Intel Packs Power, Intelligence of Xeon® Processor into System-on-Chip Offering to Target New, Growing Network Opportunities

First 14nm Intel® Xeon® Product Family Delivers Server-Class Capabilities in a Dense, Low- Power System-on-Chip Optimized for Cloud, Telco Service Providers and Web Hosters

5082_Xeon_D_Processor_Package_3QtrRight_preview.jpg

Intel® Xeon® processor D product family

SANTA CLARA, Calif., March 9, 2015 – Intel Corporation today announced the Intel® Xeon® processor D product family, the company’s first Intel Xeon processor-based system-on-chip (SoC). Built on Intel’s industry-leading 14nm process technology, the Intel Xeon processor D product family combines the performance and advanced intelligence of Intel Xeon processors with the size and power savings of an SoC.

The rapid proliferation of connected devices is driving exponential growth in data traffic, increasing the demands on the data center and network infrastructure for cloud and telecommunication service providers. As these customers look to efficiently scale their network infrastructure and seek to rapidly deliver new, revenue generating services, they are moving to standard Intel architecture to provide both the technology solutions and consistency required across the data center and network.

The Intel Xeon processor D product family offers new options for addressing the growing need for low-power, high density infrastructure solutions, extending Intel technology from the edge of data centers to the network. This provides customers with enhanced intelligence and greater agility to rapidly deliver new services at a lower total cost of ownership (TCO). Also, with server-class reliability, availability and serviceability (RAS) features now available in an ultra-dense, low-power device, telecommunication service providers will be able to deliver intelligent edge networks.

“The growth of connected devices and demand for more digital services has created new opportunities for information and communication technology,” said Diane Bryant, senior vice president and general manager of the Data Center Group at Intel. “By bringing Intel Xeon processor performance to a low-power SoC, we’re delivering the best of both worlds and enabling our customers to deliver exciting new services.”

News Facts

  • The Intel Xeon processor D product family is the first Intel Xeon SoC, and Intel’s third generation of 64-bit SoC for microserver, storage, network and the Internet of Things (IoT).
  • Products deliver up to 3.4x faster performance per node1 and up to 1.7x better performance per watt2 when compared to the Intel® Atom™ processor C2750, part of Intel’s second-generation 64-bit SoC product family.
  • Launching 4- and 8-core microserver optimized SoCs today, with a more comprehensive portfolio of network, storage and IoT SoCs targeted for availability in the second half of this year.
  • Initial products are optimized for hosters and cloud service providers for a variety of workloads such as dedicated web hosting, memory caching, dynamic web serving and warm storage. Future storage and network optimized products will target usages such as entry SAN and NAS appliances, edge routers and wireless base stations, as well as industrial IoT devices.
  • There are more than 50 systems currently in design. Approximately 75 percent are network, storage and IoT designs. System providers currently designing microservers based on the Intel Xeon processor D family include: Cisco*, HP*, NEC*, Quanta Cloud Technology*, Sugon* and Supermicro*.
  • Combines industry standard x86 cores, the industry’s most widely deployed data center processor microarchitecture, with two ports of integrated 10GbE Intel® Ethernet and integrated I/Os (PCIe, USB, SATA and other general purpose I/Os) on a single package. It operates at a thermal design point near 20 watts and supports up to 128GB of addressable memory.
  • Delivers advanced server-class reliability, availability and serviceability (RAS) features, including support for error-correcting code memory, combined with enhanced hardware-based Intel® Virtualization Technology and Intel® Advanced Encryption Standard-New Instructions (AES-NI).

“As the largest web hosting provider in Europe, technology innovation is critical to the company’s success,” said Robert Hoffmann, CEO 1&1 Internet AG. “As part of our broad technology collaboration with Intel, we are evaluating the new Intel Xeon processor D-based server platforms to help deliver a unique combination of performance and efficiency obtained from this first Intel Xeon SoC solution.”

Supporting Resources

Pricing3& Availability

  • Intel Xeon Processor D-1520 (4-core) $199.00
  • Intel Xeon Processor D-1540 (8-core) $581.00

The products are available today. The extended Intel Xeon processor D product family including microserver, network, storage and IoT optimized SoCs is expected to be available in the second half of this year.

Intel_Xeon_processor_D-die_inHand.jpg

Intel® Xeon® processor D die

5082_Xeon_D_Processor_Package_Holding_0298_Cropped_preview.jpg

Intel® Xeon® processor family

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, the Intel logo, Intel Atom and Xeon are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Results have been measured by Intel based on software, benchmark or other data of third parties and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. Intel does not control or audit the design or implementation of third party data referenced in this document. Intel encourages all of its customers to visit the websites of the referenced third parties or other sources to confirm whether the referenced data is accurate and reflects performance of systems available for purchase.

1 Up to 3.4x better performance on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43844 Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10(3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896.

2 Up to 1.7x (estimated) better performance per watt on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43843, Estimated wall power based on microserver chassis, power=90W, Perf/W=487.15 users/W Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10 (3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896. Maximum wall power =46W, Perf/W=280.3 users/W

3 Estimated MSRP. Actual prices may vary.

Intel Packs Power, Intelligence of Xeon® Processor into System-on-Chip Offering to Target New, Growing Network Opportunities

First 14nm Intel® Xeon® Product Family Delivers Server-Class Capabilities in a Dense, Low- Power System-on-Chip Optimized for Cloud, Telco Service Providers and Web Hosters

5082_Xeon_D_Processor_Package_3QtrRight_preview.jpg

Intel® Xeon® processor D product family

SANTA CLARA, Calif., March 9, 2015 – Intel Corporation today announced the Intel® Xeon® processor D product family, the company’s first Intel Xeon processor-based system-on-chip (SoC). Built on Intel’s industry-leading 14nm process technology, the Intel Xeon processor D product family combines the performance and advanced intelligence of Intel Xeon processors with the size and power savings of an SoC.

The rapid proliferation of connected devices is driving exponential growth in data traffic, increasing the demands on the data center and network infrastructure for cloud and telecommunication service providers. As these customers look to efficiently scale their network infrastructure and seek to rapidly deliver new, revenue generating services, they are moving to standard Intel architecture to provide both the technology solutions and consistency required across the data center and network.

The Intel Xeon processor D product family offers new options for addressing the growing need for low-power, high density infrastructure solutions, extending Intel technology from the edge of data centers to the network. This provides customers with enhanced intelligence and greater agility to rapidly deliver new services at a lower total cost of ownership (TCO). Also, with server-class reliability, availability and serviceability (RAS) features now available in an ultra-dense, low-power device, telecommunication service providers will be able to deliver intelligent edge networks.

“The growth of connected devices and demand for more digital services has created new opportunities for information and communication technology,” said Diane Bryant, senior vice president and general manager of the Data Center Group at Intel. “By bringing Intel Xeon processor performance to a low-power SoC, we’re delivering the best of both worlds and enabling our customers to deliver exciting new services.”

News Facts

  • The Intel Xeon processor D product family is the first Intel Xeon SoC, and Intel’s third generation of 64-bit SoC for microserver, storage, network and the Internet of Things (IoT).
  • Products deliver up to 3.4x faster performance per node1 and up to 1.7x better performance per watt2 when compared to the Intel® Atom™ processor C2750, part of Intel’s second-generation 64-bit SoC product family.
  • Launching 4- and 8-core microserver optimized SoCs today, with a more comprehensive portfolio of network, storage and IoT SoCs targeted for availability in the second half of this year.
  • Initial products are optimized for hosters and cloud service providers for a variety of workloads such as dedicated web hosting, memory caching, dynamic web serving and warm storage. Future storage and network optimized products will target usages such as entry SAN and NAS appliances, edge routers and wireless base stations, as well as industrial IoT devices.
  • There are more than 50 systems currently in design. Approximately 75 percent are network, storage and IoT designs. System providers currently designing microservers based on the Intel Xeon processor D family include: Cisco*, HP*, NEC*, Quanta Cloud Technology*, Sugon* and Supermicro*.
  • Combines industry standard x86 cores, the industry’s most widely deployed data center processor microarchitecture, with two ports of integrated 10GbE Intel® Ethernet and integrated I/Os (PCIe, USB, SATA and other general purpose I/Os) on a single package. It operates at a thermal design point near 20 watts and supports up to 128GB of addressable memory.
  • Delivers advanced server-class reliability, availability and serviceability (RAS) features, including support for error-correcting code memory, combined with enhanced hardware-based Intel® Virtualization Technology and Intel® Advanced Encryption Standard-New Instructions (AES-NI).

“As the largest web hosting provider in Europe, technology innovation is critical to the company’s success,” said Robert Hoffmann, CEO 1&1 Internet AG. “As part of our broad technology collaboration with Intel, we are evaluating the new Intel Xeon processor D-based server platforms to help deliver a unique combination of performance and efficiency obtained from this first Intel Xeon SoC solution.”

Supporting Resources

Pricing3& Availability

  • Intel Xeon Processor D-1520 (4-core) $199.00
  • Intel Xeon Processor D-1540 (8-core) $581.00

The products are available today. The extended Intel Xeon processor D product family including microserver, network, storage and IoT optimized SoCs is expected to be available in the second half of this year.

Intel Presents – Extending Intelligence to the Edge

 

Intel_Xeon_processor_D-die_inHand.jpg

Intel® Xeon® processor D die

5082_Xeon_D_Processor_Package_Holding_0298_Cropped_preview.jpg

Intel® Xeon® processor family

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, the Intel logo, Intel Atom and Xeon are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Results have been measured by Intel based on software, benchmark or other data of third parties and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. Intel does not control or audit the design or implementation of third party data referenced in this document. Intel encourages all of its customers to visit the websites of the referenced third parties or other sources to confirm whether the referenced data is accurate and reflects performance of systems available for purchase.

1 Up to 3.4x better performance on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43844 Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10(3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896.

2 Up to 1.7x (estimated) better performance per watt on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43843, Estimated wall power based on microserver chassis, power=90W, Perf/W=487.15 users/W Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10 (3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896. Maximum wall power =46W, Perf/W=280.3 users/W

3 Estimated MSRP. Actual prices may vary.

Intel Packs Power, Intelligence of Xeon® Processor into System-on-Chip Offering to Target New, Growing Network Opportunities

First 14nm Intel® Xeon® Product Family Delivers Server-Class Capabilities in a Dense, Low- Power System-on-Chip Optimized for Cloud, Telco Service Providers and Web Hosters

5082_Xeon_D_Processor_Package_3QtrRight_preview.jpg

Intel® Xeon® processor D product family

SANTA CLARA, Calif., March 9, 2015 – Intel Corporation today announced the Intel® Xeon® processor D product family, the company’s first Intel Xeon processor-based system-on-chip (SoC). Built on Intel’s industry-leading 14nm process technology, the Intel Xeon processor D product family combines the performance and advanced intelligence of Intel Xeon processors with the size and power savings of an SoC.

The rapid proliferation of connected devices is driving exponential growth in data traffic, increasing the demands on the data center and network infrastructure for cloud and telecommunication service providers. As these customers look to efficiently scale their network infrastructure and seek to rapidly deliver new, revenue generating services, they are moving to standard Intel architecture to provide both the technology solutions and consistency required across the data center and network.

The Intel Xeon processor D product family offers new options for addressing the growing need for low-power, high density infrastructure solutions, extending Intel technology from the edge of data centers to the network. This provides customers with enhanced intelligence and greater agility to rapidly deliver new services at a lower total cost of ownership (TCO). Also, with server-class reliability, availability and serviceability (RAS) features now available in an ultra-dense, low-power device, telecommunication service providers will be able to deliver intelligent edge networks.

“The growth of connected devices and demand for more digital services has created new opportunities for information and communication technology,” said Diane Bryant, senior vice president and general manager of the Data Center Group at Intel. “By bringing Intel Xeon processor performance to a low-power SoC, we’re delivering the best of both worlds and enabling our customers to deliver exciting new services.”

News Facts

  • The Intel Xeon processor D product family is the first Intel Xeon SoC, and Intel’s third generation of 64-bit SoC for microserver, storage, network and the Internet of Things (IoT).
  • Products deliver up to 3.4x faster performance per node1 and up to 1.7x better performance per watt2 when compared to the Intel® Atom™ processor C2750, part of Intel’s second-generation 64-bit SoC product family.
  • Launching 4- and 8-core microserver optimized SoCs today, with a more comprehensive portfolio of network, storage and IoT SoCs targeted for availability in the second half of this year.
  • Initial products are optimized for hosters and cloud service providers for a variety of workloads such as dedicated web hosting, memory caching, dynamic web serving and warm storage. Future storage and network optimized products will target usages such as entry SAN and NAS appliances, edge routers and wireless base stations, as well as industrial IoT devices.
  • There are more than 50 systems currently in design. Approximately 75 percent are network, storage and IoT designs. System providers currently designing microservers based on the Intel Xeon processor D family include: Cisco*, HP*, NEC*, Quanta Cloud Technology*, Sugon* and Supermicro*.
  • Combines industry standard x86 cores, the industry’s most widely deployed data center processor microarchitecture, with two ports of integrated 10GbE Intel® Ethernet and integrated I/Os (PCIe, USB, SATA and other general purpose I/Os) on a single package. It operates at a thermal design point near 20 watts and supports up to 128GB of addressable memory.
  • Delivers advanced server-class reliability, availability and serviceability (RAS) features, including support for error-correcting code memory, combined with enhanced hardware-based Intel® Virtualization Technology and Intel® Advanced Encryption Standard-New Instructions (AES-NI).

“As the largest web hosting provider in Europe, technology innovation is critical to the company’s success,” said Robert Hoffmann, CEO 1&1 Internet AG. “As part of our broad technology collaboration with Intel, we are evaluating the new Intel Xeon processor D-based server platforms to help deliver a unique combination of performance and efficiency obtained from this first Intel Xeon SoC solution.”

Supporting Resources

Pricing3& Availability

  • Intel Xeon Processor D-1520 (4-core) $199.00
  • Intel Xeon Processor D-1540 (8-core) $581.00

The products are available today. The extended Intel Xeon processor D product family including microserver, network, storage and IoT optimized SoCs is expected to be available in the second half of this year.

Intel Presents – Extending Intelligence to the Edge

 

Intel_Xeon_processor_D-die_inHand.jpg

Intel® Xeon® processor D die

5082_Xeon_D_Processor_Package_Holding_0298_Cropped_preview.jpg

Intel® Xeon® processor family

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, the Intel logo, Intel Atom and Xeon are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Results have been measured by Intel based on software, benchmark or other data of third parties and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. Intel does not control or audit the design or implementation of third party data referenced in this document. Intel encourages all of its customers to visit the websites of the referenced third parties or other sources to confirm whether the referenced data is accurate and reflects performance of systems available for purchase.

1 Up to 3.4x better performance on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43844 Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10(3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896.

2 Up to 1.7x (estimated) better performance per watt on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43843, Estimated wall power based on microserver chassis, power=90W, Perf/W=487.15 users/W Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10 (3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896. Maximum wall power =46W, Perf/W=280.3 users/W

3 Estimated MSRP. Actual prices may vary.

Intel Packs Power, Intelligence of Xeon® Processor into System-on-Chip Offering to Target New, Growing Network Opportunities

First 14nm Intel® Xeon® Product Family Delivers Server-Class Capabilities in a Dense, Low- Power System-on-Chip Optimized for Cloud, Telco Service Providers and Web Hosters

5082_Xeon_D_Processor_Package_3QtrRight_preview.jpg

Intel® Xeon® processor D product family

SANTA CLARA, Calif., March 9, 2015 – Intel Corporation today announced the Intel® Xeon® processor D product family, the company’s first Intel Xeon processor-based system-on-chip (SoC). Built on Intel’s industry-leading 14nm process technology, the Intel Xeon processor D product family combines the performance and advanced intelligence of Intel Xeon processors with the size and power savings of an SoC.

The rapid proliferation of connected devices is driving exponential growth in data traffic, increasing the demands on the data center and network infrastructure for cloud and telecommunication service providers. As these customers look to efficiently scale their network infrastructure and seek to rapidly deliver new, revenue generating services, they are moving to standard Intel architecture to provide both the technology solutions and consistency required across the data center and network.

The Intel Xeon processor D product family offers new options for addressing the growing need for low-power, high density infrastructure solutions, extending Intel technology from the edge of data centers to the network. This provides customers with enhanced intelligence and greater agility to rapidly deliver new services at a lower total cost of ownership (TCO). Also, with server-class reliability, availability and serviceability (RAS) features now available in an ultra-dense, low-power device, telecommunication service providers will be able to deliver intelligent edge networks.

“The growth of connected devices and demand for more digital services has created new opportunities for information and communication technology,” said Diane Bryant, senior vice president and general manager of the Data Center Group at Intel. “By bringing Intel Xeon processor performance to a low-power SoC, we’re delivering the best of both worlds and enabling our customers to deliver exciting new services.”

News Facts

  • The Intel Xeon processor D product family is the first Intel Xeon SoC, and Intel’s third generation of 64-bit SoC for microserver, storage, network and the Internet of Things (IoT).
  • Products deliver up to 3.4x faster performance per node1 and up to 1.7x better performance per watt2 when compared to the Intel® Atom™ processor C2750, part of Intel’s second-generation 64-bit SoC product family.
  • Launching 4- and 8-core microserver optimized SoCs today, with a more comprehensive portfolio of network, storage and IoT SoCs targeted for availability in the second half of this year.
  • Initial products are optimized for hosters and cloud service providers for a variety of workloads such as dedicated web hosting, memory caching, dynamic web serving and warm storage. Future storage and network optimized products will target usages such as entry SAN and NAS appliances, edge routers and wireless base stations, as well as industrial IoT devices.
  • There are more than 50 systems currently in design. Approximately 75 percent are network, storage and IoT designs. System providers currently designing microservers based on the Intel Xeon processor D family include: Cisco*, HP*, NEC*, Quanta Cloud Technology*, Sugon* and Supermicro*.
  • Combines industry standard x86 cores, the industry’s most widely deployed data center processor microarchitecture, with two ports of integrated 10GbE Intel® Ethernet and integrated I/Os (PCIe, USB, SATA and other general purpose I/Os) on a single package. It operates at a thermal design point near 20 watts and supports up to 128GB of addressable memory.
  • Delivers advanced server-class reliability, availability and serviceability (RAS) features, including support for error-correcting code memory, combined with enhanced hardware-based Intel® Virtualization Technology and Intel® Advanced Encryption Standard-New Instructions (AES-NI).

“As the largest web hosting provider in Europe, technology innovation is critical to the company’s success,” said Robert Hoffmann, CEO 1&1 Internet AG. “As part of our broad technology collaboration with Intel, we are evaluating the new Intel Xeon processor D-based server platforms to help deliver a unique combination of performance and efficiency obtained from this first Intel Xeon SoC solution.”

Supporting Resources

Pricing3& Availability

  • Intel Xeon Processor D-1520 (4-core) $199.00
  • Intel Xeon Processor D-1540 (8-core) $581.00

The products are available today. The extended Intel Xeon processor D product family including microserver, network, storage and IoT optimized SoCs is expected to be available in the second half of this year.

Intel Presents – Extending Intelligence to the Edge

 

Intel_Xeon_processor_D-die_inHand.jpg

Intel® Xeon® processor D die

5082_Xeon_D_Processor_Package_Holding_0298_Cropped_preview.jpg

Intel® Xeon® processor family

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, the Intel logo, Intel Atom and Xeon are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Results have been measured by Intel based on software, benchmark or other data of third parties and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. Intel does not control or audit the design or implementation of third party data referenced in this document. Intel encourages all of its customers to visit the websites of the referenced third parties or other sources to confirm whether the referenced data is accurate and reflects performance of systems available for purchase.

1 Up to 3.4x better performance on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43844 Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10(3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896.

2 Up to 1.7x (estimated) better performance per watt on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43843, Estimated wall power based on microserver chassis, power=90W, Perf/W=487.15 users/W Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10 (3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896. Maximum wall power =46W, Perf/W=280.3 users/W

3 Estimated MSRP. Actual prices may vary.

Intel Packs Power, Intelligence of Xeon® Processor into System-on-Chip Offering to Target New, Growing Network Opportunities

First 14nm Intel® Xeon® Product Family Delivers Server-Class Capabilities in a Dense, Low- Power System-on-Chip Optimized for Cloud, Telco Service Providers and Web Hosters

5082_Xeon_D_Processor_Package_3QtrRight_preview.jpg

Intel® Xeon® processor D product family

SANTA CLARA, Calif., March 9, 2015 – Intel Corporation today announced the Intel® Xeon® processor D product family, the company’s first Intel Xeon processor-based system-on-chip (SoC). Built on Intel’s industry-leading 14nm process technology, the Intel Xeon processor D product family combines the performance and advanced intelligence of Intel Xeon processors with the size and power savings of an SoC.

The rapid proliferation of connected devices is driving exponential growth in data traffic, increasing the demands on the data center and network infrastructure for cloud and telecommunication service providers. As these customers look to efficiently scale their network infrastructure and seek to rapidly deliver new, revenue generating services, they are moving to standard Intel architecture to provide both the technology solutions and consistency required across the data center and network.

The Intel Xeon processor D product family offers new options for addressing the growing need for low-power, high density infrastructure solutions, extending Intel technology from the edge of data centers to the network. This provides customers with enhanced intelligence and greater agility to rapidly deliver new services at a lower total cost of ownership (TCO). Also, with server-class reliability, availability and serviceability (RAS) features now available in an ultra-dense, low-power device, telecommunication service providers will be able to deliver intelligent edge networks.

“The growth of connected devices and demand for more digital services has created new opportunities for information and communication technology,” said Diane Bryant, senior vice president and general manager of the Data Center Group at Intel. “By bringing Intel Xeon processor performance to a low-power SoC, we’re delivering the best of both worlds and enabling our customers to deliver exciting new services.”

News Facts

  • The Intel Xeon processor D product family is the first Intel Xeon SoC, and Intel’s third generation of 64-bit SoC for microserver, storage, network and the Internet of Things (IoT).
  • Products deliver up to 3.4x faster performance per node1 and up to 1.7x better performance per watt2 when compared to the Intel® Atom™ processor C2750, part of Intel’s second-generation 64-bit SoC product family.
  • Launching 4- and 8-core microserver optimized SoCs today, with a more comprehensive portfolio of network, storage and IoT SoCs targeted for availability in the second half of this year.
  • Initial products are optimized for hosters and cloud service providers for a variety of workloads such as dedicated web hosting, memory caching, dynamic web serving and warm storage. Future storage and network optimized products will target usages such as entry SAN and NAS appliances, edge routers and wireless base stations, as well as industrial IoT devices.
  • There are more than 50 systems currently in design. Approximately 75 percent are network, storage and IoT designs. System providers currently designing microservers based on the Intel Xeon processor D family include: Cisco*, HP*, NEC*, Quanta Cloud Technology*, Sugon* and Supermicro*.
  • Combines industry standard x86 cores, the industry’s most widely deployed data center processor microarchitecture, with two ports of integrated 10GbE Intel® Ethernet and integrated I/Os (PCIe, USB, SATA and other general purpose I/Os) on a single package. It operates at a thermal design point near 20 watts and supports up to 128GB of addressable memory.
  • Delivers advanced server-class reliability, availability and serviceability (RAS) features, including support for error-correcting code memory, combined with enhanced hardware-based Intel® Virtualization Technology and Intel® Advanced Encryption Standard-New Instructions (AES-NI).

“As the largest web hosting provider in Europe, technology innovation is critical to the company’s success,” said Robert Hoffmann, CEO 1&1 Internet AG. “As part of our broad technology collaboration with Intel, we are evaluating the new Intel Xeon processor D-based server platforms to help deliver a unique combination of performance and efficiency obtained from this first Intel Xeon SoC solution.”

Supporting Resources

Pricing3& Availability

  • Intel Xeon Processor D-1520 (4-core) $199.00
  • Intel Xeon Processor D-1540 (8-core) $581.00

The products are available today. The extended Intel Xeon processor D product family including microserver, network, storage and IoT optimized SoCs is expected to be available in the second half of this year.

Intel Presents – Extending Intelligence to the Edge

 

Intel_Xeon_processor_D-die_inHand.jpg

Intel® Xeon® processor D die

5082_Xeon_D_Processor_Package_Holding_0298_Cropped_preview.jpg

Intel® Xeon® processor family

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, the Intel logo, Intel Atom and Xeon are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Results have been measured by Intel based on software, benchmark or other data of third parties and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. Intel does not control or audit the design or implementation of third party data referenced in this document. Intel encourages all of its customers to visit the websites of the referenced third parties or other sources to confirm whether the referenced data is accurate and reflects performance of systems available for purchase.

1 Up to 3.4x better performance on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43844 Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10(3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896.

2 Up to 1.7x (estimated) better performance per watt on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43843, Estimated wall power based on microserver chassis, power=90W, Perf/W=487.15 users/W Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10 (3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896. Maximum wall power =46W, Perf/W=280.3 users/W

3 Estimated MSRP. Actual prices may vary.

Intel Packs Power, Intelligence of Xeon® Processor into System-on-Chip Offering to Target New, Growing Network Opportunities

First 14nm Intel® Xeon® Product Family Delivers Server-Class Capabilities in a Dense, Low- Power System-on-Chip Optimized for Cloud, Telco Service Providers and Web Hosters

5082_Xeon_D_Processor_Package_3QtrRight_preview.jpg

Intel® Xeon® processor D product family

SANTA CLARA, Calif., March 9, 2015 – Intel Corporation today announced the Intel® Xeon® processor D product family, the company’s first Intel Xeon processor-based system-on-chip (SoC). Built on Intel’s industry-leading 14nm process technology, the Intel Xeon processor D product family combines the performance and advanced intelligence of Intel Xeon processors with the size and power savings of an SoC.

The rapid proliferation of connected devices is driving exponential growth in data traffic, increasing the demands on the data center and network infrastructure for cloud and telecommunication service providers. As these customers look to efficiently scale their network infrastructure and seek to rapidly deliver new, revenue generating services, they are moving to standard Intel architecture to provide both the technology solutions and consistency required across the data center and network.

The Intel Xeon processor D product family offers new options for addressing the growing need for low-power, high density infrastructure solutions, extending Intel technology from the edge of data centers to the network. This provides customers with enhanced intelligence and greater agility to rapidly deliver new services at a lower total cost of ownership (TCO). Also, with server-class reliability, availability and serviceability (RAS) features now available in an ultra-dense, low-power device, telecommunication service providers will be able to deliver intelligent edge networks.

“The growth of connected devices and demand for more digital services has created new opportunities for information and communication technology,” said Diane Bryant, senior vice president and general manager of the Data Center Group at Intel. “By bringing Intel Xeon processor performance to a low-power SoC, we’re delivering the best of both worlds and enabling our customers to deliver exciting new services.”

News Facts

  • The Intel Xeon processor D product family is the first Intel Xeon SoC, and Intel’s third generation of 64-bit SoC for microserver, storage, network and the Internet of Things (IoT).
  • Products deliver up to 3.4x faster performance per node1 and up to 1.7x better performance per watt2 when compared to the Intel® Atom™ processor C2750, part of Intel’s second-generation 64-bit SoC product family.
  • Launching 4- and 8-core microserver optimized SoCs today, with a more comprehensive portfolio of network, storage and IoT SoCs targeted for availability in the second half of this year.
  • Initial products are optimized for hosters and cloud service providers for a variety of workloads such as dedicated web hosting, memory caching, dynamic web serving and warm storage. Future storage and network optimized products will target usages such as entry SAN and NAS appliances, edge routers and wireless base stations, as well as industrial IoT devices.
  • There are more than 50 systems currently in design. Approximately 75 percent are network, storage and IoT designs. System providers currently designing microservers based on the Intel Xeon processor D family include: Cisco*, HP*, NEC*, Quanta Cloud Technology*, Sugon* and Supermicro*.
  • Combines industry standard x86 cores, the industry’s most widely deployed data center processor microarchitecture, with two ports of integrated 10GbE Intel® Ethernet and integrated I/Os (PCIe, USB, SATA and other general purpose I/Os) on a single package. It operates at a thermal design point near 20 watts and supports up to 128GB of addressable memory.
  • Delivers advanced server-class reliability, availability and serviceability (RAS) features, including support for error-correcting code memory, combined with enhanced hardware-based Intel® Virtualization Technology and Intel® Advanced Encryption Standard-New Instructions (AES-NI).

“As the largest web hosting provider in Europe, technology innovation is critical to the company’s success,” said Robert Hoffmann, CEO 1&1 Internet AG. “As part of our broad technology collaboration with Intel, we are evaluating the new Intel Xeon processor D-based server platforms to help deliver a unique combination of performance and efficiency obtained from this first Intel Xeon SoC solution.”

Supporting Resources

Pricing3& Availability

  • Intel Xeon Processor D-1520 (4-core) $199.00
  • Intel Xeon Processor D-1540 (8-core) $581.00

The products are available today. The extended Intel Xeon processor D product family including microserver, network, storage and IoT optimized SoCs is expected to be available in the second half of this year.

Intel Presents – Extending Intelligence to the Edge

 

Intel_Xeon_processor_D-die_inHand.jpg

Intel® Xeon® processor D die

5082_Xeon_D_Processor_Package_Holding_0298_Cropped_preview.jpg

Intel® Xeon® processor family

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, the Intel logo, Intel Atom and Xeon are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Results have been measured by Intel based on software, benchmark or other data of third parties and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. Intel does not control or audit the design or implementation of third party data referenced in this document. Intel encourages all of its customers to visit the websites of the referenced third parties or other sources to confirm whether the referenced data is accurate and reflects performance of systems available for purchase.

1 Up to 3.4x better performance on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43844 Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10(3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896.

2 Up to 1.7x (estimated) better performance per watt on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43843, Estimated wall power based on microserver chassis, power=90W, Perf/W=487.15 users/W Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10 (3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896. Maximum wall power =46W, Perf/W=280.3 users/W

3 Estimated MSRP. Actual prices may vary.

Intel Packs Power, Intelligence of Xeon® Processor into System-on-Chip Offering to Target New, Growing Network Opportunities

First 14nm Intel® Xeon® Product Family Delivers Server-Class Capabilities in a Dense, Low- Power System-on-Chip Optimized for Cloud, Telco Service Providers and Web Hosters

5082_Xeon_D_Processor_Package_3QtrRight_preview.jpg

Intel® Xeon® processor D product family

SANTA CLARA, Calif., March 9, 2015 – Intel Corporation today announced the Intel® Xeon® processor D product family, the company’s first Intel Xeon processor-based system-on-chip (SoC). Built on Intel’s industry-leading 14nm process technology, the Intel Xeon processor D product family combines the performance and advanced intelligence of Intel Xeon processors with the size and power savings of an SoC.

The rapid proliferation of connected devices is driving exponential growth in data traffic, increasing the demands on the data center and network infrastructure for cloud and telecommunication service providers. As these customers look to efficiently scale their network infrastructure and seek to rapidly deliver new, revenue generating services, they are moving to standard Intel architecture to provide both the technology solutions and consistency required across the data center and network.

The Intel Xeon processor D product family offers new options for addressing the growing need for low-power, high density infrastructure solutions, extending Intel technology from the edge of data centers to the network. This provides customers with enhanced intelligence and greater agility to rapidly deliver new services at a lower total cost of ownership (TCO). Also, with server-class reliability, availability and serviceability (RAS) features now available in an ultra-dense, low-power device, telecommunication service providers will be able to deliver intelligent edge networks.

“The growth of connected devices and demand for more digital services has created new opportunities for information and communication technology,” said Diane Bryant, senior vice president and general manager of the Data Center Group at Intel. “By bringing Intel Xeon processor performance to a low-power SoC, we’re delivering the best of both worlds and enabling our customers to deliver exciting new services.”

News Facts

  • The Intel Xeon processor D product family is the first Intel Xeon SoC, and Intel’s third generation of 64-bit SoC for microserver, storage, network and the Internet of Things (IoT).
  • Products deliver up to 3.4x faster performance per node1 and up to 1.7x better performance per watt2 when compared to the Intel® Atom™ processor C2750, part of Intel’s second-generation 64-bit SoC product family.
  • Launching 4- and 8-core microserver optimized SoCs today, with a more comprehensive portfolio of network, storage and IoT SoCs targeted for availability in the second half of this year.
  • Initial products are optimized for hosters and cloud service providers for a variety of workloads such as dedicated web hosting, memory caching, dynamic web serving and warm storage. Future storage and network optimized products will target usages such as entry SAN and NAS appliances, edge routers and wireless base stations, as well as industrial IoT devices.
  • There are more than 50 systems currently in design. Approximately 75 percent are network, storage and IoT designs. System providers currently designing microservers based on the Intel Xeon processor D family include: Cisco*, HP*, NEC*, Quanta Cloud Technology*, Sugon* and Supermicro*.
  • Combines industry standard x86 cores, the industry’s most widely deployed data center processor microarchitecture, with two ports of integrated 10GbE Intel® Ethernet and integrated I/Os (PCIe, USB, SATA and other general purpose I/Os) on a single package. It operates at a thermal design point near 20 watts and supports up to 128GB of addressable memory.
  • Delivers advanced server-class reliability, availability and serviceability (RAS) features, including support for error-correcting code memory, combined with enhanced hardware-based Intel® Virtualization Technology and Intel® Advanced Encryption Standard-New Instructions (AES-NI).

“As the largest web hosting provider in Europe, technology innovation is critical to the company’s success,” said Robert Hoffmann, CEO 1&1 Internet AG. “As part of our broad technology collaboration with Intel, we are evaluating the new Intel Xeon processor D-based server platforms to help deliver a unique combination of performance and efficiency obtained from this first Intel Xeon SoC solution.”

Supporting Resources

Pricing3& Availability

  • Intel Xeon Processor D-1520 (4-core) $199.00
  • Intel Xeon Processor D-1540 (8-core) $581.00

The products are available today. The extended Intel Xeon processor D product family including microserver, network, storage and IoT optimized SoCs is expected to be available in the second half of this year.

Intel Presents – Extending Intelligence to the Edge

 

Intel_Xeon_processor_D-die_inHand.jpg

Intel® Xeon® processor D die

5082_Xeon_D_Processor_Package_Holding_0298_Cropped_preview.jpg

Intel® Xeon® processor family

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, the Intel logo, Intel Atom and Xeon are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Results have been measured by Intel based on software, benchmark or other data of third parties and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. Intel does not control or audit the design or implementation of third party data referenced in this document. Intel encourages all of its customers to visit the websites of the referenced third parties or other sources to confirm whether the referenced data is accurate and reflects performance of systems available for purchase.

1 Up to 3.4x better performance on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43844 Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10(3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896.

2 Up to 1.7x (estimated) better performance per watt on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43843, Estimated wall power based on microserver chassis, power=90W, Perf/W=487.15 users/W Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10 (3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896. Maximum wall power =46W, Perf/W=280.3 users/W

3 Estimated MSRP. Actual prices may vary.

Intel Packs Power, Intelligence of Xeon® Processor into System-on-Chip Offering to Target New, Growing Network Opportunities

First 14nm Intel® Xeon® Product Family Delivers Server-Class Capabilities in a Dense, Low- Power System-on-Chip Optimized for Cloud, Telco Service Providers and Web Hosters

5082_Xeon_D_Processor_Package_3QtrRight_preview.jpg

Intel® Xeon® processor D product family

SANTA CLARA, Calif., March 9, 2015 – Intel Corporation today announced the Intel® Xeon® processor D product family, the company’s first Intel Xeon processor-based system-on-chip (SoC). Built on Intel’s industry-leading 14nm process technology, the Intel Xeon processor D product family combines the performance and advanced intelligence of Intel Xeon processors with the size and power savings of an SoC.

The rapid proliferation of connected devices is driving exponential growth in data traffic, increasing the demands on the data center and network infrastructure for cloud and telecommunication service providers. As these customers look to efficiently scale their network infrastructure and seek to rapidly deliver new, revenue generating services, they are moving to standard Intel architecture to provide both the technology solutions and consistency required across the data center and network.

The Intel Xeon processor D product family offers new options for addressing the growing need for low-power, high density infrastructure solutions, extending Intel technology from the edge of data centers to the network. This provides customers with enhanced intelligence and greater agility to rapidly deliver new services at a lower total cost of ownership (TCO). Also, with server-class reliability, availability and serviceability (RAS) features now available in an ultra-dense, low-power device, telecommunication service providers will be able to deliver intelligent edge networks.

“The growth of connected devices and demand for more digital services has created new opportunities for information and communication technology,” said Diane Bryant, senior vice president and general manager of the Data Center Group at Intel. “By bringing Intel Xeon processor performance to a low-power SoC, we’re delivering the best of both worlds and enabling our customers to deliver exciting new services.”

News Facts

  • The Intel Xeon processor D product family is the first Intel Xeon SoC, and Intel’s third generation of 64-bit SoC for microserver, storage, network and the Internet of Things (IoT).
  • Products deliver up to 3.4x faster performance per node1 and up to 1.7x better performance per watt2 when compared to the Intel® Atom™ processor C2750, part of Intel’s second-generation 64-bit SoC product family.
  • Launching 4- and 8-core microserver optimized SoCs today, with a more comprehensive portfolio of network, storage and IoT SoCs targeted for availability in the second half of this year.
  • Initial products are optimized for hosters and cloud service providers for a variety of workloads such as dedicated web hosting, memory caching, dynamic web serving and warm storage. Future storage and network optimized products will target usages such as entry SAN and NAS appliances, edge routers and wireless base stations, as well as industrial IoT devices.
  • There are more than 50 systems currently in design. Approximately 75 percent are network, storage and IoT designs. System providers currently designing microservers based on the Intel Xeon processor D family include: Cisco*, HP*, NEC*, Quanta Cloud Technology*, Sugon* and Supermicro*.
  • Combines industry standard x86 cores, the industry’s most widely deployed data center processor microarchitecture, with two ports of integrated 10GbE Intel® Ethernet and integrated I/Os (PCIe, USB, SATA and other general purpose I/Os) on a single package. It operates at a thermal design point near 20 watts and supports up to 128GB of addressable memory.
  • Delivers advanced server-class reliability, availability and serviceability (RAS) features, including support for error-correcting code memory, combined with enhanced hardware-based Intel® Virtualization Technology and Intel® Advanced Encryption Standard-New Instructions (AES-NI).

“As the largest web hosting provider in Europe, technology innovation is critical to the company’s success,” said Robert Hoffmann, CEO 1&1 Internet AG. “As part of our broad technology collaboration with Intel, we are evaluating the new Intel Xeon processor D-based server platforms to help deliver a unique combination of performance and efficiency obtained from this first Intel Xeon SoC solution.”

Supporting Resources

Pricing3& Availability

  • Intel Xeon Processor D-1520 (4-core) $199.00
  • Intel Xeon Processor D-1540 (8-core) $581.00

The products are available today. The extended Intel Xeon processor D product family including microserver, network, storage and IoT optimized SoCs is expected to be available in the second half of this year.

Intel Presents – Extending Intelligence to the Edge

 

Intel_Xeon_processor_D-die_inHand.jpg

Intel® Xeon® processor D die

5082_Xeon_D_Processor_Package_Holding_0298_Cropped_preview.jpg

Intel® Xeon® processor family

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, the Intel logo, Intel Atom and Xeon are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Results have been measured by Intel based on software, benchmark or other data of third parties and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. Intel does not control or audit the design or implementation of third party data referenced in this document. Intel encourages all of its customers to visit the websites of the referenced third parties or other sources to confirm whether the referenced data is accurate and reflects performance of systems available for purchase.

1 Up to 3.4x better performance on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43844 Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10(3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896.

2 Up to 1.7x (estimated) better performance per watt on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43843, Estimated wall power based on microserver chassis, power=90W, Perf/W=487.15 users/W Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10 (3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896. Maximum wall power =46W, Perf/W=280.3 users/W

3 Estimated MSRP. Actual prices may vary.

Intel Packs Power, Intelligence of Xeon® Processor into System-on-Chip Offering to Target New, Growing Network Opportunities

First 14nm Intel® Xeon® Product Family Delivers Server-Class Capabilities in a Dense, Low- Power System-on-Chip Optimized for Cloud, Telco Service Providers and Web Hosters

5082_Xeon_D_Processor_Package_3QtrRight_preview.jpg

Intel® Xeon® processor D product family

SANTA CLARA, Calif., March 9, 2015 – Intel Corporation today announced the Intel® Xeon® processor D product family, the company’s first Intel Xeon processor-based system-on-chip (SoC). Built on Intel’s industry-leading 14nm process technology, the Intel Xeon processor D product family combines the performance and advanced intelligence of Intel Xeon processors with the size and power savings of an SoC.

The rapid proliferation of connected devices is driving exponential growth in data traffic, increasing the demands on the data center and network infrastructure for cloud and telecommunication service providers. As these customers look to efficiently scale their network infrastructure and seek to rapidly deliver new, revenue generating services, they are moving to standard Intel architecture to provide both the technology solutions and consistency required across the data center and network.

The Intel Xeon processor D product family offers new options for addressing the growing need for low-power, high density infrastructure solutions, extending Intel technology from the edge of data centers to the network. This provides customers with enhanced intelligence and greater agility to rapidly deliver new services at a lower total cost of ownership (TCO). Also, with server-class reliability, availability and serviceability (RAS) features now available in an ultra-dense, low-power device, telecommunication service providers will be able to deliver intelligent edge networks.

“The growth of connected devices and demand for more digital services has created new opportunities for information and communication technology,” said Diane Bryant, senior vice president and general manager of the Data Center Group at Intel. “By bringing Intel Xeon processor performance to a low-power SoC, we’re delivering the best of both worlds and enabling our customers to deliver exciting new services.”

News Facts

  • The Intel Xeon processor D product family is the first Intel Xeon SoC, and Intel’s third generation of 64-bit SoC for microserver, storage, network and the Internet of Things (IoT).
  • Products deliver up to 3.4x faster performance per node1 and up to 1.7x better performance per watt2 when compared to the Intel® Atom™ processor C2750, part of Intel’s second-generation 64-bit SoC product family.
  • Launching 4- and 8-core microserver optimized SoCs today, with a more comprehensive portfolio of network, storage and IoT SoCs targeted for availability in the second half of this year.
  • Initial products are optimized for hosters and cloud service providers for a variety of workloads such as dedicated web hosting, memory caching, dynamic web serving and warm storage. Future storage and network optimized products will target usages such as entry SAN and NAS appliances, edge routers and wireless base stations, as well as industrial IoT devices.
  • There are more than 50 systems currently in design. Approximately 75 percent are network, storage and IoT designs. System providers currently designing microservers based on the Intel Xeon processor D family include: Cisco*, HP*, NEC*, Quanta Cloud Technology*, Sugon* and Supermicro*.
  • Combines industry standard x86 cores, the industry’s most widely deployed data center processor microarchitecture, with two ports of integrated 10GbE Intel® Ethernet and integrated I/Os (PCIe, USB, SATA and other general purpose I/Os) on a single package. It operates at a thermal design point near 20 watts and supports up to 128GB of addressable memory.
  • Delivers advanced server-class reliability, availability and serviceability (RAS) features, including support for error-correcting code memory, combined with enhanced hardware-based Intel® Virtualization Technology and Intel® Advanced Encryption Standard-New Instructions (AES-NI).

“As the largest web hosting provider in Europe, technology innovation is critical to the company’s success,” said Robert Hoffmann, CEO 1&1 Internet AG. “As part of our broad technology collaboration with Intel, we are evaluating the new Intel Xeon processor D-based server platforms to help deliver a unique combination of performance and efficiency obtained from this first Intel Xeon SoC solution.”

Supporting Resources

Pricing3& Availability

  • Intel Xeon Processor D-1520 (4-core) $199.00
  • Intel Xeon Processor D-1540 (8-core) $581.00

The products are available today. The extended Intel Xeon processor D product family including microserver, network, storage and IoT optimized SoCs is expected to be available in the second half of this year.

Intel Presents – Extending Intelligence to the Edge

 

Intel_Xeon_processor_D-die_inHand.jpg

Intel® Xeon® processor D die

5082_Xeon_D_Processor_Package_Holding_0298_Cropped_preview.jpg

Intel® Xeon® processor family

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, the Intel logo, Intel Atom and Xeon are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Results have been measured by Intel based on software, benchmark or other data of third parties and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. Intel does not control or audit the design or implementation of third party data referenced in this document. Intel encourages all of its customers to visit the websites of the referenced third parties or other sources to confirm whether the referenced data is accurate and reflects performance of systems available for purchase.

1 Up to 3.4x better performance on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43844 Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10(3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896.

2 Up to 1.7x (estimated) better performance per watt on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43843, Estimated wall power based on microserver chassis, power=90W, Perf/W=487.15 users/W Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10 (3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896. Maximum wall power =46W, Perf/W=280.3 users/W

3 Estimated MSRP. Actual prices may vary.

Intel Packs Power, Intelligence of Xeon® Processor into System-on-Chip Offering to Target New, Growing Network Opportunities

First 14nm Intel® Xeon® Product Family Delivers Server-Class Capabilities in a Dense, Low- Power System-on-Chip Optimized for Cloud, Telco Service Providers and Web Hosters

5082_Xeon_D_Processor_Package_3QtrRight_preview.jpg

Intel® Xeon® processor D product family

SANTA CLARA, Calif., March 9, 2015 – Intel Corporation today announced the Intel® Xeon® processor D product family, the company’s first Intel Xeon processor-based system-on-chip (SoC). Built on Intel’s industry-leading 14nm process technology, the Intel Xeon processor D product family combines the performance and advanced intelligence of Intel Xeon processors with the size and power savings of an SoC.

The rapid proliferation of connected devices is driving exponential growth in data traffic, increasing the demands on the data center and network infrastructure for cloud and telecommunication service providers. As these customers look to efficiently scale their network infrastructure and seek to rapidly deliver new, revenue generating services, they are moving to standard Intel architecture to provide both the technology solutions and consistency required across the data center and network.

The Intel Xeon processor D product family offers new options for addressing the growing need for low-power, high density infrastructure solutions, extending Intel technology from the edge of data centers to the network. This provides customers with enhanced intelligence and greater agility to rapidly deliver new services at a lower total cost of ownership (TCO). Also, with server-class reliability, availability and serviceability (RAS) features now available in an ultra-dense, low-power device, telecommunication service providers will be able to deliver intelligent edge networks.

“The growth of connected devices and demand for more digital services has created new opportunities for information and communication technology,” said Diane Bryant, senior vice president and general manager of the Data Center Group at Intel. “By bringing Intel Xeon processor performance to a low-power SoC, we’re delivering the best of both worlds and enabling our customers to deliver exciting new services.”

News Facts

  • The Intel Xeon processor D product family is the first Intel Xeon SoC, and Intel’s third generation of 64-bit SoC for microserver, storage, network and the Internet of Things (IoT).
  • Products deliver up to 3.4x faster performance per node1 and up to 1.7x better performance per watt2 when compared to the Intel® Atom™ processor C2750, part of Intel’s second-generation 64-bit SoC product family.
  • Launching 4- and 8-core microserver optimized SoCs today, with a more comprehensive portfolio of network, storage and IoT SoCs targeted for availability in the second half of this year.
  • Initial products are optimized for hosters and cloud service providers for a variety of workloads such as dedicated web hosting, memory caching, dynamic web serving and warm storage. Future storage and network optimized products will target usages such as entry SAN and NAS appliances, edge routers and wireless base stations, as well as industrial IoT devices.
  • There are more than 50 systems currently in design. Approximately 75 percent are network, storage and IoT designs. System providers currently designing microservers based on the Intel Xeon processor D family include: Cisco*, HP*, NEC*, Quanta Cloud Technology*, Sugon* and Supermicro*.
  • Combines industry standard x86 cores, the industry’s most widely deployed data center processor microarchitecture, with two ports of integrated 10GbE Intel® Ethernet and integrated I/Os (PCIe, USB, SATA and other general purpose I/Os) on a single package. It operates at a thermal design point near 20 watts and supports up to 128GB of addressable memory.
  • Delivers advanced server-class reliability, availability and serviceability (RAS) features, including support for error-correcting code memory, combined with enhanced hardware-based Intel® Virtualization Technology and Intel® Advanced Encryption Standard-New Instructions (AES-NI).

“As the largest web hosting provider in Europe, technology innovation is critical to the company’s success,” said Robert Hoffmann, CEO 1&1 Internet AG. “As part of our broad technology collaboration with Intel, we are evaluating the new Intel Xeon processor D-based server platforms to help deliver a unique combination of performance and efficiency obtained from this first Intel Xeon SoC solution.”

Supporting Resources

Pricing3& Availability

  • Intel Xeon Processor D-1520 (4-core) $199.00
  • Intel Xeon Processor D-1540 (8-core) $581.00

The products are available today. The extended Intel Xeon processor D product family including microserver, network, storage and IoT optimized SoCs is expected to be available in the second half of this year.

Intel Presents – Extending Intelligence to the Edge

 

Intel_Xeon_processor_D-die_inHand.jpg

Intel® Xeon® processor D die

5082_Xeon_D_Processor_Package_Holding_0298_Cropped_preview.jpg

Intel® Xeon® processor family

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, the Intel logo, Intel Atom and Xeon are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Results have been measured by Intel based on software, benchmark or other data of third parties and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. Intel does not control or audit the design or implementation of third party data referenced in this document. Intel encourages all of its customers to visit the websites of the referenced third parties or other sources to confirm whether the referenced data is accurate and reflects performance of systems available for purchase.

1 Up to 3.4x better performance on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43844 Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10(3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896.

2 Up to 1.7x (estimated) better performance per watt on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43843, Estimated wall power based on microserver chassis, power=90W, Perf/W=487.15 users/W Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10 (3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896. Maximum wall power =46W, Perf/W=280.3 users/W

3 Estimated MSRP. Actual prices may vary.

Intel Packs Power, Intelligence of Xeon® Processor into System-on-Chip Offering to Target New, Growing Network Opportunities

First 14nm Intel® Xeon® Product Family Delivers Server-Class Capabilities in a Dense, Low- Power System-on-Chip Optimized for Cloud, Telco Service Providers and Web Hosters

5082_Xeon_D_Processor_Package_3QtrRight_preview.jpg

Intel® Xeon® processor D product family

SANTA CLARA, Calif., March 9, 2015 – Intel Corporation today announced the Intel® Xeon® processor D product family, the company’s first Intel Xeon processor-based system-on-chip (SoC). Built on Intel’s industry-leading 14nm process technology, the Intel Xeon processor D product family combines the performance and advanced intelligence of Intel Xeon processors with the size and power savings of an SoC.

The rapid proliferation of connected devices is driving exponential growth in data traffic, increasing the demands on the data center and network infrastructure for cloud and telecommunication service providers. As these customers look to efficiently scale their network infrastructure and seek to rapidly deliver new, revenue generating services, they are moving to standard Intel architecture to provide both the technology solutions and consistency required across the data center and network.

The Intel Xeon processor D product family offers new options for addressing the growing need for low-power, high density infrastructure solutions, extending Intel technology from the edge of data centers to the network. This provides customers with enhanced intelligence and greater agility to rapidly deliver new services at a lower total cost of ownership (TCO). Also, with server-class reliability, availability and serviceability (RAS) features now available in an ultra-dense, low-power device, telecommunication service providers will be able to deliver intelligent edge networks.

“The growth of connected devices and demand for more digital services has created new opportunities for information and communication technology,” said Diane Bryant, senior vice president and general manager of the Data Center Group at Intel. “By bringing Intel Xeon processor performance to a low-power SoC, we’re delivering the best of both worlds and enabling our customers to deliver exciting new services.”

News Facts

  • The Intel Xeon processor D product family is the first Intel Xeon SoC, and Intel’s third generation of 64-bit SoC for microserver, storage, network and the Internet of Things (IoT).
  • Products deliver up to 3.4x faster performance per node1 and up to 1.7x better performance per watt2 when compared to the Intel® Atom™ processor C2750, part of Intel’s second-generation 64-bit SoC product family.
  • Launching 4- and 8-core microserver optimized SoCs today, with a more comprehensive portfolio of network, storage and IoT SoCs targeted for availability in the second half of this year.
  • Initial products are optimized for hosters and cloud service providers for a variety of workloads such as dedicated web hosting, memory caching, dynamic web serving and warm storage. Future storage and network optimized products will target usages such as entry SAN and NAS appliances, edge routers and wireless base stations, as well as industrial IoT devices.
  • There are more than 50 systems currently in design. Approximately 75 percent are network, storage and IoT designs. System providers currently designing microservers based on the Intel Xeon processor D family include: Cisco*, HP*, NEC*, Quanta Cloud Technology*, Sugon* and Supermicro*.
  • Combines industry standard x86 cores, the industry’s most widely deployed data center processor microarchitecture, with two ports of integrated 10GbE Intel® Ethernet and integrated I/Os (PCIe, USB, SATA and other general purpose I/Os) on a single package. It operates at a thermal design point near 20 watts and supports up to 128GB of addressable memory.
  • Delivers advanced server-class reliability, availability and serviceability (RAS) features, including support for error-correcting code memory, combined with enhanced hardware-based Intel® Virtualization Technology and Intel® Advanced Encryption Standard-New Instructions (AES-NI).

“As the largest web hosting provider in Europe, technology innovation is critical to the company’s success,” said Robert Hoffmann, CEO 1&1 Internet AG. “As part of our broad technology collaboration with Intel, we are evaluating the new Intel Xeon processor D-based server platforms to help deliver a unique combination of performance and efficiency obtained from this first Intel Xeon SoC solution.”

Supporting Resources

Pricing3& Availability

  • Intel Xeon Processor D-1520 (4-core) $199.00
  • Intel Xeon Processor D-1540 (8-core) $581.00

The products are available today. The extended Intel Xeon processor D product family including microserver, network, storage and IoT optimized SoCs is expected to be available in the second half of this year.

Intel Presents – Extending Intelligence to the Edge

 

Intel_Xeon_processor_D-die_inHand.jpg

Intel® Xeon® processor D die

5082_Xeon_D_Processor_Package_Holding_0298_Cropped_preview.jpg

Intel® Xeon® processor family

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, the Intel logo, Intel Atom and Xeon are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Results have been measured by Intel based on software, benchmark or other data of third parties and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. Intel does not control or audit the design or implementation of third party data referenced in this document. Intel encourages all of its customers to visit the websites of the referenced third parties or other sources to confirm whether the referenced data is accurate and reflects performance of systems available for purchase.

1 Up to 3.4x better performance on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43844 Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10(3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896.

2 Up to 1.7x (estimated) better performance per watt on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43843, Estimated wall power based on microserver chassis, power=90W, Perf/W=487.15 users/W Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10 (3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896. Maximum wall power =46W, Perf/W=280.3 users/W

3 Estimated MSRP. Actual prices may vary.

Intel Packs Power, Intelligence of Xeon® Processor into System-on-Chip Offering to Target New, Growing Network Opportunities

First 14nm Intel® Xeon® Product Family Delivers Server-Class Capabilities in a Dense, Low- Power System-on-Chip Optimized for Cloud, Telco Service Providers and Web Hosters

5082_Xeon_D_Processor_Package_3QtrRight_preview.jpg

Intel® Xeon® processor D product family

SANTA CLARA, Calif., March 9, 2015 – Intel Corporation today announced the Intel® Xeon® processor D product family, the company’s first Intel Xeon processor-based system-on-chip (SoC). Built on Intel’s industry-leading 14nm process technology, the Intel Xeon processor D product family combines the performance and advanced intelligence of Intel Xeon processors with the size and power savings of an SoC.

The rapid proliferation of connected devices is driving exponential growth in data traffic, increasing the demands on the data center and network infrastructure for cloud and telecommunication service providers. As these customers look to efficiently scale their network infrastructure and seek to rapidly deliver new, revenue generating services, they are moving to standard Intel architecture to provide both the technology solutions and consistency required across the data center and network.

The Intel Xeon processor D product family offers new options for addressing the growing need for low-power, high density infrastructure solutions, extending Intel technology from the edge of data centers to the network. This provides customers with enhanced intelligence and greater agility to rapidly deliver new services at a lower total cost of ownership (TCO). Also, with server-class reliability, availability and serviceability (RAS) features now available in an ultra-dense, low-power device, telecommunication service providers will be able to deliver intelligent edge networks.

“The growth of connected devices and demand for more digital services has created new opportunities for information and communication technology,” said Diane Bryant, senior vice president and general manager of the Data Center Group at Intel. “By bringing Intel Xeon processor performance to a low-power SoC, we’re delivering the best of both worlds and enabling our customers to deliver exciting new services.”

News Facts

  • The Intel Xeon processor D product family is the first Intel Xeon SoC, and Intel’s third generation of 64-bit SoC for microserver, storage, network and the Internet of Things (IoT).
  • Products deliver up to 3.4x faster performance per node1 and up to 1.7x better performance per watt2 when compared to the Intel® Atom™ processor C2750, part of Intel’s second-generation 64-bit SoC product family.
  • Launching 4- and 8-core microserver optimized SoCs today, with a more comprehensive portfolio of network, storage and IoT SoCs targeted for availability in the second half of this year.
  • Initial products are optimized for hosters and cloud service providers for a variety of workloads such as dedicated web hosting, memory caching, dynamic web serving and warm storage. Future storage and network optimized products will target usages such as entry SAN and NAS appliances, edge routers and wireless base stations, as well as industrial IoT devices.
  • There are more than 50 systems currently in design. Approximately 75 percent are network, storage and IoT designs. System providers currently designing microservers based on the Intel Xeon processor D family include: Cisco*, HP*, NEC*, Quanta Cloud Technology*, Sugon* and Supermicro*.
  • Combines industry standard x86 cores, the industry’s most widely deployed data center processor microarchitecture, with two ports of integrated 10GbE Intel® Ethernet and integrated I/Os (PCIe, USB, SATA and other general purpose I/Os) on a single package. It operates at a thermal design point near 20 watts and supports up to 128GB of addressable memory.
  • Delivers advanced server-class reliability, availability and serviceability (RAS) features, including support for error-correcting code memory, combined with enhanced hardware-based Intel® Virtualization Technology and Intel® Advanced Encryption Standard-New Instructions (AES-NI).

“As the largest web hosting provider in Europe, technology innovation is critical to the company’s success,” said Robert Hoffmann, CEO 1&1 Internet AG. “As part of our broad technology collaboration with Intel, we are evaluating the new Intel Xeon processor D-based server platforms to help deliver a unique combination of performance and efficiency obtained from this first Intel Xeon SoC solution.”

Supporting Resources

Pricing3& Availability

  • Intel Xeon Processor D-1520 (4-core) $199.00
  • Intel Xeon Processor D-1540 (8-core) $581.00

The products are available today. The extended Intel Xeon processor D product family including microserver, network, storage and IoT optimized SoCs is expected to be available in the second half of this year.

Intel Presents – Extending Intelligence to the Edge

 

Intel_Xeon_processor_D-die_inHand.jpg

Intel® Xeon® processor D die

5082_Xeon_D_Processor_Package_Holding_0298_Cropped_preview.jpg

Intel® Xeon® processor family

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, the Intel logo, Intel Atom and Xeon are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Results have been measured by Intel based on software, benchmark or other data of third parties and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. Intel does not control or audit the design or implementation of third party data referenced in this document. Intel encourages all of its customers to visit the websites of the referenced third parties or other sources to confirm whether the referenced data is accurate and reflects performance of systems available for purchase.

1 Up to 3.4x better performance on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43844 Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10(3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896.

2 Up to 1.7x (estimated) better performance per watt on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43843, Estimated wall power based on microserver chassis, power=90W, Perf/W=487.15 users/W Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10 (3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896. Maximum wall power =46W, Perf/W=280.3 users/W

3 Estimated MSRP. Actual prices may vary.

Intel Packs Power, Intelligence of Xeon® Processor into System-on-Chip Offering to Target New, Growing Network Opportunities

First 14nm Intel® Xeon® Product Family Delivers Server-Class Capabilities in a Dense, Low- Power System-on-Chip Optimized for Cloud, Telco Service Providers and Web Hosters

5082_Xeon_D_Processor_Package_3QtrRight_preview.jpg

Intel® Xeon® processor D product family

SANTA CLARA, Calif., March 9, 2015 – Intel Corporation today announced the Intel® Xeon® processor D product family, the company’s first Intel Xeon processor-based system-on-chip (SoC). Built on Intel’s industry-leading 14nm process technology, the Intel Xeon processor D product family combines the performance and advanced intelligence of Intel Xeon processors with the size and power savings of an SoC.

The rapid proliferation of connected devices is driving exponential growth in data traffic, increasing the demands on the data center and network infrastructure for cloud and telecommunication service providers. As these customers look to efficiently scale their network infrastructure and seek to rapidly deliver new, revenue generating services, they are moving to standard Intel architecture to provide both the technology solutions and consistency required across the data center and network.

The Intel Xeon processor D product family offers new options for addressing the growing need for low-power, high density infrastructure solutions, extending Intel technology from the edge of data centers to the network. This provides customers with enhanced intelligence and greater agility to rapidly deliver new services at a lower total cost of ownership (TCO). Also, with server-class reliability, availability and serviceability (RAS) features now available in an ultra-dense, low-power device, telecommunication service providers will be able to deliver intelligent edge networks.

“The growth of connected devices and demand for more digital services has created new opportunities for information and communication technology,” said Diane Bryant, senior vice president and general manager of the Data Center Group at Intel. “By bringing Intel Xeon processor performance to a low-power SoC, we’re delivering the best of both worlds and enabling our customers to deliver exciting new services.”

News Facts

  • The Intel Xeon processor D product family is the first Intel Xeon SoC, and Intel’s third generation of 64-bit SoC for microserver, storage, network and the Internet of Things (IoT).
  • Products deliver up to 3.4x faster performance per node1 and up to 1.7x better performance per watt2 when compared to the Intel® Atom™ processor C2750, part of Intel’s second-generation 64-bit SoC product family.
  • Launching 4- and 8-core microserver optimized SoCs today, with a more comprehensive portfolio of network, storage and IoT SoCs targeted for availability in the second half of this year.
  • Initial products are optimized for hosters and cloud service providers for a variety of workloads such as dedicated web hosting, memory caching, dynamic web serving and warm storage. Future storage and network optimized products will target usages such as entry SAN and NAS appliances, edge routers and wireless base stations, as well as industrial IoT devices.
  • There are more than 50 systems currently in design. Approximately 75 percent are network, storage and IoT designs. System providers currently designing microservers based on the Intel Xeon processor D family include: Cisco*, HP*, NEC*, Quanta Cloud Technology*, Sugon* and Supermicro*.
  • Combines industry standard x86 cores, the industry’s most widely deployed data center processor microarchitecture, with two ports of integrated 10GbE Intel® Ethernet and integrated I/Os (PCIe, USB, SATA and other general purpose I/Os) on a single package. It operates at a thermal design point near 20 watts and supports up to 128GB of addressable memory.
  • Delivers advanced server-class reliability, availability and serviceability (RAS) features, including support for error-correcting code memory, combined with enhanced hardware-based Intel® Virtualization Technology and Intel® Advanced Encryption Standard-New Instructions (AES-NI).

“As the largest web hosting provider in Europe, technology innovation is critical to the company’s success,” said Robert Hoffmann, CEO 1&1 Internet AG. “As part of our broad technology collaboration with Intel, we are evaluating the new Intel Xeon processor D-based server platforms to help deliver a unique combination of performance and efficiency obtained from this first Intel Xeon SoC solution.”

Supporting Resources

Pricing3& Availability

  • Intel Xeon Processor D-1520 (4-core) $199.00
  • Intel Xeon Processor D-1540 (8-core) $581.00

The products are available today. The extended Intel Xeon processor D product family including microserver, network, storage and IoT optimized SoCs is expected to be available in the second half of this year.

Intel Presents – Extending Intelligence to the Edge

 

Intel_Xeon_processor_D-die_inHand.jpg

Intel® Xeon® processor D die

5082_Xeon_D_Processor_Package_Holding_0298_Cropped_preview.jpg

Intel® Xeon® processor family

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, the Intel logo, Intel Atom and Xeon are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Results have been measured by Intel based on software, benchmark or other data of third parties and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. Intel does not control or audit the design or implementation of third party data referenced in this document. Intel encourages all of its customers to visit the websites of the referenced third parties or other sources to confirm whether the referenced data is accurate and reflects performance of systems available for purchase.

1 Up to 3.4x better performance on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43844 Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10(3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896.

2 Up to 1.7x (estimated) better performance per watt on Dynamic Web Serving Intel® Xeon Processor D-based reference platform with one Pre-Production Xeon Processor D (8C, 1.9GHz, 45W, V1-stepping, ES2), Turbo Boost Enabled, Hyper-Threading enabled, 64GB memory (4x16GB DDR4-2133 RDIMM ECC), 2x10GBase-T X552, 3x S3700 SATA SSD, Fedora* 20 (3.17.8-200.fc20.x86_64, Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=43843, Estimated wall power based on microserver chassis, power=90W, Perf/W=487.15 users/W Supermicro SuperServer* 5018A-TN4 with one Intel Atom Processor C2750 (8C, 2.4GHz,20W), Turbo Boost Enabled, 32GB memory (4x8GB DDR3-1600 SO-DIMM ECC), 1x10GBase-T X520, 2x S3700 SATA SSD, Ubuntu* 14.10 (3.16.0-23 generic), Nginx* 1.4.4, Php-fpm* 15.4.14, memcached* 1.4.14, Simultaneous users=12896. Maximum wall power =46W, Perf/W=280.3 users/W

3 Estimated MSRP. Actual prices may vary.

Intel Packs Power, Intelligence of Xeon® Processor into System-on-Chip Offering to Target New, Growing Network Opportunities

First 14nm Intel® Xeon® Product Family Delivers Server-Class Capabilities in a Dense, Low- Power System-on-Chip Optimized for Cloud, Telco Service Providers and Web Hosters Intel® Xeon® processor D product family SANTA CLARA, Calif., March 9, 2015 – Intel Corporation today announced the Intel® Xeon® processor D product family, the company’s first Intel Xeon processor-based system-on-chip … Continued

The post Intel Packs Power, Intelligence of Xeon® Processor into System-on-Chip Offering to Target New, Growing Network Opportunities appeared first on Intel Newsroom.

Intel Launches New Mobile SoCs, LTE Solution

Announces Collaborations with Ericsson*, Samsung*, Others as Part of Broad Effort Spanning Silicon, Devices, Security and Networking Solutions

NEWS HIGHLIGHTS

  • Introduces the Intel® Atom™ x3 processor series, formerly code-named “SoFIA,” for low-cost smartphones, phablets and tablets with 20 customers committed to deliver designs.
  • Introduces the Intel® Atom™ x5 and x7 processor series, formerly code-named “Cherry Trail,” for mainstream and premium tablets and small-screen 2 in 1s.
  • Introduces the five-mode Intel® XMM™ 7360 LTE Advanced solution, with support for up to Category 10 and download speeds up to 450 Mbps.
  • Brightstar Corp*, Deutsche Telekom*, LG Electronics*, Prestigio* and Samsung* select Intel Security technologies to help protect personal devices.
  • Announces efforts with Alcatel-Lucent*, Ericsson* and Huawei* to address demand for new services, improve network efficiencies and accelerate the move toward a software-defined infrastructure using Intel® architecture.

aicha-evans_Intel_XMM_7360_LTE_Advanced_Solution.jpg

Aicha Evans, Intel’s vice president and general manager of the Intel Communication and Devices Group, holds up the five-mode Intel® XMM 7360 LTE Advanced solution, which supports up to Category 10 and downlink speeds of up to 450 Mbps.

Intel_Atom_x3_processor.jpg

The Intel® Atom™ x3 processor, formerly code-named “SoFIA”, is Intel’s first integrated SoC featuring 3G or 4G (LTE) modems and Intel architecture application processors for entry and value tablets, phablets and smartphones.

MOBILE WORLD CONGRESS, Barcelona, Spain, March 2, 2015 – Intel Corporation CEO Brian Krzanich today announced a series of mobile platforms including the company’s new low-cost system-on-chip (SoC) for phones, phablets and tablets, a global LTE solution, innovative personal computing experiences, and a range of customers for mobile device and network infrastructure offerings. With technologies that span silicon, software and security, Krzanich said Intel was one of the few companies able to deliver solutions end-to-end, for devices, the network and the cloud.

The announcements include the Intel® Atom™ x3 processor series, Intel’s first integrated communications SoC solution for the growing value and entry device markets, and the five-mode Intel® XMM™ 7360 LTE Advanced solution, designed for performance and worldwide coverage. In addition, Krzanich highlighted joint efforts with Alcatel-Lucent, Ericsson and Huawei to address the demand for new telecommunications, cloud and data center services, improve network efficiencies, and accelerate the industry’s move toward a software-defined infrastructure.

Krzanich also reiterated that Samsung Galaxy S6* and S6 Edge* users will have the latest anti-malware solution from McAfee VirusScan Mobile™ technology built into and activated on their devices.

“The evolution of the mobile landscape and growth of smart, connected devices has led to increased demand for more connectivity and real-time, protected data on those devices,” said Krzanich. “All of these factors are driving a transformation of the network to accelerate the delivery of new personal computing experiences, services and capabilities in a safe and secure manner. Intel is one of the only companies in the world that can provide solutions end-to-end for the full spectrum of mobility.”

Mobile Communications Products
Intel introduced the Intel Atom x3 processor series (formerly code-named “SoFIA”), Intel’s first integrated communications platform for entry and value tablets, phablets and smartphones. Combining 64-bit multi-core Intel Atom processors together with 3G or 4G LTE connectivity, the integrated communications SoC combines the applications processor, image sensor processor, graphics, audio, connectivity and power management components in a single system chipset. This integration allows device manufacturers to deliver full-featured tablets, phablets and smartphones at affordable price points for the rapidly growing entry and value market segments.

Intel is bringing the benefits of integrated Intel architecture and wireless communications to customers, including the China technology ecosystem, with greater velocity. Twenty companies, including ASUS* and Jolla*, have committed to delivering Intel Atom x3 designs.

Rounding out its mobile portfolio that scales from the entry to performance segments, Intel also introduced its first 14nm Intel® Atom™ SoC, the Intel Atom x5 and x7 processor series (formally code-named “Cherry Trail”) for next-generation tablets and small-screen 2 in 1s. Offering 64-bit support for Windows* and Android*, Intel Gen 8 graphics, and an option to pair with next-generation LTE Advanced connectivity, the Intel Atom x5 and x7 processor series will power a range of mainstream to premium devices. The processors are also “conflict-free1,” meaning that these products do not contain minerals (tin, tantalum, tungsten and/or gold) that are inadvertently funding human rights violations in the Democratic Republic of the Congo.

Customers, including Acer*, ASUS, Dell*, HP*, Lenovo* and Toshiba*, have already committed to deliver devices on this platform. The first devices are expected to be in the market in the first half of this year.

Intel also announced its third-generation five-mode, LTE Advanced Category 10 modem. The Intel XMM 7360 supports 3x carrier aggregation and download speeds up to 450 Mbps. Its compact size and power efficiency enable the Intel XMM 7360 to accommodate a wide range of form factors, from smartphones and phablets to tablets and PCs. It also expands Intel’s portfolio of LTE solutions, giving device manufacturers a competitive option to quickly design and launch LTE devices in various market segments and geographies. At Mobile World Congress, the company also demonstrated a pre-5G concept system that combines LTE with 802.11ad to deliver speeds of more than 1 Gbps using Intel technology end-to-end.

Delivering New Experiences in Smarter, Safer Devices
With hardware and software products like Intel® RealSense™ depth sensing technology, wireless charging and True Key™ technology by Intel Security, among others, Intel continues to deliver new experiences that provide more natural, intuitive and immersive ways for people to interact with technology.  Building on the success of the world’s thinnest tablet, the Dell Venue* 8, Krzanich showed a sneak peak of the Dell Venue* 10 tablet, featuring a detachable keyboard and Intel RealSense snapshot technology. Targeting consumer and business users, the tablet is expected to be available soon.

In addition to working with Samsung to help protect Galaxy S6 and S6 Edge devices, Krzanich said Intel Security is also collaborating with LG Electronics to help secure personal data. LG Electronics will make McAfee Mobile Security  from Intel Security available on the LG Watch Urbane LTE*, delivering anti-theft capabilities that allow the owner to lock, locate and wipe the device, if needed. LG Android device users are already protected today with McAfee Mobile Security on their devices.

Krzanich announced new customers including Brightstar Corp, Deutsche Telekom and Prestigio for the company’s True Key technology, a cross-platform application to address the pain point of passwords by using personal factors like facial identification and fingerprints to make logging in easier and safer. Deutsche Telekom will preinstall the True Key product for its customers in Europe. Prestigio will be one of the first mobile device manufacturers to launch the True Key application in Russia and across Europe, making the application available across all of its Android tablets and smartphones by the end of this year.

Network Transformation – New Services, Greater Connectivity and Faster Data
Krzanich outlined how Intel is working with industry leaders to transform network infrastructure with standardized hardware and software, and helping to accelerate the industry’s move toward a flexible, agile software-defined infrastructure. This enables both telco and cloud service providers to improve network efficiencies and accelerate the delivery of new services and capabilities for consumers and businesses.

Alcatel-Lucent introduced its virtual radio access network (vRAN) solution, comprised of a virtualized baseband unit that uses general purpose servers with Intel® Xeon® processors to enable cost savings and increased network performance. The vRAN will be in customer trials this year and commercially available in 2016.

Ericsson announced a new generation of data center platforms for the Ericsson Cloud System that enable telecom and cloud service providers to lower their total cost of ownership (TCO) and realize more flexibility and efficiency in their data centers. The company is using Intel® Rack Scale Architecture, together with management and orchestration software, to optimize and scale cloud resources across private, public, enterprise and telco cloud domains, enabling improved services agility. Ericsson also announced it is working with Intel Security on mobile security for 4G networks.

Huawei and Intel are collaborating to deliver robust cloud solutions that will enable telecommunications service providers to transform their data centers. The companies will develop the next generation of Huawei’s FusionSphere* based on Intel architecture, and will use the Data Plane Development Kit and Open vSwitch to increase network virtualization performance of FusionSphere. These solutions aim to enhance performance that is optimized to minimize TCO for cloud workloads in a scalable and secure manner.

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, Intel Atom, Intel XMM, McAfee VirusScan Mobile, True Key, Intel RealSense, Intel Rackscale Architecture, Intel Xeon and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

1 “Conflict free” and “conflict-free” means “DRC conflict free,” which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term “conflict-free” in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before Jan. 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers.

Intel Launches New Mobile SoCs, LTE Solution

Announces Collaborations with Ericsson*, Samsung*, Others as Part of Broad Effort Spanning Silicon, Devices, Security and Networking Solutions

NEWS HIGHLIGHTS

  • Introduces the Intel® Atom™ x3 processor series, formerly code-named “SoFIA,” for low-cost smartphones, phablets and tablets with 20 customers committed to deliver designs.
  • Introduces the Intel® Atom™ x5 and x7 processor series, formerly code-named “Cherry Trail,” for mainstream and premium tablets and small-screen 2 in 1s.
  • Introduces the five-mode Intel® XMM™ 7360 LTE Advanced solution, with support for up to Category 10 and download speeds up to 450 Mbps.
  • Brightstar Corp*, Deutsche Telekom*, LG Electronics*, Prestigio* and Samsung* select Intel Security technologies to help protect personal devices.
  • Announces efforts with Alcatel-Lucent*, Ericsson* and Huawei* to address demand for new services, improve network efficiencies and accelerate the move toward a software-defined infrastructure using Intel® architecture.

aicha-evans_Intel_XMM_7360_LTE_Advanced_Solution.jpg

Aicha Evans, Intel’s vice president and general manager of the Intel Communication and Devices Group, holds up the five-mode Intel® XMM 7360 LTE Advanced solution, which supports up to Category 10 and downlink speeds of up to 450 Mbps.

Intel_Atom_x3_processor.jpg

The Intel® Atom™ x3 processor, formerly code-named “SoFIA”, is Intel’s first integrated SoC featuring 3G or 4G (LTE) modems and Intel architecture application processors for entry and value tablets, phablets and smartphones.

MOBILE WORLD CONGRESS, Barcelona, Spain, March 2, 2015 – Intel Corporation CEO Brian Krzanich today announced a series of mobile platforms including the company’s new low-cost system-on-chip (SoC) for phones, phablets and tablets, a global LTE solution, innovative personal computing experiences, and a range of customers for mobile device and network infrastructure offerings. With technologies that span silicon, software and security, Krzanich said Intel was one of the few companies able to deliver solutions end-to-end, for devices, the network and the cloud.

The announcements include the Intel® Atom™ x3 processor series, Intel’s first integrated communications SoC solution for the growing value and entry device markets, and the five-mode Intel® XMM™ 7360 LTE Advanced solution, designed for performance and worldwide coverage. In addition, Krzanich highlighted joint efforts with Alcatel-Lucent, Ericsson and Huawei to address the demand for new telecommunications, cloud and data center services, improve network efficiencies, and accelerate the industry’s move toward a software-defined infrastructure.

Krzanich also reiterated that Samsung Galaxy S6* and S6 Edge* users will have the latest anti-malware solution from McAfee VirusScan Mobile™ technology built into and activated on their devices.

“The evolution of the mobile landscape and growth of smart, connected devices has led to increased demand for more connectivity and real-time, protected data on those devices,” said Krzanich. “All of these factors are driving a transformation of the network to accelerate the delivery of new personal computing experiences, services and capabilities in a safe and secure manner. Intel is one of the only companies in the world that can provide solutions end-to-end for the full spectrum of mobility.”

Mobile Communications Products
Intel introduced the Intel Atom x3 processor series (formerly code-named “SoFIA”), Intel’s first integrated communications platform for entry and value tablets, phablets and smartphones. Combining 64-bit multi-core Intel Atom processors together with 3G or 4G LTE connectivity, the integrated communications SoC combines the applications processor, image sensor processor, graphics, audio, connectivity and power management components in a single system chipset. This integration allows device manufacturers to deliver full-featured tablets, phablets and smartphones at affordable price points for the rapidly growing entry and value market segments.

Intel is bringing the benefits of integrated Intel architecture and wireless communications to customers, including the China technology ecosystem, with greater velocity. Twenty companies, including ASUS* and Jolla*, have committed to delivering Intel Atom x3 designs.

Rounding out its mobile portfolio that scales from the entry to performance segments, Intel also introduced its first 14nm Intel® Atom™ SoC, the Intel Atom x5 and x7 processor series (formally code-named “Cherry Trail”) for next-generation tablets and small-screen 2 in 1s. Offering 64-bit support for Windows* and Android*, Intel Gen 8 graphics, and an option to pair with next-generation LTE Advanced connectivity, the Intel Atom x5 and x7 processor series will power a range of mainstream to premium devices. The processors are also “conflict-free1,” meaning that these products do not contain minerals (tin, tantalum, tungsten and/or gold) that are inadvertently funding human rights violations in the Democratic Republic of the Congo.

Customers, including Acer*, ASUS, Dell*, HP*, Lenovo* and Toshiba*, have already committed to deliver devices on this platform. The first devices are expected to be in the market in the first half of this year.

Intel also announced its third-generation five-mode, LTE Advanced Category 10 modem. The Intel XMM 7360 supports 3x carrier aggregation and download speeds up to 450 Mbps. Its compact size and power efficiency enable the Intel XMM 7360 to accommodate a wide range of form factors, from smartphones and phablets to tablets and PCs. It also expands Intel’s portfolio of LTE solutions, giving device manufacturers a competitive option to quickly design and launch LTE devices in various market segments and geographies. At Mobile World Congress, the company also demonstrated a pre-5G concept system that combines LTE with 802.11ad to deliver speeds of more than 1 Gbps using Intel technology end-to-end.

Delivering New Experiences in Smarter, Safer Devices
With hardware and software products like Intel® RealSense™ depth sensing technology, wireless charging and True Key™ technology by Intel Security, among others, Intel continues to deliver new experiences that provide more natural, intuitive and immersive ways for people to interact with technology.  Building on the success of the world’s thinnest tablet, the Dell Venue* 8, Krzanich showed a sneak peak of the Dell Venue* 10 tablet, featuring a detachable keyboard and Intel RealSense snapshot technology. Targeting consumer and business users, the tablet is expected to be available soon.

In addition to working with Samsung to help protect Galaxy S6 and S6 Edge devices, Krzanich said Intel Security is also collaborating with LG Electronics to help secure personal data. LG Electronics will make McAfee Mobile Security  from Intel Security available on the LG Watch Urbane LTE*, delivering anti-theft capabilities that allow the owner to lock, locate and wipe the device, if needed. LG Android device users are already protected today with McAfee Mobile Security on their devices.

Krzanich announced new customers including Brightstar Corp, Deutsche Telekom and Prestigio for the company’s True Key technology, a cross-platform application to address the pain point of passwords by using personal factors like facial identification and fingerprints to make logging in easier and safer. Deutsche Telekom will preinstall the True Key product for its customers in Europe. Prestigio will be one of the first mobile device manufacturers to launch the True Key application in Russia and across Europe, making the application available across all of its Android tablets and smartphones by the end of this year.

Network Transformation – New Services, Greater Connectivity and Faster Data
Krzanich outlined how Intel is working with industry leaders to transform network infrastructure with standardized hardware and software, and helping to accelerate the industry’s move toward a flexible, agile software-defined infrastructure. This enables both telco and cloud service providers to improve network efficiencies and accelerate the delivery of new services and capabilities for consumers and businesses.

Alcatel-Lucent introduced its virtual radio access network (vRAN) solution, comprised of a virtualized baseband unit that uses general purpose servers with Intel® Xeon® processors to enable cost savings and increased network performance. The vRAN will be in customer trials this year and commercially available in 2016.

Ericsson announced a new generation of data center platforms for the Ericsson Cloud System that enable telecom and cloud service providers to lower their total cost of ownership (TCO) and realize more flexibility and efficiency in their data centers. The company is using Intel® Rack Scale Architecture, together with management and orchestration software, to optimize and scale cloud resources across private, public, enterprise and telco cloud domains, enabling improved services agility. Ericsson also announced it is working with Intel Security on mobile security for 4G networks.

Huawei and Intel are collaborating to deliver robust cloud solutions that will enable telecommunications service providers to transform their data centers. The companies will develop the next generation of Huawei’s FusionSphere* based on Intel architecture, and will use the Data Plane Development Kit and Open vSwitch to increase network virtualization performance of FusionSphere. These solutions aim to enhance performance that is optimized to minimize TCO for cloud workloads in a scalable and secure manner.

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, Intel Atom, Intel XMM, McAfee VirusScan Mobile, True Key, Intel RealSense, Intel Rackscale Architecture, Intel Xeon and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

1 “Conflict free” and “conflict-free” means “DRC conflict free,” which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term “conflict-free” in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before Jan. 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers.

Intel Launches New Mobile SoCs, LTE Solution

Announces Collaborations with Ericsson*, Samsung*, Others as Part of Broad Effort Spanning Silicon, Devices, Security and Networking Solutions

NEWS HIGHLIGHTS

  • Introduces the Intel® Atom™ x3 processor series, formerly code-named “SoFIA,” for low-cost smartphones, phablets and tablets with 20 customers committed to deliver designs.
  • Introduces the Intel® Atom™ x5 and x7 processor series, formerly code-named “Cherry Trail,” for mainstream and premium tablets and small-screen 2 in 1s.
  • Introduces the five-mode Intel® XMM™ 7360 LTE Advanced solution, with support for up to Category 10 and download speeds up to 450 Mbps.
  • Brightstar Corp*, Deutsche Telekom*, LG Electronics*, Prestigio* and Samsung* select Intel Security technologies to help protect personal devices.
  • Announces efforts with Alcatel-Lucent*, Ericsson* and Huawei* to address demand for new services, improve network efficiencies and accelerate the move toward a software-defined infrastructure using Intel® architecture.

aicha-evans_Intel_XMM_7360_LTE_Advanced_Solution.jpg

Aicha Evans, Intel’s vice president and general manager of the Intel Communication and Devices Group, holds up the five-mode Intel® XMM 7360 LTE Advanced solution, which supports up to Category 10 and downlink speeds of up to 450 Mbps.

Intel_Atom_x3_processor.jpg

The Intel® Atom™ x3 processor, formerly code-named “SoFIA”, is Intel’s first integrated SoC featuring 3G or 4G (LTE) modems and Intel architecture application processors for entry and value tablets, phablets and smartphones.

MOBILE WORLD CONGRESS, Barcelona, Spain, March 2, 2015 – Intel Corporation CEO Brian Krzanich today announced a series of mobile platforms including the company’s new low-cost system-on-chip (SoC) for phones, phablets and tablets, a global LTE solution, innovative personal computing experiences, and a range of customers for mobile device and network infrastructure offerings. With technologies that span silicon, software and security, Krzanich said Intel was one of the few companies able to deliver solutions end-to-end, for devices, the network and the cloud.

The announcements include the Intel® Atom™ x3 processor series, Intel’s first integrated communications SoC solution for the growing value and entry device markets, and the five-mode Intel® XMM™ 7360 LTE Advanced solution, designed for performance and worldwide coverage. In addition, Krzanich highlighted joint efforts with Alcatel-Lucent, Ericsson and Huawei to address the demand for new telecommunications, cloud and data center services, improve network efficiencies, and accelerate the industry’s move toward a software-defined infrastructure.

Krzanich also reiterated that Samsung Galaxy S6* and S6 Edge* users will have the latest anti-malware solution from McAfee VirusScan Mobile™ technology built into and activated on their devices.

“The evolution of the mobile landscape and growth of smart, connected devices has led to increased demand for more connectivity and real-time, protected data on those devices,” said Krzanich. “All of these factors are driving a transformation of the network to accelerate the delivery of new personal computing experiences, services and capabilities in a safe and secure manner. Intel is one of the only companies in the world that can provide solutions end-to-end for the full spectrum of mobility.”

Mobile Communications Products
Intel introduced the Intel Atom x3 processor series (formerly code-named “SoFIA”), Intel’s first integrated communications platform for entry and value tablets, phablets and smartphones. Combining 64-bit multi-core Intel Atom processors together with 3G or 4G LTE connectivity, the integrated communications SoC combines the applications processor, image sensor processor, graphics, audio, connectivity and power management components in a single system chipset. This integration allows device manufacturers to deliver full-featured tablets, phablets and smartphones at affordable price points for the rapidly growing entry and value market segments.

Intel is bringing the benefits of integrated Intel architecture and wireless communications to customers, including the China technology ecosystem, with greater velocity. Twenty companies, including ASUS* and Jolla*, have committed to delivering Intel Atom x3 designs.

Rounding out its mobile portfolio that scales from the entry to performance segments, Intel also introduced its first 14nm Intel® Atom™ SoC, the Intel Atom x5 and x7 processor series (formally code-named “Cherry Trail”) for next-generation tablets and small-screen 2 in 1s. Offering 64-bit support for Windows* and Android*, Intel Gen 8 graphics, and an option to pair with next-generation LTE Advanced connectivity, the Intel Atom x5 and x7 processor series will power a range of mainstream to premium devices. The processors are also “conflict-free1,” meaning that these products do not contain minerals (tin, tantalum, tungsten and/or gold) that are inadvertently funding human rights violations in the Democratic Republic of the Congo.

Customers, including Acer*, ASUS, Dell*, HP*, Lenovo* and Toshiba*, have already committed to deliver devices on this platform. The first devices are expected to be in the market in the first half of this year.

Intel also announced its third-generation five-mode, LTE Advanced Category 10 modem. The Intel XMM 7360 supports 3x carrier aggregation and download speeds up to 450 Mbps. Its compact size and power efficiency enable the Intel XMM 7360 to accommodate a wide range of form factors, from smartphones and phablets to tablets and PCs. It also expands Intel’s portfolio of LTE solutions, giving device manufacturers a competitive option to quickly design and launch LTE devices in various market segments and geographies. At Mobile World Congress, the company also demonstrated a pre-5G concept system that combines LTE with 802.11ad to deliver speeds of more than 1 Gbps using Intel technology end-to-end.

Delivering New Experiences in Smarter, Safer Devices
With hardware and software products like Intel® RealSense™ depth sensing technology, wireless charging and True Key™ technology by Intel Security, among others, Intel continues to deliver new experiences that provide more natural, intuitive and immersive ways for people to interact with technology.  Building on the success of the world’s thinnest tablet, the Dell Venue* 8, Krzanich showed a sneak peak of the Dell Venue* 10 tablet, featuring a detachable keyboard and Intel RealSense snapshot technology. Targeting consumer and business users, the tablet is expected to be available soon.

In addition to working with Samsung to help protect Galaxy S6 and S6 Edge devices, Krzanich said Intel Security is also collaborating with LG Electronics to help secure personal data. LG Electronics will make McAfee Mobile Security  from Intel Security available on the LG Watch Urbane LTE*, delivering anti-theft capabilities that allow the owner to lock, locate and wipe the device, if needed. LG Android device users are already protected today with McAfee Mobile Security on their devices.

Krzanich announced new customers including Brightstar Corp, Deutsche Telekom and Prestigio for the company’s True Key technology, a cross-platform application to address the pain point of passwords by using personal factors like facial identification and fingerprints to make logging in easier and safer. Deutsche Telekom will preinstall the True Key product for its customers in Europe. Prestigio will be one of the first mobile device manufacturers to launch the True Key application in Russia and across Europe, making the application available across all of its Android tablets and smartphones by the end of this year.

Network Transformation – New Services, Greater Connectivity and Faster Data
Krzanich outlined how Intel is working with industry leaders to transform network infrastructure with standardized hardware and software, and helping to accelerate the industry’s move toward a flexible, agile software-defined infrastructure. This enables both telco and cloud service providers to improve network efficiencies and accelerate the delivery of new services and capabilities for consumers and businesses.

Alcatel-Lucent introduced its virtual radio access network (vRAN) solution, comprised of a virtualized baseband unit that uses general purpose servers with Intel® Xeon® processors to enable cost savings and increased network performance. The vRAN will be in customer trials this year and commercially available in 2016.

Ericsson announced a new generation of data center platforms for the Ericsson Cloud System that enable telecom and cloud service providers to lower their total cost of ownership (TCO) and realize more flexibility and efficiency in their data centers. The company is using Intel® Rack Scale Architecture, together with management and orchestration software, to optimize and scale cloud resources across private, public, enterprise and telco cloud domains, enabling improved services agility. Ericsson also announced it is working with Intel Security on mobile security for 4G networks.

Huawei and Intel are collaborating to deliver robust cloud solutions that will enable telecommunications service providers to transform their data centers. The companies will develop the next generation of Huawei’s FusionSphere* based on Intel architecture, and will use the Data Plane Development Kit and Open vSwitch to increase network virtualization performance of FusionSphere. These solutions aim to enhance performance that is optimized to minimize TCO for cloud workloads in a scalable and secure manner.

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, Intel Atom, Intel XMM, McAfee VirusScan Mobile, True Key, Intel RealSense, Intel Rackscale Architecture, Intel Xeon and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

1 “Conflict free” and “conflict-free” means “DRC conflict free,” which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term “conflict-free” in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before Jan. 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers.

Intel Launches New Mobile SoCs, LTE Solution

Announces Collaborations with Ericsson*, Samsung*, Others as Part of Broad Effort Spanning Silicon, Devices, Security and Networking Solutions

NEWS HIGHLIGHTS

  • Introduces the Intel® Atom™ x3 processor series, formerly code-named “SoFIA,” for low-cost smartphones, phablets and tablets with 20 customers committed to deliver designs.
  • Introduces the Intel® Atom™ x5 and x7 processor series, formerly code-named “Cherry Trail,” for mainstream and premium tablets and small-screen 2 in 1s.
  • Introduces the five-mode Intel® XMM™ 7360 LTE Advanced solution, with support for up to Category 10 and download speeds up to 450 Mbps.
  • Brightstar Corp*, Deutsche Telekom*, LG Electronics*, Prestigio* and Samsung* select Intel Security technologies to help protect personal devices.
  • Announces efforts with Alcatel-Lucent*, Ericsson* and Huawei* to address demand for new services, improve network efficiencies and accelerate the move toward a software-defined infrastructure using Intel® architecture.

aicha-evans_Intel_XMM_7360_LTE_Advanced_Solution.jpg

Aicha Evans, Intel’s vice president and general manager of the Intel Communication and Devices Group, holds up the five-mode Intel® XMM 7360 LTE Advanced solution, which supports up to Category 10 and downlink speeds of up to 450 Mbps.

Intel_Atom_x3_processor.jpg

The Intel® Atom™ x3 processor, formerly code-named “SoFIA”, is Intel’s first integrated SoC featuring 3G or 4G (LTE) modems and Intel architecture application processors for entry and value tablets, phablets and smartphones.

MOBILE WORLD CONGRESS, Barcelona, Spain, March 2, 2015 – Intel Corporation CEO Brian Krzanich today announced a series of mobile platforms including the company’s new low-cost system-on-chip (SoC) for phones, phablets and tablets, a global LTE solution, innovative personal computing experiences, and a range of customers for mobile device and network infrastructure offerings. With technologies that span silicon, software and security, Krzanich said Intel was one of the few companies able to deliver solutions end-to-end, for devices, the network and the cloud.

The announcements include the Intel® Atom™ x3 processor series, Intel’s first integrated communications SoC solution for the growing value and entry device markets, and the five-mode Intel® XMM™ 7360 LTE Advanced solution, designed for performance and worldwide coverage. In addition, Krzanich highlighted joint efforts with Alcatel-Lucent, Ericsson and Huawei to address the demand for new telecommunications, cloud and data center services, improve network efficiencies, and accelerate the industry’s move toward a software-defined infrastructure.

Krzanich also reiterated that Samsung Galaxy S6* and S6 Edge* users will have the latest anti-malware solution from McAfee VirusScan Mobile™ technology built into and activated on their devices.

“The evolution of the mobile landscape and growth of smart, connected devices has led to increased demand for more connectivity and real-time, protected data on those devices,” said Krzanich. “All of these factors are driving a transformation of the network to accelerate the delivery of new personal computing experiences, services and capabilities in a safe and secure manner. Intel is one of the only companies in the world that can provide solutions end-to-end for the full spectrum of mobility.”

Mobile Communications Products
Intel introduced the Intel Atom x3 processor series (formerly code-named “SoFIA”), Intel’s first integrated communications platform for entry and value tablets, phablets and smartphones. Combining 64-bit multi-core Intel Atom processors together with 3G or 4G LTE connectivity, the integrated communications SoC combines the applications processor, image sensor processor, graphics, audio, connectivity and power management components in a single system chipset. This integration allows device manufacturers to deliver full-featured tablets, phablets and smartphones at affordable price points for the rapidly growing entry and value market segments.

Intel is bringing the benefits of integrated Intel architecture and wireless communications to customers, including the China technology ecosystem, with greater velocity. Twenty companies, including ASUS* and Jolla*, have committed to delivering Intel Atom x3 designs.

Rounding out its mobile portfolio that scales from the entry to performance segments, Intel also introduced its first 14nm Intel® Atom™ SoC, the Intel Atom x5 and x7 processor series (formally code-named “Cherry Trail”) for next-generation tablets and small-screen 2 in 1s. Offering 64-bit support for Windows* and Android*, Intel Gen 8 graphics, and an option to pair with next-generation LTE Advanced connectivity, the Intel Atom x5 and x7 processor series will power a range of mainstream to premium devices. The processors are also “conflict-free1,” meaning that these products do not contain minerals (tin, tantalum, tungsten and/or gold) that are inadvertently funding human rights violations in the Democratic Republic of the Congo.

Customers, including Acer*, ASUS, Dell*, HP*, Lenovo* and Toshiba*, have already committed to deliver devices on this platform. The first devices are expected to be in the market in the first half of this year.

Intel also announced its third-generation five-mode, LTE Advanced Category 10 modem. The Intel XMM 7360 supports 3x carrier aggregation and download speeds up to 450 Mbps. Its compact size and power efficiency enable the Intel XMM 7360 to accommodate a wide range of form factors, from smartphones and phablets to tablets and PCs. It also expands Intel’s portfolio of LTE solutions, giving device manufacturers a competitive option to quickly design and launch LTE devices in various market segments and geographies. At Mobile World Congress, the company also demonstrated a pre-5G concept system that combines LTE with 802.11ad to deliver speeds of more than 1 Gbps using Intel technology end-to-end.

Delivering New Experiences in Smarter, Safer Devices
With hardware and software products like Intel® RealSense™ depth sensing technology, wireless charging and True Key™ technology by Intel Security, among others, Intel continues to deliver new experiences that provide more natural, intuitive and immersive ways for people to interact with technology.  Building on the success of the world’s thinnest tablet, the Dell Venue* 8, Krzanich showed a sneak peak of the Dell Venue* 10 tablet, featuring a detachable keyboard and Intel RealSense snapshot technology. Targeting consumer and business users, the tablet is expected to be available soon.

In addition to working with Samsung to help protect Galaxy S6 and S6 Edge devices, Krzanich said Intel Security is also collaborating with LG Electronics to help secure personal data. LG Electronics will make McAfee Mobile Security  from Intel Security available on the LG Watch Urbane LTE*, delivering anti-theft capabilities that allow the owner to lock, locate and wipe the device, if needed. LG Android device users are already protected today with McAfee Mobile Security on their devices.

Krzanich announced new customers including Brightstar Corp, Deutsche Telekom and Prestigio for the company’s True Key technology, a cross-platform application to address the pain point of passwords by using personal factors like facial identification and fingerprints to make logging in easier and safer. Deutsche Telekom will preinstall the True Key product for its customers in Europe. Prestigio will be one of the first mobile device manufacturers to launch the True Key application in Russia and across Europe, making the application available across all of its Android tablets and smartphones by the end of this year.

Network Transformation – New Services, Greater Connectivity and Faster Data
Krzanich outlined how Intel is working with industry leaders to transform network infrastructure with standardized hardware and software, and helping to accelerate the industry’s move toward a flexible, agile software-defined infrastructure. This enables both telco and cloud service providers to improve network efficiencies and accelerate the delivery of new services and capabilities for consumers and businesses.

Alcatel-Lucent introduced its virtual radio access network (vRAN) solution, comprised of a virtualized baseband unit that uses general purpose servers with Intel® Xeon® processors to enable cost savings and increased network performance. The vRAN will be in customer trials this year and commercially available in 2016.

Ericsson announced a new generation of data center platforms for the Ericsson Cloud System that enable telecom and cloud service providers to lower their total cost of ownership (TCO) and realize more flexibility and efficiency in their data centers. The company is using Intel® Rack Scale Architecture, together with management and orchestration software, to optimize and scale cloud resources across private, public, enterprise and telco cloud domains, enabling improved services agility. Ericsson also announced it is working with Intel Security on mobile security for 4G networks.

Huawei and Intel are collaborating to deliver robust cloud solutions that will enable telecommunications service providers to transform their data centers. The companies will develop the next generation of Huawei’s FusionSphere* based on Intel architecture, and will use the Data Plane Development Kit and Open vSwitch to increase network virtualization performance of FusionSphere. These solutions aim to enhance performance that is optimized to minimize TCO for cloud workloads in a scalable and secure manner.

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, Intel Atom, Intel XMM, McAfee VirusScan Mobile, True Key, Intel RealSense, Intel Rackscale Architecture, Intel Xeon and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

1 “Conflict free” and “conflict-free” means “DRC conflict free,” which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term “conflict-free” in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before Jan. 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers.

Intel Launches New Mobile SoCs, LTE Solution

Announces Collaborations with Ericsson*, Samsung*, Others as Part of Broad Effort Spanning Silicon, Devices, Security and Networking Solutions

NEWS HIGHLIGHTS

  • Introduces the Intel® Atom™ x3 processor series, formerly code-named “SoFIA,” for low-cost smartphones, phablets and tablets with 20 customers committed to deliver designs.
  • Introduces the Intel® Atom™ x5 and x7 processor series, formerly code-named “Cherry Trail,” for mainstream and premium tablets and small-screen 2 in 1s.
  • Introduces the five-mode Intel® XMM™ 7360 LTE Advanced solution, with support for up to Category 10 and download speeds up to 450 Mbps.
  • Brightstar Corp*, Deutsche Telekom*, LG Electronics*, Prestigio* and Samsung* select Intel Security technologies to help protect personal devices.
  • Announces efforts with Alcatel-Lucent*, Ericsson* and Huawei* to address demand for new services, improve network efficiencies and accelerate the move toward a software-defined infrastructure using Intel® architecture.

aicha-evans_Intel_XMM_7360_LTE_Advanced_Solution.jpg

Aicha Evans, Intel’s vice president and general manager of the Intel Communication and Devices Group, holds up the five-mode Intel® XMM 7360 LTE Advanced solution, which supports up to Category 10 and downlink speeds of up to 450 Mbps.

Intel_Atom_x3_processor.jpg

The Intel® Atom™ x3 processor, formerly code-named “SoFIA”, is Intel’s first integrated SoC featuring 3G or 4G (LTE) modems and Intel architecture application processors for entry and value tablets, phablets and smartphones.

MOBILE WORLD CONGRESS, Barcelona, Spain, March 2, 2015 – Intel Corporation CEO Brian Krzanich today announced a series of mobile platforms including the company’s new low-cost system-on-chip (SoC) for phones, phablets and tablets, a global LTE solution, innovative personal computing experiences, and a range of customers for mobile device and network infrastructure offerings. With technologies that span silicon, software and security, Krzanich said Intel was one of the few companies able to deliver solutions end-to-end, for devices, the network and the cloud.

The announcements include the Intel® Atom™ x3 processor series, Intel’s first integrated communications SoC solution for the growing value and entry device markets, and the five-mode Intel® XMM™ 7360 LTE Advanced solution, designed for performance and worldwide coverage. In addition, Krzanich highlighted joint efforts with Alcatel-Lucent, Ericsson and Huawei to address the demand for new telecommunications, cloud and data center services, improve network efficiencies, and accelerate the industry’s move toward a software-defined infrastructure.

Krzanich also reiterated that Samsung Galaxy S6* and S6 Edge* users will have the latest anti-malware solution from McAfee VirusScan Mobile™ technology built into and activated on their devices.

“The evolution of the mobile landscape and growth of smart, connected devices has led to increased demand for more connectivity and real-time, protected data on those devices,” said Krzanich. “All of these factors are driving a transformation of the network to accelerate the delivery of new personal computing experiences, services and capabilities in a safe and secure manner. Intel is one of the only companies in the world that can provide solutions end-to-end for the full spectrum of mobility.”

Mobile Communications Products
Intel introduced the Intel Atom x3 processor series (formerly code-named “SoFIA”), Intel’s first integrated communications platform for entry and value tablets, phablets and smartphones. Combining 64-bit multi-core Intel Atom processors together with 3G or 4G LTE connectivity, the integrated communications SoC combines the applications processor, image sensor processor, graphics, audio, connectivity and power management components in a single system chipset. This integration allows device manufacturers to deliver full-featured tablets, phablets and smartphones at affordable price points for the rapidly growing entry and value market segments.

Intel is bringing the benefits of integrated Intel architecture and wireless communications to customers, including the China technology ecosystem, with greater velocity. Twenty companies, including ASUS* and Jolla*, have committed to delivering Intel Atom x3 designs.

Rounding out its mobile portfolio that scales from the entry to performance segments, Intel also introduced its first 14nm Intel® Atom™ SoC, the Intel Atom x5 and x7 processor series (formally code-named “Cherry Trail”) for next-generation tablets and small-screen 2 in 1s. Offering 64-bit support for Windows* and Android*, Intel Gen 8 graphics, and an option to pair with next-generation LTE Advanced connectivity, the Intel Atom x5 and x7 processor series will power a range of mainstream to premium devices. The processors are also “conflict-free1,” meaning that these products do not contain minerals (tin, tantalum, tungsten and/or gold) that are inadvertently funding human rights violations in the Democratic Republic of the Congo.

Customers, including Acer*, ASUS, Dell*, HP*, Lenovo* and Toshiba*, have already committed to deliver devices on this platform. The first devices are expected to be in the market in the first half of this year.

Intel also announced its third-generation five-mode, LTE Advanced Category 10 modem. The Intel XMM 7360 supports 3x carrier aggregation and download speeds up to 450 Mbps. Its compact size and power efficiency enable the Intel XMM 7360 to accommodate a wide range of form factors, from smartphones and phablets to tablets and PCs. It also expands Intel’s portfolio of LTE solutions, giving device manufacturers a competitive option to quickly design and launch LTE devices in various market segments and geographies. At Mobile World Congress, the company also demonstrated a pre-5G concept system that combines LTE with 802.11ad to deliver speeds of more than 1 Gbps using Intel technology end-to-end.

Delivering New Experiences in Smarter, Safer Devices
With hardware and software products like Intel® RealSense™ depth sensing technology, wireless charging and True Key™ technology by Intel Security, among others, Intel continues to deliver new experiences that provide more natural, intuitive and immersive ways for people to interact with technology.  Building on the success of the world’s thinnest tablet, the Dell Venue* 8, Krzanich showed a sneak peak of the Dell Venue* 10 tablet, featuring a detachable keyboard and Intel RealSense snapshot technology. Targeting consumer and business users, the tablet is expected to be available soon.

In addition to working with Samsung to help protect Galaxy S6 and S6 Edge devices, Krzanich said Intel Security is also collaborating with LG Electronics to help secure personal data. LG Electronics will make McAfee Mobile Security  from Intel Security available on the LG Watch Urbane LTE*, delivering anti-theft capabilities that allow the owner to lock, locate and wipe the device, if needed. LG Android device users are already protected today with McAfee Mobile Security on their devices.

Krzanich announced new customers including Brightstar Corp, Deutsche Telekom and Prestigio for the company’s True Key technology, a cross-platform application to address the pain point of passwords by using personal factors like facial identification and fingerprints to make logging in easier and safer. Deutsche Telekom will preinstall the True Key product for its customers in Europe. Prestigio will be one of the first mobile device manufacturers to launch the True Key application in Russia and across Europe, making the application available across all of its Android tablets and smartphones by the end of this year.

Network Transformation – New Services, Greater Connectivity and Faster Data
Krzanich outlined how Intel is working with industry leaders to transform network infrastructure with standardized hardware and software, and helping to accelerate the industry’s move toward a flexible, agile software-defined infrastructure. This enables both telco and cloud service providers to improve network efficiencies and accelerate the delivery of new services and capabilities for consumers and businesses.

Alcatel-Lucent introduced its virtual radio access network (vRAN) solution, comprised of a virtualized baseband unit that uses general purpose servers with Intel® Xeon® processors to enable cost savings and increased network performance. The vRAN will be in customer trials this year and commercially available in 2016.

Ericsson announced a new generation of data center platforms for the Ericsson Cloud System that enable telecom and cloud service providers to lower their total cost of ownership (TCO) and realize more flexibility and efficiency in their data centers. The company is using Intel® Rack Scale Architecture, together with management and orchestration software, to optimize and scale cloud resources across private, public, enterprise and telco cloud domains, enabling improved services agility. Ericsson also announced it is working with Intel Security on mobile security for 4G networks.

Huawei and Intel are collaborating to deliver robust cloud solutions that will enable telecommunications service providers to transform their data centers. The companies will develop the next generation of Huawei’s FusionSphere* based on Intel architecture, and will use the Data Plane Development Kit and Open vSwitch to increase network virtualization performance of FusionSphere. These solutions aim to enhance performance that is optimized to minimize TCO for cloud workloads in a scalable and secure manner.

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About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, Intel Atom, Intel XMM, McAfee VirusScan Mobile, True Key, Intel RealSense, Intel Rackscale Architecture, Intel Xeon and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

1 “Conflict free” and “conflict-free” means “DRC conflict free,” which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term “conflict-free” in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before Jan. 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers.

Intel Launches New Mobile SoCs, LTE Solution

Announces Collaborations with Ericsson*, Samsung*, Others as Part of Broad Effort Spanning Silicon, Devices, Security and Networking Solutions

NEWS HIGHLIGHTS

  • Introduces the Intel® Atom™ x3 processor series, formerly code-named “SoFIA,” for low-cost smartphones, phablets and tablets with 20 customers committed to deliver designs.
  • Introduces the Intel® Atom™ x5 and x7 processor series, formerly code-named “Cherry Trail,” for mainstream and premium tablets and small-screen 2 in 1s.
  • Introduces the five-mode Intel® XMM™ 7360 LTE Advanced solution, with support for up to Category 10 and download speeds up to 450 Mbps.
  • Brightstar Corp*, Deutsche Telekom*, LG Electronics*, Prestigio* and Samsung* select Intel Security technologies to help protect personal devices.
  • Announces efforts with Alcatel-Lucent*, Ericsson* and Huawei* to address demand for new services, improve network efficiencies and accelerate the move toward a software-defined infrastructure using Intel® architecture.

aicha-evans_Intel_XMM_7360_LTE_Advanced_Solution.jpg

Aicha Evans, Intel’s vice president and general manager of the Intel Communication and Devices Group, holds up the five-mode Intel® XMM 7360 LTE Advanced solution, which supports up to Category 10 and downlink speeds of up to 450 Mbps.

Intel_Atom_x3_processor.jpg

The Intel® Atom™ x3 processor, formerly code-named “SoFIA”, is Intel’s first integrated SoC featuring 3G or 4G (LTE) modems and Intel architecture application processors for entry and value tablets, phablets and smartphones.

MOBILE WORLD CONGRESS, Barcelona, Spain, March 2, 2015 – Intel Corporation CEO Brian Krzanich today announced a series of mobile platforms including the company’s new low-cost system-on-chip (SoC) for phones, phablets and tablets, a global LTE solution, innovative personal computing experiences, and a range of customers for mobile device and network infrastructure offerings. With technologies that span silicon, software and security, Krzanich said Intel was one of the few companies able to deliver solutions end-to-end, for devices, the network and the cloud.

The announcements include the Intel® Atom™ x3 processor series, Intel’s first integrated communications SoC solution for the growing value and entry device markets, and the five-mode Intel® XMM™ 7360 LTE Advanced solution, designed for performance and worldwide coverage. In addition, Krzanich highlighted joint efforts with Alcatel-Lucent, Ericsson and Huawei to address the demand for new telecommunications, cloud and data center services, improve network efficiencies, and accelerate the industry’s move toward a software-defined infrastructure.

Krzanich also reiterated that Samsung Galaxy S6* and S6 Edge* users will have the latest anti-malware solution from McAfee VirusScan Mobile™ technology built into and activated on their devices.

“The evolution of the mobile landscape and growth of smart, connected devices has led to increased demand for more connectivity and real-time, protected data on those devices,” said Krzanich. “All of these factors are driving a transformation of the network to accelerate the delivery of new personal computing experiences, services and capabilities in a safe and secure manner. Intel is one of the only companies in the world that can provide solutions end-to-end for the full spectrum of mobility.”

Mobile Communications Products
Intel introduced the Intel Atom x3 processor series (formerly code-named “SoFIA”), Intel’s first integrated communications platform for entry and value tablets, phablets and smartphones. Combining 64-bit multi-core Intel Atom processors together with 3G or 4G LTE connectivity, the integrated communications SoC combines the applications processor, image sensor processor, graphics, audio, connectivity and power management components in a single system chipset. This integration allows device manufacturers to deliver full-featured tablets, phablets and smartphones at affordable price points for the rapidly growing entry and value market segments.

Intel is bringing the benefits of integrated Intel architecture and wireless communications to customers, including the China technology ecosystem, with greater velocity. Twenty companies, including ASUS* and Jolla*, have committed to delivering Intel Atom x3 designs.

Rounding out its mobile portfolio that scales from the entry to performance segments, Intel also introduced its first 14nm Intel® Atom™ SoC, the Intel Atom x5 and x7 processor series (formally code-named “Cherry Trail”) for next-generation tablets and small-screen 2 in 1s. Offering 64-bit support for Windows* and Android*, Intel Gen 8 graphics, and an option to pair with next-generation LTE Advanced connectivity, the Intel Atom x5 and x7 processor series will power a range of mainstream to premium devices. The processors are also “conflict-free1,” meaning that these products do not contain minerals (tin, tantalum, tungsten and/or gold) that are inadvertently funding human rights violations in the Democratic Republic of the Congo.

Customers, including Acer*, ASUS, Dell*, HP*, Lenovo* and Toshiba*, have already committed to deliver devices on this platform. The first devices are expected to be in the market in the first half of this year.

Intel also announced its third-generation five-mode, LTE Advanced Category 10 modem. The Intel XMM 7360 supports 3x carrier aggregation and download speeds up to 450 Mbps. Its compact size and power efficiency enable the Intel XMM 7360 to accommodate a wide range of form factors, from smartphones and phablets to tablets and PCs. It also expands Intel’s portfolio of LTE solutions, giving device manufacturers a competitive option to quickly design and launch LTE devices in various market segments and geographies. At Mobile World Congress, the company also demonstrated a pre-5G concept system that combines LTE with 802.11ad to deliver speeds of more than 1 Gbps using Intel technology end-to-end.

Delivering New Experiences in Smarter, Safer Devices
With hardware and software products like Intel® RealSense™ depth sensing technology, wireless charging and True Key™ technology by Intel Security, among others, Intel continues to deliver new experiences that provide more natural, intuitive and immersive ways for people to interact with technology.  Building on the success of the world’s thinnest tablet, the Dell Venue* 8, Krzanich showed a sneak peak of the Dell Venue* 10 tablet, featuring a detachable keyboard and Intel RealSense snapshot technology. Targeting consumer and business users, the tablet is expected to be available soon.

In addition to working with Samsung to help protect Galaxy S6 and S6 Edge devices, Krzanich said Intel Security is also collaborating with LG Electronics to help secure personal data. LG Electronics will make McAfee Mobile Security  from Intel Security available on the LG Watch Urbane LTE*, delivering anti-theft capabilities that allow the owner to lock, locate and wipe the device, if needed. LG Android device users are already protected today with McAfee Mobile Security on their devices.

Krzanich announced new customers including Brightstar Corp, Deutsche Telekom and Prestigio for the company’s True Key technology, a cross-platform application to address the pain point of passwords by using personal factors like facial identification and fingerprints to make logging in easier and safer. Deutsche Telekom will preinstall the True Key product for its customers in Europe. Prestigio will be one of the first mobile device manufacturers to launch the True Key application in Russia and across Europe, making the application available across all of its Android tablets and smartphones by the end of this year.

Network Transformation – New Services, Greater Connectivity and Faster Data
Krzanich outlined how Intel is working with industry leaders to transform network infrastructure with standardized hardware and software, and helping to accelerate the industry’s move toward a flexible, agile software-defined infrastructure. This enables both telco and cloud service providers to improve network efficiencies and accelerate the delivery of new services and capabilities for consumers and businesses.

Alcatel-Lucent introduced its virtual radio access network (vRAN) solution, comprised of a virtualized baseband unit that uses general purpose servers with Intel® Xeon® processors to enable cost savings and increased network performance. The vRAN will be in customer trials this year and commercially available in 2016.

Ericsson announced a new generation of data center platforms for the Ericsson Cloud System that enable telecom and cloud service providers to lower their total cost of ownership (TCO) and realize more flexibility and efficiency in their data centers. The company is using Intel® Rack Scale Architecture, together with management and orchestration software, to optimize and scale cloud resources across private, public, enterprise and telco cloud domains, enabling improved services agility. Ericsson also announced it is working with Intel Security on mobile security for 4G networks.

Huawei and Intel are collaborating to deliver robust cloud solutions that will enable telecommunications service providers to transform their data centers. The companies will develop the next generation of Huawei’s FusionSphere* based on Intel architecture, and will use the Data Plane Development Kit and Open vSwitch to increase network virtualization performance of FusionSphere. These solutions aim to enhance performance that is optimized to minimize TCO for cloud workloads in a scalable and secure manner.

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, Intel Atom, Intel XMM, McAfee VirusScan Mobile, True Key, Intel RealSense, Intel Rackscale Architecture, Intel Xeon and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

1 “Conflict free” and “conflict-free” means “DRC conflict free,” which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term “conflict-free” in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before Jan. 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers.