables users to experience a captured scene from any angle and perspective and can provide true 6 degrees of freedom.

» Download team-specific demo videos:

James Carwana, vice president and general manager of Intel Sports, said: “Immersive media experiences continue to create more opportunities for sports teams and leagues to put the fan experience first. With the expansion of Intel True View into more stadiums with Arsenal, Liverpool and Manchester City, we have the chance to transform the experience for fans of one of the world’s top sports leagues with our leading and differentiated volumetric technology.”

Peter Silverstone, commercial director of Arsenal FC, said: “We are always looking to find new ways to bring our 780 million fans and followers around the world closer to the action and this partnership will give our fans a whole new view of the game. The technology effectively allows a supporter to step into the boots of players and see the game from their perspective.

“We have seen the impact this Intel technology has had in other sports leagues across the world and are excited that it will be installed at Emirates Stadium.

“At Arsenal we are committed to innovating and keeping at the forefront of developments on and off the pitch so it’s fitting that Emirates Stadium will be the first stadium to bring Intel’s immersive and transformational True View technology to the Premier League.”

Billy Hogan, managing director and chief commercial officer of Liverpool FC, said: “We’re delighted to be working with Intel to bring this advanced Intel True View technology to our supporters.

“Intel True View enables fans to immerse themselves even further into the game and has the power to add a new depth to match highlights, which can significantly improve the supporter experience. This technology has the potential to add a new dynamic to how people interact with the game and create different conversations with our fans around the world.

“We strive to utilise the latest technology to be at the forefront of the experience our supporters have, whether that’s on-screen or online, and with the help of our newest partner Intel, that is certainly set to continue.”

Damian Willoughby, senior vice president of Partnerships at City Football Group, said: “We’re very excited to integrate Intel True View at the Etihad Stadium and to announce our new partnership with a world-class brand like Intel. We love to be first, both on and off the pitch, so we are delighted to pioneer this game-changing technology at the Etihad Stadium. We are sure City fans, and football fans around the world, will love watching beautiful football from every angle.”

intel fc true view 4

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Intel Drone Light Show and Intel True View Technology Enhance Pepsi Super Bowl LIII Halftime Show and Super Bowl LIII Viewing Experience

Intel SBLIII True View 6

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News Highlights:

  • One hundred fifty enhanced Intel® Shooting Star™ drones took a live flight during the Pepsi* Super Bowl LIII Halftime Show to amplify Maroon 5’s performance.
  • Intel® True View™ captures volumetric content to let fans see key plays from multiple angles and players’ points of view.

ATLANTA, Feb. 3, 2019 – Today during the Super Bowl, Intel Corporation partnered with the NFL* to create the first-ever live drone light show during a Super Bowl Halftime Show. Intel and the NFL will also make advanced Intel® True View™ highlights available for fans to relive the most exciting moments of the biggest game of the year.

As Maroon 5 began the song “She Will Be Loved,” 150 enhanced Intel Shooting Star drones floated up and over the field in a choreographed performance to the music to form the words “ONE” and “LOVE.” Intel enhanced the Intel Shooting Star drones specifically for the Pepsi Super Bowl Halftime Show to emulate the experience of floating lanterns. The drones were also enabled to successfully fly a pre-programmed path inside a closed stadium environment without GPS. Additionally, the 150 drones flown indoors exceed the world record that Intel earned flying 110 indoor drones at CES in 2018.

“Our team constantly looks for opportunities to push the boundaries of innovation and deliver stunning entertainment experiences with our drone technology,” said Anil Nanduri, Intel vice president and general manager of the Intel Drone Group. “When we received the opportunity to bring our drone light show technology back to the Super Bowl, we were excited by the challenge to execute it live and within a closed stadium environment. We collaborated with the show producers, both creatively and technically, to bring a special and unique show experience to the viewers. It was an honor to have performed with Maroon 5 to create a memorable experience for those watching live from their seats in the stadium and for viewers watching at home.”


» Download video: “Intel Drone Light Show and Intel True View at Super Bowl LIII (B-Roll)”

As an Official Technology Provider for the NFL, Intel installed Intel True View in 13 NFL stadiums, including Super Bowl LIII host Mercedes-Benz Stadium. Volumetric capture is enabling immersive experiences that bring the game to life from every angle, allowing fans to analyze key plays with multi-angle views, including through the eyes of the players. Using high-performance computing, Intel True View transforms massive amounts of volumetric video data captured from 38 5K ultra-high-definition cameras into immersive 3D replays of the game’s biggest moments. Intel True View content is accessible via NFL.com/trueview, the NFL app, the NFL channel on YouTube* and other endpoints across the NFL and participating teams.

“There is tremendous potential in what True View can do to bring our fans closer to the game than ever before,” said William Deng, vice president, Media Strategy and Business Development at the NFL. “We are thrilled to be partnered with Intel to advance this groundbreaking technology. It truly brings the fan into the action and gives them a perspective of the game that was never before possible.”

Drone light shows and Intel True View are part of Intel’s larger effort to deliver powerful, innovative technologies that enable the rich viewing and entertainment experiences of the future. For more information on Intel’s drone light show, visit Intel’s drone page. For more information on Intel True View, visit Intel’s True View page.

The Pepsi Super Bowl LIII Halftime Show was consistent with the temporary flight restrictions in effect during the game. The Intel Shooting Star drones appearing during the show were specially preprogrammed to fly and remain within the stadium, and therefore did not enter the controlled airspace over Mercedes-Benz Stadium.

The Intel Shooting Star drones appearing during the Pepsi Super Bowl LIII Halftime Show received authorization to operate under an experimental license issued by the Federal Communications Commission in compliance with federal regulations. This model of the Intel Shooting Star drone has not received final certification from the FCC and may not be offered for sale or lease, or sold or leased, until final certification is obtained.

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