AMD to Report Fourth Quarter & Fiscal Year 2020 Financial Results

SANTA CLARA, Calif., Jan. 13, 2021 (GLOBE NEWSWIRE) -- AMD (NASDAQ: AMD) announced today that it will report fourth quarter and fiscal year 2020 financial results on Tuesday, January 26, 2021 after the close of market. Management will conduct a conference call to discuss these results at 5:00 p.m. EST / 2:00 p.m. PST. Interested parties are invited to listen to the webcast of the conference call via AMD’s Investor Relations website ir.amd.com. An archive of the webcast will be available for approximately one year after the conference call.

About AMD
For more than 50 years, AMD has driven innovation in high-performance computing, graphics and visualization technologies ― the building blocks for gaming, immersive platforms and the data center. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ: AMD) websiteblog, LinkedIn, Facebook and Twitter pages.

AMD, the AMD Arrow logo and the combination thereof are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.

Contact
Drew Prairie
AMD Communications
512-602-4425
drew.prairie@amd.com

Laura Graves
AMD Investor Relations
408-749-5467
laura.graves@amd.com


Primary Logo

Source: Advanced Micro Devices, Inc.

AMD Announces World’s Best Mobile Processors¹ In CES 2021 Keynote

AMD Ryzen Threadripper PRO Processors, designed for the most demanding professional workloads, coming to retail channel

SANTA CLARA, Calif., Jan. 12, 2021 (GLOBE NEWSWIRE) -- CES 2021 -- Today, AMD (NASDAQ: AMD) announced the full portfolio of AMD Ryzen™ 5000 Series Mobile Processors, bringing the highly-efficient and extremely powerful “Zen 3” core architecture to the laptop market. New AMD Ryzen 5000 Series Mobile Processors provide unprecedented levels of performance and incredible battery life for gamers, creators, and professionals. New laptops powered by Ryzen 5000 Series Mobile processors will be available from major PC manufacturers including ASUS, HP and Lenovo, starting in Q1 2021. Expanding its leadership client computing product portfolio featuring the “Zen 3” core, AMD also announced the AMD Ryzen PRO 5000 Series Mobile Processors, delivering enterprise-grade security and seamless manageability to commercial users. Throughout the course of 2021, AMD expects a broad portfolio of more than 150 consumer and commercial notebooks based on the Ryzen 5000 Series Mobile Processors.

“As the PC becomes an even more essential part of how we work, play and connect, users demand more performance, security and connectivity,” said Saeid Moshkelani, senior vice president and general manager, Client business unit, AMD. “The new AMD Ryzen 5000 Series Desktop and Mobile Processors bring the best innovation AMD has to offer to consumers and professionals as we continue our commitment to delivering best-in-class experiences with instant responsiveness, incredible battery life and fantastic designs. With our PC partners, we are delivering top-quality performance and no-compromise solutions alongside our record-breaking growth in the notebook and desktop space in the previous year.”

AMD Ryzen 5000 Series Mobile Processors

Building upon the previous generation of leadership mobile processors, the Ryzen 5000 Series includes high-performance H- and ultra-mobile U-Series processors. At the top of the product stack, AMD Ryzen 5000 H-Series Mobile Processors deliver impressive gaming experiences by combining unmatched performance with outstanding battery life, featuring up to 8 cores and 16 threads and built on the new AMD “Zen 3” architecture.

Topping out the mobile processor offering, the HX Series processors provide gamers and creators with elite-level performance while HS processors bring the power of H-Series in thinner and lighter form factors. The new AMD Ryzen 9 5980HX processor is capable of up to 23% increased single-threaded performance and up to 17% faster multi-threaded performance over the previous generation2 making it the ideal solution for gaming and creator notebooks.

For mainstream consumers looking for performance on-the-go, the AMD Ryzen 5000 U-Series Mobile Processors offer the perfect blend of performance and efficiency. The new AMD Ryzen 7 5800U processor offers:

  • Up to 16% more single-threaded performance and up to 14% faster multithreaded performance over the previous generation3
  • Up to an incredible 17.5 hours of general usage battery life and up to 21 hours of movie playback on a single charge4

Product Specification: AMD Ryzen 5000 Series Mobile Processors

Model Cores/Threads Boost5/Base6
Frequency (GHz)
Cache (MB) TDP (Watts) Architecture
AMD Ryzen 9 5980HX 8C/16T Up to 4.8 / 3.3 GHz 20 45+ “Zen 3”
AMD Ryzen 9 5980HS 8C/16T Up to 4.8 / 3.0 GHz 20 35 “Zen 3”
AMD Ryzen 9 5900HX 8C/16T Up to 4.6 / 3.3 GHz 20 45+ “Zen 3”
AMD Ryzen 9 5900HS 8C/16T Up to 4.6 / 3.0 GHz 20 35 “Zen 3”
AMD Ryzen 7 5800H 8C/16T Up to 4.4 / 3.2 GHz 20 45 “Zen 3”
AMD Ryzen 7 5800HS 8C/16T Up to 4.4 / 2.8 GHz 20 35 “Zen 3”
AMD Ryzen 5 5600H 6C/12T Up to 4.2 / 3.3 GHz 19 45 “Zen 3”
AMD Ryzen 5 5600HS 6C/12T Up to 4.2 / 3.0 GHz 19 35 “Zen 3”
AMD Ryzen 7 5800U 8C/16T Up to 4.4 / 1.9 GHz 20 15 “Zen 3”
AMD Ryzen 7 5700U 8C/16T Up to 4.3 /1.8 GHz 12 15 “Zen 2”
AMD Ryzen 5 5600U 6C/12T Up to 4.2 / 2.3 GHz 19 15 “Zen 3”
AMD Ryzen 5 5500U 6C/12T Up to 4.0 / 2.1G Hz 11 15 “Zen 2”
AMD Ryzen 3 5300U 4C/8T Up to 3.8 / 2.6 GHz 6 15 “Zen 2”

Available in the first half of 2021, the Ryzen™ PRO 5000 Series Mobile Processors provide new levels of productivity and collaboration along with seamless manageability to meet the ever-shifting demands of modern work environments. The Ryzen PRO 5000 Series Mobile Processors also offer enterprise-level security features with innovative layers of defense at the silicon, OS and platform levels, giving IT teams confidence their PCs have protection, no matter where their workforce is stationed.

AMD Ryzen Desktop Processors

AMD is also announcing reduced-TDP alternatives to the award-winning AMD Ryzen™ 9 5900X and AMD Ryzen™ 7 5800X desktop processors, coming to pre-built OEM systems only. Powered by the new “Zen 3” core architecture and with a lower 65W TDP, the Ryzen 9 5900 desktop processor offers an average of 24% faster 1080p gaming across select titles compared to the prior generation7.

Product Specification: AMD Ryzen 5000 Series Desktop Processors

Model Cores/Threads Boost5/Base6
Frequency (GHz)
Cache (MB) TDP (Watts)
AMD Ryzen 9 5900 12C/24T Up to 4.7 / 3.0 GHz 70 65
AMD Ryzen 7 5800 8C/16T Up to 4.6 / 3.4 GHz 36 65

Additionally, AMD Ryzen Threadripper PRO Processors will now be directly available to consumers through participating global retailers, e-tailers and system integrators with on-shelf availability expected in March 2021. Ryzen Threadripper PRO Processors offer an unmatched feature set to workstation customers with up to 64 cores, 8 channels of memory, RDIMM and LRDIMM support, 128 PCIe® Gen 4 lanes, and AMD PRO security technologies.

Product Specification: AMD Ryzen Threadripper PRO

Model Cores/ Threads Boost5/Base6
Frequency (GHz)
Total Cache (MB) TDP (Watts)
AMD Ryzen Threadripper PRO 3995WX 64C/128T Up to 4.2 / 2.7 GHz 288 280
AMD Ryzen Threadripper PRO 3975WX 32C/64T Up to 4.2 / 3.5 GHz 144 280
AMD Ryzen Threadripper PRO 3955WX 16C/32T Up to 4.3 / 3.9 GHz 72 280

Partner Quotes

“As the world continues to embrace a flexible, remote lifestyle, ASUS is constantly innovating to bring consumers the products they need to stay connected no matter where in the world they are gaming, streaming or working,” said Eric Chen, corporate senior vice president, ASUS. “ASUS is also pleased to continue to work with AMD to deliver cutting-edge innovations to raise the bar of gaming performance for mobile and gaming users everywhere.”

"Today's employees and IT teams are continuing to adapt to new ways of collaborating and creating – whether at home, in the office or other remote locations," said Andy Rhodes, global head of Commercial Personal Systems, HP Inc. "We are proud of our continued collaboration with AMD to offer powerful and highly secure business PCs to help people stay connected, engaged, and productive wherever they are."

“Lenovo listens to customer feedback to derive user insights for innovation. What’s demanded of us during this new 'remote revolution' is simple—top performance to help foster more real-time collaboration. By partnering with AMD, we deliver on both counts to provide amazing user experiences,” said Dilip Bhatia, chief customer experience officer, Lenovo. “From small business pros working together on the new ThinkBook 14p Gen 2 and ThinkBook 16p Gen 2 laptops, to competitive gamers whose team is playing to win on this season’s powerful new Lenovo Legion laptops—staying productive and entertained with the latest Ryzen™ mobile processor technology is essential to those thriving in today’s blended work- and play-from-home lifestyle."

Supporting Resources

CAUTIONARY STATEMENT

This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as the features, functionality, performance, availability, timing and expected benefits of AMD products including the AMD Ryzen™ 5000 Series Mobile Processors, AMD Ryzen™ 5000 Series Desktop Processors and AMD Ryzen™ Threadripper PRO, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation’s dominance of the microprocessor market and its aggressive business practices; the ability of third party manufacturers to manufacture AMD's products on a timely basis in sufficient quantities and using competitive technologies; expected manufacturing yields for AMD’s products; the availability of essential equipment, materials or manufacturing processes; AMD's ability to introduce products on a timely basis with features and performance levels that provide value to its customers; global economic uncertainty; the loss of a significant customer; AMD's ability to generate revenue from its semi-custom SoC products; the impact of the COVID-19 pandemic on AMD’s business, financial condition and results of operations; political, legal, economic risks and natural disasters; the impact of government actions and regulations such as export administration regulations, tariffs and trade protection measures; the impact of acquisitions, joint ventures and/or investments on AMD's business, including the announced acquisition of Xilinx, and the failure to integrate acquired businesses; AMD’s ability to complete the Xilinx merger; the impact of the announcement and pendency of the Xilinx merger on AMD’s business; potential security vulnerabilities; potential IT outages, data loss, data breaches and cyber-attacks; uncertainties involving the ordering and shipment of AMD’s products; quarterly and seasonal sales patterns; the restrictions imposed by agreements governing AMD’s notes and the revolving credit facility; the competitive markets in which AMD’s products are sold; market conditions of the industries in which AMD products are sold; AMD’s reliance on third-party intellectual property to design and introduce new products in a timely manner; AMD's reliance on third-party companies for the design, manufacture and supply of motherboards, software and other computer platform components; AMD's reliance on Microsoft Corporation and other software vendors' support to design and develop software to run on AMD’s products; AMD’s reliance on third-party distributors and add-in-board partners; the potential dilutive effect if the 2.125% Convertible Senior Notes due 2026 are converted; future impairments of goodwill and technology license purchases; AMD’s ability to attract and retain qualified personnel; AMD's ability to generate sufficient revenue and operating cash flow or obtain external financing for research and development or other strategic investments; AMD's indebtedness; AMD's ability to generate sufficient cash to service its debt obligations or meet its working capital requirements; AMD's ability to repurchase its outstanding debt in the event of a change of control; the cyclical nature of the semiconductor industry; the impact of modification or interruption of AMD’s internal business processes and information systems; compatibility of AMD’s products with some or all industry-standard software and hardware; costs related to defective products; the efficiency of AMD's supply chain; AMD's ability to rely on third party supply-chain logistics functions; AMD’s stock price volatility; worldwide political conditions; unfavorable currency exchange rate fluctuations; AMD’s ability to effectively control the sales of its products on the gray market; AMD's ability to adequately protect its technology or other intellectual property; current and future claims and litigation; potential tax liabilities; and the impact of environmental laws, conflict minerals-related provisions and other laws or regulations. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to AMD’s Quarterly Report on Form 10-Q for the quarter ended September 26, 2020.

 

About AMD
For 50 years AMD has driven innovation in high-performance computing, graphics and visualization technologies ― the building blocks for gaming, immersive platforms and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ:AMD) websiteblogFacebook and Twitter pages.

_________________________________
1 ‘Best Mobile Processors’ is defined as having the highest multi-thread processing performance in each of four (4) classes of Ryzen 5000 series processors. Testing by AMD engineering using the Cinebench R20 nT benchmark, measuring multithreaded performance of a Ryzen 9 5900HX processor engineering sample vs Core i9-10980HK, Ryzen 7 5800U processor engineering sample vs Core i7-1185G7 processor, the Ryzen 5 5600U processor engineering sample vs Core i5-1135G7 processor, and a Ryzen 3 5400U processor engineering sample vs Core i3-1115G4 processor. Performance may vary. CZM-1.
2 Testing by AMD engineering using the Cinebench R20 nT benchmark to measure the single-threaded and multithreaded performance of a Ryzen 7 5980X processor engineering sample vs. the previous generation Ryzen 9 4900H processor. Performance may vary. CZM-50.
3 Testing by AMD Performance Labs as of 09/02/2020 utilizing engineering platforms configured with Ryzen 7 5800U and Ryzen 7 4800U processors, each with 32GB RAM, 512MB SSD, Radeon™ Graphics, and Win 10 vs. a similarly configured Dell XPS 7390 laptop with a Core i7-1065G7 processor, Integrated Graphics and 16GB RAM, in the following benchmarks: Cinebench R20 nT, Cinebench R20 1T and 3DMark Physics for gaming performance. Performance may vary. 3DMark is a registered trademark of Futuremark Corporation. – CZM-11
4 Testing by AMD Performance Labs as of 12/08/2020 using an AMD Ryzen 7 5800U processor on an AMD Reference Platform configured with a 53WHr battery, WLAN enabled and Bluetooth off, using 1080p video playback (result: up to 21.4 hours) and the MobileMark 2018 benchmark test (result: up to 17.5 hours). CZM-33.
5 Max boost for AMD Ryzen Processors is the maximum frequency achievable by a single core on the processor running a bursty single-threaded workload. Max boost will vary based on several factors, including, but not limited to: thermal paste; system cooling; motherboard design and BIOS; the latest AMD chipset driver; and the latest OS updates. GD-150
6 Base frequency is the approximate processor clock speed of a typical workload running at the processor’s standard TDP. GD-166.
7 Testing by AMD performance labs as of December 11, 2020 measuring the gaming performance of an AMD Ryzen 9 5900 vs an AMD Ryzen 9 3900 in 12 popular titles at 1920x1080, High image quality preset. Systems configured with a GeForce RTX 2080 Ti. Results may vary. R5K-055


Contact:
Alex Verduzco
AMD Communications
(512) 913-7062
Alex.Verduzco@amd.com

Laura Graves
AMD Investor Relations
(408) 749-5467
Laura.Graves@amd.com

Primary Logo

Source: Advanced Micro Devices, Inc.

AMD President and CEO Lisa Su Showcases a Digital-First World at Consumer Technology Association’s Consumer Electronics Show

― Dr. Su’s keynote highlights the acceleration of digital transformation at home, work and in entertainment with appearances from Microsoft, HP, Lucasfilm, Lenovo and Mercedes-AMG Petronas Formula 1 Team ―

SANTA CLARA, Calif., Jan. 12, 2021 (GLOBE NEWSWIRE) -- Today at Consumer Technology Association’s Consumer Electronics Show, AMD (NASDAQ: AMD) showcased technology innovations that are improving how consumers live, work and play. During her keynote, AMD President and CEO Dr. Lisa Su reiterated the importance of high-performance computing in people’s daily lives and the ways in which the acceleration of digital transformation – at home and at work – point to a bright future this year and beyond. To power that future, Dr. Su announced a new family of high-performance mobile processors for laptops and offered a preview of an upcoming next-generation server processor for data centers.

“AMD is incredibly proud to be at the heart of products, services and experiences keeping us productive, learning, connected and entertained in an increasingly ‘digital first’ world,” said Dr. Su. “We are committed to consistently pushing the envelope on what’s possible in PCs, gaming, data centers and the cloud together with our industry partners.”

Dr. Su was joined in the keynote by a diverse set of partners: HP CEO Enrique Lores, Lenovo CEO Yang Yuanqing, Vice President of Technology for Lucasfilm François Chardavoine, Mercedes-AMG Petronas Formula One Team Driver Lewis Hamilton and Team Principal and CEO Toto Wolff, and Microsoft Chief Product Officer Panos Panay. Each shared how they partner with AMD to offer some of the most exciting products, services and experiences to people around the world. For example, Lewis Hamilton, Formula 1 World Champion, discussed the role of high-performance computing in racing, from the design and testing of the car to the analysis of race data for competitive advantage. (38:50 – 45:55)

In addition, scientific researchers explained how an additional 12 petaflops of donated AMD EPYC™ and AMD Radeon Instinct compute power is accelerating their work to research infectious disease including COVID-19. (6:00 – 9:00)

New Product Innovation
AMD showcased its track record of executing consistently against its ambitious product roadmap again at CES 2021. Dr. Su announced the new AMD Ryzen™ 5000 series mobile processors that bring the industry-leading performance1 and high efficiency of the “Zen 3” core to laptops, and shared the first public demonstration of the upcoming 3rd Gen AMD EPYC™ server processor for data centers, cloud services and high-performance computing.

AMD Ryzen 5000 Series Mobile Processors – powerful and energy-efficient PC processors for ultrathin and gaming laptops.
To support the dramatic shift to working and learning from home, AMD launched new AMD Ryzen 5000 series processors based on the “Zen 3” core, combining industry-leading performance1 with the power efficiency needed for next-generation mobile PC computing. (18:29 – 23:42)

  • The world’s top notebook OEMs, including Asus, HP and Lenovo, will all bring AMD Ryzen 5000 systems to market starting in February, with more than 150 systems expected to launch this year.
  • The newly announced family of AMD processors includes AMD Ryzen 5000 U-Series Processors optimized for thin and light notebooks, as well as AMD Ryzen 5000 H-Series Processors for mobile gamers and creators.
  • HP CEO Enrique Lores and Lenovo CEO Yang Yuanqing discussed how their companies in partnership with AMD are shaping the compute experience of the future with new form factors. (23:43 – 27:15; 35:30 – 38:49)
  • Microsoft Chief Product Officer Panos Panay discussed the essential nature of the PC for connecting, working, learning and gaming and the AMD and Microsoft co-engineering that is revolutionizing these computing experiences. (11:00 – 17:15)

3rd Gen AMD EPYC Processor, codenamed “Milan” – designed to extend AMD leadership in performance, total cost of ownership and security features.
AMD EPYC processors are at the heart of the supercomputers, data centers and cloud services underpinning scientific research, global business, ecommerce and increasingly important cloud services like online learning, collaboration applications and video conferencing. In her keynote, Dr. Su provided the first public demonstration of the 3rd Gen AMD EPYC processor, codenamed “Milan.” The demonstration featured the Weather Research and Forecast (WRF) Model – used in more than 160 countries – crunching through a compute-intensive weather forecast for the continental United States, with two 32-core “Milan” processors outperforming two of the competition’s highest end dual socket processors by ~68%2. (46:03 – 48:48) 3rd Gen AMD EPYC processors will raise the bar for performance, advanced security features and the business value for which AMD is known. AMD plans to announce product and ecosystem details in Q1 2021.

Supporting Resources

  • Watch the opening video here
  • See clips from our partners here:
    -- HP CEO Enrique Lores (23:43 – 27:15)
    -- Lenovo CEO Yang Yuanqing (35:30 – 38:49)
    -- Vice President of Technology for Lucasfilm François Chardavoine (30:32 – 35:29)
    -- Mercedes-AMG Petronas Formula 1 Team Driver Lewis Hamilton and Team CEO Toto Wolff (38:50 – 45:55)
    -- Microsoft Chief Product Officer Panos Panay (11:00 – 17:15)
  • Listen to scientific researchers discuss the impact of the AMD HPC Fund here: (6:00 – 9:00)
  • Learn more about AMD Ryzen Mobile Processors here
  • Learn more about AMD EPYC Processors here
  • Learn more about supercharging creativity with the Radeon RX 6900 XT and see a ProRender-developed demo of the Mercedes-AMG F1 W11 EG performance car here
  • Follow AMD on Twitter to stay up to date

CAUTIONARY STATEMENT

This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as the features, functionality, performance, availability, timing and expected benefits of AMD products including the AMD Ryzen™ 5000 Series Mobile Processors and the 3rd Gen AMD EPYC™ Server Processor, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation’s dominance of the microprocessor market and its aggressive business practices; the ability of third party manufacturers to manufacture AMD's products on a timely basis in sufficient quantities and using competitive technologies; expected manufacturing yields for AMD’s products; the availability of essential equipment, materials or manufacturing processes; AMD's ability to introduce products on a timely basis with features and performance levels that provide value to its customers; global economic uncertainty; the loss of a significant customer; AMD's ability to generate revenue from its semi-custom SoC products; the impact of the COVID-19 pandemic on AMD’s business, financial condition and results of operations; political, legal, economic risks and natural disasters; the impact of government actions and regulations such as export administration regulations, tariffs and trade protection measures; the impact of acquisitions, joint ventures and/or investments on AMD's business, including the announced acquisition of Xilinx, and the failure to integrate acquired businesses; AMD’s ability to complete the Xilinx merger; the impact of the announcement and pendency of the Xilinx merger on AMD’s business; potential security vulnerabilities; potential IT outages, data loss, data breaches and cyber-attacks; uncertainties involving the ordering and shipment of AMD’s products; quarterly and seasonal sales patterns; the restrictions imposed by agreements governing AMD’s notes and the revolving credit facility; the competitive markets in which AMD’s products are sold; market conditions of the industries in which AMD products are sold; AMD’s reliance on third-party intellectual property to design and introduce new products in a timely manner; AMD's reliance on third-party companies for the design, manufacture and supply of motherboards, software and other computer platform components; AMD's reliance on Microsoft Corporation and other software vendors' support to design and develop software to run on AMD’s products; AMD’s reliance on third-party distributors and add-in-board partners; the potential dilutive effect if the 2.125% Convertible Senior Notes due 2026 are converted; future impairments of goodwill and technology license purchases; AMD’s ability to attract and retain qualified personnel; AMD's ability to generate sufficient revenue and operating cash flow or obtain external financing for research and development or other strategic investments; AMD's indebtedness; AMD's ability to generate sufficient cash to service its debt obligations or meet its working capital requirements; AMD's ability to repurchase its outstanding debt in the event of a change of control; the cyclical nature of the semiconductor industry; the impact of modification or interruption of AMD’s internal business processes and information systems; compatibility of AMD’s products with some or all industry-standard software and hardware; costs related to defective products; the efficiency of AMD's supply chain; AMD's ability to rely on third party supply-chain logistics functions; AMD’s stock price volatility; worldwide political conditions; unfavorable currency exchange rate fluctuations; AMD’s ability to effectively control the sales of its products on the gray market; AMD's ability to adequately protect its technology or other intellectual property; current and future claims and litigation; potential tax liabilities; and the impact of environmental laws, conflict minerals-related provisions and other laws or regulations. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to AMD’s Quarterly Report on Form 10-Q for the quarter ended September 26, 2020.

About AMD
For more than 50 years, AMD has driven innovation in high-performance computing, graphics and visualization technologies ― the building blocks for gaming, immersive platforms and the data center. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ:AMD) website, blog, Facebook and Twitter pages.

AMD, the AMD logo, EPYC, Ryzen, and combinations thereof are trademarks of Advanced Micro Devices, Inc.

1 As of December 2020, the Ryzen 5000 series mobile processors are the fastest mobile processors with the highest-performing single-thread and multi-thread performance available on x86 mobile processors, measured by AMD Labs with Cinebench R.20 1T and Cinebench R20 nT respectively. Performance may vary. CZM-35
2 AMD internal testing completed on 7Dec2020 on a reference platform with 2x pre-production EPYC™ 7003 series 32-core processors, compared to an Intel server on a production system with 2x Intel® Xeon® Gold 6258R (28C) processors. Results may vary. MIL-002

Contact:
Sarah Feller
AMD Communications
(512) 602-4333
sarah.feller@amd.com  

Laura Graves
AMD Investor Relations
(408) 749-5467
laura.graves@amd.com  

Photos accompanying this announcement are available at:

https://www.globenewswire.com/NewsRoom/AttachmentNg/40559877-3a75-4ec3-9b77-999c9259e9c3

https://www.globenewswire.com/NewsRoom/AttachmentNg/eef5cdd6-720b-4f0e-a406-de07bad46406

https://www.globenewswire.com/NewsRoom/AttachmentNg/31ef0506-7167-4070-b648-1ebfbaa98ef4


Primary Logo

AMD at CES 2021

AMD CEO Dr. Lisa Su talks with Vice President of Technology for Lucasfilm François Chardavoine at CES 2021.
AMD at CES 2021

AMD CEO Dr. Lisa Su talks with Mercedes-AMG Petronas Formula One Team Driver Lewis Hamilton at CES 2021.
AMD at CES 2021

AMD CEO Dr. Lisa Su talks with Microsoft Chief Product Officer Panos Panay at CES 2021.
Source: Advanced Micro Devices, Inc.

AMD Expands Senior Leadership Team

SANTA CLARA, Calif., Jan. 06, 2021 (GLOBE NEWSWIRE) -- AMD (NASDAQ: AMD) today announced several senior leadership promotions in support of the company’s long-term growth goals.

AMD announced two executive vice president promotions:

  • Darren Grasby to executive vice president and Chief Sales Officer, responsible for driving adoption of AMD products and delivering a world-class customer experience.
  • Devinder Kumar to executive vice president and Chief Financial Officer, responsible for continued strengthening of the company's financial profile.

AMD also announced three senior vice president promotions:

  • Martin Ashton to senior vice president of Graphics Architecture and Radeon Technologies Group Intellectual Property (IP) with continued responsibility for leading the development of leadership GPU architectures and IP for gaming, data center and mobile products.
  • Mark Fuselier to senior vice president of Technology and Product Engineering, leading end-to-end engineering for new product introductions to deliver on the unprecedented demand for AMD products.
  • Sam Naffziger to senior vice president, Corporate Fellow and Product Technology Architect with continued responsibility for maximizing the competitiveness, efficiency and cost of next-generation AMD solutions.

“Our high-performance products and long-term roadmaps have placed AMD on a significant growth trajectory,” said Dr. Lisa Su, AMD president and CEO. “Aligning and expanding our senior leadership team around our highest-priority growth opportunities will continue the momentum we have built across our business in 2021 and beyond.”

Supporting Resources

About AMD
For more than 50 years, AMD has driven innovation in high-performance computing, graphics and visualization technologies ― the building blocks for gaming, immersive platforms and the data center. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ:AMD) websiteblogFacebook and Twitter pages. 

Contact:
Drew Prairie
AMD Communications
(512) 602-4425
Drew.Prairie@amd.com

Laura Graves
AMD Investor Relations
(408) 749-5467
Laura.Graves@amd.com


Primary Logo

Source: Advanced Micro Devices, Inc.

High-Performance AMD EPYC™ CPUs and Radeon™ Pro GPUs Power New AWS Instance for Graphics Optimized Workloads

2nd Gen AMD EPYC CPUs and AMD Radeon™ Pro GPUs power new Amazon EC2 G4ad Instance with up to 40% better graphics performance ꟷ

ꟷ Amazon GameLift leverages the power of 2nd Gen AMD EPYC™ processors for game server hosting solution ꟷ

SANTA CLARA, Calif., Dec. 02, 2020 (GLOBE NEWSWIRE) -- AMD (NASDAQ: AMD) announced Amazon Web Services, Inc. (AWS) has expanded its AMD-based offerings with a new cloud instance for Amazon Elastic Compute Cloud (Amazon EC2): Amazon EC2 G4ad instances for graphics-optimized workloads. With this new instance, AMD now powers eight Amazon EC2 instance families across 20 global AWS Regions. AMD also announced that Amazon GameLift, a fully managed dedicated game server hosting solution, is now providing its video game hosting customers access to AMD EPYC processor-based Amazon EC2 C5a, M5a and R5a instances.

“Today we build on the strong collaboration between AMD and AWS, which started in 2017. This expansion of our cooperation is a proof point of the continued performance and capabilities that AMD provides its customers,” said Forrest Norrod, senior vice president and general manager, Data Center and Embedded Solutions Group, AMD. “Amazon EC2 G4ad instances are the first powered by both AMD EPYC CPUs and Radeon Pro GPUs, and adding to the existing EPYC processor-based instances, they exemplify the ways in which AMD CPUs and GPUs provide fantastic performance and price/performance for AWS customers.”

“The high-performance capabilities of the AMD EPYC CPUs and Radeon Pro GPUs are enabling AWS to create a new graphics-focused instance that help us keep our leadership price/performance offerings that our customers expect,” said David Brown, Vice President, Amazon EC2, Amazon Web Services, Inc. “We’re delighted to continue this great collaboration with AMD, enabling the Amazon EC2 G4ad instances to provide the industry’s best price performance for graphics-intensive applications.”

New Amazon EC2 G4ad Instance

Featuring 2nd Gen AMD EPYC CPUs and AMD Radeon™ Pro V520 GPUs, the new G4ad instance, which will be available later this month, is the first AWS instance powered by both 7nm AMD CPUs and GPUs.

  • G4ad is built to support graphics-intensive workloads and can provide customers with up to 45 percent better price performance and 40 percent better graphics performance, for critical workstation-class applications and real-time game engines, compared to existing GPU based, Amazon EC2 G4dn instances.
  • Based on the AMD RDNA architecture, the AMD Radeon™ Pro V520 GPUs can deliver highly responsive, cloud-based workstation-class experiences for the most demanding workloads with enterprise-grade reliability.
  • These instances also come with AMD Radeon™ Pro Software for Enterprise at no additional cost, offering support for professionals working with workstation applications and the latest graphic APIs, like DirectX®, OpenGL® and Vulkan® offering professional-grade graphics rendering for virtual workstations.

You can learn more about the AMD and AWS collaboration in this video interview between AMD CEO Lisa Su and AWS Vice President of Amazon EC2, David Brown, which will go live on December 2 at 12:30pm PT as part of the AWS Virtual re:Invent sessions.

Amazon GameLift

Amazon GameLift is now providing its video game hosting customers access on the AMD EPYC based Amazon EC2 C5a, M5a and R5a instances to provide great price/performance capabilities to its video game server hosting customers.

With AMD EPYC processors, developers can use Amazon GameLift to deploy, operate, and scale dedicated high-performance servers for multiplayer games at up to 10 percent lower cost over comparable instances. You can read more about the Amazon GameLift service supporting AMD EPYC processor-based instances here.

Supporting Resources

About AMD

For more than 50 years AMD has driven innovation in high-performance computing, graphics and visualization technologies ― the building blocks for gaming, immersive platforms and the data center. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ: AMD) websiteblogFacebook and Twitter pages.

©2020 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, EPYC, Radeon, RDNA, and combinations thereof are trademarks of Advanced Micro Devices, Inc. PCIe is a registered trademark of PCI-SIG Corporation. DirectX is either a registered trademark or trademark of Microsoft Corporation in the US and/or other countries. OpenGL® and the oval logo are trademarks or registered trademarks of Hewlett Packard Enterprise in the United States and/or other countries worldwide. Vulkan and the Vulkan logo are registered trademarks of the Khronos Group Inc. AWS is a trademark of Amazon.com, Inc. or its affiliates in the United States and/or other countries Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.


Contacts:
Aaron Grabein
AMD Communications
+1 512-602-8950
Aaron.Grabein@amd.com

Laura Graves
AMD Investor Relations
+1 408-749-5467
Laura.Graves@amd.com

Primary Logo

Source: Advanced Micro Devices, Inc.

AMD to Present at Credit Suisse 24th Annual Technology Conference

SANTA CLARA, Calif., Nov. 16, 2020 (GLOBE NEWSWIRE) -- Today, AMD (NASDAQ: AMD) announced that Dr. Lisa Su, president and chief executive officer, will present at the Credit Suisse 24th Annual Technology Conference on Monday, November 30, 2020 at 11:00am ET/8:00am PT.

A real-time video webcast of the presentation can be accessed on AMD’s Investor Relations website ir.amd.com. A replay of the webcast can be accessed approximately four hours after the conclusion of the live event and will be available for one year after the conference.

About AMD
For more than 50 years, AMD has driven innovation in high-performance computing, graphics and visualization technologies – the building blocks for gaming, immersive platforms and the data center. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ: AMD) website, blog, Facebook and Twitter pages.

AMD, the AMD Arrow logo and the combination thereof are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.

Media Contact:
Drew Prairie
AMD Communications
512-602-4425
drew.prairie@amd.com

Investor Contact:
Laura Graves
AMD Investor Relations
408-306-9157
Laura.Graves@amd.com


Primary Logo

Source: Advanced Micro Devices, Inc.

AMD Announces World’s Fastest HPC Accelerator for Scientific Research¹

AMD Instinct™ MI100 accelerators revolutionize high-performance computing (HPC) and AI with industry-leading compute performance

First GPU accelerator with new AMD CDNA architecture engineered for the exascale era

SANTA CLARA, Calif., Nov. 16, 2020 (GLOBE NEWSWIRE) --  AMD (NASDAQ: AMD) today announced the new AMD Instinct™ MI100 accelerator – the world’s fastest HPC GPU and the first x86 server GPU to surpass the 10 teraflops (FP64) performance barrier.1 Supported by new accelerated compute platforms from Dell, Gigabyte, HPE, and Supermicro, the MI100, combined with AMD EPYCTM CPUs and the ROCm™ 4.0 open software platform, is designed to propel new discoveries ahead of the exascale era.

Built on the new AMD CDNA architecture, the AMD Instinct MI100 GPU enables a new class of accelerated systems for HPC and AI when paired with 2nd Gen AMD EPYC processors. The MI100 offers up to 11.5 TFLOPS of peak FP64 performance for HPC and up to 46.1 TFLOPS peak FP32 Matrix performance for AI and machine learning workloads2. With new AMD Matrix Core technology, the MI100 also delivers a nearly 7x boost in FP16 theoretical peak floating point performance for AI training workloads compared to AMD’s prior generation accelerators.3

“Today AMD takes a major step forward in the journey toward exascale computing as we unveil the AMD Instinct MI100 – the world’s fastest HPC GPU,” said Brad McCredie, corporate vice president, Data Center GPU and Accelerated Processing, AMD. “Squarely targeted toward the workloads that matter in scientific computing, our latest accelerator, when combined with the AMD ROCm open software platform, is designed to provide scientists and researchers a superior foundation for their work in HPC.”

Open Software Platform for the Exascale Era

The AMD ROCm developer software provides the foundation for exascale computing. As an open source toolset consisting of compilers, programming APIs and libraries, ROCm is used by exascale software developers to create high performance applications. ROCm 4.0 has been optimized to deliver performance at scale for MI100-based systems. ROCm 4.0 has upgraded the compiler to be open source and unified to support both OpenMP® 5.0 and HIP. PyTorch and Tensorflow frameworks, which have been optimized with ROCm 4.0, can now achieve higher performance with MI1007,8. ROCm 4.0 is the latest offering for HPC, ML and AI application developers which allows them to create performance portable software.

“We’ve received early access to the MI100 accelerator, and the preliminary results are very encouraging. We’ve typically seen significant performance boosts, up to 2-3x compared to other GPUs,” said Bronson Messer, director of science, Oak Ridge Leadership Computing Facility. “What’s also important to recognize is the impact software has on performance. The fact that the ROCm open software platform and HIP developer tool are open source and work on a variety of platforms, it is something that we have been absolutely almost obsessed with since we fielded the very first hybrid CPU/GPU system.”

Key capabilities and features of the AMD Instinct MI100 accelerator include:

  • All-New AMD CDNA Architecture- Engineered to power AMD GPUs for the exascale era and at the heart of the MI100 accelerator, the AMD CDNA architecture offers exceptional performance and power efficiency
  • Leading FP64 and FP32 Performance for HPC Workloads - Delivers industry leading 11.5 TFLOPS peak FP64 performance and 23.1 TFLOPS peak FP32 performance, enabling scientists and researchers across the globe to accelerate discoveries in industries including life sciences, energy, finance, academics, government, defense and more.1
  • All-New Matrix Core Technology for HPC and AI – Supercharged performance for a full range of single and mixed precision matrix operations, such as FP32, FP16, bFloat16, Int8 and Int4, engineered to boost the convergence of HPC and AI.
  • 2nd Gen AMD Infinity Fabric™ Technology Instinct MI100 provides ~2x the peer-to-peer (P2P) peak I/O bandwidth over PCIe® 4.0 with up to 340 GB/s of aggregate bandwidth per card with three AMD Infinity Fabric™ Links.4 In a server, MI100 GPUs can be configured with up to two fully-connected quad GPU hives, each providing up to 552 GB/s of P2P I/O bandwidth for fast data sharing.4
  • Ultra-Fast HBM2 Memory– Features 32GB High-bandwidth HBM2 memory at a clock rate of 1.2 GHz and delivers an ultra-high 1.23 TB/s of memory bandwidth to support large data sets and help eliminate bottlenecks in moving data in and out of memory.5
  • Support for Industry's Latest PCIe® Gen 4.0 – Designed with the latest PCIe Gen 4.0 technology support providing up to 64GB/s peak theoretical transport data bandwidth from CPU to GPU.6

Available Server Solutions
The AMD Instinct MI100 accelerators are expected by end of the year in systems from major OEM and ODM partners in the enterprise markets, including:

Dell
“Dell EMC PowerEdge servers will support the new AMD Instinct MI100, which will enable faster insights from data. This would help our customers achieve more robust and efficient HPC and AI results rapidly,” said Ravi Pendekanti, senior vice president, PowerEdge Servers, Dell Technologies. "AMD has been a valued partner in our support for advancing innovation in the data center. The high-performance capabilities of AMD Instinct accelerators are a natural fit for our PowerEdge server AI & HPC portfolio.”

Gigabyte
“We’re pleased to again work with AMD as a strategic partner offering customers server hardware for high performance computing,” said Alan Chen, assistant vice president in NCBU, GIGABYTE. “AMD Instinct MI100 accelerators represent the next level of high-performance computing in the data center, bringing greater connectivity and data bandwidth for energy research, molecular dynamics, and deep learning training. As a new accelerator in the GIGABYTE portfolio, our customers can look to benefit from improved performance across a range of scientific and industrial HPC workloads.”

Hewlett Packard Enterprise (HPE)
“Customers use HPE Apollo systems for purpose-built capabilities and performance to tackle a range of complex, data-intensive workloads across high-performance computing (HPC), deep learning and analytics,” said Bill Mannel, vice president and general manager, HPC at HPE. “With the introduction of the new HPE Apollo 6500 Gen10 Plus system, we are further advancing our portfolio to improve workload performance by supporting the new AMD Instinct MI100 accelerator, which enables greater connectivity and data processing, alongside the 2nd Gen AMD EPYC™ processor. We look forward to continuing our collaboration with AMD to expand our offerings with its latest CPUs and accelerators.”

Supermicro
“We’re excited that AMD is making a big impact in high-performance computing with AMD Instinct MI100 GPU accelerators,” said Vik Malyala, senior vice president, field application engineering and business development, Supermicro. “With the combination of the compute power gained with the new CDNA architecture, along with the high memory and GPU peer-to-peer bandwidth the MI100 brings, our customers will get access to great solutions that will meet their accelerated compute requirements and critical enterprise workloads. The AMD Instinct MI100 will be a great addition for our multi-GPU servers and our extensive portfolio of high-performance systems and server building block solutions.”

MI100 Specifications

Compute
Units
Stream
Processors
FP64
TFLOPS
(Peak)
FP32
TFLOPS
(Peak)
FP32
Matrix
TFLOPS
(Peak)
FP16/FP16
Matrix
TFLOPS
(Peak)
INT4 |
INT8
TOPS
(Peak)
bFloat16
TFLOPS
(Peak)
HBM2
ECC
Memory
Memory
Bandwidth
120 7680 Up to
11.5
Up to 23.1 Up to
46.1
Up to
184.6
Up to
184.6
Up to
92.3
TFLOPS
32GB Up to 1.23
TB/s

Supporting Resources

About AMD
For more than 50 years AMD has driven innovation in high-performance computing, graphics and visualization technologies ― the building blocks for gaming, immersive platforms and the data center. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ: AMD) websiteblogFacebook and Twitter pages.

CAUTIONARY STATEMENT
This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as the features, functionality, performance, availability, timing and expected benefits of AMD products including the AMD Instinct™ MI100 accelerator, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation’s dominance of the microprocessor market and its aggressive business practices; the ability of third party manufacturers to manufacture AMD's products on a timely basis in sufficient quantities and using competitive technologies; expected manufacturing yields for AMD’s products; the availability of essential equipment, materials or manufacturing processes; AMD's ability to introduce products on a timely basis with features and performance levels that provide value to its customers; global economic uncertainty; the loss of a significant customer; AMD's ability to generate revenue from its semi-custom SoC products; the impact of the COVID-19 pandemic on AMD’s business, financial condition and results of operations; political, legal, economic risks and natural disasters; the impact of government actions and regulations such as export administration regulations, tariffs and trade protection measures; the impact of acquisitions, joint ventures and/or investments on AMD's business, including the announced acquisition of Xilinx, and the failure to integrate acquired businesses; AMD’s ability to complete the Xilinx merger; the impact of the announcement and pendency of the Xilinx merger on AMD’s business; potential security vulnerabilities; potential IT outages, data loss, data breaches and cyber-attacks; uncertainties involving the ordering and shipment of AMD’s products; quarterly and seasonal sales patterns; the restrictions imposed by agreements governing AMD’s notes and the revolving credit facility; the competitive markets in which AMD’s products are sold; market conditions of the industries in which AMD products are sold; AMD’s reliance on third-party intellectual property to design and introduce new products in a timely manner; AMD's reliance on third-party companies for the design, manufacture and supply of motherboards, software and other computer platform components; AMD's reliance on Microsoft Corporation and other software vendors' support to design and develop software to run on AMD’s products; AMD’s reliance on third-party distributors and add-in-board partners; the potential dilutive effect if the 2.125% Convertible Senior Notes due 2026 are converted; future impairments of goodwill and technology license purchases; AMD’s ability to attract and retain qualified personnel; AMD's ability to generate sufficient revenue and operating cash flow or obtain external financing for research and development or other strategic investments; AMD's indebtedness; AMD's ability to generate sufficient cash to service its debt obligations or meet its working capital requirements; AMD's ability to repurchase its outstanding debt in the event of a change of control; the cyclical nature of the semiconductor industry; the impact of modification or interruption of AMD’s internal business processes and information systems; compatibility of AMD’s products with some or all industry-standard software and hardware; costs related to defective products; the efficiency of AMD's supply chain; AMD's ability to rely on third party supply-chain logistics functions; AMD’s stock price volatility; worldwide political conditions; unfavorable currency exchange rate fluctuations; AMD’s ability to effectively control the sales of its products on the gray market; AMD's ability to adequately protect its technology or other intellectual property; current and future claims and litigation; potential tax liabilities; and the impact of environmental laws, conflict minerals-related provisions and other laws or regulations. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to AMD’s Quarterly Report on Form 10-Q for the quarter ended September 26, 2020.

©2020 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, EPYC, AMD Instinct, Infinity Fabric, ROCm and combinations thereof are trademarks of Advanced Micro Devices, Inc. The OpenMP name and the OpenMP logos are registered trademarks of the OpenMP Architecture Review Board. PCIe is a registered trademark of PCI-SIG Corporation. Python is a trademark of the Python Software Foundation. PyTorch is a trademark or registered trademark of PyTorch. TensorFlow, the TensorFlow logo and any related marks are trademarks of Google Inc. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
_______________________________

  1. Calculations conducted by AMD Performance Labs as of Sep 18, 2020 for the AMD Instinct™ MI100 (32GB HBM2 PCIe® card) accelerator at 1,502 MHz peak boost engine clock resulted in 11.54 TFLOPS peak double precision (FP64), 46.1 TFLOPS peak single precision matrix (FP32), 23.1 TFLOPS peak single precision (FP32), 184.6 TFLOPS peak half precision (FP16) peak theoretical, floating-point performance. Published results on the NVidia Ampere A100 (40GB) GPU accelerator resulted in 9.7 TFLOPS peak double precision (FP64). 19.5 TFLOPS peak single precision (FP32), 78 TFLOPS peak half precision (FP16) theoretical, floating-point performance. Server manufacturers may vary configuration offerings yielding different results. MI100-03
  2. Calculations performed by AMD Performance Labs as of Sep 3, 2020 on the AMD Instinct™ MI100 (32GB HBM2 PCIe® card) accelerator at 1,502 MHz peak engine clock resulted in 46.1 TFLOPS peak theoretical single precision (FP32 Matrix) Math floating-point performance. The Nvidia Ampere A100 (40GB) GPU accelerator published results are 19.5 TFLOPS peak single precision (FP32) floating-point performance. Nvidia results found at: https://www.nvidia.com/content/dam/en-zz/Solutions/Data-Center/nvidia-ampere-architecture-whitepaper.pdf. Server manufacturers may vary configuration offerings yielding different results. MI100-01
  3. Calculations performed by AMD Performance Labs as of Sep 18, 2020 for the AMD Instinct™ MI100 accelerator at 1,502 MHz peak boost engine clock resulted in 184.57 TFLOPS peak theoretical half precision (FP16) and 46.14 TFLOPS peak theoretical single precision (FP32 Matrix) floating-point performance. The results calculated for Radeon Instinct™ MI50 GPU at 1,725 MHz peak engine clock resulted in 26.5 TFLOPS peak theoretical half precision (FP16) and 13.25 TFLOPS peak theoretical single precision (FP32 Matrix) floating-point performance. Server manufacturers may vary configuration offerings yielding different results. MI100-04
  4. Calculations as of SEP 18th, 2020. AMD Instinct™ MI100 built on AMD CDNA technology accelerators supporting PCIe® Gen4 providing up to 64 GB/s peak theoretical transport data bandwidth from CPU to GPU per card. AMD Instinct™ MI100 accelerators include three Infinity Fabric™ links providing up to 276 GB/s peak theoretical GPU to GPU or Peer-to-Peer (P2P) transport rate bandwidth performance per GPU card. Combined with PCIe Gen4 support providing an aggregate GPU card I/O peak bandwidth of up to 340 GB/s. MI100s have three links: 92 GB/s * 3 links per GPU = 276 GB/s. Four GPU hives provide up to 552 GB/s peak theoretical P2P performance. Dual 4 GPU hives in a server provide up to 1.1 TB/s total peak theoretical direct P2P performance per server. AMD Infinity Fabric link technology not enabled: Four GPU hives provide up to 256 GB/s peak theoretical P2P performance with PCIe® 4.0. Server manufacturers may vary configuration offerings yielding different results. MI100-07
  5. Calculations by AMD Performance Labs as of Oct 5th, 2020 for the AMD Instinct™ MI100 accelerator designed with AMD CDNA 7nm FinFET process technology at 1,200 MHz peak memory clock resulted in 1.2288 TFLOPS peak theoretical memory bandwidth performance. The results calculated for Radeon Instinct™ MI50 GPU designed with “Vega” 7nm FinFET process technology with 1,000 MHz peak memory clock resulted in 1.024 TFLOPS peak theoretical memory bandwidth performance. CDNA-04
  6. Works with PCIe® Gen 4.0 and Gen 3.0 compliant motherboards. Performance may vary from motherboard to motherboard. Refer to system or motherboard provider for individual product performance and features.
  7. Testing Conducted by AMD performance labs as of October 30th, 2020, on three platforms and software versions typical for the launch dates of the Radeon Instinct MI25 (2018), MI50 (2019) and AMD Instinct MI100 GPU (2020) running the benchmark application Quicksilver. MI100 platform (2020): Gigabyte G482-Z51-00 system comprised of Dual Socket AMD EPYC™ 7702 64-Core Processor, AMD Instinct™ MI100 GPU, ROCm™ 3.10 driver, 512GB DDR4, RHEL 8.2.  MI50 platform (2019): Supermicro® SYS-4029GP-TRT2 system comprised of Dual Socket Intel Xeon® Gold® 6132, Radeon Instinct™ MI50 GPU, ROCm 2.10 driver, 256 GB DDR4, SLES15SP1. MI25 platform (2018): Supermicro SYS-4028GR-TR2 system comprised of Dual Socket Intel Xeon CPU E5-2690, Radeon Instinct™ MI25 GPU, ROCm 2.0.89 driver, 246GB DDR4 system memory, Ubuntu 16.04.5 LTS. MI100-14
  8. Testing Conducted by AMD performance labs as of October 30th, 2020, on three platforms and software versions typical for the launch dates of the Radeon Instinct MI25 (2018), MI50 (2019) and AMD Instinct MI100 GPU (2020) running the benchmark application TensorFlow ResNet 50 FP 16 batch size 128. MI100 platform (2020): Gigabyte G482-Z51-00 system comprised of Dual Socket AMD EPYC™ 7702 64-Core Processor, AMD Instinct™ MI100 GPU, ROCm™ 3.10 driver, 512GB DDR4, RHEL 8.2. MI50 platform (2019): Supermicro® SYS-4029GP-TRT2 system comprised of Dual Socket Intel Xeon® Gold® 6254, Radeon Instinct™ MI50 GPU, ROCm 3.0.6 driver, 338 GB DDR4, Ubuntu® 16.04.6 LTS. MI25 platform (2018): a Supermicro SYS-4028GR-TR2 system comprised of Dual Socket Intel Xeon CPU E5-2690, Radeon Instinct™ MI25 GPU, ROCm 2.0.89 driver, 246GB DDR4 system memory, Ubuntu 16.04.5 LTS. MI100-15

Contacts:
Gary Silcott
AMD Communications
+1 512-602-0889
Gary.Silcott@amd.com

Laura Graves
AMD Investor Relations
+1 408-749-5467
Laura.Graves@amd.com

Primary Logo

Source: Advanced Micro Devices, Inc.

AMD EPYC™ Processors and New AMD Instinct™ MI100 Accelerator Redefine Performance for HPC and Scientific Research

Support for next generation AMD EPYC processors, codenamed ‘Milan,’ in new HBv3 Virtual Machines announced by Microsoft

AMD Instinct™ MI100 accelerator is first accelerator to use new AMD CDNA architecture dedicated to high-performance computing (HPC) workloads

SANTA CLARA, Calif., Nov. 16, 2020 (GLOBE NEWSWIRE) -- During this year’s SC20 virtual tradeshow, AMD (NASDAQ: AMD) is showcasing its leadership in the high performance computing (HPC) industry. It launched the new AMD Instinct™ MI100 accelerator with ROCm™ 4.0 open ecosystem support and showcased a growing list of AMD EPYC™ CPU and AMD Instinct accelerator based deployments, and highlighted its collaboration with Microsoft Azure for HPC in the cloud. AMD also remains on track to begin volume shipments of the 3rd Gen EPYC processors with “Zen 3” core to select HPC and cloud customers this quarter in advance of the expected public launch in Q1 2021, aligned with OEM availability.

The new AMD InstinctMI100 accelerator, is the world’s fastest HPC GPU accelerator for scientific workloads and the first to surpass the 10 teraflops (FP64) performance barrier 1. Built on the new AMD CDNA architecture, the AMD Instinct MI100 GPU enables a new class of accelerated systems for HPC and AI when paired with 2nd Gen AMD EPYC processors. Supported by new accelerated compute platforms from Dell, HPE, Gigabyte and Supermicro, the MI100, combined with AMD EPYC CPUs and ROCm 4.0 software, is designed to propel new discoveries ahead of the exascale era.

“No two customers are the same in HPC, and AMD is providing a path to today’s most advanced technologies and capabilities that are critical to support their HPC work, from small clusters on premise, to virtual machines in the cloud, all the way to exascale supercomputers,” said Forrest Norrod, senior vice president and general manager, Data Center and Embedded Solutions Business Group, AMD. “Combining AMD EPYC processors and Instinct accelerators with critical application software and development tools enables AMD to deliver leadership performance for HPC workloads.”

AMD and Microsoft Azure Power HPC In the Cloud

Azure is using 2nd Gen AMD EPYC processors to power its HBv2 virtual machines (VMs) for HPC workloads. These VMs offer up to 2x the performance of first-generation HB-series virtual machines2, can support up to 80,000 cores for MPI jobs3, and take advantage of 2nd Gen AMD EPYC processors’ up to 45% more memory bandwidth than comparable x86 alternatives4.

HBv2 VMs are used by numerous customers including The University of Illinois at Urbana-Champaign’s Beckman Institute for Advanced Science & Technology which used 86,400 cores to model a plant virus that previously required a leadership class supercomputer and the U.S. Navy which rapidly deploys and scales enhanced weather and ocean pattern predictions on demand. HBv2 powered by 2nd Gen AMD EPYC processors also provides the bulk of the CPU compute power for the OpenAI environment Microsoft announced earlier this year.

AMD EPYC processors have also helped HBv2 reach new cloud HPC milestones, such as a new record for Cloud MPI scaling results with NAMD, Top 20 results on the Graph500, and the first 1 terabyte/sec cloud HPC parallel filesystem. Across these and other application benchmarks, HBv2 is delivering 12x higher scaling than found elsewhere on the public cloud.

Adding on to its existing HBv2 HPC virtual machine powered by 2nd Gen AMD EPYC processors, Azure announced it will utilize next generation AMD EPYC processors, codenamed ‘Milan’, for future HB-series VM products for HPC.

You can see more about the AMD and Azure collaboration in this video with Jason Zander of Azure and Lisa Su of AMD.

AMD Continues to Be the Choice for HPC

AMD EPYC processors and Instinct accelerators have the performance and capabilities to support numerous HPC workloads across a variety of implementations. From small clusters at research centers, to commercial HPC, to off premise and in the cloud, to exascale computing, AMD continues to provide performance and choice for HPC solutions.

Hewlett Packard Enterprise (HPE), CSC Finland and EuroHPC recently introduced a new pre-exascale system, LUMI. Based on the HPE Cray EX supercomputer architecture, LUMI will use next generation AMD EPYC CPUs and Instinct accelerators and is expected to provide a peak performance of 552 petaflops when it comes online in 2021, making it one of the fastest supercomputers in the world.

Beyond LUMI, AMD powered HPC systems continue to grow in volume. Since SC19, there have been more than 15 supercomputing systems announced using AMD EPYC CPUs, Instinct GPUs, or both. A highlight of the systems includes

  • Chicoma – Los Alamos National Laboratory – this system is based on the HPE Cray EX supercomputer architecture and uses 2nd Gen AMD EPYC CPUs, combined with 300 terabytes of system memory for COVID-19 research,
  • Corona – Lawrence Livermore National Laboratory – this system was recently upgraded with funding from the Coronavirus Aid, Relief and Economic Security (CARES) Act, adding nearly 1,000 AMD Instinct MI50 accelerators, pushing peak performance to more than 11 petaFLOPS,
  • Mammoth – Lawrence Livermore National Laboratory – the “big memory” cluster uses 2nd Gen AMD EPYC Processors to perform genomics analysis and graph analytics required by scientists working on COVID-19.
  • Northern Data – a distributed computing system in Europe that is using AMD EPYC CPUs and Instinct accelerators for large scale HPC applications such as rendering, artificial intelligence and deep learning,
  • Pawsey Supercomputing Centre – Using the HPE Cray EX supercomputer architecture and future AMD EPYC CPUs and AMD Instinct accelerators, the supercomputer at Pawsey will be Australia’s most powerful supercomputer.

In addition, AMD is also powering the following supercomputers: Anvil and Bell – Purdue University, Big Red 200 – Indiana University, Bridges 2 – Pittsburgh Supercomputing Center, CERN, European Centre for Medium-Range Weather Forecasts, Expanse – San Diego Supercomputer Center, Goethe University Frankfurt, IT4Innovations National Supercomputing Center, Jetstream 2 – Indiana University, Mahti – CSC, Mangi – University of Minnesota, National Oceanic and Atmospheric Administration, Red Raider – Texas Tech University, TinkerCliffs – Virginia Tech.

“With the Expanse supercomputer, our goal is to give scientists and researchers cloud-like access to a high-performance machine that can handle everything from astrophysics to zoology,” said Michael Norman, Director of the San Diego Supercomputer Center. “The 2nd Gen AMD EPYC processors have helped us achieve fantastic performance with Expanse, enabling our researchers to do more science than before. We also have a great collaboration with AMD and have worked together to create a forum for AMD HPC customers to share experiences, information and more, to better benefit HPC research.”

Paving the Path to Exascale Computing

To help researchers start on the path to exascale, AMD has provided Oak Ridge National Labs access to the new AMD Instinct MI100 accelerator, which delivers a giant leap in compute and interconnect performance. The Instinct MI100 accelerator enables a new class of accelerated systems and delivers true heterogeneous compute capabilities from AMD for HPC and AI. Designed to complement the 2nd Gen AMD EPYC processors, and built on the AMD Infinity Architecture, the AMD Instinct MI100 delivers true heterogeneous compute capabilities from AMD for HPC and AI.

“Frontier, powered by AMD, represents a huge increase in computational power compared to today’s systems. It’s going to allow scientists to answer questions that we didn't have the answer to before,” said Bronson Messer, director of science, Oak Ridge Leadership Computing Facility. “The ability to run molecular simulations that aren't just a few million atoms, but a few billion atoms, provides a more realistic representation of the science, and to be able to do that as a matter of course and over and over again will lead to a significant amount of important discoveries.”

AMD continues to provide the performance, capabilities and scale needed to power current and future HPC workloads, no matter if they are helping students at a research center, improving aerodynamic efficiency for an auto manufacturer, or providing valuable insights for critical medical breakthroughs. Read more about the AMD presence at SC20 and its HPC capabilities here.

Supporting Resources

About AMD
For more than 50 years AMD has driven innovation in high-performance computing, graphics and visualization technologies ― the building blocks for gaming, immersive platforms and the data center. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ: AMD) websiteblogFacebook and Twitter pages.

CAUTIONARY STATEMENT

This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as the features, functionality, performance, availability, timing and expected benefits of AMD products including the next generation AMD EPYCTM Processors and AMD InstinctTM MI100 Accelerator and the expected timing and benefits of AMD partnerships, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation’s dominance of the microprocessor market and its aggressive business practices; the ability of third party manufacturers to manufacture AMD's products on a timely basis in sufficient quantities and using competitive technologies; expected manufacturing yields for AMD’s products; the availability of essential equipment, materials or manufacturing processes; AMD's ability to introduce products on a timely basis with features and performance levels that provide value to its customers; global economic uncertainty; the loss of a significant customer; AMD's ability to generate revenue from its semi-custom SoC products;  the impact of the COVID-19 pandemic on AMD’s business, financial condition and results of operations; political, legal, economic risks and natural disasters; the impact of government actions and regulations such as export administration regulations, tariffs and trade protection measures; the impact of acquisitions, joint ventures and/or investments on AMD's business, including the announced acquisition of Xilinx, and the failure to integrate acquired businesses; AMD’s ability to complete the Xilinx merger; the impact of the announcement and pendency of the Xilinx merger on AMD’s business; potential security vulnerabilities; potential IT outages, data loss, data breaches and cyber-attacks; uncertainties involving the ordering and shipment of AMD’s products; quarterly and seasonal sales patterns; the restrictions imposed by agreements governing AMD’s notes and the revolving credit facility; the competitive markets in which AMD’s products are sold; market conditions of the industries in which AMD products are sold; AMD’s reliance on third-party intellectual property to design and introduce new products in a timely manner; AMD's reliance on third-party companies for the design, manufacture and supply of motherboards, software and other computer platform components; AMD's reliance on Microsoft Corporation and other software vendors' support to design and develop software to run on AMD’s products; AMD’s reliance on third-party distributors and add-in-board partners; the potential dilutive effect if the 2.125% Convertible Senior Notes due 2026 are converted; future impairments of goodwill and technology license purchases; AMD’s ability to attract and retain qualified personnel; AMD's ability to generate sufficient revenue and operating cash flow or obtain external financing for research and development or other strategic investments; AMD's indebtedness; AMD's ability to generate sufficient cash to service its debt obligations or meet its working capital requirements; AMD's ability to repurchase its outstanding debt in the event of a change of control; the cyclical nature of the semiconductor industry; the impact of modification or interruption of AMD’s internal business processes and information systems; compatibility of AMD’s products with some or all industry-standard software and hardware; costs related to defective products; the efficiency of AMD's supply chain; AMD's ability to rely on third party supply-chain logistics functions; AMD’s stock price volatility; worldwide political conditions; unfavorable currency exchange rate fluctuations; AMD’s ability to effectively control the sales of its products on the gray market; AMD's ability to adequately protect its technology or other intellectual property; current and future claims and litigation; potential tax liabilities; and the impact of environmental laws, conflict minerals-related provisions and other laws or regulations. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to AMD’s Quarterly Report on Form 10-Q for the quarter ended September 26, 2020.

©2020 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, EPYC, AMD Instinct, and combinations thereof are trademarks of Advanced Micro Devices, Inc. PCIe is a registered trademark of PCI-SIG Corporation. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

________________________________

1 Calculations conducted by AMD Performance Labs as of Sep 18, 2020 for the AMD Instinct™ MI100 (32GB HBM2 PCIe® card) accelerator at 1,502 MHz peak boost engine clock resulted in 11.54 TFLOPS peak double precision (FP64), 46.1 TFLOPS peak single precision matrix (FP32), 23.1 TFLOPS peak single precision (FP32), 184.6 TFLOPS peak half precision (FP16) peak theoretical, floating-point performance. Published results on the NVidia Ampere A100 (40GB) GPU accelerator resulted in 9.7 TFLOPS peak double precision (FP64). 19.5 TFLOPS peak single precision (FP32), 78 TFLOPS peak half precision (FP16) theoretical, floating-point performance. Server manufacturers may vary configuration offerings yielding different results. MI100-03
2 Source: https://azure.microsoft.com/en-us/blog/introducing-the-new-hbv2-azure-virtual-machines-for-high-performance-computing/
3 Source: https://azure.microsoft.com/en-us/blog/azure-hbv2-virtual-machines-eclipse-80000-cores-for-mpi-hpc/
4 AMD EPYC™ 7002 Series processors have 45% more memory bandwidth than Intel Scalable processors in the same class.


Contacts:
Gary Silcott
AMD Communications
+1 512-602-0889
Gary.Silcott@amd.com

Laura Graves
AMD Investor Relations
+1 408-749-5467
Laura.Graves@amd.com

Primary Logo

Source: Advanced Micro Devices, Inc.

AMD Unveils AMD Ryzen™ Embedded V2000 Processors with Enhanced Performance and Power Efficiency

— AMD Ryzen Embedded V2000 Series processors deliver double the cores1, up to 2x the performance-per-watt2 and an estimated 15 percent IPC uplift3 over the previous generation

SANTA CLARA, Calif., Nov. 10, 2020 (GLOBE NEWSWIRE) -- AMD (NASDAQ: AMD) today launched a new product in its high-performance Embedded processor family, the AMD Ryzen™ Embedded V2000 Series processor. Built on the innovative 7nm process technology, ‘Zen 2’ cores and high-performance AMD Radeon™ graphics, the AMD Ryzen Embedded V2000 Series provides a new class of performance with 7nm technology, incredible power efficiency and continues to deliver enterprise-class security features for embedded customers.

The AMD Embedded Ryzen V2000 family is designed for embedded applications such as Thin Client, MiniPC and Edge systems. Equipped with up to eight CPU cores and seven GPU compute units, a single AMD Ryzen Embedded V2000 Series processor provides 2x4 the multi-threaded performance-per-watt, up to 30 percent5 better single-thread CPU performance and up to 40 percent6 better graphics performance over the previous generation. For customers and applications that need high-performance display capabilities, the Ryzen Embedded V2000 series can power up to four independent displays in 4K resolution.

“AMD is continuing to deliver high performance embedded processors for our customers with the new Ryzen Embedded V2000 series,” said Rajneesh Gaur, corporate vice president and general manager, Embedded Business, AMD. “Pairing the ‘Zen 2’ CPU cores with Radeon graphics, we’re now providing our customers with a new class of performance and power efficiency with 7nm technology that enables them to implement unique designs that target their applications. We continue the 10-year planned availability as with our other Ryzen Embedded processors and look forward to seeing partners and customers utilizing fast processing speeds, integrated graphics and outstanding power efficiency of the Ryzen Embedded V2000 processor for years to come.”

Keeping Security Top of Mind

In addition to providing customers with generationally improved performance and efficiency, the AMD Ryzen Embedded V2000 Series processor continues providing advanced security features, helping to defend against unauthorized access to memory or critical software. Similar to the AMD Ryzen Embedded V1000 and R1000 Series, the AMD Ryzen Embedded V2000 will support AMD Memory Guard, a suite of security features including Secure Boot and Secure Memory Encryption, in which stored memory is encrypted to help prevent an attacker from accessing the data, as well as helps to mitigate cold boot attacks.

Growing the Ryzen Embedded Family

With support for rich multimedia capabilities, the AMD Ryzen Embedded processor ecosystem includes a strong roster of key customers and partners who rely on the AMD Ryzen Embedded V1000 and R1000 Series processors. Initial launch partners of the AMD Ryzen Embedded V2000 series include Advantech, ASRock Industrial, iBase and Sapphire, with numerous other ecosystem partners pledging their support.

As a current provider of AMD Ryzen Embedded V1000 and R1000 Series-based Mini PCs, ASRock Industrial is adding support for the new V2000 Series to its Mini PC lineup. “By working with AMD, we were able to deliver the first AMD Ryzen Embedded Mini PC system in the world, providing reliable, high-performance solutions. With the launch of the AMD Ryzen Embedded V2000 Series, we are looking forward to implementing the new enhanced performance and security capabilities into our family of 4x4 products,” said James Lee, President of ASRock Industrial.

Advantech is supporting the new V2000 Series in its Mini-ITX and COM Express solutions by Embedded IoT Group. “Our customers rely on us to deliver innovative embedded products with superior performance and reliable hardware design to accelerate the revolution on Edge AIoT applications. The planned longevity with CPU and GPU integration of the V2000 Series from AMD will help us continue to offer leading performance to the embedded market,” said Rex Lee, Director at Advantech.

Additionally, Sapphire is utilizing the AMD Ryzen Embedded V2000 Series to target the Mini PC and other segments. “The AMD Ryzen Embedded products have been an excellent choice for us building platforms with leading performance and features. The V2000 series sets a new standard for embedded designs and allows us to offer the performance to support four independent displays in 4 resolution, while maintaining a secure host connection. We are excited to bring the embedded industry the performance and features from the Ryzen Embedded V2000 series with our new 4x4 and 5x5 motherboards and the new Simply NUC Mini PC,” said Paul Smith, senior director of Business Development for Embedded Products at Sapphire.

AMD Ryzen Embedded V2000 Series Processor Overview

Model TDP
Range
CPU
Core /
Thread
Count
CPU
Base
Freq.
GHz
1T CPU
Boost
Freq.
GHz
@80C (Up
to)*
Radeon
Graphics
Compute
Unit
Count
Graphics
Freq.
GHz
(
up to
max)
Max # of
simultaneous
displays
L2
Cache
DRAM
ECC
V2748 35-54W 8 / 16 2.9 GHz 4.25 GHz 7 1.6 GHz 4 4 MB 3200
V2546 35-54W 6 / 12 3.0 GHz 3.95 GHz 6 1.5 GHz 4 3 MB 3200
V2718 10-25W 8 / 16 1.7 GHz 4.15 GHz 7 1.6 GHz 4 4 MB 3200
V2516 10-25W 6 / 12 2.1 GHz 3.95 GHz 6 1.5 GHz 4 3 MB 3200

Supporting Resources

AMD, the AMD Arrow logo, Ryzen, Radeon and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

About AMD
For more than 50 years AMD has driven innovation in high-performance computing, graphics and visualization technologies ― the building blocks for gaming, immersive platforms and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ: AMD) websiteblogFacebook and Twitter pages.

1 Ryzen™ Embedded V2000 SoCs offer up to eight CPU cores. Ryzen™ Embedded V1000 SoCs offer up to four CPU cores. EMB-168
2 Testing conducted by AMD Performance Labs as of July 2020 on the Ryzen™ Embedded V2718 and June 2018 on the Ryzen Embedded V1605B processor both at 15 watts (STAPM mode enabled) using Cinebench R15 nt. Results may vary. EMB-170
3 AMD “Zen 2” CPU-based system scored an estimated 15% higher than previous generation AMD “Zen” based system using estimated SPECint®_base2006 results. SPEC® and SPECint® are registered trademarks of the Standard Performance Evaluation Corporation. See www.spec.org. GD-141
4 Testing conducted by AMD Performance Labs as of July 2020 on the Ryzen™ Embedded V2718 and June 2018 on the Ryzen Embedded V1605B processor both at 15 watts (STAPM mode enabled) using Cinebench R15 nt. Results may vary. EMB-169 
5 Testing conducted by AMD Performance Labs as of July 2020 on the Ryzen™ Embedded V2718 and June 2018 on the Ryzen Embedded V1605B processor both at 15 watts (STAPM mode enabled) using Cinebench R15 1T. Results may vary. EMB-171
6 Testing conducted by AMD Performance Labs as of July 2020 on the Ryzen™ Embedded V2718 and June 2018 on the Ryzen Embedded V1605B processor both at 15 watts (STAPM mode enabled) using 3DMark11. Results may vary. EMB-172

Contacts:
Aaron Grabein
AMD Communications
+1 512-602-8950
Aaron.Grabein@amd.com

Laura Graves
AMD Investor Relations
+1 408-749-5467
Laura.Graves@amd.com

Primary Logo

Source: Advanced Micro Devices, Inc.

AMD Unveils Next-Generation PC Gaming with AMD Radeon™ RX 6000 Series – Bringing Leadership 4K Resolution Performance to AAA Gaming

– Groundbreaking AMD RDNA™ 2 gaming architecture delivers up to 2X higher performance1 and up to 54 percent higher performance-per-watt compared to AMD RDNA™-based graphics cards2

AMD Radeon™ RX 6900 XT graphics card
AMD Radeon™ RX 6900 XT graphics card


AMD Radeon™ RX 6000 Series die shot
AMD Radeon™ RX 6000 Series die shot


New flagship AMD Radeon™ RX 6900 XT is the ultimate 4K graphics card, and the fastest ever AMD gaming graphics card –

SANTA CLARA, Calif., Oct. 28, 2020 (GLOBE NEWSWIRE) -- AMD (NASDAQ: AMD) today unveiled the AMD Radeon™ RX 6000 Series graphics cards, delivering powerhouse performance, incredibly life-like visuals, and must-have features that set a new standard for enthusiast-class PC gaming experiences. Representing the forefront of extreme engineering and design, the highly anticipated AMD Radeon™ RX 6000 Series includes the AMD Radeon™ RX 6800 and Radeon™ RX 6800 XT graphics cards, as well as the new flagship Radeon™ RX 6900 XT – the fastest AMD gaming graphics card ever developed.

AMD Radeon™ RX 6000 Series graphics cards are built upon groundbreaking AMD RDNA™ 2 gaming architecture, a new foundation for next-generation consoles, PCs, laptops and mobile devices, designed to deliver the optimal combination of performance and power efficiency. AMD RDNA™ 2 gaming architecture provides up to 2X higher performance in select titles with the AMD Radeon™ RX 6900 XT graphics card compared to the AMD Radeon™ RX 5700 XT graphics card built on AMD RDNA™ architecture1, and up to 54 percent more performance-per-watt when comparing the AMD Radeon™ RX 6800 XT graphics card to the AMD Radeon™ RX 5700 XT graphics card using the same 7nm process technology2.

AMD RDNA™ 2 offers a number of innovations, including applying advanced power saving techniques to high-performance compute units to improve energy efficiency by up to 30 percent per cycle per compute unit3, and leveraging high-speed design methodologies to provide up to a 30 percent frequency boost at the same power level4. It also includes new AMD Infinity Cache technology that offers up to 2.4X greater bandwidth-per-watt compared to GDDR6-only AMD RDNA™-based architectural designs5.

“Today’s announcement is the culmination of years of R&D focused on bringing the best of AMD Radeon graphics to the enthusiast and ultra-enthusiast gaming markets, and represents a major evolution in PC gaming,” said Scott Herkelman, corporate vice president and general manager, Graphics Business Unit at AMD. “The new AMD Radeon RX 6800, RX 6800 XT and RX 6900 XT graphics cards deliver world class 4K and 1440p performance in major AAA titles, new levels of immersion with breathtaking life-like visuals, and must-have features that provide the ultimate gaming experiences. I can’t wait for gamers to get these incredible new graphics cards in their hands.”

Powerhouse Performance, Vivid Visuals & Incredible Gaming Experiences

AMD Radeon™ RX 6000 Series graphics cards support high-bandwidth PCIe® 4.0 technology and feature 16GB of GDDR6 memory to power the most demanding 4K workloads today and in the future. Key features and capabilities include:

Powerhouse Performance

  • AMD Infinity Cache A high-performance, last-level data cache suitable for 4K and 1440p gaming with the highest level of detail enabled. 128 MB of on-die cache dramatically reduces latency6 and power consumption7, delivering higher overall gaming performance than traditional architectural designs.
  • AMD Smart Access Memory8 – An exclusive feature of systems with AMD Ryzen™ 5000 Series processors, AMD B550 and X570 motherboards and Radeon™ RX 6000 Series graphics cards. It gives AMD Ryzen™ processors greater access to the high-speed GDDR6 graphics memory, accelerating CPU processing and providing up to a 13-percent performance increase on a AMD Radeon™ RX 6800 XT graphics card in Forza Horizon™ 4 at 4K when combined with the new Rage Mode one-click overclocking setting.9,10
  • Built for Standard Chassis – With a length of 267mm and 2x8 standard 8-pin power connectors, and designed to operate with existing enthusiast-class 650W-750W power supplies, gamers can easily upgrade their existing large to small form factor PCs without additional cost.

True to Life, High-Fidelity Visuals

  • DirectX® 12 Ultimate Support – Provides a powerful blend of raytracing, compute, and rasterized effects, such as DirectX® Raytracing (DXR) and Variable Rate Shading, to elevate games to a new level of realism.
  • DirectX® Raytracing (DXR) – Adding a high performance, fixed-function Ray Accelerator engine to each compute unit, AMD RDNA™ 2-based graphics cards are optimized to deliver real-time lighting, shadow and reflection realism with DXR. When paired with AMD FidelityFX, which enables hybrid rendering, developers can combine rasterized and ray-traced effects to ensure an optimal combination of image quality and performance.
  • AMD FidelityFX – An open-source toolkit for game developers available on AMD GPUOpen. It features a collection of lighting, shadow and reflection effects that make it easier for developers to add high-quality post-process effects that make games look beautiful while offering the optimal balance of visual fidelity and performance.
  • Variable Rate Shading (VRS) – Dynamically reduces the shading rate for different areas of a frame that do not require a high level of visual detail, delivering higher levels of overall performance with little to no perceptible change in image quality.

Elevated Gaming Experience

  • Microsoft® DirectStorage Support – Future support for the DirectStorage API enables lightning-fast load times and high-quality textures by eliminating storage API-related bottlenecks and limiting CPU involvement.
  • Radeon Software Performance Tuning Presets – Simple one-click presets in Radeon™ Software help gamers easily extract the most from their graphics card. The presets include the new Rage Mode stable over clocking setting that takes advantage of extra available headroom to deliver higher gaming performance10.
  • Radeon™ Anti-Lag11 – Significantly decreases input-to-display response times and offers a competitive edge in gameplay.

AMD Radeon RX 6000 Series Product Family

Model Compute Units GDDR6 Game Clock12 (MHz) Boost Clock13 (MHZ) Memory Interface Infinity Cache
AMD Radeon™ RX 6900 XT 80 16GB 2015 Up to 2250 256 bit 128 MB
AMD Radeon™ RX 6800 XT 72 16GB 2015 Up to 2250 256 bit 128 MB
AMD Radeon™ RX 6800 60 16GB 1815 Up to
2105
256 bit 128 MB

Robust Gaming Ecosystem and Partnerships

In the coming weeks, AMD will release a series of videos from its ISV partners showcasing the incredible gaming experiences enabled by AMD Radeon™ RX 6000 Series graphics cards in some of this year’s most anticipated games. These videos can be viewed on the AMD website.

  • DIRT® 5 – October 29
  • Godfall – November 2
  • World of Warcraft®: Shadowlands – November 10
  • RiftBreaker – November 12
  • FarCry® 6 – November 17

Pricing and Availability

AMD Radeon™ RX 6800 and Radeon™ RX 6800 XT graphics cards are expected to be available from global etailers/retailers and on AMD.com beginning November 18, 2020, for $579 USD SEP and $649 USD SEP, respectively. The AMD Radeon™ RX 6900 XT is expected to be available December 8, 2020, for $999 USD SEP.

AMD Radeon™ RX 6800 and RX 6800 XT graphics cards are also expected to be available from AMD board partners, including ASRock, ASUS, Gigabyte, MSI, PowerColor, SAPPHIRE and XFX, beginning in November 2020.

Supporting Resources

  • Lean more about the AMD Radeon™ RX 6000 Series here
  • Learn more about AMD RDNA™ 2 graphics architecture here
  • Learn more about the AMD Radeon™ Software here
  • Learn more about AMD Ryzen™ 5000 Series here
  • Become a fan of AMD on Facebook
  • Follow AMD on Twitter

About AMD
For 50 years AMD has driven innovation in high-performance computing, graphics and visualization technologies ― the building blocks for gaming, immersive platforms and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ:AMD) websiteblogFacebook and Twitter pages. 

CAUTIONARY STATEMENT

This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as the features, functionality, performance, availability, timing and expected benefits of AMD products including the AMD RadeonTM RX 6000 Series graphics cards, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation’s dominance of the microprocessor market and its aggressive business practices; the ability of third party manufacturers to manufacture AMD's products on a timely basis in sufficient quantities and using competitive technologies; expected manufacturing yields for AMD’s products; the availability of essential equipment, materials or manufacturing processes; AMD's ability to introduce products on a timely basis with features and performance levels that provide value to its customers; global economic uncertainty; the loss of a significant customer; AMD's ability to generate revenue from its semi-custom SoC products;  the impact of the COVID-19 pandemic on AMD’s business, financial condition and results of operations; political, legal, economic risks and natural disasters; the impact of government actions and regulations such as export administration regulations, tariffs and trade protection measures; the impact of acquisitions, joint ventures and/or investments on AMD's business; potential security vulnerabilities; potential IT outages, data loss, data breaches and cyber-attacks; uncertainties involving the ordering and shipment of AMD’s products; quarterly and seasonal sales patterns; the restrictions imposed by agreements governing AMD’s notes and the revolving credit facility; the competitive markets in which AMD’s products are sold; market conditions of the industries in which AMD products are sold; AMD’s reliance on third-party intellectual property to design and introduce new products in a timely manner; AMD's reliance on third-party companies for the design, manufacture and supply of motherboards, software and other computer platform components; AMD's reliance on Microsoft Corporation and other software vendors' support to design and develop software to run on AMD’s products; AMD’s reliance on third-party distributors and add-in-board partners; the potential dilutive effect if the 2.125% Convertible Senior Notes due 2026 are converted; future impairments of goodwill and technology license purchases; AMD’s ability to attract and retain qualified personnel; AMD's ability to generate sufficient revenue and operating cash flow or obtain external financing for research and development or other strategic investments; AMD's indebtedness; AMD's ability to generate sufficient cash to service its debt obligations or meet its working capital requirements; AMD's ability to repurchase its outstanding debt in the event of a change of control; the cyclical nature of the semiconductor industry; the impact of modification or interruption of AMD’s internal business processes and information systems; compatibility of AMD’s products with some or all industry-standard software and hardware; costs related to defective products; the efficiency of AMD's supply chain; AMD's ability to rely on third party supply-chain logistics functions; AMD’s stock price volatility; worldwide political conditions; unfavorable currency exchange rate fluctuations; AMD’s ability to effectively control the sales of its products on the gray market; AMD's ability to adequately protect its technology or other intellectual property; current and future claims and litigation; potential tax liabilities; and the impact of environmental laws, conflict minerals-related provisions and other laws or regulations. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to AMD’s Quarterly Report on Form 10-Q for the quarter ended September 26, 2020.

©2020 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, Radeon, FreeSync, and combinations thereof are trademarks of Advanced Micro Devices, Inc. DirectX is a registered trademark of Microsoft Corporation in the US and other jurisdictions. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

The information contained herein is for informational purposes only, and is subject to change without notice. Timelines, roadmaps, and/or product release dates shown in this Press Release are plans only and subject to change. “Navi” is an AMD codename and is not a product name.

___________________________________

1 Testing done by AMD performance labs October 20 2020 on a Radeon RX 6900 XT and Radeon RX 5700 XT (20.45-201013n driver), AMD Ryzen 9 5900X (3.70GHz) CPU, 16GB DDR4-3200MHz, Engineering AM4 motherboard, Win10 Pro 64. The Following games were tested at 4k at max settings: Battlefield V DX11, Doom Eternal Vulkan, Forza DX12, Resident Evil 3 DX11, Shadow of the Tomb Raider DX12. Performance may vary. RX-558
2 RX-549 - Testing done by AMD performance labs 10/16/20, using Assassins Creed Odyssey (DX11, Ultra), Battlefield V (DX12, Ultra), Borderlands 3 (DX12, Ultra), Control (DX12, High), Death Stranding (DX12 Ultra), Division 2 (DX12, Ultra), F1 2020 (DX12, Ultra), Far Cry 5 (DX11, Ultra), Gears of War 5 (DX12, Ultra), Hitman 2 (DX12, Ultra), Horizon Zero Dawn (DX12, Ultra), Metro Exodus (DX12, Ultra), Resident Evil 3 (DX12, Ultra), Shadow of the Tomb Raider (DX12, Highest), Strange Brigade (DX12, Ultra), Total War Three Kingdoms (DX11, Ultra), Witcher 3 (DX11, Ultra no HairWorks) at 4K. System comprised of a Radeon RX 6800 XT with AMD Radeon Graphics driver 27.20.12031.1000 and an Radeon RX 5700 XT with AMD Radeon Graphics driver 26.20.13001.9005. Performance may vary. RX-549
3 AMD internal modeling based on the average CAC of 33 apps tested on the RX 5700 XT and RX 6900 XT divided by the number of active compute units 40 and 80, respectively. Performance will vary. RX-543
4 AMD internal modeling based on graphics-engine-only measured average gaming power consumption and 3DMark11 power consumption vs. frequency for RX5700 XT and RX 6900 XT divided by the number of compute units (40 and 80 respectively). RX-536
5 Measurement calculated by AMD engineering, on a Radeon RX 6000 series card with 128 MB AMD Infinity Cache and 256-bit GDDR6. Measuring 4k gaming average AMD Infinity Cache hit rates of 58% across top gaming titles, multiplied by theoretical peak bandwidth from the 16 64B AMD Infinity Fabric channels connecting the Cache to the Graphics Engine at boost frequency of up to 1.94 GHz. RX-547
6 Based on internal modeling and testing done by AMD engineering labs 10/5/2020 on Radeon RX 6800 XT with 128 MB of AMD Infinity Cache vs a Radeon RX 5700 XT graphics card measuring memory latency. Performance may vary. RX-564
7 Based on internal modeling and testing done by AMD engineering labs 10/5/2020 on a Radeon RX 6800 XT vs a Radeon RX 5700 XT, using measurements taken of Cac, frequency at same power uplifts, and AMD Infinity Cache uplifts. Performance may vary. RX-566
8 AMD Smart Access Memory is only supported on AMD Radeon RX 6000 series graphics cards. Not validated on any other graphics solutions. GD-178.
9 Testing done by AMD performance labs October 18 2020 on Radeon RX 6800 XT (20.45-201013n driver), RTX 3080 (driver 456.71), AMD Ryzen 9 5900X (3.70GHz) CPU, 16GB DDR4-3200MHz, Engineering AM4 motherboard, Win10 Pro 64. The following games were tested at 4k at max settings with RAGE MODE + SMART ACCESS MEMORY enabled and disabled: Borderlands 3, best API Ultra; Doom Eternal, Vulkan Ultra Nightmare; Forza Horizon 4, DX 12 Ultra; Gears 5, DX12 Ultra; Hitman 2, DX12 Ultra; Resident Evil 3, best API, Ultra; Wolfenstein: Young Blood, Vulkan Mein Leben. Performance may vary. RX-559
10 AMD’s product warranty does not cover damages caused by overclocking, even when overclocking is enabled via AMD hardware and/or software. GD-26
11 Radeon™ Anti-Lag is compatible with DirectX 9 and DirectX 11 APIs, Windows 7 and 10. Hardware compatibility includes GCN and newer consumer dGPUs Ryzen 2000 and newer APUs, including hybrid and detachable graphics configurations. No mGPU support GD-157  
12 Game clock is the expected GPU clock when running typical gaming applications, set to typical TGP (Total Graphics Power). Actual individual game clock results may vary. GD-147
13 Boost Clock Frequency is the maximum frequency achievable on the GPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads. GD-151

Contacts:
George Millington
AMD Communications
(408) 547-7481
George.Millington@amd.com

Jason Schmidt
AMD Investor Relations
(408) 749-6688
Jason.Schmidt@amd.com

Photos accompanying this announcement are available at

https://www.globenewswire.com/NewsRoom/AttachmentNg/8d2c8fbe-ce61-40ba-ba38-2b7ee6f62c99

https://www.globenewswire.com/NewsRoom/AttachmentNg/56b9f51f-b313-41a3-9fc1-0f1bf766c3d4


AMD logo black .jpg

Source: Advanced Micro Devices, Inc.