Intel at SC16

Intel is transforming high performance computing (HPC) from traditional modeling and simulation to artificial intelligence, analytics and visualization. At Supercomputing 2016 in Salt Lake City, Intel is launching solutions to power breakthrough innovations and discoveries with Intel® Scalable System Framework, Intel® Xeon® processors and software.

Some of Intel’s latest technologies for HPC include Field Programmable Gate Arrays (FPGAs) and Intel® Xeon Phi™ processor-based solutions. Demonstrations at Supercomputing 2016 will showcase how flexible, energy efficient FPGAs and highly-parallel Xeon Phi processors can boost performance for a range of HPC workloads.

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Intel at SC16

Intel is transforming high performance computing (HPC) from traditional modeling and simulation to artificial intelligence, analytics and visualization. At Supercomputing 2016 in Salt Lake City, Intel is launching solutions to power breakthrough innovations and discoveries with Intel® Scalable System Framework, Intel® Xeon® processors and software.

Some of Intel’s latest technologies for HPC include Field Programmable Gate Arrays (FPGAs) and Intel® Xeon Phi™ processor-based solutions. Demonstrations at Supercomputing 2016 will showcase how flexible, energy efficient FPGAs and highly-parallel Xeon Phi processors can boost performance for a range of HPC workloads.

Press Materials

Related info on Intel.com

Blogs and social media

Product and Event photos

Intel-SC16-8.jpg

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Videos

Audio

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Intel HPC Performance Prevails at Supercomputing 2016

Today at Supercomputing 2016, Intel made another splash on the Top500 list of supercomputers with a 2.5x increase in Intel® Omni-Path Architecture (Intel® OPA) systems and nine additional Intel® Xeon Phi™-based systems, demonstrating the rapid market adoption of its technologies.

Intel announced key updates to its high performance computing (HPC) portfolio including Intel® HPC Orchestrator, a modular toolset that improves setup and management of systems, enables testing at scale and simplified deployment. Intel® HPC Orchestrator is now generally available through OEM partners Dell and Fujitsu.

Lastly, for the first time publically, Intel demonstrated an HPC cluster featuring an early version of next-generation Intel® Xeon® processor using Intel OPA and Advanced Vector Extensions-512.

» View the Intel at SC16 press kit

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Intel HPC Performance Prevails at Supercomputing 2016

Today at Supercomputing 2016, Intel made another splash on the Top500 list of supercomputers with a 2.5x increase in Intel® Omni-Path Architecture (Intel® OPA) systems and nine additional Intel® Xeon Phi™-based systems, demonstrating the rapid market adoption of its technologies.

Intel announced key updates to its high performance computing (HPC) portfolio including Intel® HPC Orchestrator, a modular toolset that improves setup and management of systems, enables testing at scale and simplified deployment. Intel® HPC Orchestrator is now generally available through OEM partners Dell and Fujitsu.

Lastly, for the first time publically, Intel demonstrated an HPC cluster featuring an early version of next-generation Intel® Xeon® processor using Intel OPA and Advanced Vector Extensions-512.

» View the Intel at SC16 press kit

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Sony Pictures Home Entertainment and Intel Bring Premium 4k Movies to PCs

sony-intel-logosAugust 30, 2016 – CULVER CITY, CA – Sony Pictures Home Entertainment (SPHE) and Intel Corporation today announced that ULTRA, SPHE’s 4K movie streaming service, will debut on computers powered by 7th Gen Intel® Core™ processors beginning Q1 in 2017.

Coinciding with the expanded availability of the service, ULTRA will add new features like 48 hour rentals and free 10 minute previews, allowing customers to experience a sample of any film on the service in full 4k resolution before buying.

With its new 7th Gen Intel Core processor, Intel is bringing 4K content to mainstream PC users. This latest processor sets a higher bar for richer experiences and incredible performance and responsiveness, with long battery life and true 4K entertainment. More than 100 stunning new devices powered by 7th Gen Intel Core will be available this holiday season, and some will be available as early as September.

By leveraging new hardware security technologies in its processor, computers powered by 7th Gen Intel Core will be the first PCs to provide secure access to premium 4K movies and television content through Sony Pictures Home Entertainment’s ULTRA 4K service.

ultra-sony-intel“More and more people are turning to their PC as their main movie viewing device. At the same time, studios like Sony Pictures Home Entertainment are leading the way in producing beautiful 4K content,” said Navin Shenoy, general manager of Intel’s Client Computing Group. “The combination of the amazing technology in our 7th Gen Intel Core processors combined with the fantastic 4K titles on ULTRA means that anyone with these new computers will be immersed in a 4K viewing world.”

“Audiences have shown a strong and growing appetite for premium 4K content, and ULTRA takes advantage of the latest industry innovations – high dynamic range, digital movie extras, and now the 7th Gen Intel Core with Intel hardware security technologies – so viewers get the most out of their movie collections,” said Pete Wood, SPHE’s Senior Vice President, Digital Distribution.

ULTRA offers a variety of movies for purchase and streaming in 4K, many with Digital Extras, taking full advantage of the latest display technologies and interactive capabilities.

“By enhancing our ULTRA streaming service with the addition of rental and free preview options, and teaming with Intel to provide users greater access to their collections, Sony Pictures Home Entertainment is making ULTRA an even more flexible, user-friendly destination for consumers who demand a premium 4K viewing experience,” added Richard Berger, SPHE’s Senior Vice President, Worldwide Digital Strategy and Advanced Platforms.

ULTRA initially launched in early 2016 on Sony 4K Televisions. Films available on the service for purchase, rental, and streaming on ULTRA include new releases as well as a library of classic films. New releases are priced at $29.99 to own in 4K with HDR, and will be $7.99 for 48 hour rental. Library titles are priced at $25.99 to own.

About SONY PICTURES HOME ENTERTAINMENT

Sony Pictures Entertainment (SPE) is a subsidiary of Sony Entertainment Inc., a subsidiary of Tokyo-based Sony Corporation. SPE’s global operations encompass motion picture production, acquisition and distribution; television production, acquisition and distribution; television networks; digital content creation and distribution; operation of studio facilities; and development of new entertainment products, services and technologies. For additional information, go to http://www.sonypictures.com.

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New 7th Gen Intel Core Processor: Built for the Immersive Internet

Navin_Shenoy

The way we interact and connect with each other has evolved. It’s richer and more immersive, as video has become an increasingly important medium we use to enhance our conversations. The emergence of 4K Ultra High-Definition, 360-degree video, and virtual reality has dramatically widened and deepened our vantage points.

These trends in how we consume and create content, in how we communicate and interact, reflect what we at Intel call the immersive internet. And the best way to take advantage of the immersive internet is on a computer with the performance to deliver a lifelike experience. People need the power to view, the power to create and the power to play – something that the PC is uniquely designed to do.

» 7th Gen Core press kit

To power these experiences, today I’m excited to unveil the new 7th Gen Intel® Core™ processors. Built for the immersive internet, this new generation of processors leverages our long-standing performance leadership and adds unmatched new media capabilities.

Our 7th Gen Intel Core processors show advances across the board:

Faster and more responsive: Intel’s engineering and manufacturing teams have drawn even more out of our 14nm process technology with what we call 14nm+. 7th Gen Intel Core delivers up to 12 percent faster productivity performance1 and up to 19 percent faster web performance2 over our previous generation from just a year ago.

7th Gen Intel Core processors are manufactured on silicon wafers at Intel production facilities. New 7th Gen Intel Core processors deliver richer experiences, incredible performance and responsiveness, and true ultra HD 4K entertainment in stunning new devices. (Credit: Intel Corporation)
7th Gen Intel Core processors are manufactured on silicon wafers at Intel production facilities. New 7th Gen Intel Core processors deliver richer experiences, incredible performance and responsiveness, and true ultra HD 4K entertainment in stunning new devices. (Credit: Intel Corporation)

Access to premium 4K UHD content: With new computers powered by 7th Gen Intel Core, TV and movie fans will have access to premium 4K UHD content streaming from studios like Sony Pictures Home Entertainment and providers like Fandango. This is just the beginning as we see 4K UHD content go mainstream over time. We’re excited about some additional content announcements in the next few months, so stay tuned.

Opens a world of user-generated 4K UHD content: People can now view the 4K UHD content being shared on sites like YouTube and watch for longer on 7th Gen Intel Core based systems. But they also have the power to create, edit and share their own 4K UHD and 360-degree clips up to 15 times faster3 than on a 5-year-old PC thanks to the work we’ve done under the hood with our new media engine.

Gaming on the go: Gamers will see a threefold improvement in graphics4 compared to a 5-year-old PC, meaning you can play popular games like Overwatch™ anytime and anywhere on a thin, light laptop. And with Thunderbolt 3 support coming to more devices, gamers can use a single cord to plug in an external graphics dock and 4K UHD monitors for top-line gaming performance.

Navin Shenoy discusses the benefits of the 7th Gen Intel® Core™ processor
Navin Shenoy discusses the benefits of the 7th Gen Intel® Core™ processor

Powers the thinnest and lightest devices ever: Just compare what is available now to a 5-year-old PC, and it’s obvious how far we’ve come. Some of the new 7th Gen Intel Core PCs are thinner than a phone, with the full performance expected from a PC!

We are incredibly excited about the strong partnership with our OEM customers and expect more than 100 different 2 in 1s and laptops powered by 7th Gen Intel Core to be available starting in September through this holiday season.  We will share more on the rest of the 7th Gen Intel Core family for desktops and enterprise PCs early next year.

To say we are excited about our new 7th Gen Intel Core family is an understatement. I don’t think there has ever been a better time to check out what a new Intel-powered PC can do.

 

Navin Shenoy is corporate vice president and general manager for the Client Computing Group at Intel Corporation.

 

1As Measured by SYSmark* 2014 (Intel® Core™ i7-7500U vs. Intel® Core™ i7-6500U)

2As Measured by WebXPRT* 2015 (Intel® Core™ i7-7500U compared to Intel® Core™ i7-6500U)

3Based on MAGIX* Fastcut Video Create Workload (Intel® Core™ i5-7200U vs. Intel® Core™ i5-2467M)

4Based on 3DMark* Cloud Gate Graphics Score (Intel® Core™ i5-7200U vs. Intel® Core™ i5-2467M)

Overwatch is a trademark of Blizzard Entertainment, Inc., in the U.S. and/or other countries

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors.

Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.  For more complete information visit www.intel.com/benchmarks.

Intel is a sponsor and member of the BenchmarkXPRT Development Community, and was the major developer of the XPRT family of benchmarks. Principled Technologies is the publisher of the XPRT family of benchmarks. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases.

System Configurations:

7th Generation Measurements:

Intel® CRB, Intel® Core™ i5-7200U Processor, PL1=15W TDP, 2C4T, Turbo up to 3.1GHz, Memory: 2x4GB DDR4-2133, Storage: Intel SSD, Display Resolution:1920×1080. Intel HD, Graphics 620, OS: Windows* 10 TH2

Intel® CRB, Intel® Core™ i7-7500U Processor, PL1=15W TDP, 2C4T, Turbo up to 3.5GHz, Memory: 2x4GB DDR4-2133, Storage: Intel SSD, Display Resolution: 1920×1080, Intel HD Graphics 620, OS: Windows* 10 TH2

6th Generation Measurements:

Intel® CRB, Intel® Core™ i7-6500U Processor, PL1=15W TDP, 2C4T, Turbo up to 3.1, Memory: 2x4GB DDR4-2133, Storage: Intel SSD, Display Resolution: 1920×1080. Graphics Driver: 15.40.4254, OS: Windows* 10 TH2

Refresh Comparison Measurements:

Intel® Core™ i5-2467M Processor (1.6 GHz base, up to 2.3GHz 2C4T, 17W TDP) measured on Dell* XPS13-40002sLV 13” Ultrabook, RAM: 4GB DDR3, Storage: 128GB SSD, Display: 13.3” 1366×768 resolution, Battery: 46WHr, OS: Windows* 7

Workload Descriptions:

SYSmark* 2014 is a benchmark from the BAPCo* consortium that measures the performance of Windows* platforms.  SYSmark tests three usage scenarios:   Office Productivity, Media Creation and Data/Financial Analysis.  SYSmark contains real applications from Independent Software Vendors such as Microsoft* and Adobe*.  Reported metrics:  SYSmark 2014 Rating and a rating for each scenario result (higher is better for all).  Scaling efficiencies:  CPU dominant, sensitive to frequency, core count and memory.  QSV enabled.

WebXPRT* 2015 is a benchmark from Principled Technologies* that measures the performance of web applications using six usage scenarios:  Photo Enhancements, Organize Album, Local Notes, Stock Option Pricing, Sales Graphs, and Explore DNA Sequencing.  WebXPRT tests modern browser technologies such as HTML5 Canvas 2D, HTML5 Table, HTML5 Local Storage, as well as JavaScript*.  Reported metrics:  elapsed time in seconds (lower is better) for each scenario, plus an overall score (higher is better).  Scaling efficiencies:  CPU dominant (newer browsers are GPU accelerated), sensitive to frequency.  WebXPRT is very sensitive to browser type and version.  OS support:  Any OS that supports an HTML5 browser.

3DMark* is a benchmark from Futuremark* that measures DX* 9 / OpenGL* ES 2.0, DX 10 and DX 11 gaming performance.  There are three main tests:  “Ice Storm” for DX 9 / OpenGL ES 2.0, “Cloud Gate” for DX 10, “Sky Diver” for DX11 and “Fire Strike” for DX 11 graphics.  Reported metrics:  Graphics Score (GPU), Physics Score (CPU), Combined Score (GPU & CPU) and an overall 3DMark Score (higher is better for all Scores).  Scaling efficiencies:  Graphics tests are GPU dominant, sensitive to graphics and CPU frequency, core count and memory.  OS support:  Desktop Windows*, Android*, iOS* and Windows RT.

MAGIX Fastcut Video Create Workload: Using MAGIX* Fastcut – The workload video is a 9min 21sec, 3840×2106, ~59.9Mbps, 30fps, H.264, 3.89GB, .mp4 file. The “A Cold Place” template is applied and is exported using the UHD setting. The output video is a 38s, 3840×2160, ~59Mbps, H.264, .mp4 file.

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IDF 2016: Big News, New Products You May Have Missed

The 2016 Intel Developer Forum has wrapped.

If you were among the more than 6,000 participants, you had a front-row introduction to the Project Alloy virtual reality headset, the Intel Joule module and the now-available Silicon Photonic transceivers – among other new products. You also learned about Intel’s announcement that ARM is a new ecosystem partner with Intel Custom Foundry.

For developers, makers and media at IDF, it was a busy week. Here’s a roundup of many of the activities and some of the thousands of media reports from the event:

OVERVIEW

Attendees look at Intel products at the 2016 Intel Developer Forum in San Francisco on Tuesday, Aug. 16, 2016. (Credit: Intel Corporation)
Attendees look at Intel products at the 2016 Intel Developer Forum in San Francisco on Tuesday, Aug. 16, 2016.

PRESS KIT: 2016 Intel Developer Forum Press Kit: Keynote videos (replays and B-roll highlights), links and product fact sheets.

PHOTO GALLERIES: 2016 IDF Photo Galleries: Downloadable photos from three days of events, keynotes and product launches.

 “Here’s Why Intel and AT&T Are Becoming Best Friends” (Fortune): On Wednesday at Intel’s annual developer conference, Intel and AT&T said they were deepening an existing partnership that involves AT&T getting early access to new Intel technologies and jointly working on networking infrastructure problems specific to the carrier’s needs. The two companies have already created a technology team of 50 engineers that is attempting to fine-tune Intel’s chip technology to work more efficiently with AT&T’s custom networking software that it plans to make publicly available for free.

“Best New Tech from IDF 2016” (Intel IQ): It looks like the world’s largest geekfest, but the six thousand change makers who attend the Intel Developer Forum 2016 in San Francisco see it as a giant springboard into the digital future.

AUTONOMOUS DRIVING

“Each autonomous car will one day generate more data than thousands of people” (Mashable): There’s going to be a ton of information flying around in the near future, and humans aren’t going to be the only ones generating it. Your car will send and receive location data, check in on the weather, navigate traffic and so on.

“Autonomous Cars: The Road Ahead” (Intel IQ):  At the Intel Developer Forum 2016, developers are key to shaping the digital future.

From Intel: Intel Accelerates Autonomous Driving Vision at IDF Investor Day

JOULE MODULE

DJ Sures (left) with EZ-Robots talks with Intel’s La Tiffaney Williams about robots that utilizes Intel's Joule module at the 2016 Intel Developer Forum in San Francisco on Tuesday, Aug. 16, 2016. (Credit: Intel Corporation)
DJ Sures (left) with EZ-Robots talks with Intel’s La Tiffaney Williams about robots that utilizes Intel’s Joule module at the 2016 Intel Developer Forum in San Francisco on Tuesday, Aug. 16, 2016.

“Intel Lifts Curtain On New Joule Module, A Game-Changer for The Internet of Things” (CRN): Intel Tuesday placed even more bets on the Internet of Things with the introduction of its Joule platform, a module built for IoT applications by packing a high-performance system-on-module into a low-power package.

Intel challenges Raspberry Pi 3 with tricked out Joule board” (PC World): Intel has unleashed a new competitor to Raspberry Pi 3 with its new Joule development board, which packs in superior graphics and wireless connectivity. The chipmaker has loaded the development board with technology found in regular PCs: a 64-bit quad-core Atom processor, 4K graphics, 802.11ac connectivity, and DDR4 memory features. … The Joule will provide big-time computing power for robots, drones, smart devices, and wearables.

“Intel’s Joule is its most powerful dev kit yet” (Engadget): The company says the tiny, low-powered Joule would be ideal for testing concepts in robotics, augmented reality, VR, industrial Internet of Things, and a slew of other categories. And it also looks like it could be an interesting way for students to dabble in RealSense’s depth-sensing technology in schools.

From Intel: Make Amazing Things Happen in IoT and Entrepreneurship with Intel Joule

INTEL SOC DEVELOPER FORUM

“Intel to put its brand on Stratix 10, ship by the end of the year” (ZDNet): Brian Krzanich showed the audience at the Intel SoC Developer Forum the first Intel-branded Stratix 10 FPGA. Stratix 10 will be the first Intel manufactured FPGA based on its 14nm process technology, following the acquisition of Altera. This brand transfer from Altera to Intel represents a significant milestone in the acquisition.

“Intel to Accelerate Altera, Says CEO” (EE Times): Brian Krzanich, during his keynote at the Day 3 Intel SoC FPGA Developer Forum (ISDF), highlighted to the audience Intel’s vision and strategy for FPGAs and SoC FPGAs.  This vision includes Intel’s investment in, and growth of, the FPGA business through the development of discrete FPGAs and SoC FPGAs which integrate both ARM and Intel Architecture. Brian also reiterated Intel’s support for FPGA customers, by continuing to deliver the same levels of outstanding service they received from Altera, and continuing to support long FPGA product life cycles.

From Intel: Intel’s FPGA future: We’re Here to Stay

VIRTUAL REALITY

Intel’s Craig Raymond displays the Project Alloy virtual reality headset during the Day 1 keynote at the 2016 Intel Developer Forum in San Francisco on Tuesday, Aug. 16, 2016. Intel CEO Brian Krzanich’s keynote presentation offered perspective on the unique role Intel will play as the boundaries of computing continue to expand.
Intel’s Craig Raymond displays the Project Alloy virtual reality headset during the Day 1 keynote at the 2016 Intel Developer Forum in San Francisco on Tuesday, Aug. 16, 2016. Intel CEO Brian Krzanich’s keynote presentation offered perspective on the unique role Intel will play as the boundaries of computing continue to expand.

“With Its Project Alloy Headset, Intel Wants To Usher In The Era Of “Merged Reality” (Fast Company): The company announced a headset platform called Project Alloy, and explained “merged reality,” a term it has coined to describe the experience that Alloy is capable of creating. Despite being from Intel, Alloy – unlike the Oculus Rift and HTC Vive – is distinguished in part by the fact that it doesn’t rely on a PC for processing power. Instead, it’s self-contained, with everything required to create the experience built into the goggles themselves.

“Intel’s Project Alloy headset cuts the cord” (CNET video report)

“Intel, Microsoft jump into mixed reality with Project Alloy, and Windows Holographic tie-up” (CNET video report)

From Intel: Intel Unveils Project Alloy

ARTIFICIAL INTELLIGENCE

 “ ‘A.I. is still rather nascent,’ says Intel executive Diane Bryant” (VentureBeat): Last week Intel made a bold move and acquired Nervana, one of the preeminent startups in deep learning, a type of A.I. that involves training artificial neural networks on data and then getting them to make inferences on new data. Today, when Intel announced a new generation of Xeon Phi server chips, the emphasis was on their ability to handle A.I. workloads. Clearly, the company’s interest in the area is on the upswing — following a considerable A.I. push from graphics card maker Nvidia.  “The world of A.I. is still rather nascent,” Diane Bryant, executive vice president and general manager of Intel’s Data Center Group, told VentureBeat.

“Intel Takes Aim at Nvidia (Again) With New AI Chip and Baidu Partnership” (Forbes):  Hoping to push back against Nvidia’s inroads, Intel announced on Wednesday a new server processor tailored for artificial intelligence, the third-generation Xeon Phi, code-named “Knights Mill.” Intel hopes the chip will give it more of a chance to compete in the rapidly evolving (but still small market) for machine learning, a subset of AI that allows the computer to teach itself instead of having to be programmed. Intel said only 7% of all servers being used for machine learning and only 0.1% are running deep neural nets, a subset of machine learning that emulates the neurons and synapses of the brain to make sense of unstructured data

“Intel Unveils Upcoming Xeon Phi Chip Aimed at AI Workloads” (eWeek): At the Intel Developer Forum here Aug. 17, company officials said they will continue their efforts to make the chip maker’s x86 products the foundational silicon for the job of training the neural networks driving the development of artificial intelligence (AI). The combination of Knights Mill — a derivative of the current Xeon Phi Knights Landing chip aimed at the AI space — and the presence of Baidu on the IDF stage is another boost for Intel as it looks to gain more traction in the rapidly growing AI and machine learning space, according to Patrick Moorhead, principal analyst with Moor Insights and Strategy.

5G

“Intel Plans 5G Trials in 2018, Commercial Deployment in 2020” (PC Magazine): Intel has repeatedly said it is committed to 5G and IoT, in no small part because its most valuable customers are demanding that commitment. It will begin 5G trials in 2018, and plans commercial deployment by 2020. … “The shift to 5G will be as profound as the shift from analog to digital,” said Murthy Renduchintala, Intel’s IoT president.

“IDF 2016: Intel lays out its 5G, IoT strategy” (ZDNet): “5G is really about the machines,” Sandra Rivera, vice president of Intel’s Data Center Group, said at the Intel Developer Forum in San Francisco on Tuesday. “The tens of billions of machines and sensors that will connect and create the fabric of our future networks.” At IDF, Intel demonstrated in multiple ways how it’s aiming to provide the processing power for those machines. The chipmaker introduced multiple modules designed for all sorts of IoT applications.

From Intel: 5 Things about 5G (Infographic)

SILICON PHOTONICS

Diane M. Bryant, Intel executive vice president and general manager of its Data Center Group, announces at the 2016 Intel Developer Forum in San Francisco on Wednesday, Aug. 17, 2016, that the first Intel Silicon Photonics 100G optical transceivers are commercially available. During her keynote, Bryant spoke of the demand on connectivity in an increasingly connected world. (Credit: Intel Corporation)
Diane M. Bryant, Intel executive vice president and general manager of its Data Center Group, announces at the 2016 Intel Developer Forum in San Francisco on Wednesday, Aug. 17, 2016, that the first Intel Silicon Photonics 100G optical transceivers are commercially available. During her keynote, Bryant spoke of the demand on connectivity in an increasingly connected world.

Intel: Our laser chips will make sites like Google and Facebook faster” (CNET): Laser light has made its way into a new product line Intel expects will speed up the data centers at the heart of online services like Google search and Facebook social networking. After years of research, the chipmaker has begun selling a product using a technology called silicon photonics that builds lasers directly into computer chips. That means communications can take place using light traveling over glass fiber-optic cables that can carry much more data than electrons on traditional copper wires.

Intel debuts silicon photonics module for lightning-fast connectivity in data centers” (VentureBeat): Intel is launching a new silicon photonics product that will make it a lot easier to hurl data around data centers at tremendous speeds. The Intel PSM4 silicon photonics module can deliver 100 gigabits per second across two kilometers, making it easier to share data at high speeds across the “spine” of a data center. The technology is the result of years-long efforts to bring both electronics and optical components onto a single piece of silicon, which is lower cost and easier to make.

EUCLID

“Intel’s new computer can serve as the brains of robots” (PCWorld): A compact computer called Euclid from Intel should make the development of robots much easier. Euclid looks much like the Kinect camera for Xbox consoles, but it’s a self-contained PC that can be the guts of a robot. It’s possible to install the Euclid computer where the “eyes” of a human-like robot would be typically placed. … Euclid has a 3D RealSense camera that can serve as the eyes in a robot, capturing images in real-time. It has motion and position sensors that can help the robot move around both indoors and outdoors.

“Intel’s Candy Bar-Sized Euclid RealSense PC And Joule Devkit Empower Our Robot Overlords” (HotHardware): One of the more interesting products announced this morning was Euclid, which manages to incorporate a fully self-contained PC into a device that is the size of a candy bar and runs Ubuntu Linux and Robot OS. Euclid even has its own internal battery, which allows it to function on its own without a tether. Onboard is one of Intel’s RealSense cameras, which [Intel CEO Brian] Krzanich says “brings sensors to robots.” Playing up on the statement, Euclid was installed into a small robot that took the stage at IDF. The robot had been preprogrammed to use its RealSense camera to follow someone around; sort of like your own miniature paparazzi, only less annoying.

From Intel: Intel Announces Tools for RealSense Technology Development

INTEL AND ARM

“Intel Licenses ARM Technology to Boost Foundry Business” (Bloomberg): Intel Corp., the world’s biggest semiconductor maker, said it’s licensing technology from rival ARM Holdings Plc, a move to win more customers for its business that manufactures chips for other companies. The two chipmakers, whose designs and technology dominate in computing and mobile, unveiled the agreement Tuesday at the Intel Developer Forum in San Francisco. The accord will let Intel offer third-party semiconductor companies its most advanced 10-nanometer production lines for manufacturing the complex chips usually used in smartphones.

“Intel Foundry Rounds Out IP Lineup With ARM, Adds New Customers AT IDF 2016” (Forbes): The ability to fab ARM Holdings processors in the traditionally x86 Intel fab comes from a partnership between Intel and ARM that includes ARM’s Artisan Physical IP platform. This means that Intel has access to ARM’s high performance and high density logic libraries as well as their memory compilers and POP IP.  While Intel has had the ability to fab an ARM-based part, the addition of the Artisan IP makes it easier.

From Intel: Accelerating Foundry Innovation for a Smart and Connected World

PROJECT AERO

A ready-to-fly drone that uses Intel’s Aero Compute Board and RealSense technology is flown during a demonstration at the 2016 Intel Developer Forum in San Francisco on Wednesday, Aug. 17, 2016. (Credit: Intel Corporation)
A ready-to-fly drone that uses Intel’s Aero Compute Board and RealSense technology is flown during a demonstration at the 2016 Intel Developer Forum in San Francisco on Wednesday, Aug. 17, 2016.

“Intel’s Drone Aspirations Take Flight With Project Aero” (PCMag): In a specially designed “Drone Cage” established on the second floor of the Moscone Center, Intel held multiple demonstrations throughout the day of the Ready To Fly Drone in action. Though limited space precluded the possibility of any fancy aerial tricks, the (obviously experienced) drone pilot showed how the Ready To Fly model was just as flexible and maneuverable as larger models. Considering this was the base platform model, it stands to reason that creative and enterprising developers will be able to spin off Aero into even more visually and technologically exciting directions in the months to come.

From Intel: New Opportunities and Tech for Drone Developers and Enthusiasts

INTERNATIONAL COVERAGE

“Intel fires up 5G engines” (The Australian): Intel is gearing up to power the “post-smartphone era” with the US giant lifting the lid on the role it’s going to play in the 5G revolution. The chipmaker has used its Developer Forum in San Francisco to outline its plans for the next few years, with Intel’s general manager of 5G business and technology, Rob Topol, telling The Australian that the advent of 5G would be a “major inflection point” for the telecommunications industry.

“Data Glasses Instead Of Old Hardware” (Handelsblatt): In the 1980s, the two IT giants Intel and Microsoft dominated the PC market. Now they work together again to conquer the computer landscape of the future. And their chances are very good. … The combination of Windows 10 and Alloy has the potential to change the burgeoning VR industry dramatically. This is just as in 1975, when Microsoft and Intel changed the IT world together, because Bill Gates, Paul Allen and Monte Davidoff wrote the Altair BASIC programming language for the Intel 8080 processor. (Translated from German)

“Project Alloy: Intel Presents Merged Reality Glasses” (Spiegel Online): Chip producer Intel wants to solve the problems of current virtual reality glasses. A new system is meant to merge the real world and the virtual world. Microsoft already announced its support. … The existing technology of Virtual Reality is complicated and not intuitively usable for everyone. … On its annual developer conference, Intel announced its newest project: a new system called “Alloy,” developed to eliminate the restrictions of Virtual Reality. (Translated from German)

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Sony Pictures Home Entertainment’s Premium Hollywood 4K Movies Coming to PCs with 7th Gen Intel Core Processor

During his keynote at the Intel Developer Forum, Intel CEO Brian Krzanich talked about how the 7th Generation Intel® Core™ Processor (Kaby Lake) will make 4K videos more readily accessible to everyone, providing deeply realistic, crystal clear images and videos.

As part of this effort, Sony Pictures Home Entertainment (SPHE) and Intel announced that they are collaborating to make SPHE’s premium movies in 4K available on PCs powered by the upcoming 7th Gen Intel Core Processor, taking advantage of the latest media capabilities and Intel hardware security technologies offered by this next generation processor.

Movie fans will be able to stream SPHE’s premium 4k movies for smooth playback and long battery life on devices based on the next generation 7th Gen Intel Core Processor that will be available later this year.

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Computing and Data: Meant to Be Together

Robert CrookeThe rapid growth in smart and connected devices, digital services, and cloud applications is resulting in an explosion of data. This is bringing new experiences to all facets of our lives, from smart cities to autonomous vehicles, precision medicine, immersive gaming and more.

At the same time, Moore’s Law is driving even greater computing capability that can be used both in the cloud and in devices to make use of that data. Using analytics to gain actionable and timely insights is allowing for new discoveries and improved services in areas like genome sequencing, predictive factory maintenance and retail fraud detection.

This combination of data growth and increased computing capability is a fantastic opportunity to transform both device and cloud computing, which in turn creates a virtuous cycle of growth. However, a key challenge lies in getting data much closer to the central processing unit (CPU).

Historically, growth in memory performance has been much slower than increases in CPU performance, resulting in scenarios where the CPU is often waiting for data from storage. In addition, we have been gated by the amount of memory capacity and how close it is to the CPU. These two constraints create a data bottleneck. The result has been a technology void between DRAM and hard disk drives. But that is changing as new technologies are meeting the needs of the memory and storage hierarchy.

rob-crooke-datasphere-infographic

Intel is driving innovations – using our deep understanding of materials science as well as computer architecture – to grow memory and storage at a much faster rate to virtually eliminate the bottleneck. We believe two recent technological inventions – 3D XPoint™ technology and 3D NAND – are key to keeping pace with the combination of growing data and increased computing capability.

Bigger memory and faster storage provides significant value to the cloud, further enabling us to automate and efficiently analyze increasing quantities of data so businesses can run more efficiently. The need for storage and memory innovation is clear and the opportunity is big, whether it is for customer service, supply chain optimization, financial fraud detection, or precision healthcare research that is processing and analyzing larger genetic data sets in real time. As an example, Facebook and Intel are collaborating closely on Intel® Optane™ technology, and Facebook has been working to re-architect its storage hierarchy to take advantage of this type of technology. Early testing of Intel Optane solid state drive (SSD) prototypes – which utilize 3D XPoint Memory Media – demonstrate a 10 times reduction in latency and three times increase in throughput as compared to a NAND SSD1, allowing for significantly faster movement of data between the storage device and CPU.

The availability of faster storage and bigger memory also benefits many new devices by enabling more immersive experiences with natural interaction. Consider gaming, for example: Our new generation of gamers demand more. The immersive, open world of uninterrupted game play they expect has been unachievable with current memory and storage solutions. Cinematics, load screens and level changes are tricks that developers use to mask the current memory size or storage bottleneck. With bigger memory and faster storage, developers are able to deliver the gaming experience of a lifetime. You’ll hear more in the near future about how Intel is working with game developers to realize this potential.

What exactly are Intel’s new storage and memory technologies?

3D XPoint technology is a breakthrough that creates a new class of memory that greatly reduces the cost, performance and power trade-offs that most system builders make when they design storage and memory solutions. It is much denser than DRAM and faster than NAND, allowing us to place more data closer to the CPU. Intel Optane technology will utilize 3D XPoint Memory Media and will come to market in Intel® SSDs and DIMMs. This will enable bigger memory and faster storage to accelerate access to more of the most frequently used “hot” data in servers and devices.

3D NAND technology allows us to provide much bigger storage at lower costs. Intel SSDs with 3D NAND technology open more opportunities to use SSDs instead of hard disk drives in PCs, devices and servers that store data in the cloud. SSDs are up to 1000 times faster than a hard disk drive2, and that performance can translate to quicker boot times, faster posting of videos and a better, smoother gaming experience. SSDs are also close to 10 times more reliable than hard disk drives3 to better protect your personal data.

These big changes in storage and memory also provide new opportunities for us to advance the computing platform by offering new ways to utilize and optimize memory and storage in the computing platform. We view memory and storage with an eye toward synergistic enhancements for both computing architecture and business growth. What if we could put a terabyte of storage in a space the size of a postage stamp or a petabyte in a space the size of a pizza box? That would be like storing 250,000 songs4 in a postage stamp-sized device or like storing 250,000 high-definition movies5 in a pizza box-sized rack.

We will continue to improve both 3D NAND and Intel Optane technologies to keep pace with the rate of innovation in computing so that the CPU and memory can be optimized to reduce the data delay. With memory and storage inevitably becoming more important to the performance of applications in the connected world, these technologies will open new ways to think about computing for connected “things” and the cloud. This is all part of the virtuous cycle of growth where the cloud, the Internet of Things and memory are all bound together by connectivity and enhanced by computing innovations driven by the economics of Moore’s Law.

We are very excited about the areas we know will benefit from using Intel Optane technology and Intel SSDs with 3D NAND technology to bring computing and data closer together. We are even more excited about how people will use bigger memory and wicked fast storage in ways we haven’t imagined.

Rob Crooke is senior vice president and general manager of the Non-Volatile Memory Solutions Group at Intel Corporation.


1“10 times reduction in latency and three times increase in throughput” measured by Intel using RocksDB setup based on published tests at rocksdb.org: 1B Key Database used, 8 “Shards” of 25M Key/Values each, 20 byte keys, 800 byte values, 50% compression, ~100 GB on-disk. Read: All threads randomly read all keys. Read/Write: All threads randomly reads keys 1 writer thread updates up to ~80K keys/second.

2Technology claims are based on comparisons of latency, density and write cycling metrics amongst memory technologies recorded on published specifications of in-market memory products against internal Intel specifications.

3Sources: Intel SSD – Intel SSD Annualized Fail Rate Report for all of 2015. HDD – Backblaze.com: https://www.backblaze.com/blog/hard-drive-reliability-q3-2015/

44 MB MP3 file

54 GB high-definition movie file

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Intel Developer Forum 2016: ‘The Future is What You Make’

WHEN: August 16—18, 2016
WHERE: Moscone Center West, San Francisco
WHAT: The 2016 Intel Developer Forum (IDF) will bring together leaders who are shaping the future of technology – from developers and technologists to inventors and makers, as well as top industry business executives.
2016 IDF Speakers
2016 IDF Speakers: Brian Krzanich, Venkata “Murthy” Renduchintala, Diane Bryant

At the annual conference, top executives from Intel and the technology industry will share their vision of the future in key growth areas, including virtual reality, autonomous driving, machine learning and 5G. This year’s show will include the following keynotes:

  • Tuesday, Aug. 16 at 9 a.m.:
    • Brian Krzanich, CEO
      Krzanich will share Intel’s latest innovations and product demonstrations that will inspire the audience to drive innovation and invention together.
  • Wednesday, Aug. 17 at 9 a.m.:
    • Venkata “Murthy” Renduchintala, president, Client and Internet of Things Businesses and Systems Architecture Group
      Murthy will highlight the innovations that will drive the next revolution in technology as we shift to a truly connected world.
    • Diane Bryant, executive vice president, general manager, Data Center Group
      Bryant will discuss the future of the data center and cloud infrastructure.

More than 140 business and technical sessions with industry and Intel experts will also be offered over the three-day event in addition to a showcase featuring demonstrations from more than 200 of the world’s top technology companies.

New this year, the Intel SoC FPGA Developers Forum (ISDF) will be co-located with IDF 2016. On August 18, Intel CEO Brian Krzanich will kick-off ISDF by discussing the importance of FPGAs in enabling the smart and connected world. ISDF, which includes workshops and in-depth technical sessions, is dedicated to the technology and application of SoC FPGAs within the Internet of Things (IoT), data center, cloud computing, networking, industrial, automotive and more.

IDF 2016 will also provide media and analysts with opportunities to speak one-on-one with industry leaders and Intel engineers who are influencing the direction of future technologies.

ATTENDANCE: More than 5,000 attendees are expected from around the world.
TO REGISTER: https://idfregistration.com
INFORMATION: https://newsroom.intel.com/2016-idf/
MEDIA
CONTACTS:
Krystal Temple
480-552-1760
krystal.temple@intel.com

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