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New Intel-Powered Retail Experiences to Hit Stores This Year

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Includes Virtual Reality, 3-D Scanning Featuring Boulanger*, Brooks Brothers*, Coop*, Levi Strauss & Co.*, Nordstrom*; Intel Announces First IoT Platform Designed for Retail

SANTA CLARA, Calif., Jan. 18, 2016 – Intel Corporation today unveiled a range of technological innovations that are driving new retail experiences for consumers and enabling retailers to better understand and connect with customers. The solutions feature popular brands including Boulanger*, Brooks Brothers*, Coop*, Levi Strauss & Co.*, and Nordstrom*. The company also announced the Intel® Retail Sensor Platform, the first vertical solution based on the Intel® IoT Platform, designed to enable future retail systems with analytics.

New Retail Experiences
Intel is driving the future of the Internet of Things (IoT) for retail by powering solutions that are behind several new and exciting shopping experiences for customers. These include:

  • Digital scanning with Intel® RealSense™ technology for body measurement to make a custom Brooks Brothers shirt using Size Stream*.
  • Precise foot scanning solution at Nordstrom* using Volumental* technology to give recommendations for shoes that are a great fit.
  • A Capgemini* solution that uses Intel® RealSense™ and Intel® Core™ processors to instantly translate small-scale physical building blocks into customizable 3-D room or store layouts to allow customers to enter a virtual reality model and design their spaces how they want.
  • Coop*, a leading Italian grocer, is showcasing the supermarket of the future, developed by Accenture* in collaboration with Avanade*, featuring Intel technology to recreate the atmosphere of an open-air market with a digital, interactive twist.

“Retailers seem to be turning a corner in terms of using new technologies to better understand their business and connect with customers,” said Joe Jensen, vice president of Intel’s Retail Solutions Division. “In fact, Lightspeed POS recently found that, compared to last year, twice as many independent retailers are currently investing in technology that uses data analytics and software to make smarter buying decisions.”

“We want to serve customers in new and unique ways and we’re constantly testing how technology can enhance our service experience,” Scott Meden, Executive Vice President, GMM of Shoes, Nordstrom. “In our shoe business, fit is a critical component of serving customers and we’re excited to explore improving the accuracy and convenience of finding the right size.”

Understand and Connect with the Customer
Intel technology has been helping retailers lower operating costs, increase sales and secure consumer data for many years. Now, with increased data analytics, retailers are able to better understand and connect with their customers by having more visibility about inventory and customer shopping patterns.

  • WestRock*, a leading retail display provider, is now able to gain real-time inventory insights using conductive ink technology from T+ink* in its intelligent smart shelves and pegs. The technology will enable real-time information about on-shelf product availability and gives retailers the necessary data to ensure they have the right product at the right time.
  • French retailer Boulanger* worked with Capgemini and Intel to create new digital retail spaces in-store. The interactive and content rich environment  helps engage customers with virtual walls, and allows employees and stores to perform better using analytics technologies.
  • Intel continues to drive security for the evolving retail customer experience, with growing ecosystem support for Intel® Data Protection Technology for Transactions, including HP*, Ingenico* and Panasonic*.

New IoT Platforms for Retail
Available today, the new Intel Retail Sensor Platform is the first vertical end-to-end Intel® IoT Platform solution that combines an Intel-based retail sensor, an Intel-based gateway, and the Intel Trusted Analytics Platform (TAP) to provide a simple, affordable way for retailers to gather actionable, near-real-time intelligence – saving money and converting more sales. Levi Strauss and Co. is currently piloting the platform in three stores in the United States.

Demonstrations of the solutions are on display at Intel’s NRF booth (#2543) in New York City’s Jacob K. Javits Convention Center.

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, the Intel logo, Intel Core and Intel RealSense are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

New Intel-Powered Retail Experiences to Hit Stores This Year

by

Includes Virtual Reality, 3-D Scanning Featuring Boulanger*, Brooks Brothers*, Coop*, Levi Strauss & Co.*, Nordstrom*; Intel Announces First IoT Platform Designed for Retail SANTA CLARA, Calif., Jan. 18, 2016 – Intel Corporation today unveiled a range of technological innovations that are driving new retail experiences for consumers and enabling retailers to better understand and connect … Continued

The post New Intel-Powered Retail Experiences to Hit Stores This Year appeared first on Intel Newsroom.

Intel Brings Amazing Experiences to Life at Consumer Electronics Show

by

CES®, Las Vegas, Jan. 5, 2016 – Intel Corporation today showcased the vast power of technology to deliver new and amazing experiences throughout daily life. From the digitization of sports, to advances in health and wellness, to unleashing human creativity through music, art, robotics and invention, the company announced a number of collaborations, products and innovative technologies that make the amazing possible.

Transforming the way people train, view and compete in sports, Intel CEO Brian Krzanich  announced a series of exciting collaborations with leading industry brands that will use technology and data analytics to benefit people’s overall health, fitness and athletic performance. Intel announced plans to work with ESPN* and Red Bull Media House* to design Intel-powered solutions that empower athletes and bring amazing viewing experiences to life, and joint efforts with New Balance* and Oakley* to personalize and advance the tools people use to be more active.

As Intel technology continues to inspire people to create, invent and explore, Krzanich announced a multiyear partnership with The Recording Academy® as part of its official “Next Generation of GRAMMY® Moments” to bring technological innovation to the program so people can see, engage and be amazed by the evolution of technology in music. The first artist to collaborate with Intel to create a unique musical experience – will be six-time GRAMMY®-winning global music icon Lady Gaga.

These collaborations underscore the three trends that Krzanich said are shaping the future: the smart and connected world, technologies gaining human-like senses, and computing becoming ultra-personal.

“There is a rapidly growing role for technology that is at once transformative, unprecedented and accessible,” said Krzanich. “With people choosing experiences over products more than ever before, Intel technology is a catalyst to making amazing new experiences possible, and ultimately improving the world in which we live.”

He also stressed that Intel remains focused on addressing big societal challenges facing the technology industry and foreshadowed plans for a bold, new anti-online harassment effort with Vox Media*, Re/code* and Lady Gaga’s Born This Way Foundation* to promote diversity and inclusion. And he confirmed that Intel is moving beyond just microprocessors to achieve its goal of validating its broader product base as “conflict-free” in 2016**.

“When Intel started its work to address conflict minerals and gaps in diversity and inclusion, we were told by many people that our goals were unrealistic and would be impossible to achieve,” said Krzanich. “Our collective efforts show that we can influence entirely new and different ways of doing business that also improve the human experience.”

Below are more details from announcements featured during the Intel keynote at CES® 2016:

Digitizing the Sports Experience:
Intel announced a collaboration with ESPN to showcase the latest technology set to add new levels of data-powered insights to the feats of athleticism at X Games Aspen 2016. The tiny, low power Intel® Curie™ module will be integrated into the Men’s Snowboard Slopestyle and Men’s Snowboard Big Air competitions to provide real-time data on athlete performance such as in-air rotations, jump height, jump distance, speed, and force on landing. This access to new data will provide athletes with greater insights into their performance, provide additional metrics for on-air analysts, and change the fan experience both at home and in the stands. The competitions will be televised on ESPN and ABC***.

Intel and Red Bull Media House announced a global partnership that will extend into multiple genres and platforms. Red Bull Media House CTO Andreas Gall joined Krzanich on stage to demonstrate how athletes and spectators can get information about the performance instantly with the help of Intel Curie technology, with the promise of more announcements to come in 2016 and beyond.

Intel is working with Replay Technologies* to deliver completely new viewing experiences for sports fans on broadcast, in the stadium, and in the home. Using Replay’s freeD™ technology optimized for Intel platforms, sports fans will be able to re-watch key moments of sporting events from nearly every conceivable angle and share a custom created clip with the world. FreeD takes advantage of 6th Generation Intel® Core™ processors and Intel server technology that has been optimized to deliver this immersive entertainment experience.

Changing the Landscape of Health and Wellness:
Intel and New Balance announced a strategic collaboration to develop wearable technologies that connect athletes with technology to improve their athletic performance as part of New Balance’s newly formed Digital Sport division. Krzanich and New Balance CEO, Rob DeMartini, wore running shoes featuring customized 3-D printed midsoles enabled by Intel®  RealSense™ technology and disclosed plans to develop a smart sport watch available for the 2016 holiday season***.

Oakley and Intel previewed the first look at “Radar Pace” – smart eyewear featuring a voice-activated, real-time coaching system. Oakley is the first Luxottica Group* brand that Intel is working with to fuse premium, luxury and sports eyewear with smart technology. Engineered with Intel Innovation and crafted with Oakley’s high-quality design and materials, the smart eyewear is designed to provide runners, cyclists and workout enthusiasts with in-the-moment feedback and analytics, helping to track progress and improve real-time performance***.

Unleashing Creativity:
Six-time GRAMMY®-winning global music icon Lady Gaga announced today her first collaboration with Intel, in association with Intel’s announcement of a multiyear partnership between Intel and The Recording Academy® as part of the official “Next Generation of GRAMMY® Moments” program that will launch during Grammy week February 2016. Lady Gaga commented: “Intel has enlisted Haus of Gaga to work together on a project that will showcase technology through creativity at the highest level. The partnership culminates in a ground-breaking collaboration that inspires to remind the world of the seed of innovation.” While Lady Gaga will not perform new material as part of the program, she promises to deliver an experience not to be forgotten.

MGM Television Group* and Digital President Mark Burnett joined Krzanich onstage to provide a sneak peek at the innovators vying to turn their ideas into reality – from improving health monitoring to communicating in new ways to testing the limits of our imagination – in the new competition series, America’s Greatest Makers. Premiering this spring on TBS*, America’s Greatest Makers is part of a larger initiative that includes coverage on CNN.com*, Bleacher Report* and other Turner* digital brands. They also launched the Digital Hub at www.americasgreatestmakers.com, which spotlights inventors, new innovations and tech tutorials, as well as unique, weekly digital content.

Intel’s leadership to integrate human-like senses into technology continues to gain momentum: In unmanned aerial vehicles (UAVs), Krzanich demonstrated the Yuneec* Typhoon H* with Intel RealSense technology, which enables collision-avoidance capabilities and will be available 1H 2016. In robotics, Krzanich showcased a Segway* personal transporter from Ninebot* that can transform into a robot. The open platform uses the new Intel RealSense ZR300 Camera to navigate complex environments and intelligently interact with users and sensors in the home and is powered by an Intel Atom™ processor. Segway plans to make the robot commercially available and will initially introduce a developer kit in second half of this year***.

Improving the Human Experience:
Krzanich highlighted plans for a new anti-online harassment effort with Vox Media*, Re/code* andBorn This Way Foundation. The initiative will be unveiled on Jan. 7 and will help make our smart, connected world a safer, more inclusive place.

Third-party audits and direct validation by Intel’s supply chain organization will confirm that the company’s broader product base – beyond just microprocessors – is “conflict free.” Maintaining accountability in the supply chain is an ongoing process for Intel.

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

About Intel

Intel (NASDAQ: INTC) makes the most amazing experiences of the future possible. Intel’s innovations expand the reach and power of computing in personal devices and enterprise servers, the Cloud, make the Internet of Things smart and connected, and help ensure the security of our digital lives. The work of the company’s more than 100,000 employees transforms businesses, propels new discoveries and improves human experiences. More information about Intel is atnewsroom.intel.comorintel.com.

Intel, Intel Core, Curie, Intel Atom, Intel RealSense and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

**”Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Our “conflict-free” statements in this press release may not apply to products of Altera Corporation, which we recently acquired on December 28, 2015. We also use the term “conflict-free” in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Additional information about Intel’s conflict-free efforts is available atconflictfree.intel.com.

***These devices have not been authorized as required by the rules of the Federal Communications Commission. These devices are not, and may not be, offered for sale or lease, or sold or leased, until authorization is obtained.

Intel Brings Amazing Experiences to Life at Consumer Electronics Show

by

CES®, Las Vegas, Jan. 5, 2016 – Intel Corporation today showcased the vast power of technology to deliver new and amazing experiences throughout daily life. From the digitization of sports, to advances in health and wellness, to unleashing human creativity through music, art, robotics and invention, the company announced a number of collaborations, products and innovative technologies that make the amazing possible.

Transforming the way people train, view and compete in sports, Intel CEO Brian Krzanich  announced a series of exciting collaborations with leading industry brands that will use technology and data analytics to benefit people’s overall health, fitness and athletic performance. Intel announced plans to work with ESPN* and Red Bull Media House* to design Intel-powered solutions that empower athletes and bring amazing viewing experiences to life, and joint efforts with New Balance* and Oakley* to personalize and advance the tools people use to be more active.

As Intel technology continues to inspire people to create, invent and explore, Krzanich announced a multiyear partnership with The Recording Academy® as part of its official “Next Generation of GRAMMY® Moments” to bring technological innovation to the program so people can see, engage and be amazed by the evolution of technology in music. The first artist to collaborate with Intel to create a unique musical experience – will be six-time GRAMMY®-winning global music icon Lady Gaga.

These collaborations underscore the three trends that Krzanich said are shaping the future: the smart and connected world, technologies gaining human-like senses, and computing becoming ultra-personal.

“There is a rapidly growing role for technology that is at once transformative, unprecedented and accessible,” said Krzanich. “With people choosing experiences over products more than ever before, Intel technology is a catalyst to making amazing new experiences possible, and ultimately improving the world in which we live.”

He also stressed that Intel remains focused on addressing big societal challenges facing the technology industry and foreshadowed plans for a bold, new anti-online harassment effort with Vox Media*, Re/code* and Lady Gaga’s Born This Way Foundation* to promote diversity and inclusion. And he confirmed that Intel is moving beyond just microprocessors to achieve its goal of validating its broader product base as “conflict-free” in 2016**.

“When Intel started its work to address conflict minerals and gaps in diversity and inclusion, we were told by many people that our goals were unrealistic and would be impossible to achieve,” said Krzanich. “Our collective efforts show that we can influence entirely new and different ways of doing business that also improve the human experience.”

Below are more details from announcements featured during the Intel keynote at CES® 2016:

Digitizing the Sports Experience:
Intel announced a collaboration with ESPN to showcase the latest technology set to add new levels of data-powered insights to the feats of athleticism at X Games Aspen 2016. The tiny, low power Intel® Curie™ module will be integrated into the Men’s Snowboard Slopestyle and Men’s Snowboard Big Air competitions to provide real-time data on athlete performance such as in-air rotations, jump height, jump distance, speed, and force on landing. This access to new data will provide athletes with greater insights into their performance, provide additional metrics for on-air analysts, and change the fan experience both at home and in the stands. The competitions will be televised on ESPN and ABC***.

Intel and Red Bull Media House announced a global partnership that will extend into multiple genres and platforms. Red Bull Media House CTO Andreas Gall joined Krzanich on stage to demonstrate how athletes and spectators can get information about the performance instantly with the help of Intel Curie technology, with the promise of more announcements to come in 2016 and beyond.

Intel is working with Replay Technologies* to deliver completely new viewing experiences for sports fans on broadcast, in the stadium, and in the home. Using Replay’s freeD™ technology optimized for Intel platforms, sports fans will be able to re-watch key moments of sporting events from nearly every conceivable angle and share a custom created clip with the world. FreeD takes advantage of 6th Generation Intel® Core™ processors and Intel server technology that has been optimized to deliver this immersive entertainment experience.

Changing the Landscape of Health and Wellness:
Intel and New Balance announced a strategic collaboration to develop wearable technologies that connect athletes with technology to improve their athletic performance as part of New Balance’s newly formed Digital Sport division. Krzanich and New Balance CEO, Rob DeMartini, wore running shoes featuring customized 3-D printed midsoles enabled by Intel®  RealSense™ technology and disclosed plans to develop a smart sport watch available for the 2016 holiday season***.

Oakley and Intel previewed the first look at “Radar Pace” – smart eyewear featuring a voice-activated, real-time coaching system. Oakley is the first Luxottica Group* brand that Intel is working with to fuse premium, luxury and sports eyewear with smart technology. Engineered with Intel Innovation and crafted with Oakley’s high-quality design and materials, the smart eyewear is designed to provide runners, cyclists and workout enthusiasts with in-the-moment feedback and analytics, helping to track progress and improve real-time performance***.

Unleashing Creativity:
Six-time GRAMMY®-winning global music icon Lady Gaga announced today her first collaboration with Intel, in association with Intel’s announcement of a multiyear partnership between Intel and The Recording Academy® as part of the official “Next Generation of GRAMMY® Moments” program that will launch during Grammy week February 2016. Lady Gaga commented: “Intel has enlisted Haus of Gaga to work together on a project that will showcase technology through creativity at the highest level. The partnership culminates in a ground-breaking collaboration that inspires to remind the world of the seed of innovation.” While Lady Gaga will not perform new material as part of the program, she promises to deliver an experience not to be forgotten.

MGM Television Group* and Digital President Mark Burnett joined Krzanich onstage to provide a sneak peek at the innovators vying to turn their ideas into reality – from improving health monitoring to communicating in new ways to testing the limits of our imagination – in the new competition series, America’s Greatest Makers. Premiering this spring on TBS*, America’s Greatest Makers is part of a larger initiative that includes coverage on CNN.com*, Bleacher Report* and other Turner* digital brands. They also launched the Digital Hub at www.americasgreatestmakers.com, which spotlights inventors, new innovations and tech tutorials, as well as unique, weekly digital content.

Intel’s leadership to integrate human-like senses into technology continues to gain momentum: In unmanned aerial vehicles (UAVs), Krzanich demonstrated the Yuneec* Typhoon H* with Intel RealSense technology, which enables collision-avoidance capabilities and will be available 1H 2016. In robotics, Krzanich showcased a Segway* personal transporter from Ninebot* that can transform into a robot. The open platform uses the new Intel RealSense ZR300 Camera to navigate complex environments and intelligently interact with users and sensors in the home and is powered by an Intel Atom™ processor. Segway plans to make the robot commercially available and will initially introduce a developer kit in second half of this year***.

Improving the Human Experience:
Krzanich highlighted plans for a new anti-online harassment effort with Vox Media*, Re/code* andBorn This Way Foundation. The initiative will be unveiled on Jan. 7 and will help make our smart, connected world a safer, more inclusive place.

Third-party audits and direct validation by Intel’s supply chain organization will confirm that the company’s broader product base – beyond just microprocessors – is “conflict free.” Maintaining accountability in the supply chain is an ongoing process for Intel.

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

About Intel

Intel (NASDAQ: INTC) makes the most amazing experiences of the future possible. Intel’s innovations expand the reach and power of computing in personal devices and enterprise servers, the Cloud, make the Internet of Things smart and connected, and help ensure the security of our digital lives. The work of the company’s more than 100,000 employees transforms businesses, propels new discoveries and improves human experiences. More information about Intel is atnewsroom.intel.comorintel.com.

Intel, Intel Core, Curie, Intel Atom, Intel RealSense and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

**”Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Our “conflict-free” statements in this press release may not apply to products of Altera Corporation, which we recently acquired on December 28, 2015. We also use the term “conflict-free” in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Additional information about Intel’s conflict-free efforts is available atconflictfree.intel.com.

***These devices have not been authorized as required by the rules of the Federal Communications Commission. These devices are not, and may not be, offered for sale or lease, or sold or leased, until authorization is obtained.

Intel Brings Amazing Experiences to Life at Consumer Electronics Show

by

CES®, Las Vegas, Jan. 5, 2016 – Intel Corporation today showcased the vast power of technology to deliver new and amazing experiences throughout daily life. From the digitization of sports, to advances in health and wellness, to unleashing human creativity through music, art, robotics and invention, the company announced a number of collaborations, products and innovative technologies that make the amazing possible.

Transforming the way people train, view and compete in sports, Intel CEO Brian Krzanich  announced a series of exciting collaborations with leading industry brands that will use technology and data analytics to benefit people’s overall health, fitness and athletic performance. Intel announced plans to work with ESPN* and Red Bull Media House* to design Intel-powered solutions that empower athletes and bring amazing viewing experiences to life, and joint efforts with New Balance* and Oakley* to personalize and advance the tools people use to be more active.

As Intel technology continues to inspire people to create, invent and explore, Krzanich announced a multiyear partnership with The Recording Academy® as part of its official “Next Generation of GRAMMY® Moments” to bring technological innovation to the program so people can see, engage and be amazed by the evolution of technology in music. The first artist to collaborate with Intel to create a unique musical experience – will be six-time GRAMMY®-winning global music icon Lady Gaga.

These collaborations underscore the three trends that Krzanich said are shaping the future: the smart and connected world, technologies gaining human-like senses, and computing becoming ultra-personal.

“There is a rapidly growing role for technology that is at once transformative, unprecedented and accessible,” said Krzanich. “With people choosing experiences over products more than ever before, Intel technology is a catalyst to making amazing new experiences possible, and ultimately improving the world in which we live.”

He also stressed that Intel remains focused on addressing big societal challenges facing the technology industry and foreshadowed plans for a bold, new anti-online harassment effort with Vox Media*, Re/code* and Lady Gaga’s Born This Way Foundation* to promote diversity and inclusion. And he confirmed that Intel is moving beyond just microprocessors to achieve its goal of validating its broader product base as “conflict-free” in 2016**.

“When Intel started its work to address conflict minerals and gaps in diversity and inclusion, we were told by many people that our goals were unrealistic and would be impossible to achieve,” said Krzanich. “Our collective efforts show that we can influence entirely new and different ways of doing business that also improve the human experience.”

Below are more details from announcements featured during the Intel keynote at CES® 2016:

Digitizing the Sports Experience:
Intel announced a collaboration with ESPN to showcase the latest technology set to add new levels of data-powered insights to the feats of athleticism at X Games Aspen 2016. The tiny, low power Intel® Curie™ module will be integrated into the Men’s Snowboard Slopestyle and Men’s Snowboard Big Air competitions to provide real-time data on athlete performance such as in-air rotations, jump height, jump distance, speed, and force on landing. This access to new data will provide athletes with greater insights into their performance, provide additional metrics for on-air analysts, and change the fan experience both at home and in the stands. The competitions will be televised on ESPN and ABC***.

Intel and Red Bull Media House announced a global partnership that will extend into multiple genres and platforms. Red Bull Media House CTO Andreas Gall joined Krzanich on stage to demonstrate how athletes and spectators can get information about the performance instantly with the help of Intel Curie technology, with the promise of more announcements to come in 2016 and beyond.

Intel is working with Replay Technologies* to deliver completely new viewing experiences for sports fans on broadcast, in the stadium, and in the home. Using Replay’s freeD™ technology optimized for Intel platforms, sports fans will be able to re-watch key moments of sporting events from nearly every conceivable angle and share a custom created clip with the world. FreeD takes advantage of 6th Generation Intel® Core™ processors and Intel server technology that has been optimized to deliver this immersive entertainment experience.

Changing the Landscape of Health and Wellness:
Intel and New Balance announced a strategic collaboration to develop wearable technologies that connect athletes with technology to improve their athletic performance as part of New Balance’s newly formed Digital Sport division. Krzanich and New Balance CEO, Rob DeMartini, wore running shoes featuring customized 3-D printed midsoles enabled by Intel®  RealSense™ technology and disclosed plans to develop a smart sport watch available for the 2016 holiday season***.

Oakley and Intel previewed the first look at “Radar Pace” – smart eyewear featuring a voice-activated, real-time coaching system. Oakley is the first Luxottica Group* brand that Intel is working with to fuse premium, luxury and sports eyewear with smart technology. Engineered with Intel Innovation and crafted with Oakley’s high-quality design and materials, the smart eyewear is designed to provide runners, cyclists and workout enthusiasts with in-the-moment feedback and analytics, helping to track progress and improve real-time performance***.

Unleashing Creativity:
Six-time GRAMMY®-winning global music icon Lady Gaga announced today her first collaboration with Intel, in association with Intel’s announcement of a multiyear partnership between Intel and The Recording Academy® as part of the official “Next Generation of GRAMMY® Moments” program that will launch during Grammy week February 2016. Lady Gaga commented: “Intel has enlisted Haus of Gaga to work together on a project that will showcase technology through creativity at the highest level. The partnership culminates in a ground-breaking collaboration that inspires to remind the world of the seed of innovation.” While Lady Gaga will not perform new material as part of the program, she promises to deliver an experience not to be forgotten.

MGM Television Group* and Digital President Mark Burnett joined Krzanich onstage to provide a sneak peek at the innovators vying to turn their ideas into reality – from improving health monitoring to communicating in new ways to testing the limits of our imagination – in the new competition series, America’s Greatest Makers. Premiering this spring on TBS*, America’s Greatest Makers is part of a larger initiative that includes coverage on CNN.com*, Bleacher Report* and other Turner* digital brands. They also launched the Digital Hub at www.americasgreatestmakers.com, which spotlights inventors, new innovations and tech tutorials, as well as unique, weekly digital content.

Intel’s leadership to integrate human-like senses into technology continues to gain momentum: In unmanned aerial vehicles (UAVs), Krzanich demonstrated the Yuneec* Typhoon H* with Intel RealSense technology, which enables collision-avoidance capabilities and will be available 1H 2016. In robotics, Krzanich showcased a Segway* personal transporter from Ninebot* that can transform into a robot. The open platform uses the new Intel RealSense ZR300 Camera to navigate complex environments and intelligently interact with users and sensors in the home and is powered by an Intel Atom™ processor. Segway plans to make the robot commercially available and will initially introduce a developer kit in second half of this year***.

Improving the Human Experience:
Krzanich highlighted plans for a new anti-online harassment effort with Vox Media*, Re/code* andBorn This Way Foundation. The initiative will be unveiled on Jan. 7 and will help make our smart, connected world a safer, more inclusive place.

Third-party audits and direct validation by Intel’s supply chain organization will confirm that the company’s broader product base – beyond just microprocessors – is “conflict free.” Maintaining accountability in the supply chain is an ongoing process for Intel.

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

About Intel

Intel (NASDAQ: INTC) makes the most amazing experiences of the future possible. Intel’s innovations expand the reach and power of computing in personal devices and enterprise servers, the Cloud, make the Internet of Things smart and connected, and help ensure the security of our digital lives. The work of the company’s more than 100,000 employees transforms businesses, propels new discoveries and improves human experiences. More information about Intel is atnewsroom.intel.comorintel.com.

Intel, Intel Core, Curie, Intel Atom, Intel RealSense and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

**”Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Our “conflict-free” statements in this press release may not apply to products of Altera Corporation, which we recently acquired on December 28, 2015. We also use the term “conflict-free” in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Additional information about Intel’s conflict-free efforts is available atconflictfree.intel.com.

***These devices have not been authorized as required by the rules of the Federal Communications Commission. These devices are not, and may not be, offered for sale or lease, or sold or leased, until authorization is obtained.

Intel Brings Amazing Experiences to Life at Consumer Electronics Show

by

CES®, Las Vegas, Jan. 5, 2016 – Intel Corporation today showcased the vast power of technology to deliver new and amazing experiences throughout daily life. From the digitization of sports, to advances in health and wellness, to unleashing human creativity through music, art, robotics and invention, the company announced a number of collaborations, products and … Continued

The post Intel Brings Amazing Experiences to Life at Consumer Electronics Show appeared first on Intel Newsroom.

Intel Leads a New Era of Computing Experiences, Intelligence Everywhere

by

Computing Innovation, New Experiences and Internet of Things Solutions to Create Smart and Connected World

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5th Gen Intel® Core™ mobile processor (“Broadwell-H”)

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5th Gen Intel® Core™ desktop processor (“Broadwell-H”)

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Intel Unite enables smart and connected meeting spaces with enhanced security

COMPUTEX, Taipei, Taiwan, June 2, 2015 – Intel Corporation today announced products and solutions that will deliver new user experiences and support the computing ecosystem’s expansion into new areas. During the opening keynote address at Computex 2015, Kirk Skaugen, senior vice president and general manager of Intel’s Client Computing Group encouraged the Taiwan ecosystem to work together and capture the opportunity to shape the future of computing.

“The power of Moore’s Law has enabled incredible computing innovation over the past 50 years and because of it, nearly everything in the future will have the ability to compute and connect,” said Skaugen. “Our 30-year history of collaboration with Taiwan has delivered historic innovation to the world, from personal computing to the cloud and data centers. The next 30 years will see even greater innovation as we deliver new computing experiences and bring intelligence and connectivity to the Internet of Things together.”

Skaugen offered predictions into the future of computing and showcased the products and platforms that will take us there. He also showed how these innovations will soon enable intelligence to be everywhere.

Internet of Things News:

  • Intel introduced the expansion of the Intel® IoT Gateway product family. The latest gateway reference design offers expanded choice in silicon and software with the addition of Intel® Core™ processor-based gateways and Wind River* Intelligent Device Platform XT 3 with flexible packaging options for applications that require a low cost of entry.
  • Intel also expanded the choice of operating systems for Intel® IoT Gateway reference designs with the availability of Ubuntu Snappy Core from Canonical*. This builds upon the current OS availability from Microsoft* and Wind River.
  • Specifically for IoT solutions, especially retail and medical environments, Intel announced the new Intel® Pentium®, Intel® Celeron® and Intel® Atom™ processors. With stunning graphics performance in a low thermal envelope, the processors are customized for IoT and offer seven year availability.

Computing Experiences and Platform News:

  • Intel® Unite™ was introduced as a new cost-effective business solution designed for easy and intuitive collaboration and improved meeting productivity. With a select Intel® Core™ vPro™ processor-based mini PC in the conference room and the Intel Unite application running on devices, existing conference rooms are modernized and transformed into smart and connected meeting spaces with enhanced security.
  • In the biggest advancement since its inception, Thunderbolt™ 3 delivers one computer port that connects to Thunderbolt devices, every display and billions of USB devices. For the first time, a single cable now provides four times the data and twice the video bandwidth of any other cable, while also supplying power. It’s unrivaled for new uses, such as 4K video, single-cable docks with charging, external graphics and built-in 10 GbE networking. Initial products are expected to start shipping before the end of this year, with more expected in 2016.
  • The 5th generation Intel Core family also now includes the first LGA socketed desktop processor with integrated Iris™ Pro graphics, Intel’s most powerful client processor graphics and media engine. The lower 65-watt thermal design power (TDP) allows full PC performance in a broad range of form factors, including smaller and thinner mini PCs and all-in-one desktops, providing up to two times better 3-D graphics performance, 35 percent video conversion and 20 percent compute performance over the previous generation processors.1
  • Intel also introduced 5th generation Intel® Core™ mobile processors for mobile and IoT with integrated Intel® Iris™ Pro Graphics. Optimized for gamers and content creators on the go, Intel’s fastest and most responsive mobile processors have Intel Iris Pro graphics 6200 and provide up to two times higher compute performance and two times better 3-D graphics performance compared to the current generation.2 These processors are also ideal for medical, public works and industrial IoT applications with the inclusion of critical features for powerful IoT designs, including ECC memory support, Intel® vPro™ technology and offer seven year availability.
  • Highlighting progress toward a future of a completely wireless computing experience, Intel announced it is working with Targus* to deliver Rezence standard-based wireless charging solutions. Intel also recently announced an agreement with China-based Haier* to bring wireless charging solutions to restaurants, hotels, cafés, and airports in China later this year. Additionally, Intel will work with A4WP members, Foxconn Interconnect*, Basecom* and original design manufacturers BYD* and Primax* to bring wireless charging solutions to market later this year.

Data Center News:

  • Intel introduced the Intel® Xeon® processor E3-1200 v4 product family, the first time the Xeon processor line has included integrated Intel® Iris™ Pro graphics P6300. Built on 14nm process technology and designed for visually intensive, cloud-based workloads such as high-definition (HD) video transcoding and remote workstation delivery, the product family delivers up to 1.4x the performance for video transcoding3 and up to 1.8x the 3-D graphics performance4 compared to the prior generation.

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, the Intel logo, Celeron, Intel Atom, Intel Core, Intel RealSense, Intel vPro, Iris, Pentium and Thunderbolt are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

1 Intel® Core™ i7-5775C with Intel® Iris® Pro graphics 6200 compared to 65W Intel® Core™ i7-4790S with Intel® HD graphics 4600 using 3DMark11 – Graphics score performance preset, HDxPRT_2014 Convert Videos, SPECint_rate_base2006*.

2 Intel® Core™ i7-5950HQ with Intel® Iris® Pro graphics 6200 compared to i7-5600U with Intel HD Graphics 5500 using SPECint_rate_base2006, 3DMark11 – Graphics score performance preset.

3 Up to 1.4x transcoding performance with Intel® Xeon® E3-1285L v4 when compared with Intel® Xeon E3 v3 on Intel Media Server Studio 2015 R3 Essentials Edition. Number of real time threads transcoded simultaneously: 10 on E301286L v3, 14 on E3-1285L, using 1080p30 20Mbps streams. Baseline configuration: Intel Rainbow Pass SR1200V3RP Platform with Intel® Xeon® E3-1286Lv3 (65W, 4C, 3.4Ghz, Intel® Iris Pro Graphics P6300) or Intel® Xeon® Processor E3-1286L V3 (65W, 4C, 3.2Ghz, Intel® HD Graphics p4700), 32 GB (4x8GB DDR3-1600MHz UDIMM), 160GB 7200 SATA HDD, Turbo Boost Enabled, HT Enabled, Windows Server 2012 R2, Intel Media Server Studio 2015 R3 Essentials Edition, Multi Transcoding Sample Version 6.0.0.36, Intel graphics driver pGFX 10.18.14.4172, BIOS S1200RP.86B.03.01.002. Source: Intel internal measurements as of May 2015

4 Up to 1.8x better performance on 3DMark11*. Baseline configuration: Intel® Hermosa Beach 2 CRB platform with Intel® Xeon® E3-1286v3, 32GB memory (4x 8GB DDR3-1333 UDIMM), 64GB SATA SSD, Turbo Boost Enabled, HT Enabled, Red Hat Enterprise Linux 6.3, Oracle Java Hotspot Java 1.7.0_17. 3DMark Score 1524, Source: Internal Intel® measurements as of April 2014. Intel® Xeon® workstation platform (Intel S1200RP Board) with one Intel Xeon processor E3-1285 v4 (quad-core, 3.5GHz, 6M cache) BIOS S1200RP.86B.03.01.0002.041520151123, Intel HT Technology best configuration, 32GB memory (4x8GB DDR3-1600 ECC UDIMM), Intel Iris Pro Graphics P6300 with driver 10.18.10.3980, Intel SSDSC2BB300G4, Microsoft Windows 8.1*. 3DMark Score 2881, Source: Intel internal testing as of June 2015.

Systems:
Intel® Core™ i7-4790S processor (up to 4.0GHz, 4C8T, 8M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920×1080, Intel HD Graphics 4600, Windows* 8.1
Intel® Core™ i7-5775C processor (up to 3.7GHz, 4C8T, 6M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920×1080, Intel Iris™ Pro Graphics 6200, Windows* 8.1
Intel® Core™ i7-5950HQ processor (up to 3.8GHz, 4C8T, 6M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920×1080, Intel Iris™ Pro Graphics 6200, Windows* 8.1
Intel® Core™ i7-5600U processor (up to 3.7GHz, 2C4T, 4M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920×1080, Intel HD Graphics 5500, Windows* 8.1

Tests:
HDxPRT* 2014 – Convert Videos: High Definition Experience & Performance Ratings Test, is a benchmark from Principled Technologies* that measures Windows* media editing performance. It uses mainstream applications to test the performance of the system.

3DMark* 11:  3DMark* 11 is a benchmark from Futuremark* that measures DX 11 gaming performance. There are four DX 11 graphics tests with three quality presets: Entry, Performance, Extreme. Reported metrics: Graphics Score (GPU), Physics Score (CPU), Combined Score (GPU & CPU) and an overall 3DMark Score (higher is better for all Scores). OS support: Desktop Windows.

SPEC* CPU2006:  SPEC* CPU2006 is a benchmark from the SPEC consortium that measures device performance and throughput using compute intensive application subtests. SPECint*_base2006 measures how fast a device completes a single integer compute task. SPECint*_rate_base2006 measures throughput, or how many integer compute tasks a device can accomplish in a given amount of time. Reported metrics: TBD. Scaling efficiencies: TBD. OS support: Desktop Windows*.

Results have been estimated based on internal Intel analysis and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors.

Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.  For more complete information visit www.intel.com/performance.

Intel Leads a New Era of Computing Experiences, Intelligence Everywhere

by

Computing Innovation, New Experiences and Internet of Things Solutions to Create Smart and Connected World

BDW-H-WhiteBkgd.jpgBDW-H-noReflect-noShadow.jpg

5th Gen Intel® Core™ mobile processor (“Broadwell-H”)

BDW-LGA-BlueBkgd.jpgBDW-LGA-noreflect.jpg

5th Gen Intel® Core™ desktop processor (“Broadwell-H”)

unite_lnchr_andrd_512.jpg

Intel Unite enables smart and connected meeting spaces with enhanced security

COMPUTEX, Taipei, Taiwan, June 2, 2015 – Intel Corporation today announced products and solutions that will deliver new user experiences and support the computing ecosystem’s expansion into new areas. During the opening keynote address at Computex 2015, Kirk Skaugen, senior vice president and general manager of Intel’s Client Computing Group encouraged the Taiwan ecosystem to work together and capture the opportunity to shape the future of computing.

“The power of Moore’s Law has enabled incredible computing innovation over the past 50 years and because of it, nearly everything in the future will have the ability to compute and connect,” said Skaugen. “Our 30-year history of collaboration with Taiwan has delivered historic innovation to the world, from personal computing to the cloud and data centers. The next 30 years will see even greater innovation as we deliver new computing experiences and bring intelligence and connectivity to the Internet of Things together.”

Skaugen offered predictions into the future of computing and showcased the products and platforms that will take us there. He also showed how these innovations will soon enable intelligence to be everywhere.

Internet of Things News:

  • Intel introduced the expansion of the Intel® IoT Gateway product family. The latest gateway reference design offers expanded choice in silicon and software with the addition of Intel® Core™ processor-based gateways and Wind River* Intelligent Device Platform XT 3 with flexible packaging options for applications that require a low cost of entry.
  • Intel also expanded the choice of operating systems for Intel® IoT Gateway reference designs with the availability of Ubuntu Snappy Core from Canonical*. This builds upon the current OS availability from Microsoft* and Wind River.
  • Specifically for IoT solutions, especially retail and medical environments, Intel announced the new Intel® Pentium®, Intel® Celeron® and Intel® Atom™ processors. With stunning graphics performance in a low thermal envelope, the processors are customized for IoT and offer seven year availability.

Computing Experiences and Platform News:

  • Intel® Unite™ was introduced as a new cost-effective business solution designed for easy and intuitive collaboration and improved meeting productivity. With a select Intel® Core™ vPro™ processor-based mini PC in the conference room and the Intel Unite application running on devices, existing conference rooms are modernized and transformed into smart and connected meeting spaces with enhanced security.
  • In the biggest advancement since its inception, Thunderbolt™ 3 delivers one computer port that connects to Thunderbolt devices, every display and billions of USB devices. For the first time, a single cable now provides four times the data and twice the video bandwidth of any other cable, while also supplying power. It’s unrivaled for new uses, such as 4K video, single-cable docks with charging, external graphics and built-in 10 GbE networking. Initial products are expected to start shipping before the end of this year, with more expected in 2016.
  • The 5th generation Intel Core family also now includes the first LGA socketed desktop processor with integrated Iris™ Pro graphics, Intel’s most powerful client processor graphics and media engine. The lower 65-watt thermal design power (TDP) allows full PC performance in a broad range of form factors, including smaller and thinner mini PCs and all-in-one desktops, providing up to two times better 3-D graphics performance, 35 percent video conversion and 20 percent compute performance over the previous generation processors.1
  • Intel also introduced 5th generation Intel® Core™ mobile processors for mobile and IoT with integrated Intel® Iris™ Pro Graphics. Optimized for gamers and content creators on the go, Intel’s fastest and most responsive mobile processors have Intel Iris Pro graphics 6200 and provide up to two times higher compute performance and two times better 3-D graphics performance compared to the current generation.2 These processors are also ideal for medical, public works and industrial IoT applications with the inclusion of critical features for powerful IoT designs, including ECC memory support, Intel® vPro™ technology and offer seven year availability.
  • Highlighting progress toward a future of a completely wireless computing experience, Intel announced it is working with Targus* to deliver Rezence standard-based wireless charging solutions. Intel also recently announced an agreement with China-based Haier* to bring wireless charging solutions to restaurants, hotels, cafés, and airports in China later this year. Additionally, Intel will work with A4WP members, Foxconn Interconnect*, Basecom* and original design manufacturers BYD* and Primax* to bring wireless charging solutions to market later this year.

Data Center News:

  • Intel introduced the Intel® Xeon® processor E3-1200 v4 product family, the first time the Xeon processor line has included integrated Intel® Iris™ Pro graphics P6300. Built on 14nm process technology and designed for visually intensive, cloud-based workloads such as high-definition (HD) video transcoding and remote workstation delivery, the product family delivers up to 1.4x the performance for video transcoding3 and up to 1.8x the 3-D graphics performance4 compared to the prior generation.

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, the Intel logo, Celeron, Intel Atom, Intel Core, Intel RealSense, Intel vPro, Iris, Pentium and Thunderbolt are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

1 Intel® Core™ i7-5775C with Intel® Iris® Pro graphics 6200 compared to 65W Intel® Core™ i7-4790S with Intel® HD graphics 4600 using 3DMark11 – Graphics score performance preset, HDxPRT_2014 Convert Videos, SPECint_rate_base2006*.

2 Intel® Core™ i7-5950HQ with Intel® Iris® Pro graphics 6200 compared to i7-5600U with Intel HD Graphics 5500 using SPECint_rate_base2006, 3DMark11 – Graphics score performance preset.

3 Up to 1.4x transcoding performance with Intel® Xeon® E3-1285L v4 when compared with Intel® Xeon E3 v3 on Intel Media Server Studio 2015 R3 Essentials Edition. Number of real time threads transcoded simultaneously: 10 on E301286L v3, 14 on E3-1285L, using 1080p30 20Mbps streams. Baseline configuration: Intel Rainbow Pass SR1200V3RP Platform with Intel® Xeon® E3-1286Lv3 (65W, 4C, 3.4Ghz, Intel® Iris Pro Graphics P6300) or Intel® Xeon® Processor E3-1286L V3 (65W, 4C, 3.2Ghz, Intel® HD Graphics p4700), 32 GB (4x8GB DDR3-1600MHz UDIMM), 160GB 7200 SATA HDD, Turbo Boost Enabled, HT Enabled, Windows Server 2012 R2, Intel Media Server Studio 2015 R3 Essentials Edition, Multi Transcoding Sample Version 6.0.0.36, Intel graphics driver pGFX 10.18.14.4172, BIOS S1200RP.86B.03.01.002. Source: Intel internal measurements as of May 2015

4 Up to 1.8x better performance on 3DMark11*. Baseline configuration: Intel® Hermosa Beach 2 CRB platform with Intel® Xeon® E3-1286v3, 32GB memory (4x 8GB DDR3-1333 UDIMM), 64GB SATA SSD, Turbo Boost Enabled, HT Enabled, Red Hat Enterprise Linux 6.3, Oracle Java Hotspot Java 1.7.0_17. 3DMark Score 1524, Source: Internal Intel® measurements as of April 2014. Intel® Xeon® workstation platform (Intel S1200RP Board) with one Intel Xeon processor E3-1285 v4 (quad-core, 3.5GHz, 6M cache) BIOS S1200RP.86B.03.01.0002.041520151123, Intel HT Technology best configuration, 32GB memory (4x8GB DDR3-1600 ECC UDIMM), Intel Iris Pro Graphics P6300 with driver 10.18.10.3980, Intel SSDSC2BB300G4, Microsoft Windows 8.1*. 3DMark Score 2881, Source: Intel internal testing as of June 2015.

Systems:
Intel® Core™ i7-4790S processor (up to 4.0GHz, 4C8T, 8M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920×1080, Intel HD Graphics 4600, Windows* 8.1
Intel® Core™ i7-5775C processor (up to 3.7GHz, 4C8T, 6M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920×1080, Intel Iris™ Pro Graphics 6200, Windows* 8.1
Intel® Core™ i7-5950HQ processor (up to 3.8GHz, 4C8T, 6M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920×1080, Intel Iris™ Pro Graphics 6200, Windows* 8.1
Intel® Core™ i7-5600U processor (up to 3.7GHz, 2C4T, 4M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920×1080, Intel HD Graphics 5500, Windows* 8.1

Tests:
HDxPRT* 2014 – Convert Videos: High Definition Experience & Performance Ratings Test, is a benchmark from Principled Technologies* that measures Windows* media editing performance. It uses mainstream applications to test the performance of the system.

3DMark* 11:  3DMark* 11 is a benchmark from Futuremark* that measures DX 11 gaming performance. There are four DX 11 graphics tests with three quality presets: Entry, Performance, Extreme. Reported metrics: Graphics Score (GPU), Physics Score (CPU), Combined Score (GPU & CPU) and an overall 3DMark Score (higher is better for all Scores). OS support: Desktop Windows.

SPEC* CPU2006:  SPEC* CPU2006 is a benchmark from the SPEC consortium that measures device performance and throughput using compute intensive application subtests. SPECint*_base2006 measures how fast a device completes a single integer compute task. SPECint*_rate_base2006 measures throughput, or how many integer compute tasks a device can accomplish in a given amount of time. Reported metrics: TBD. Scaling efficiencies: TBD. OS support: Desktop Windows*.

Results have been estimated based on internal Intel analysis and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors.

Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.  For more complete information visit www.intel.com/performance.

Intel Leads a New Era of Computing Experiences, Intelligence Everywhere

by

Computing Innovation, New Experiences and Internet of Things Solutions to Create Smart and Connected World

BDW-H-WhiteBkgd.jpgBDW-H-noReflect-noShadow.jpg

5th Gen Intel® Core™ mobile processor (“Broadwell-H”)

BDW-LGA-BlueBkgd.jpgBDW-LGA-noreflect.jpg

5th Gen Intel® Core™ desktop processor (“Broadwell-H”)

unite_lnchr_andrd_512.jpg

Intel Unite enables smart and connected meeting spaces with enhanced security

COMPUTEX, Taipei, Taiwan, June 2, 2015 – Intel Corporation today announced products and solutions that will deliver new user experiences and support the computing ecosystem’s expansion into new areas. During the opening keynote address at Computex 2015, Kirk Skaugen, senior vice president and general manager of Intel’s Client Computing Group encouraged the Taiwan ecosystem to work together and capture the opportunity to shape the future of computing.

“The power of Moore’s Law has enabled incredible computing innovation over the past 50 years and because of it, nearly everything in the future will have the ability to compute and connect,” said Skaugen. “Our 30-year history of collaboration with Taiwan has delivered historic innovation to the world, from personal computing to the cloud and data centers. The next 30 years will see even greater innovation as we deliver new computing experiences and bring intelligence and connectivity to the Internet of Things together.”

Skaugen offered predictions into the future of computing and showcased the products and platforms that will take us there. He also showed how these innovations will soon enable intelligence to be everywhere.

Internet of Things News:

  • Intel introduced the expansion of the Intel® IoT Gateway product family. The latest gateway reference design offers expanded choice in silicon and software with the addition of Intel® Core™ processor-based gateways and Wind River* Intelligent Device Platform XT 3 with flexible packaging options for applications that require a low cost of entry.
  • Intel also expanded the choice of operating systems for Intel® IoT Gateway reference designs with the availability of Ubuntu Snappy Core from Canonical*. This builds upon the current OS availability from Microsoft* and Wind River.
  • Specifically for IoT solutions, especially retail and medical environments, Intel announced the new Intel® Pentium®, Intel® Celeron® and Intel® Atom™ processors. With stunning graphics performance in a low thermal envelope, the processors are customized for IoT and offer seven year availability.

Computing Experiences and Platform News:

  • Intel® Unite™ was introduced as a new cost-effective business solution designed for easy and intuitive collaboration and improved meeting productivity. With a select Intel® Core™ vPro™ processor-based mini PC in the conference room and the Intel Unite application running on devices, existing conference rooms are modernized and transformed into smart and connected meeting spaces with enhanced security.
  • In the biggest advancement since its inception, Thunderbolt™ 3 delivers one computer port that connects to Thunderbolt devices, every display and billions of USB devices. For the first time, a single cable now provides four times the data and twice the video bandwidth of any other cable, while also supplying power. It’s unrivaled for new uses, such as 4K video, single-cable docks with charging, external graphics and built-in 10 GbE networking. Initial products are expected to start shipping before the end of this year, with more expected in 2016.
  • The 5th generation Intel Core family also now includes the first LGA socketed desktop processor with integrated Iris™ Pro graphics, Intel’s most powerful client processor graphics and media engine. The lower 65-watt thermal design power (TDP) allows full PC performance in a broad range of form factors, including smaller and thinner mini PCs and all-in-one desktops, providing up to two times better 3-D graphics performance, 35 percent video conversion and 20 percent compute performance over the previous generation processors.1
  • Intel also introduced 5th generation Intel® Core™ mobile processors for mobile and IoT with integrated Intel® Iris™ Pro Graphics. Optimized for gamers and content creators on the go, Intel’s fastest and most responsive mobile processors have Intel Iris Pro graphics 6200 and provide up to two times higher compute performance and two times better 3-D graphics performance compared to the current generation.2 These processors are also ideal for medical, public works and industrial IoT applications with the inclusion of critical features for powerful IoT designs, including ECC memory support, Intel® vPro™ technology and offer seven year availability.
  • Highlighting progress toward a future of a completely wireless computing experience, Intel announced it is working with Targus* to deliver Rezence standard-based wireless charging solutions. Intel also recently announced an agreement with China-based Haier* to bring wireless charging solutions to restaurants, hotels, cafés, and airports in China later this year. Additionally, Intel will work with A4WP members, Foxconn Interconnect*, Basecom* and original design manufacturers BYD* and Primax* to bring wireless charging solutions to market later this year.

Data Center News:

  • Intel introduced the Intel® Xeon® processor E3-1200 v4 product family, the first time the Xeon processor line has included integrated Intel® Iris™ Pro graphics P6300. Built on 14nm process technology and designed for visually intensive, cloud-based workloads such as high-definition (HD) video transcoding and remote workstation delivery, the product family delivers up to 1.4x the performance for video transcoding3 and up to 1.8x the 3-D graphics performance4 compared to the prior generation.

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, the Intel logo, Celeron, Intel Atom, Intel Core, Intel RealSense, Intel vPro, Iris, Pentium and Thunderbolt are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

1 Intel® Core™ i7-5775C with Intel® Iris® Pro graphics 6200 compared to 65W Intel® Core™ i7-4790S with Intel® HD graphics 4600 using 3DMark11 – Graphics score performance preset, HDxPRT_2014 Convert Videos, SPECint_rate_base2006*.

2 Intel® Core™ i7-5950HQ with Intel® Iris® Pro graphics 6200 compared to i7-5600U with Intel HD Graphics 5500 using SPECint_rate_base2006, 3DMark11 – Graphics score performance preset.

3 Up to 1.4x transcoding performance with Intel® Xeon® E3-1285L v4 when compared with Intel® Xeon E3 v3 on Intel Media Server Studio 2015 R3 Essentials Edition. Number of real time threads transcoded simultaneously: 10 on E301286L v3, 14 on E3-1285L, using 1080p30 20Mbps streams. Baseline configuration: Intel Rainbow Pass SR1200V3RP Platform with Intel® Xeon® E3-1286Lv3 (65W, 4C, 3.4Ghz, Intel® Iris Pro Graphics P6300) or Intel® Xeon® Processor E3-1286L V3 (65W, 4C, 3.2Ghz, Intel® HD Graphics p4700), 32 GB (4x8GB DDR3-1600MHz UDIMM), 160GB 7200 SATA HDD, Turbo Boost Enabled, HT Enabled, Windows Server 2012 R2, Intel Media Server Studio 2015 R3 Essentials Edition, Multi Transcoding Sample Version 6.0.0.36, Intel graphics driver pGFX 10.18.14.4172, BIOS S1200RP.86B.03.01.002. Source: Intel internal measurements as of May 2015

4 Up to 1.8x better performance on 3DMark11*. Baseline configuration: Intel® Hermosa Beach 2 CRB platform with Intel® Xeon® E3-1286v3, 32GB memory (4x 8GB DDR3-1333 UDIMM), 64GB SATA SSD, Turbo Boost Enabled, HT Enabled, Red Hat Enterprise Linux 6.3, Oracle Java Hotspot Java 1.7.0_17. 3DMark Score 1524, Source: Internal Intel® measurements as of April 2014. Intel® Xeon® workstation platform (Intel S1200RP Board) with one Intel Xeon processor E3-1285 v4 (quad-core, 3.5GHz, 6M cache) BIOS S1200RP.86B.03.01.0002.041520151123, Intel HT Technology best configuration, 32GB memory (4x8GB DDR3-1600 ECC UDIMM), Intel Iris Pro Graphics P6300 with driver 10.18.10.3980, Intel SSDSC2BB300G4, Microsoft Windows 8.1*. 3DMark Score 2881, Source: Intel internal testing as of June 2015.

Systems:
Intel® Core™ i7-4790S processor (up to 4.0GHz, 4C8T, 8M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920×1080, Intel HD Graphics 4600, Windows* 8.1
Intel® Core™ i7-5775C processor (up to 3.7GHz, 4C8T, 6M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920×1080, Intel Iris™ Pro Graphics 6200, Windows* 8.1
Intel® Core™ i7-5950HQ processor (up to 3.8GHz, 4C8T, 6M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920×1080, Intel Iris™ Pro Graphics 6200, Windows* 8.1
Intel® Core™ i7-5600U processor (up to 3.7GHz, 2C4T, 4M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920×1080, Intel HD Graphics 5500, Windows* 8.1

Tests:
HDxPRT* 2014 – Convert Videos: High Definition Experience & Performance Ratings Test, is a benchmark from Principled Technologies* that measures Windows* media editing performance. It uses mainstream applications to test the performance of the system.

3DMark* 11:  3DMark* 11 is a benchmark from Futuremark* that measures DX 11 gaming performance. There are four DX 11 graphics tests with three quality presets: Entry, Performance, Extreme. Reported metrics: Graphics Score (GPU), Physics Score (CPU), Combined Score (GPU & CPU) and an overall 3DMark Score (higher is better for all Scores). OS support: Desktop Windows.

SPEC* CPU2006:  SPEC* CPU2006 is a benchmark from the SPEC consortium that measures device performance and throughput using compute intensive application subtests. SPECint*_base2006 measures how fast a device completes a single integer compute task. SPECint*_rate_base2006 measures throughput, or how many integer compute tasks a device can accomplish in a given amount of time. Reported metrics: TBD. Scaling efficiencies: TBD. OS support: Desktop Windows*.

Results have been estimated based on internal Intel analysis and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors.

Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.  For more complete information visit www.intel.com/performance.

Intel Leads a New Era of Computing Experiences, Intelligence Everywhere

by

Computing Innovation, New Experiences and Internet of Things Solutions to Create Smart and Connected World

BDW-H-WhiteBkgd.jpgBDW-H-noReflect-noShadow.jpg

5th Gen Intel® Core™ mobile processor (“Broadwell-H”)

BDW-LGA-BlueBkgd.jpgBDW-LGA-noreflect.jpg

5th Gen Intel® Core™ desktop processor (“Broadwell-H”)

unite_lnchr_andrd_512.jpg

Intel Unite enables smart and connected meeting spaces with enhanced security

COMPUTEX, Taipei, Taiwan, June 2, 2015 – Intel Corporation today announced products and solutions that will deliver new user experiences and support the computing ecosystem’s expansion into new areas. During the opening keynote address at Computex 2015, Kirk Skaugen, senior vice president and general manager of Intel’s Client Computing Group encouraged the Taiwan ecosystem to work together and capture the opportunity to shape the future of computing.

“The power of Moore’s Law has enabled incredible computing innovation over the past 50 years and because of it, nearly everything in the future will have the ability to compute and connect,” said Skaugen. “Our 30-year history of collaboration with Taiwan has delivered historic innovation to the world, from personal computing to the cloud and data centers. The next 30 years will see even greater innovation as we deliver new computing experiences and bring intelligence and connectivity to the Internet of Things together.”

Skaugen offered predictions into the future of computing and showcased the products and platforms that will take us there. He also showed how these innovations will soon enable intelligence to be everywhere.

Internet of Things News:

  • Intel introduced the expansion of the Intel® IoT Gateway product family. The latest gateway reference design offers expanded choice in silicon and software with the addition of Intel® Core™ processor-based gateways and Wind River* Intelligent Device Platform XT 3 with flexible packaging options for applications that require a low cost of entry.
  • Intel also expanded the choice of operating systems for Intel® IoT Gateway reference designs with the availability of Ubuntu Snappy Core from Canonical*. This builds upon the current OS availability from Microsoft* and Wind River.
  • Specifically for IoT solutions, especially retail and medical environments, Intel announced the new Intel® Pentium®, Intel® Celeron® and Intel® Atom™ processors. With stunning graphics performance in a low thermal envelope, the processors are customized for IoT and offer seven year availability.

Computing Experiences and Platform News:

  • Intel® Unite™ was introduced as a new cost-effective business solution designed for easy and intuitive collaboration and improved meeting productivity. With a select Intel® Core™ vPro™ processor-based mini PC in the conference room and the Intel Unite application running on devices, existing conference rooms are modernized and transformed into smart and connected meeting spaces with enhanced security.
  • In the biggest advancement since its inception, Thunderbolt™ 3 delivers one computer port that connects to Thunderbolt devices, every display and billions of USB devices. For the first time, a single cable now provides four times the data and twice the video bandwidth of any other cable, while also supplying power. It’s unrivaled for new uses, such as 4K video, single-cable docks with charging, external graphics and built-in 10 GbE networking. Initial products are expected to start shipping before the end of this year, with more expected in 2016.
  • The 5th generation Intel Core family also now includes the first LGA socketed desktop processor with integrated Iris™ Pro graphics, Intel’s most powerful client processor graphics and media engine. The lower 65-watt thermal design power (TDP) allows full PC performance in a broad range of form factors, including smaller and thinner mini PCs and all-in-one desktops, providing up to two times better 3-D graphics performance, 35 percent video conversion and 20 percent compute performance over the previous generation processors.1
  • Intel also introduced 5th generation Intel® Core™ mobile processors for mobile and IoT with integrated Intel® Iris™ Pro Graphics. Optimized for gamers and content creators on the go, Intel’s fastest and most responsive mobile processors have Intel Iris Pro graphics 6200 and provide up to two times higher compute performance and two times better 3-D graphics performance compared to the current generation.2 These processors are also ideal for medical, public works and industrial IoT applications with the inclusion of critical features for powerful IoT designs, including ECC memory support, Intel® vPro™ technology and offer seven year availability.
  • Highlighting progress toward a future of a completely wireless computing experience, Intel announced it is working with Targus* to deliver Rezence standard-based wireless charging solutions. Intel also recently announced an agreement with China-based Haier* to bring wireless charging solutions to restaurants, hotels, cafés, and airports in China later this year. Additionally, Intel will work with A4WP members, Foxconn Interconnect*, Basecom* and original design manufacturers BYD* and Primax* to bring wireless charging solutions to market later this year.

Data Center News:

  • Intel introduced the Intel® Xeon® processor E3-1200 v4 product family, the first time the Xeon processor line has included integrated Intel® Iris™ Pro graphics P6300. Built on 14nm process technology and designed for visually intensive, cloud-based workloads such as high-definition (HD) video transcoding and remote workstation delivery, the product family delivers up to 1.4x the performance for video transcoding3 and up to 1.8x the 3-D graphics performance4 compared to the prior generation.

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, the Intel logo, Celeron, Intel Atom, Intel Core, Intel RealSense, Intel vPro, Iris, Pentium and Thunderbolt are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

1 Intel® Core™ i7-5775C with Intel® Iris® Pro graphics 6200 compared to 65W Intel® Core™ i7-4790S with Intel® HD graphics 4600 using 3DMark11 – Graphics score performance preset, HDxPRT_2014 Convert Videos, SPECint_rate_base2006*.

2 Intel® Core™ i7-5950HQ with Intel® Iris® Pro graphics 6200 compared to i7-5600U with Intel HD Graphics 5500 using SPECint_rate_base2006, 3DMark11 – Graphics score performance preset.

3 Up to 1.4x transcoding performance with Intel® Xeon® E3-1285L v4 when compared with Intel® Xeon E3 v3 on Intel Media Server Studio 2015 R3 Essentials Edition. Number of real time threads transcoded simultaneously: 10 on E301286L v3, 14 on E3-1285L, using 1080p30 20Mbps streams. Baseline configuration: Intel Rainbow Pass SR1200V3RP Platform with Intel® Xeon® E3-1286Lv3 (65W, 4C, 3.4Ghz, Intel® Iris Pro Graphics P6300) or Intel® Xeon® Processor E3-1286L V3 (65W, 4C, 3.2Ghz, Intel® HD Graphics p4700), 32 GB (4x8GB DDR3-1600MHz UDIMM), 160GB 7200 SATA HDD, Turbo Boost Enabled, HT Enabled, Windows Server 2012 R2, Intel Media Server Studio 2015 R3 Essentials Edition, Multi Transcoding Sample Version 6.0.0.36, Intel graphics driver pGFX 10.18.14.4172, BIOS S1200RP.86B.03.01.002. Source: Intel internal measurements as of May 2015

4 Up to 1.8x better performance on 3DMark11*. Baseline configuration: Intel® Hermosa Beach 2 CRB platform with Intel® Xeon® E3-1286v3, 32GB memory (4x 8GB DDR3-1333 UDIMM), 64GB SATA SSD, Turbo Boost Enabled, HT Enabled, Red Hat Enterprise Linux 6.3, Oracle Java Hotspot Java 1.7.0_17. 3DMark Score 1524, Source: Internal Intel® measurements as of April 2014. Intel® Xeon® workstation platform (Intel S1200RP Board) with one Intel Xeon processor E3-1285 v4 (quad-core, 3.5GHz, 6M cache) BIOS S1200RP.86B.03.01.0002.041520151123, Intel HT Technology best configuration, 32GB memory (4x8GB DDR3-1600 ECC UDIMM), Intel Iris Pro Graphics P6300 with driver 10.18.10.3980, Intel SSDSC2BB300G4, Microsoft Windows 8.1*. 3DMark Score 2881, Source: Intel internal testing as of June 2015.

Systems:
Intel® Core™ i7-4790S processor (up to 4.0GHz, 4C8T, 8M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920×1080, Intel HD Graphics 4600, Windows* 8.1
Intel® Core™ i7-5775C processor (up to 3.7GHz, 4C8T, 6M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920×1080, Intel Iris™ Pro Graphics 6200, Windows* 8.1
Intel® Core™ i7-5950HQ processor (up to 3.8GHz, 4C8T, 6M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920×1080, Intel Iris™ Pro Graphics 6200, Windows* 8.1
Intel® Core™ i7-5600U processor (up to 3.7GHz, 2C4T, 4M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920×1080, Intel HD Graphics 5500, Windows* 8.1

Tests:
HDxPRT* 2014 – Convert Videos: High Definition Experience & Performance Ratings Test, is a benchmark from Principled Technologies* that measures Windows* media editing performance. It uses mainstream applications to test the performance of the system.

3DMark* 11:  3DMark* 11 is a benchmark from Futuremark* that measures DX 11 gaming performance. There are four DX 11 graphics tests with three quality presets: Entry, Performance, Extreme. Reported metrics: Graphics Score (GPU), Physics Score (CPU), Combined Score (GPU & CPU) and an overall 3DMark Score (higher is better for all Scores). OS support: Desktop Windows.

SPEC* CPU2006:  SPEC* CPU2006 is a benchmark from the SPEC consortium that measures device performance and throughput using compute intensive application subtests. SPECint*_base2006 measures how fast a device completes a single integer compute task. SPECint*_rate_base2006 measures throughput, or how many integer compute tasks a device can accomplish in a given amount of time. Reported metrics: TBD. Scaling efficiencies: TBD. OS support: Desktop Windows*.

Results have been estimated based on internal Intel analysis and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors.

Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.  For more complete information visit www.intel.com/performance.

Intel Leads a New Era of Computing Experiences, Intelligence Everywhere

by

Computing Innovation, New Experiences and Internet of Things Solutions to Create Smart and Connected World

BDW-H-WhiteBkgd.jpgBDW-H-noReflect-noShadow.jpg

5th Gen Intel® Core™ mobile processor (“Broadwell-H”)

BDW-LGA-BlueBkgd.jpgBDW-LGA-noreflect.jpg

5th Gen Intel® Core™ desktop processor (“Broadwell-H”)

unite_lnchr_andrd_512.jpg

Intel Unite enables smart and connected meeting spaces with enhanced security

COMPUTEX, Taipei, Taiwan, June 2, 2015 – Intel Corporation today announced products and solutions that will deliver new user experiences and support the computing ecosystem’s expansion into new areas. During the opening keynote address at Computex 2015, Kirk Skaugen, senior vice president and general manager of Intel’s Client Computing Group encouraged the Taiwan ecosystem to work together and capture the opportunity to shape the future of computing.

“The power of Moore’s Law has enabled incredible computing innovation over the past 50 years and because of it, nearly everything in the future will have the ability to compute and connect,” said Skaugen. “Our 30-year history of collaboration with Taiwan has delivered historic innovation to the world, from personal computing to the cloud and data centers. The next 30 years will see even greater innovation as we deliver new computing experiences and bring intelligence and connectivity to the Internet of Things together.”

Skaugen offered predictions into the future of computing and showcased the products and platforms that will take us there. He also showed how these innovations will soon enable intelligence to be everywhere.

Internet of Things News:

  • Intel introduced the expansion of the Intel® IoT Gateway product family. The latest gateway reference design offers expanded choice in silicon and software with the addition of Intel® Core™ processor-based gateways and Wind River* Intelligent Device Platform XT 3 with flexible packaging options for applications that require a low cost of entry.
  • Intel also expanded the choice of operating systems for Intel® IoT Gateway reference designs with the availability of Ubuntu Snappy Core from Canonical*. This builds upon the current OS availability from Microsoft* and Wind River.
  • Specifically for IoT solutions, especially retail and medical environments, Intel announced the new Intel® Pentium®, Intel® Celeron® and Intel® Atom™ processors. With stunning graphics performance in a low thermal envelope, the processors are customized for IoT and offer seven year availability.

Computing Experiences and Platform News:

  • Intel® Unite™ was introduced as a new cost-effective business solution designed for easy and intuitive collaboration and improved meeting productivity. With a select Intel® Core™ vPro™ processor-based mini PC in the conference room and the Intel Unite application running on devices, existing conference rooms are modernized and transformed into smart and connected meeting spaces with enhanced security.
  • In the biggest advancement since its inception, Thunderbolt™ 3 delivers one computer port that connects to Thunderbolt devices, every display and billions of USB devices. For the first time, a single cable now provides four times the data and twice the video bandwidth of any other cable, while also supplying power. It’s unrivaled for new uses, such as 4K video, single-cable docks with charging, external graphics and built-in 10 GbE networking. Initial products are expected to start shipping before the end of this year, with more expected in 2016.
  • The 5th generation Intel Core family also now includes the first LGA socketed desktop processor with integrated Iris™ Pro graphics, Intel’s most powerful client processor graphics and media engine. The lower 65-watt thermal design power (TDP) allows full PC performance in a broad range of form factors, including smaller and thinner mini PCs and all-in-one desktops, providing up to two times better 3-D graphics performance, 35 percent video conversion and 20 percent compute performance over the previous generation processors.1
  • Intel also introduced 5th generation Intel® Core™ mobile processors for mobile and IoT with integrated Intel® Iris™ Pro Graphics. Optimized for gamers and content creators on the go, Intel’s fastest and most responsive mobile processors have Intel Iris Pro graphics 6200 and provide up to two times higher compute performance and two times better 3-D graphics performance compared to the current generation.2 These processors are also ideal for medical, public works and industrial IoT applications with the inclusion of critical features for powerful IoT designs, including ECC memory support, Intel® vPro™ technology and offer seven year availability.
  • Highlighting progress toward a future of a completely wireless computing experience, Intel announced it is working with Targus* to deliver Rezence standard-based wireless charging solutions. Intel also recently announced an agreement with China-based Haier* to bring wireless charging solutions to restaurants, hotels, cafés, and airports in China later this year. Additionally, Intel will work with A4WP members, Foxconn Interconnect*, Basecom* and original design manufacturers BYD* and Primax* to bring wireless charging solutions to market later this year.

Data Center News:

  • Intel introduced the Intel® Xeon® processor E3-1200 v4 product family, the first time the Xeon processor line has included integrated Intel® Iris™ Pro graphics P6300. Built on 14nm process technology and designed for visually intensive, cloud-based workloads such as high-definition (HD) video transcoding and remote workstation delivery, the product family delivers up to 1.4x the performance for video transcoding3 and up to 1.8x the 3-D graphics performance4 compared to the prior generation.

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, the Intel logo, Celeron, Intel Atom, Intel Core, Intel RealSense, Intel vPro, Iris, Pentium and Thunderbolt are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

1 Intel® Core™ i7-5775C with Intel® Iris® Pro graphics 6200 compared to 65W Intel® Core™ i7-4790S with Intel® HD graphics 4600 using 3DMark11 – Graphics score performance preset, HDxPRT_2014 Convert Videos, SPECint_rate_base2006*.

2 Intel® Core™ i7-5950HQ with Intel® Iris® Pro graphics 6200 compared to i7-5600U with Intel HD Graphics 5500 using SPECint_rate_base2006, 3DMark11 – Graphics score performance preset.

3 Up to 1.4x transcoding performance with Intel® Xeon® E3-1285L v4 when compared with Intel® Xeon E3 v3 on Intel Media Server Studio 2015 R3 Essentials Edition. Number of real time threads transcoded simultaneously: 10 on E301286L v3, 14 on E3-1285L, using 1080p30 20Mbps streams. Baseline configuration: Intel Rainbow Pass SR1200V3RP Platform with Intel® Xeon® E3-1286Lv3 (65W, 4C, 3.4Ghz, Intel® Iris Pro Graphics P6300) or Intel® Xeon® Processor E3-1286L V3 (65W, 4C, 3.2Ghz, Intel® HD Graphics p4700), 32 GB (4x8GB DDR3-1600MHz UDIMM), 160GB 7200 SATA HDD, Turbo Boost Enabled, HT Enabled, Windows Server 2012 R2, Intel Media Server Studio 2015 R3 Essentials Edition, Multi Transcoding Sample Version 6.0.0.36, Intel graphics driver pGFX 10.18.14.4172, BIOS S1200RP.86B.03.01.002. Source: Intel internal measurements as of May 2015

4 Up to 1.8x better performance on 3DMark11*. Baseline configuration: Intel® Hermosa Beach 2 CRB platform with Intel® Xeon® E3-1286v3, 32GB memory (4x 8GB DDR3-1333 UDIMM), 64GB SATA SSD, Turbo Boost Enabled, HT Enabled, Red Hat Enterprise Linux 6.3, Oracle Java Hotspot Java 1.7.0_17. 3DMark Score 1524, Source: Internal Intel® measurements as of April 2014. Intel® Xeon® workstation platform (Intel S1200RP Board) with one Intel Xeon processor E3-1285 v4 (quad-core, 3.5GHz, 6M cache) BIOS S1200RP.86B.03.01.0002.041520151123, Intel HT Technology best configuration, 32GB memory (4x8GB DDR3-1600 ECC UDIMM), Intel Iris Pro Graphics P6300 with driver 10.18.10.3980, Intel SSDSC2BB300G4, Microsoft Windows 8.1*. 3DMark Score 2881, Source: Intel internal testing as of June 2015.

Systems:
Intel® Core™ i7-4790S processor (up to 4.0GHz, 4C8T, 8M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920×1080, Intel HD Graphics 4600, Windows* 8.1
Intel® Core™ i7-5775C processor (up to 3.7GHz, 4C8T, 6M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920×1080, Intel Iris™ Pro Graphics 6200, Windows* 8.1
Intel® Core™ i7-5950HQ processor (up to 3.8GHz, 4C8T, 6M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920×1080, Intel Iris™ Pro Graphics 6200, Windows* 8.1
Intel® Core™ i7-5600U processor (up to 3.7GHz, 2C4T, 4M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920×1080, Intel HD Graphics 5500, Windows* 8.1

Tests:
HDxPRT* 2014 – Convert Videos: High Definition Experience & Performance Ratings Test, is a benchmark from Principled Technologies* that measures Windows* media editing performance. It uses mainstream applications to test the performance of the system.

3DMark* 11:  3DMark* 11 is a benchmark from Futuremark* that measures DX 11 gaming performance. There are four DX 11 graphics tests with three quality presets: Entry, Performance, Extreme. Reported metrics: Graphics Score (GPU), Physics Score (CPU), Combined Score (GPU & CPU) and an overall 3DMark Score (higher is better for all Scores). OS support: Desktop Windows.

SPEC* CPU2006:  SPEC* CPU2006 is a benchmark from the SPEC consortium that measures device performance and throughput using compute intensive application subtests. SPECint*_base2006 measures how fast a device completes a single integer compute task. SPECint*_rate_base2006 measures throughput, or how many integer compute tasks a device can accomplish in a given amount of time. Reported metrics: TBD. Scaling efficiencies: TBD. OS support: Desktop Windows*.

Results have been estimated based on internal Intel analysis and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors.

Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.  For more complete information visit www.intel.com/performance.

Intel Leads a New Era of Computing Experiences, Intelligence Everywhere

by

Computing Innovation, New Experiences and Internet of Things Solutions to Create Smart and Connected World

BDW-H-WhiteBkgd.jpgBDW-H-noReflect-noShadow.jpg

5th Gen Intel® Core™ mobile processor (“Broadwell-H”)

BDW-LGA-BlueBkgd.jpgBDW-LGA-noreflect.jpg

5th Gen Intel® Core™ desktop processor (“Broadwell-H”)

unite_lnchr_andrd_512.jpg

Intel Unite enables smart and connected meeting spaces with enhanced security

COMPUTEX, Taipei, Taiwan, June 2, 2015 – Intel Corporation today announced products and solutions that will deliver new user experiences and support the computing ecosystem’s expansion into new areas. During the opening keynote address at Computex 2015, Kirk Skaugen, senior vice president and general manager of Intel’s Client Computing Group encouraged the Taiwan ecosystem to work together and capture the opportunity to shape the future of computing.

“The power of Moore’s Law has enabled incredible computing innovation over the past 50 years and because of it, nearly everything in the future will have the ability to compute and connect,” said Skaugen. “Our 30-year history of collaboration with Taiwan has delivered historic innovation to the world, from personal computing to the cloud and data centers. The next 30 years will see even greater innovation as we deliver new computing experiences and bring intelligence and connectivity to the Internet of Things together.”

Skaugen offered predictions into the future of computing and showcased the products and platforms that will take us there. He also showed how these innovations will soon enable intelligence to be everywhere.

Internet of Things News:

  • Intel introduced the expansion of the Intel® IoT Gateway product family. The latest gateway reference design offers expanded choice in silicon and software with the addition of Intel® Core™ processor-based gateways and Wind River* Intelligent Device Platform XT 3 with flexible packaging options for applications that require a low cost of entry.
  • Intel also expanded the choice of operating systems for Intel® IoT Gateway reference designs with the availability of Ubuntu Snappy Core from Canonical*. This builds upon the current OS availability from Microsoft* and Wind River.
  • Specifically for IoT solutions, especially retail and medical environments, Intel announced the new Intel® Pentium®, Intel® Celeron® and Intel® Atom™ processors. With stunning graphics performance in a low thermal envelope, the processors are customized for IoT and offer seven year availability.

Computing Experiences and Platform News:

  • Intel® Unite™ was introduced as a new cost-effective business solution designed for easy and intuitive collaboration and improved meeting productivity. With a select Intel® Core™ vPro™ processor-based mini PC in the conference room and the Intel Unite application running on devices, existing conference rooms are modernized and transformed into smart and connected meeting spaces with enhanced security.
  • In the biggest advancement since its inception, Thunderbolt™ 3 delivers one computer port that connects to Thunderbolt devices, every display and billions of USB devices. For the first time, a single cable now provides four times the data and twice the video bandwidth of any other cable, while also supplying power. It’s unrivaled for new uses, such as 4K video, single-cable docks with charging, external graphics and built-in 10 GbE networking. Initial products are expected to start shipping before the end of this year, with more expected in 2016.
  • The 5th generation Intel Core family also now includes the first LGA socketed desktop processor with integrated Iris™ Pro graphics, Intel’s most powerful client processor graphics and media engine. The lower 65-watt thermal design power (TDP) allows full PC performance in a broad range of form factors, including smaller and thinner mini PCs and all-in-one desktops, providing up to two times better 3-D graphics performance, 35 percent video conversion and 20 percent compute performance over the previous generation processors.1
  • Intel also introduced 5th generation Intel® Core™ mobile processors for mobile and IoT with integrated Intel® Iris™ Pro Graphics. Optimized for gamers and content creators on the go, Intel’s fastest and most responsive mobile processors have Intel Iris Pro graphics 6200 and provide up to two times higher compute performance and two times better 3-D graphics performance compared to the current generation.2 These processors are also ideal for medical, public works and industrial IoT applications with the inclusion of critical features for powerful IoT designs, including ECC memory support, Intel® vPro™ technology and offer seven year availability.
  • Highlighting progress toward a future of a completely wireless computing experience, Intel announced it is working with Targus* to deliver Rezence standard-based wireless charging solutions. Intel also recently announced an agreement with China-based Haier* to bring wireless charging solutions to restaurants, hotels, cafés, and airports in China later this year. Additionally, Intel will work with A4WP members, Foxconn Interconnect*, Basecom* and original design manufacturers BYD* and Primax* to bring wireless charging solutions to market later this year.

Data Center News:

  • Intel introduced the Intel® Xeon® processor E3-1200 v4 product family, the first time the Xeon processor line has included integrated Intel® Iris™ Pro graphics P6300. Built on 14nm process technology and designed for visually intensive, cloud-based workloads such as high-definition (HD) video transcoding and remote workstation delivery, the product family delivers up to 1.4x the performance for video transcoding3 and up to 1.8x the 3-D graphics performance4 compared to the prior generation.

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, the Intel logo, Celeron, Intel Atom, Intel Core, Intel RealSense, Intel vPro, Iris, Pentium and Thunderbolt are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

1 Intel® Core™ i7-5775C with Intel® Iris® Pro graphics 6200 compared to 65W Intel® Core™ i7-4790S with Intel® HD graphics 4600 using 3DMark11 – Graphics score performance preset, HDxPRT_2014 Convert Videos, SPECint_rate_base2006*.

2 Intel® Core™ i7-5950HQ with Intel® Iris® Pro graphics 6200 compared to i7-5600U with Intel HD Graphics 5500 using SPECint_rate_base2006, 3DMark11 – Graphics score performance preset.

3 Up to 1.4x transcoding performance with Intel® Xeon® E3-1285L v4 when compared with Intel® Xeon E3 v3 on Intel Media Server Studio 2015 R3 Essentials Edition. Number of real time threads transcoded simultaneously: 10 on E301286L v3, 14 on E3-1285L, using 1080p30 20Mbps streams. Baseline configuration: Intel Rainbow Pass SR1200V3RP Platform with Intel® Xeon® E3-1286Lv3 (65W, 4C, 3.4Ghz, Intel® Iris Pro Graphics P6300) or Intel® Xeon® Processor E3-1286L V3 (65W, 4C, 3.2Ghz, Intel® HD Graphics p4700), 32 GB (4x8GB DDR3-1600MHz UDIMM), 160GB 7200 SATA HDD, Turbo Boost Enabled, HT Enabled, Windows Server 2012 R2, Intel Media Server Studio 2015 R3 Essentials Edition, Multi Transcoding Sample Version 6.0.0.36, Intel graphics driver pGFX 10.18.14.4172, BIOS S1200RP.86B.03.01.002. Source: Intel internal measurements as of May 2015

4 Up to 1.8x better performance on 3DMark11*. Baseline configuration: Intel® Hermosa Beach 2 CRB platform with Intel® Xeon® E3-1286v3, 32GB memory (4x 8GB DDR3-1333 UDIMM), 64GB SATA SSD, Turbo Boost Enabled, HT Enabled, Red Hat Enterprise Linux 6.3, Oracle Java Hotspot Java 1.7.0_17. 3DMark Score 1524, Source: Internal Intel® measurements as of April 2014. Intel® Xeon® workstation platform (Intel S1200RP Board) with one Intel Xeon processor E3-1285 v4 (quad-core, 3.5GHz, 6M cache) BIOS S1200RP.86B.03.01.0002.041520151123, Intel HT Technology best configuration, 32GB memory (4x8GB DDR3-1600 ECC UDIMM), Intel Iris Pro Graphics P6300 with driver 10.18.10.3980, Intel SSDSC2BB300G4, Microsoft Windows 8.1*. 3DMark Score 2881, Source: Intel internal testing as of June 2015.

Systems:
Intel® Core™ i7-4790S processor (up to 4.0GHz, 4C8T, 8M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920×1080, Intel HD Graphics 4600, Windows* 8.1
Intel® Core™ i7-5775C processor (up to 3.7GHz, 4C8T, 6M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920×1080, Intel Iris™ Pro Graphics 6200, Windows* 8.1
Intel® Core™ i7-5950HQ processor (up to 3.8GHz, 4C8T, 6M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920×1080, Intel Iris™ Pro Graphics 6200, Windows* 8.1
Intel® Core™ i7-5600U processor (up to 3.7GHz, 2C4T, 4M Cache), Intel Reference Board, Memory: 2x4GB DDR3-1600, Storage: 160GB Intel Series 320 SSD, Display Resolution:1920×1080, Intel HD Graphics 5500, Windows* 8.1

Tests:
HDxPRT* 2014 – Convert Videos: High Definition Experience & Performance Ratings Test, is a benchmark from Principled Technologies* that measures Windows* media editing performance. It uses mainstream applications to test the performance of the system.

3DMark* 11:  3DMark* 11 is a benchmark from Futuremark* that measures DX 11 gaming performance. There are four DX 11 graphics tests with three quality presets: Entry, Performance, Extreme. Reported metrics: Graphics Score (GPU), Physics Score (CPU), Combined Score (GPU & CPU) and an overall 3DMark Score (higher is better for all Scores). OS support: Desktop Windows.

SPEC* CPU2006:  SPEC* CPU2006 is a benchmark from the SPEC consortium that measures device performance and throughput using compute intensive application subtests. SPECint*_base2006 measures how fast a device completes a single integer compute task. SPECint*_rate_base2006 measures throughput, or how many integer compute tasks a device can accomplish in a given amount of time. Reported metrics: TBD. Scaling efficiencies: TBD. OS support: Desktop Windows*.

Results have been estimated based on internal Intel analysis and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors.

Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.  For more complete information visit www.intel.com/performance.

Intel Leads a New Era of Computing Experiences, Intelligence Everywhere

by

Computing Innovation, New Experiences and Internet of Things Solutions to Create Smart and Connected World 5th Gen Intel® Core™ mobile processor (“Broadwell-H”) 5th Gen Intel® Core™ desktop processor (“Broadwell-H”) Intel Unite enables smart and connected meeting spaces with enhanced security COMPUTEX, Taipei, Taiwan, June 2, 2015 – Intel Corporation today announced products and solutions that … Continued

The post Intel Leads a New Era of Computing Experiences, Intelligence Everywhere appeared first on Intel Newsroom.

Micron and Intel Unveil New 3D NAND Flash Memory

by

Micron and Intel Unveil New 3D NAND Flash Memory Technology Advancements Enable Three Times More Capacity than Other NAND Technologies

NEWS HIGHLIGHTS

  • 3D NAND technology uses floating gate cells and enables the highest-density flash device ever developed—three times higher capacity1 than other NAND die in production.
  • Enables gum stick-sized SSDs with more than 3.5 terabytes (TB) of storage and standard 2.5-inch SSDs with greater than 10TB.
  • Innovative process architecture techniques extend Moore’s Law for flash storage, bringing significant improvements in density while lowering the cost of NAND flash.

3D_NAND_Die_with_M2_SSD.jpg

Enables gum stick-sized SSDs with more than 3.5TB of storage

3D_NAND_Die.jpg

Innovative process architecture techniques extend Moore’s Law for flash storage to bring significant improvements in density and lower the cost of NAND flash

3D_NAND_Wafer_Close-Up.jpg

Micron and Intel unveil new 3D NAND technology with three times higher capacity than other NAND die in production

BOISE, Idaho and SANTA CLARA, Calif., March 26, 2015 – Micron Technology, Inc. (Nasdaq: MU), and Intel Corporation today revealed the availability of their 3D NAND technology, the world’s highest-density flash memory. Flash is the storage technology used inside the lightest laptops, fastest data centers, and nearly every cellphone, tablet and mobile device.

This new 3D NAND technology, which was jointly developed by Intel and Micron, stacks layers of data storage cells vertically with extraordinary precision to create storage devices with three times higher capacity1 than competing NAND technologies. This enables more storage in a smaller space, bringing significant cost savings, low power usage and high performance to a range of mobile consumer devices as well as the most demanding enterprise deployments.

Planar NAND flash memory is nearing its practical scaling limits, posing significant challenges for the memory industry. 3D NAND technology is poised to make a dramatic impact by keeping flash storage solutions aligned with Moore’s Law, the trajectory for continued performance gains and cost savings, driving more widespread use of flash storage.

“Micron and Intel’s collaboration has created an industry-leading solid-state storage technology that offers high density, performance and efficiency and is unmatched by any flash today,” said Brian Shirley, vice president of Memory Technology and Solutions at Micron Technology. “This 3D NAND technology has the potential to create fundamental market shifts. The depth of the impact that flash has had to date—from smartphones to flash-optimized supercomputing—is really just scratching the surface of what’s possible.”

“Intel’s development efforts with Micron reflect our continued commitment to offer leading and innovative non-volatile memory technologies to the marketplace,” said Rob Crooke, senior vice president and general manager, Non-Volatile Memory Solutions Group, Intel Corporation. “The significant improvements in density and cost enabled by our new 3D NAND technology innovation will accelerate solid-state storage in computing platforms.”

Innovative Process Architecture
One of the most significant aspects of this technology is in the foundational memory cell itself. Intel and Micron chose to use a floating gate cell, a universally utilized design refined through years of high-volume planar flash manufacturing. This is the first use of a floating gate cell in 3D NAND, which was a key design choice to enable greater performance and increase quality and reliability.

The new 3D NAND technology stacks flash cells vertically in 32 layers to achieve 256Gb multilevel cell (MLC) and 384Gb triple-level cell (TLC) die that fit within a standard package. These capacities can enable gum stick-sized SSDs with more than 3.5TB of storage and standard 2.5-inch SSDs with greater than 10TB. Because capacity is achieved by stacking cells vertically, the individual cell dimensions can be considerably larger. This is expected to increase both performance and endurance and make even the TLC designs well-suited for data center storage.

The key product features of this 3D NAND design include:

  • Large Capacities –Three times the capacity of existing 3D technology1—up to 48GB of NAND per die—enabling three-fourths of a terabyte to fit in a single fingertip-sized package.
  • Reduced Cost per GB – First-generation 3D NAND is architected to achieve better cost efficiencies than planar NAND.
  • Fast – High read/write bandwidth, I/O speeds and random read performance.
  • Green – New sleep modes enable low-power use by cutting power to inactive NAND die (even when other die in the same package are active), dropping power consumption significantly in standby mode.
  • Smart – Innovative new features improve latency and increase endurance over previous generations, and also make system integration easier.

The 256Gb MLC version of 3D NAND is sampling with select partners today, and the 384Gb TLC design will be sampling later this spring. The fab production line has already begun initial runs, and both devices will be in full production by the fourth quarter of this year. Both companies are also developing individual lines of SSD solutions based on 3D NAND technology and expect those products to be available within the next year.

Webcast Replay of 3D NAND Announcement

Related Information

Micron

Take part in Micron’s social conversations where we’re talking all things storage and memory:

Intel

Contribute to the SSD conversations through Intel’s social channels:

Micron Technology, Inc.
 Micron Technology, Inc., is a global leader in advanced semiconductor systems. Micron’s broad portfolio of high-performance memory technologies—including DRAM, NAND and NOR Flash—is the basis for solid state drives, modules, multichip packages and other system solutions. Backed by more than 35 years of technology leadership, Micron’s memory solutions enable the world’s most innovative computing, consumer, enterprise storage, networking, mobile, embedded and automotive applications. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com

©2015 Micron Technology, Inc. All rights reserved. Micron and the Micron orbit logo are trademarks of Micron Technology, Inc.

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

This document contains forward looking statements. Forward looking statements are predictions, projections and other statements about future events that are based on current expectations and assumptions and, as a result, are subject to risks and uncertainties. Many factors could cause actual results to differ materially from the forward-looking statements in this document. A detailed discussion of the factors that could affect Intel’s results and plans is included in Intel’s SEC filings, including the annual report on Form 10-K.

1 Capacity difference based on comparison between Micron and Intel 384 Gb TLC 3D NAND die and other industry 3D NAND TLC

Micron and Intel Unveil New 3D NAND Flash Memory

by

Micron and Intel Unveil New 3D NAND Flash Memory Technology Advancements Enable Three Times More Capacity than Other NAND Technologies

NEWS HIGHLIGHTS

  • 3D NAND technology uses floating gate cells and enables the highest-density flash device ever developed—three times higher capacity1 than other NAND die in production.
  • Enables gum stick-sized SSDs with more than 3.5 terabytes (TB) of storage and standard 2.5-inch SSDs with greater than 10TB.
  • Innovative process architecture techniques extend Moore’s Law for flash storage, bringing significant improvements in density while lowering the cost of NAND flash.

3D_NAND_Die_with_M2_SSD.jpg

Enables gum stick-sized SSDs with more than 3.5TB of storage

3D_NAND_Die.jpg

Innovative process architecture techniques extend Moore’s Law for flash storage to bring significant improvements in density and lower the cost of NAND flash

3D_NAND_Wafer_Close-Up.jpg

Micron and Intel unveil new 3D NAND technology with three times higher capacity than other NAND die in production

BOISE, Idaho and SANTA CLARA, Calif., March 26, 2015 – Micron Technology, Inc. (Nasdaq: MU), and Intel Corporation today revealed the availability of their 3D NAND technology, the world’s highest-density flash memory. Flash is the storage technology used inside the lightest laptops, fastest data centers, and nearly every cellphone, tablet and mobile device.

This new 3D NAND technology, which was jointly developed by Intel and Micron, stacks layers of data storage cells vertically with extraordinary precision to create storage devices with three times higher capacity1 than competing NAND technologies. This enables more storage in a smaller space, bringing significant cost savings, low power usage and high performance to a range of mobile consumer devices as well as the most demanding enterprise deployments.

Planar NAND flash memory is nearing its practical scaling limits, posing significant challenges for the memory industry. 3D NAND technology is poised to make a dramatic impact by keeping flash storage solutions aligned with Moore’s Law, the trajectory for continued performance gains and cost savings, driving more widespread use of flash storage.

“Micron and Intel’s collaboration has created an industry-leading solid-state storage technology that offers high density, performance and efficiency and is unmatched by any flash today,” said Brian Shirley, vice president of Memory Technology and Solutions at Micron Technology. “This 3D NAND technology has the potential to create fundamental market shifts. The depth of the impact that flash has had to date—from smartphones to flash-optimized supercomputing—is really just scratching the surface of what’s possible.”

“Intel’s development efforts with Micron reflect our continued commitment to offer leading and innovative non-volatile memory technologies to the marketplace,” said Rob Crooke, senior vice president and general manager, Non-Volatile Memory Solutions Group, Intel Corporation. “The significant improvements in density and cost enabled by our new 3D NAND technology innovation will accelerate solid-state storage in computing platforms.”

Innovative Process Architecture
One of the most significant aspects of this technology is in the foundational memory cell itself. Intel and Micron chose to use a floating gate cell, a universally utilized design refined through years of high-volume planar flash manufacturing. This is the first use of a floating gate cell in 3D NAND, which was a key design choice to enable greater performance and increase quality and reliability.

The new 3D NAND technology stacks flash cells vertically in 32 layers to achieve 256Gb multilevel cell (MLC) and 384Gb triple-level cell (TLC) die that fit within a standard package. These capacities can enable gum stick-sized SSDs with more than 3.5TB of storage and standard 2.5-inch SSDs with greater than 10TB. Because capacity is achieved by stacking cells vertically, the individual cell dimensions can be considerably larger. This is expected to increase both performance and endurance and make even the TLC designs well-suited for data center storage.

The key product features of this 3D NAND design include:

  • Large Capacities –Three times the capacity of existing 3D technology1—up to 48GB of NAND per die—enabling three-fourths of a terabyte to fit in a single fingertip-sized package.
  • Reduced Cost per GB – First-generation 3D NAND is architected to achieve better cost efficiencies than planar NAND.
  • Fast – High read/write bandwidth, I/O speeds and random read performance.
  • Green – New sleep modes enable low-power use by cutting power to inactive NAND die (even when other die in the same package are active), dropping power consumption significantly in standby mode.
  • Smart – Innovative new features improve latency and increase endurance over previous generations, and also make system integration easier.

The 256Gb MLC version of 3D NAND is sampling with select partners today, and the 384Gb TLC design will be sampling later this spring. The fab production line has already begun initial runs, and both devices will be in full production by the fourth quarter of this year. Both companies are also developing individual lines of SSD solutions based on 3D NAND technology and expect those products to be available within the next year.

Webcast Replay of 3D NAND Announcement

Related Information

Micron

Take part in Micron’s social conversations where we’re talking all things storage and memory:

Intel

Contribute to the SSD conversations through Intel’s social channels:

Micron Technology, Inc.
 Micron Technology, Inc., is a global leader in advanced semiconductor systems. Micron’s broad portfolio of high-performance memory technologies—including DRAM, NAND and NOR Flash—is the basis for solid state drives, modules, multichip packages and other system solutions. Backed by more than 35 years of technology leadership, Micron’s memory solutions enable the world’s most innovative computing, consumer, enterprise storage, networking, mobile, embedded and automotive applications. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com

©2015 Micron Technology, Inc. All rights reserved. Micron and the Micron orbit logo are trademarks of Micron Technology, Inc.

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

This document contains forward looking statements. Forward looking statements are predictions, projections and other statements about future events that are based on current expectations and assumptions and, as a result, are subject to risks and uncertainties. Many factors could cause actual results to differ materially from the forward-looking statements in this document. A detailed discussion of the factors that could affect Intel’s results and plans is included in Intel’s SEC filings, including the annual report on Form 10-K.

1 Capacity difference based on comparison between Micron and Intel 384 Gb TLC 3D NAND die and other industry 3D NAND TLC

Micron and Intel Unveil New 3D NAND Flash Memory

by

Micron and Intel Unveil New 3D NAND Flash Memory Technology Advancements Enable Three Times More Capacity than Other NAND Technologies

NEWS HIGHLIGHTS

  • 3D NAND technology uses floating gate cells and enables the highest-density flash device ever developed—three times higher capacity1 than other NAND die in production.
  • Enables gum stick-sized SSDs with more than 3.5 terabytes (TB) of storage and standard 2.5-inch SSDs with greater than 10TB.
  • Innovative process architecture techniques extend Moore’s Law for flash storage, bringing significant improvements in density while lowering the cost of NAND flash.

3D_NAND_Die_with_M2_SSD.jpg

Enables gum stick-sized SSDs with more than 3.5TB of storage

3D_NAND_Die.jpg

Innovative process architecture techniques extend Moore’s Law for flash storage to bring significant improvements in density and lower the cost of NAND flash

3D_NAND_Wafer_Close-Up.jpg

Micron and Intel unveil new 3D NAND technology with three times higher capacity than other NAND die in production

BOISE, Idaho and SANTA CLARA, Calif., March 26, 2015 – Micron Technology, Inc. (Nasdaq: MU), and Intel Corporation today revealed the availability of their 3D NAND technology, the world’s highest-density flash memory. Flash is the storage technology used inside the lightest laptops, fastest data centers, and nearly every cellphone, tablet and mobile device.

This new 3D NAND technology, which was jointly developed by Intel and Micron, stacks layers of data storage cells vertically with extraordinary precision to create storage devices with three times higher capacity1 than competing NAND technologies. This enables more storage in a smaller space, bringing significant cost savings, low power usage and high performance to a range of mobile consumer devices as well as the most demanding enterprise deployments.

Planar NAND flash memory is nearing its practical scaling limits, posing significant challenges for the memory industry. 3D NAND technology is poised to make a dramatic impact by keeping flash storage solutions aligned with Moore’s Law, the trajectory for continued performance gains and cost savings, driving more widespread use of flash storage.

“Micron and Intel’s collaboration has created an industry-leading solid-state storage technology that offers high density, performance and efficiency and is unmatched by any flash today,” said Brian Shirley, vice president of Memory Technology and Solutions at Micron Technology. “This 3D NAND technology has the potential to create fundamental market shifts. The depth of the impact that flash has had to date—from smartphones to flash-optimized supercomputing—is really just scratching the surface of what’s possible.”

“Intel’s development efforts with Micron reflect our continued commitment to offer leading and innovative non-volatile memory technologies to the marketplace,” said Rob Crooke, senior vice president and general manager, Non-Volatile Memory Solutions Group, Intel Corporation. “The significant improvements in density and cost enabled by our new 3D NAND technology innovation will accelerate solid-state storage in computing platforms.”

Innovative Process Architecture
One of the most significant aspects of this technology is in the foundational memory cell itself. Intel and Micron chose to use a floating gate cell, a universally utilized design refined through years of high-volume planar flash manufacturing. This is the first use of a floating gate cell in 3D NAND, which was a key design choice to enable greater performance and increase quality and reliability.

The new 3D NAND technology stacks flash cells vertically in 32 layers to achieve 256Gb multilevel cell (MLC) and 384Gb triple-level cell (TLC) die that fit within a standard package. These capacities can enable gum stick-sized SSDs with more than 3.5TB of storage and standard 2.5-inch SSDs with greater than 10TB. Because capacity is achieved by stacking cells vertically, the individual cell dimensions can be considerably larger. This is expected to increase both performance and endurance and make even the TLC designs well-suited for data center storage.

The key product features of this 3D NAND design include:

  • Large Capacities –Three times the capacity of existing 3D technology1—up to 48GB of NAND per die—enabling three-fourths of a terabyte to fit in a single fingertip-sized package.
  • Reduced Cost per GB – First-generation 3D NAND is architected to achieve better cost efficiencies than planar NAND.
  • Fast – High read/write bandwidth, I/O speeds and random read performance.
  • Green – New sleep modes enable low-power use by cutting power to inactive NAND die (even when other die in the same package are active), dropping power consumption significantly in standby mode.
  • Smart – Innovative new features improve latency and increase endurance over previous generations, and also make system integration easier.

The 256Gb MLC version of 3D NAND is sampling with select partners today, and the 384Gb TLC design will be sampling later this spring. The fab production line has already begun initial runs, and both devices will be in full production by the fourth quarter of this year. Both companies are also developing individual lines of SSD solutions based on 3D NAND technology and expect those products to be available within the next year.

Webcast Replay of 3D NAND Announcement

Related Information

Micron

Take part in Micron’s social conversations where we’re talking all things storage and memory:

Intel

Contribute to the SSD conversations through Intel’s social channels:

Micron Technology, Inc.
 Micron Technology, Inc., is a global leader in advanced semiconductor systems. Micron’s broad portfolio of high-performance memory technologies—including DRAM, NAND and NOR Flash—is the basis for solid state drives, modules, multichip packages and other system solutions. Backed by more than 35 years of technology leadership, Micron’s memory solutions enable the world’s most innovative computing, consumer, enterprise storage, networking, mobile, embedded and automotive applications. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com

©2015 Micron Technology, Inc. All rights reserved. Micron and the Micron orbit logo are trademarks of Micron Technology, Inc.

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

This document contains forward looking statements. Forward looking statements are predictions, projections and other statements about future events that are based on current expectations and assumptions and, as a result, are subject to risks and uncertainties. Many factors could cause actual results to differ materially from the forward-looking statements in this document. A detailed discussion of the factors that could affect Intel’s results and plans is included in Intel’s SEC filings, including the annual report on Form 10-K.

1 Capacity difference based on comparison between Micron and Intel 384 Gb TLC 3D NAND die and other industry 3D NAND TLC

Micron and Intel Unveil New 3D NAND Flash Memory

by

Micron and Intel Unveil New 3D NAND Flash Memory Technology Advancements Enable Three Times More Capacity than Other NAND Technologies

NEWS HIGHLIGHTS

  • 3D NAND technology uses floating gate cells and enables the highest-density flash device ever developed—three times higher capacity1 than other NAND die in production.
  • Enables gum stick-sized SSDs with more than 3.5 terabytes (TB) of storage and standard 2.5-inch SSDs with greater than 10TB.
  • Innovative process architecture techniques extend Moore’s Law for flash storage, bringing significant improvements in density while lowering the cost of NAND flash.

3D_NAND_Die_with_M2_SSD.jpg

Enables gum stick-sized SSDs with more than 3.5TB of storage

3D_NAND_Die.jpg

Innovative process architecture techniques extend Moore’s Law for flash storage to bring significant improvements in density and lower the cost of NAND flash

3D_NAND_Wafer_Close-Up.jpg

Micron and Intel unveil new 3D NAND technology with three times higher capacity than other NAND die in production

BOISE, Idaho and SANTA CLARA, Calif., March 26, 2015 – Micron Technology, Inc. (Nasdaq: MU), and Intel Corporation today revealed the availability of their 3D NAND technology, the world’s highest-density flash memory. Flash is the storage technology used inside the lightest laptops, fastest data centers, and nearly every cellphone, tablet and mobile device.

This new 3D NAND technology, which was jointly developed by Intel and Micron, stacks layers of data storage cells vertically with extraordinary precision to create storage devices with three times higher capacity1 than competing NAND technologies. This enables more storage in a smaller space, bringing significant cost savings, low power usage and high performance to a range of mobile consumer devices as well as the most demanding enterprise deployments.

Planar NAND flash memory is nearing its practical scaling limits, posing significant challenges for the memory industry. 3D NAND technology is poised to make a dramatic impact by keeping flash storage solutions aligned with Moore’s Law, the trajectory for continued performance gains and cost savings, driving more widespread use of flash storage.

“Micron and Intel’s collaboration has created an industry-leading solid-state storage technology that offers high density, performance and efficiency and is unmatched by any flash today,” said Brian Shirley, vice president of Memory Technology and Solutions at Micron Technology. “This 3D NAND technology has the potential to create fundamental market shifts. The depth of the impact that flash has had to date—from smartphones to flash-optimized supercomputing—is really just scratching the surface of what’s possible.”

“Intel’s development efforts with Micron reflect our continued commitment to offer leading and innovative non-volatile memory technologies to the marketplace,” said Rob Crooke, senior vice president and general manager, Non-Volatile Memory Solutions Group, Intel Corporation. “The significant improvements in density and cost enabled by our new 3D NAND technology innovation will accelerate solid-state storage in computing platforms.”

Innovative Process Architecture
One of the most significant aspects of this technology is in the foundational memory cell itself. Intel and Micron chose to use a floating gate cell, a universally utilized design refined through years of high-volume planar flash manufacturing. This is the first use of a floating gate cell in 3D NAND, which was a key design choice to enable greater performance and increase quality and reliability.

The new 3D NAND technology stacks flash cells vertically in 32 layers to achieve 256Gb multilevel cell (MLC) and 384Gb triple-level cell (TLC) die that fit within a standard package. These capacities can enable gum stick-sized SSDs with more than 3.5TB of storage and standard 2.5-inch SSDs with greater than 10TB. Because capacity is achieved by stacking cells vertically, the individual cell dimensions can be considerably larger. This is expected to increase both performance and endurance and make even the TLC designs well-suited for data center storage.

The key product features of this 3D NAND design include:

  • Large Capacities –Three times the capacity of existing 3D technology1—up to 48GB of NAND per die—enabling three-fourths of a terabyte to fit in a single fingertip-sized package.
  • Reduced Cost per GB – First-generation 3D NAND is architected to achieve better cost efficiencies than planar NAND.
  • Fast – High read/write bandwidth, I/O speeds and random read performance.
  • Green – New sleep modes enable low-power use by cutting power to inactive NAND die (even when other die in the same package are active), dropping power consumption significantly in standby mode.
  • Smart – Innovative new features improve latency and increase endurance over previous generations, and also make system integration easier.

The 256Gb MLC version of 3D NAND is sampling with select partners today, and the 384Gb TLC design will be sampling later this spring. The fab production line has already begun initial runs, and both devices will be in full production by the fourth quarter of this year. Both companies are also developing individual lines of SSD solutions based on 3D NAND technology and expect those products to be available within the next year.

Webcast Replay of 3D NAND Announcement

Related Information

Micron

Take part in Micron’s social conversations where we’re talking all things storage and memory:

Intel

Contribute to the SSD conversations through Intel’s social channels:

Micron Technology, Inc.
 Micron Technology, Inc., is a global leader in advanced semiconductor systems. Micron’s broad portfolio of high-performance memory technologies—including DRAM, NAND and NOR Flash—is the basis for solid state drives, modules, multichip packages and other system solutions. Backed by more than 35 years of technology leadership, Micron’s memory solutions enable the world’s most innovative computing, consumer, enterprise storage, networking, mobile, embedded and automotive applications. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com

©2015 Micron Technology, Inc. All rights reserved. Micron and the Micron orbit logo are trademarks of Micron Technology, Inc.

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

This document contains forward looking statements. Forward looking statements are predictions, projections and other statements about future events that are based on current expectations and assumptions and, as a result, are subject to risks and uncertainties. Many factors could cause actual results to differ materially from the forward-looking statements in this document. A detailed discussion of the factors that could affect Intel’s results and plans is included in Intel’s SEC filings, including the annual report on Form 10-K.

1 Capacity difference based on comparison between Micron and Intel 384 Gb TLC 3D NAND die and other industry 3D NAND TLC

Micron and Intel Unveil New 3D NAND Flash Memory

by

Micron and Intel Unveil New 3D NAND Flash Memory Technology Advancements Enable Three Times More Capacity than Other NAND Technologies

NEWS HIGHLIGHTS

  • 3D NAND technology uses floating gate cells and enables the highest-density flash device ever developed—three times higher capacity1 than other NAND die in production.
  • Enables gum stick-sized SSDs with more than 3.5 terabytes (TB) of storage and standard 2.5-inch SSDs with greater than 10TB.
  • Innovative process architecture techniques extend Moore’s Law for flash storage, bringing significant improvements in density while lowering the cost of NAND flash.

3D_NAND_Die_with_M2_SSD.jpg

Enables gum stick-sized SSDs with more than 3.5TB of storage

3D_NAND_Die.jpg

Innovative process architecture techniques extend Moore’s Law for flash storage to bring significant improvements in density and lower the cost of NAND flash

3D_NAND_Wafer_Close-Up.jpg

Micron and Intel unveil new 3D NAND technology with three times higher capacity than other NAND die in production

BOISE, Idaho and SANTA CLARA, Calif., March 26, 2015 – Micron Technology, Inc. (Nasdaq: MU), and Intel Corporation today revealed the availability of their 3D NAND technology, the world’s highest-density flash memory. Flash is the storage technology used inside the lightest laptops, fastest data centers, and nearly every cellphone, tablet and mobile device.

This new 3D NAND technology, which was jointly developed by Intel and Micron, stacks layers of data storage cells vertically with extraordinary precision to create storage devices with three times higher capacity1 than competing NAND technologies. This enables more storage in a smaller space, bringing significant cost savings, low power usage and high performance to a range of mobile consumer devices as well as the most demanding enterprise deployments.

Planar NAND flash memory is nearing its practical scaling limits, posing significant challenges for the memory industry. 3D NAND technology is poised to make a dramatic impact by keeping flash storage solutions aligned with Moore’s Law, the trajectory for continued performance gains and cost savings, driving more widespread use of flash storage.

“Micron and Intel’s collaboration has created an industry-leading solid-state storage technology that offers high density, performance and efficiency and is unmatched by any flash today,” said Brian Shirley, vice president of Memory Technology and Solutions at Micron Technology. “This 3D NAND technology has the potential to create fundamental market shifts. The depth of the impact that flash has had to date—from smartphones to flash-optimized supercomputing—is really just scratching the surface of what’s possible.”

“Intel’s development efforts with Micron reflect our continued commitment to offer leading and innovative non-volatile memory technologies to the marketplace,” said Rob Crooke, senior vice president and general manager, Non-Volatile Memory Solutions Group, Intel Corporation. “The significant improvements in density and cost enabled by our new 3D NAND technology innovation will accelerate solid-state storage in computing platforms.”

Innovative Process Architecture
One of the most significant aspects of this technology is in the foundational memory cell itself. Intel and Micron chose to use a floating gate cell, a universally utilized design refined through years of high-volume planar flash manufacturing. This is the first use of a floating gate cell in 3D NAND, which was a key design choice to enable greater performance and increase quality and reliability.

The new 3D NAND technology stacks flash cells vertically in 32 layers to achieve 256Gb multilevel cell (MLC) and 384Gb triple-level cell (TLC) die that fit within a standard package. These capacities can enable gum stick-sized SSDs with more than 3.5TB of storage and standard 2.5-inch SSDs with greater than 10TB. Because capacity is achieved by stacking cells vertically, the individual cell dimensions can be considerably larger. This is expected to increase both performance and endurance and make even the TLC designs well-suited for data center storage.

The key product features of this 3D NAND design include:

  • Large Capacities –Three times the capacity of existing 3D technology1—up to 48GB of NAND per die—enabling three-fourths of a terabyte to fit in a single fingertip-sized package.
  • Reduced Cost per GB – First-generation 3D NAND is architected to achieve better cost efficiencies than planar NAND.
  • Fast – High read/write bandwidth, I/O speeds and random read performance.
  • Green – New sleep modes enable low-power use by cutting power to inactive NAND die (even when other die in the same package are active), dropping power consumption significantly in standby mode.
  • Smart – Innovative new features improve latency and increase endurance over previous generations, and also make system integration easier.

The 256Gb MLC version of 3D NAND is sampling with select partners today, and the 384Gb TLC design will be sampling later this spring. The fab production line has already begun initial runs, and both devices will be in full production by the fourth quarter of this year. Both companies are also developing individual lines of SSD solutions based on 3D NAND technology and expect those products to be available within the next year.

Webcast Replay of 3D NAND Announcement

Related Information

Micron

Take part in Micron’s social conversations where we’re talking all things storage and memory:

Intel

Contribute to the SSD conversations through Intel’s social channels:

Micron Technology, Inc.
 Micron Technology, Inc., is a global leader in advanced semiconductor systems. Micron’s broad portfolio of high-performance memory technologies—including DRAM, NAND and NOR Flash—is the basis for solid state drives, modules, multichip packages and other system solutions. Backed by more than 35 years of technology leadership, Micron’s memory solutions enable the world’s most innovative computing, consumer, enterprise storage, networking, mobile, embedded and automotive applications. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com

©2015 Micron Technology, Inc. All rights reserved. Micron and the Micron orbit logo are trademarks of Micron Technology, Inc.

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

This document contains forward looking statements. Forward looking statements are predictions, projections and other statements about future events that are based on current expectations and assumptions and, as a result, are subject to risks and uncertainties. Many factors could cause actual results to differ materially from the forward-looking statements in this document. A detailed discussion of the factors that could affect Intel’s results and plans is included in Intel’s SEC filings, including the annual report on Form 10-K.

1 Capacity difference based on comparison between Micron and Intel 384 Gb TLC 3D NAND die and other industry 3D NAND TLC

Micron and Intel Unveil New 3D NAND Flash Memory

by

Micron and Intel Unveil New 3D NAND Flash Memory Technology Advancements Enable Three Times More Capacity than Other NAND Technologies

NEWS HIGHLIGHTS

  • 3D NAND technology uses floating gate cells and enables the highest-density flash device ever developed—three times higher capacity1 than other NAND die in production.
  • Enables gum stick-sized SSDs with more than 3.5 terabytes (TB) of storage and standard 2.5-inch SSDs with greater than 10TB.
  • Innovative process architecture techniques extend Moore’s Law for flash storage, bringing significant improvements in density while lowering the cost of NAND flash.

3D_NAND_Die_with_M2_SSD.jpg

Enables gum stick-sized SSDs with more than 3.5TB of storage

3D_NAND_Die.jpg

Innovative process architecture techniques extend Moore’s Law for flash storage to bring significant improvements in density and lower the cost of NAND flash

3D_NAND_Wafer_Close-Up.jpg

Micron and Intel unveil new 3D NAND technology with three times higher capacity than other NAND die in production

BOISE, Idaho and SANTA CLARA, Calif., March 26, 2015 – Micron Technology, Inc. (Nasdaq: MU), and Intel Corporation today revealed the availability of their 3D NAND technology, the world’s highest-density flash memory. Flash is the storage technology used inside the lightest laptops, fastest data centers, and nearly every cellphone, tablet and mobile device.

This new 3D NAND technology, which was jointly developed by Intel and Micron, stacks layers of data storage cells vertically with extraordinary precision to create storage devices with three times higher capacity1 than competing NAND technologies. This enables more storage in a smaller space, bringing significant cost savings, low power usage and high performance to a range of mobile consumer devices as well as the most demanding enterprise deployments.

Planar NAND flash memory is nearing its practical scaling limits, posing significant challenges for the memory industry. 3D NAND technology is poised to make a dramatic impact by keeping flash storage solutions aligned with Moore’s Law, the trajectory for continued performance gains and cost savings, driving more widespread use of flash storage.

“Micron and Intel’s collaboration has created an industry-leading solid-state storage technology that offers high density, performance and efficiency and is unmatched by any flash today,” said Brian Shirley, vice president of Memory Technology and Solutions at Micron Technology. “This 3D NAND technology has the potential to create fundamental market shifts. The depth of the impact that flash has had to date—from smartphones to flash-optimized supercomputing—is really just scratching the surface of what’s possible.”

“Intel’s development efforts with Micron reflect our continued commitment to offer leading and innovative non-volatile memory technologies to the marketplace,” said Rob Crooke, senior vice president and general manager, Non-Volatile Memory Solutions Group, Intel Corporation. “The significant improvements in density and cost enabled by our new 3D NAND technology innovation will accelerate solid-state storage in computing platforms.”

Innovative Process Architecture
One of the most significant aspects of this technology is in the foundational memory cell itself. Intel and Micron chose to use a floating gate cell, a universally utilized design refined through years of high-volume planar flash manufacturing. This is the first use of a floating gate cell in 3D NAND, which was a key design choice to enable greater performance and increase quality and reliability.

The new 3D NAND technology stacks flash cells vertically in 32 layers to achieve 256Gb multilevel cell (MLC) and 384Gb triple-level cell (TLC) die that fit within a standard package. These capacities can enable gum stick-sized SSDs with more than 3.5TB of storage and standard 2.5-inch SSDs with greater than 10TB. Because capacity is achieved by stacking cells vertically, the individual cell dimensions can be considerably larger. This is expected to increase both performance and endurance and make even the TLC designs well-suited for data center storage.

The key product features of this 3D NAND design include:

  • Large Capacities –Three times the capacity of existing 3D technology1—up to 48GB of NAND per die—enabling three-fourths of a terabyte to fit in a single fingertip-sized package.
  • Reduced Cost per GB – First-generation 3D NAND is architected to achieve better cost efficiencies than planar NAND.
  • Fast – High read/write bandwidth, I/O speeds and random read performance.
  • Green – New sleep modes enable low-power use by cutting power to inactive NAND die (even when other die in the same package are active), dropping power consumption significantly in standby mode.
  • Smart – Innovative new features improve latency and increase endurance over previous generations, and also make system integration easier.

The 256Gb MLC version of 3D NAND is sampling with select partners today, and the 384Gb TLC design will be sampling later this spring. The fab production line has already begun initial runs, and both devices will be in full production by the fourth quarter of this year. Both companies are also developing individual lines of SSD solutions based on 3D NAND technology and expect those products to be available within the next year.

Related Information

Micron

Take part in Micron’s social conversations where we’re talking all things storage and memory:

Intel

Contribute to the SSD conversations through Intel’s social channels:

Micron Technology, Inc.
 Micron Technology, Inc., is a global leader in advanced semiconductor systems. Micron’s broad portfolio of high-performance memory technologies—including DRAM, NAND and NOR Flash—is the basis for solid state drives, modules, multichip packages and other system solutions. Backed by more than 35 years of technology leadership, Micron’s memory solutions enable the world’s most innovative computing, consumer, enterprise storage, networking, mobile, embedded and automotive applications. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com

©2015 Micron Technology, Inc. All rights reserved. Micron and the Micron orbit logo are trademarks of Micron Technology, Inc.

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

This document contains forward looking statements. Forward looking statements are predictions, projections and other statements about future events that are based on current expectations and assumptions and, as a result, are subject to risks and uncertainties. Many factors could cause actual results to differ materially from the forward-looking statements in this document. A detailed discussion of the factors that could affect Intel’s results and plans is included in Intel’s SEC filings, including the annual report on Form 10-K.

1 Capacity difference based on comparison between Micron and Intel 384 Gb TLC 3D NAND die and other industry 3D NAND TLC

Micron and Intel Unveil New 3D NAND Flash Memory

by

Micron and Intel Unveil New 3D NAND Flash Memory Technology Advancements Enable Three Times More Capacity than Other NAND Technologies

NEWS HIGHLIGHTS

  • 3D NAND technology uses floating gate cells and enables the highest-density flash device ever developed—three times higher capacity1 than other NAND die in production.
  • Enables gum stick-sized SSDs with more than 3.5 terabytes (TB) of storage and standard 2.5-inch SSDs with greater than 10TB.
  • Innovative process architecture techniques extend Moore’s Law for flash storage, bringing significant improvements in density while lowering the cost of NAND flash.

3D_NAND_Die_with_M2_SSD.jpg

Enables gum stick-sized SSDs with more than 3.5TB of storage

3D_NAND_Die.jpg

Innovative process architecture techniques extend Moore’s Law for flash storage to bring significant improvements in density and lower the cost of NAND flash

3D_NAND_Wafer_Close-Up.jpg

Micron and Intel unveil new 3D NAND technology with three times higher capacity than other NAND die in production

BOISE, Idaho and SANTA CLARA, Calif., March 26, 2015 – Micron Technology, Inc. (Nasdaq: MU), and Intel Corporation today revealed the availability of their 3D NAND technology, the world’s highest-density flash memory. Flash is the storage technology used inside the lightest laptops, fastest data centers, and nearly every cellphone, tablet and mobile device.

This new 3D NAND technology, which was jointly developed by Intel and Micron, stacks layers of data storage cells vertically with extraordinary precision to create storage devices with three times higher capacity1 than competing NAND technologies. This enables more storage in a smaller space, bringing significant cost savings, low power usage and high performance to a range of mobile consumer devices as well as the most demanding enterprise deployments.

Planar NAND flash memory is nearing its practical scaling limits, posing significant challenges for the memory industry. 3D NAND technology is poised to make a dramatic impact by keeping flash storage solutions aligned with Moore’s Law, the trajectory for continued performance gains and cost savings, driving more widespread use of flash storage.

“Micron and Intel’s collaboration has created an industry-leading solid-state storage technology that offers high density, performance and efficiency and is unmatched by any flash today,” said Brian Shirley, vice president of Memory Technology and Solutions at Micron Technology. “This 3D NAND technology has the potential to create fundamental market shifts. The depth of the impact that flash has had to date—from smartphones to flash-optimized supercomputing—is really just scratching the surface of what’s possible.”

“Intel’s development efforts with Micron reflect our continued commitment to offer leading and innovative non-volatile memory technologies to the marketplace,” said Rob Crooke, senior vice president and general manager, Non-Volatile Memory Solutions Group, Intel Corporation. “The significant improvements in density and cost enabled by our new 3D NAND technology innovation will accelerate solid-state storage in computing platforms.”

Innovative Process Architecture
One of the most significant aspects of this technology is in the foundational memory cell itself. Intel and Micron chose to use a floating gate cell, a universally utilized design refined through years of high-volume planar flash manufacturing. This is the first use of a floating gate cell in 3D NAND, which was a key design choice to enable greater performance and increase quality and reliability.

The new 3D NAND technology stacks flash cells vertically in 32 layers to achieve 256Gb multilevel cell (MLC) and 384Gb triple-level cell (TLC) die that fit within a standard package. These capacities can enable gum stick-sized SSDs with more than 3.5TB of storage and standard 2.5-inch SSDs with greater than 10TB. Because capacity is achieved by stacking cells vertically, the individual cell dimensions can be considerably larger. This is expected to increase both performance and endurance and make even the TLC designs well-suited for data center storage.

The key product features of this 3D NAND design include:

  • Large Capacities –Three times the capacity of existing 3D technology1—up to 48GB of NAND per die—enabling three-fourths of a terabyte to fit in a single fingertip-sized package.
  • Reduced Cost per GB – First-generation 3D NAND is architected to achieve better cost efficiencies than planar NAND.
  • Fast – High read/write bandwidth, I/O speeds and random read performance.
  • Green – New sleep modes enable low-power use by cutting power to inactive NAND die (even when other die in the same package are active), dropping power consumption significantly in standby mode.
  • Smart – Innovative new features improve latency and increase endurance over previous generations, and also make system integration easier.

The 256Gb MLC version of 3D NAND is sampling with select partners today, and the 384Gb TLC design will be sampling later this spring. The fab production line has already begun initial runs, and both devices will be in full production by the fourth quarter of this year. Both companies are also developing individual lines of SSD solutions based on 3D NAND technology and expect those products to be available within the next year.

Webcast Replay of 3D NAND Announcement

Related Information

Micron

Take part in Micron’s social conversations where we’re talking all things storage and memory:

Intel

Contribute to the SSD conversations through Intel’s social channels:

Micron Technology, Inc.
 Micron Technology, Inc., is a global leader in advanced semiconductor systems. Micron’s broad portfolio of high-performance memory technologies—including DRAM, NAND and NOR Flash—is the basis for solid state drives, modules, multichip packages and other system solutions. Backed by more than 35 years of technology leadership, Micron’s memory solutions enable the world’s most innovative computing, consumer, enterprise storage, networking, mobile, embedded and automotive applications. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com

©2015 Micron Technology, Inc. All rights reserved. Micron and the Micron orbit logo are trademarks of Micron Technology, Inc.

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

This document contains forward looking statements. Forward looking statements are predictions, projections and other statements about future events that are based on current expectations and assumptions and, as a result, are subject to risks and uncertainties. Many factors could cause actual results to differ materially from the forward-looking statements in this document. A detailed discussion of the factors that could affect Intel’s results and plans is included in Intel’s SEC filings, including the annual report on Form 10-K.

1 Capacity difference based on comparison between Micron and Intel 384 Gb TLC 3D NAND die and other industry 3D NAND TLC