Lakefield

Intel Hybrid Processors: Uncompromised PC Experiences for Innovative Form Factors Like Foldables, Dual Screens

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What’s New: Today, Intel launched Intel® Core™ processors with Intel® Hybrid Technology, code-named “Lakefield.” Leveraging Intel’s Foveros 3D packaging technology and featuring a hybrid CPU architecture for power and performance scalability, Lakefield processors are the smallest to deliver Intel Core performance and full Windows compatibility across productivity and content creation experiences for ultra-light and innovative … Continued

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Up Close with Lakefield – Intel’s Chip with Award-Winning Foveros 3D Tech

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The fingernail-size Intel chip with Foveros technology is a first-of-its kind. With Foveros, processors are built in a totally new way: not with the various IPs spread out flat in two dimensions, but with them stacked in three dimensions. Think of a chip designed as a layer cake (a 1-millimeter-thick layer cake) versus a chip with … Continued

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Intel’s Project Athena, 10th Gen and Lakefield Drive ‘New Mobile Computing’ at Samsung Developer Conference

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What’s New: Today at the Samsung Developer Conference, Samsung announced three new laptops co-engineered with Intel: Samsung’s first two laptops verified to the target specification and experiences of Intel’s innovation program code-named “Project Athena” and an upcoming Samsung Galaxy Book S based on Intel’s unique processor code-named “Lakefield.” “Our partnership with Samsung opens the door to bring … Continued

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Microsoft Unveils First Lakefield Device and New Surface Lineup with 10th Gen Intel Core

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What’s New: Today, at a launch event in New York City, Microsoft previewed the Surface Neo, a category-defining device co-engineered with Intel. The dual-screen device will be powered by Intel’s unique processor, code-named “Lakefield,” that features an industry-first architecture combining a hybrid CPU with Intel’s Foveros 3D packaging technology. It offers device-makers more flexibility to … Continued

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At Hot Chips, Intel Pushes ‘AI Everywhere’

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What’s New: At Hot Chips 2019, Intel revealed new details of upcoming high-performance artificial intelligence (AI) accelerators: Intel® Nervana™ neural network processors, with the NNP-T for training and the NNP-I for inference. Intel engineers also presented technical details on hybrid chip packaging technology, Intel® Optane™ DC persistent memory and chiplet technology for optical I/O. “To get … Continued

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2019 Investor Meeting: Intel Previews Design Innovation; 10nm CPU Ships in June; 7nm Product in 2021

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Today, Wall Street analysts are gathered at Intel headquarters in Santa Clara for the company’s 2019 Investor Meeting, which features executive keynotes by Intel CEO Bob Swan and business unit leaders. At the meeting, Dr. Murthy Renduchintala, Intel’s chief engineering officer and group president of the Technology, Systems Architecture and Client Group, announced that Intel … Continued

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2019 CES: Intel Advances PC Experience with New Platforms, Technologies and Industry Collaboration

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Today at CES 2019 in Las Vegas, Intel unveiled the next wave of PC innovation that will advance the PC experience to help power every person’s greatest contribution, including: Details on our highly integrated platform that will feature our upcoming first volume 10nm PC processor, code-named “Ice Lake” Preview of a hybrid 10nm CPU architecture with Foveros 3D packaging, … Continued

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