Today Intel unveiled the ‘Intel® Cloud Technology’ program to help display cloud service capabilities for improved customer experience and value. The program helps users identify underlying technology, benefits cloud service providers (CSPs) by co…
New ‘Intel® Cloud Technology’ Program Exposes Cloud Service Capabilities for Better Customer Experience and Value
NEWS HIGHLIGHTS
SANTA CLARA, Calif., Jan. 15, 2014 – To help IT organizations make better, more informed purchasing decisions and ensure optimal performance for their cloud applications, Intel Corporation is teaming with 16 leading cloud service providers (CSPs) around the world to introduce the “Intel® Cloud Technology” program. This first-of-its-kind initiative will provide cloud users with a clear view into the technology powering a CSP’s infrastructure before they purchase any services or instances.
With infrastructure-as-a-service (IaaS) revenue expected to increase 41 percent annually by 20163 and more companies considering outsourcing their IT services, the technology that powers cloud-based services and applications matters more than ever. CSPs participating in the new Intel program will be recognized by using the “Powered by Intel® Cloud Technology” badge to distinguish their Intel-based instances where the performance and security capabilities of the underlying hardware become transparent to the end user.
The Intel Cloud Technology program builds on the collaboration announced last September between Amazon Web Services* (AWS) and Intel to communicate to customers the specifications, performance, quality, and security benefits of the Intel technology used in AWS instances.
“Much like when choosing a car, the type of engine that runs a cloud service dramatically affects performance and efficiency,” said Jason Waxman, vice president, Data Center Group and general manager, Cloud Platform Group, at Intel. “Cloud customers want to know what technology their applications are running on because it has direct impact to their business. For the first time, users will have the transparency to select the technologies that are optimal for running their applications in the cloud.”
It has been reported that a heterogeneous cloud infrastructure environment may result in 40 to 60 percent performance variation4. Therefore, end users are increasingly looking for more insight into the performance, capabilities and cost trade-offs of the many instances that CSPs offer so they can get the right size and type of performance matched to their specific workloads.
“The key to unlocking flexibility, productivity and cost trade-offs when using the public cloud is choosing a quality provider with platform performance and capabilities that meet our specific needs,” said Don Whittington, CIO of Florida Crystals (owner of Domino Sugar and C&H Sugar). “With our CSP Virtustream participating in Intel Cloud Technology program, we are now aware of the underlying hardware powering the services we buy and we can make better choices to ensure we have the optimal workload performance for our investment.”
In addition to Virtustream (U.S.); Canopy*, an ATOS* company (U.K.); Cloud4com* (Czech Republic); CloudWatt* (France); Expedient* (U.S.); KIO Networks* (Mexico); KT* (Korea); Locaweb* (Brazil); NxtGen* (India); Online.net* (France); OVH* (France); Rackspace* (U.S.); Savvis*, a company of CenturyLink* (US); Selectel* (Russia); and UOLDIVEO* / UOL Host* (Brazil) have committed to participating in the program.
Behind the Program: When Seconds Count
Even a slight change in cloud instance performance can impact sales on e-commerce sites. For example, Shopzilla* increased its revenue by up to 12 percent by accelerating its page load times from seven to two seconds5. For enterprise and other IT buyers evaluating hybrid or public cloud services, CSPs participating in the Intel® Cloud Technology program will provide detailed information about available CPUs, hardware acceleration features, storage, software and network capabilities – all of which can have a have significant impact on applications, costs and experiences for end users.
CSPs will promote the users’ benefits of Intel cloud technologies powering their services through multiple channels. The capabilities available today from participating CSPs aim to significantly increase performance of applications and security of end users’ data and include Intel® Turbo Boost Technology, Intel® Advanced Vector Extensions (AVX), Intel® Data Protection Technology with Advanced Encryption Standard New Instructions (AES-NI), and Intel® Virtualization Technology (VT).
Additionally, Intel will drive direct marketing campaigns and participate in co-marketing activities with CSP partners in the program to educate customers about underlying technologies, their impact on applications performance, user experience and ultimately the business. Understanding service capabilities helps the cloud user make better choices, which can lead to significant cost savings.
For example, Novartis Pharmaceuticals* performed an extensive analysis of instances to find that choosing a premium high-performing one would provide the company up to 65 percent cost savings2 over the lower cost, lower performing options when matching available capabilities with specific requirements of its workloads. It also allowed the company to significantly reduce the time spent on processing, creating faster turnaround of projects.
“Rackspace has customers around the world that trust us to fulfill their cloud infrastructure needs,” said Rajeev Shrivastava, vice president of product marketing at Rackspace. “Our participation in the Intel Cloud Technology program strengthens our ability to deliver a broader range of hybrid cloud solutions to optimize application performance, and helps assure current and potential customers that Rackspace will run their business critical services on a cloud developed with the best available technology.”
Intel® Cloud Finder Helps to Find the Right CSP for the Job
It’s the Intel® Cloud Finder tool, which helps end users cut through the complexity of identifying the optimal cloud service by providing comparison guidance across more than 50 CSPs for 80 end-user requirements, will be integrated with the Intel® Cloud Technology program. A new feature will allow end users to select a “trial” option for these services. The ability to “test drive” services prior to purchase will help IT decision makers better understand the underlying technologies and ensure that the services are the right fit for their workload before purchase.
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About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.
Intel is a trademark of Intel Corporation in the United States and other countries.
* Other names and brands may be claimed as the property of others.
1 End of the Year Cloud Provider and Cloud Enabling Technologies report and tracker, includes Amazon Web Services collaboration announced in September.
2 The difference in costs when choosing an optimal instance for a highly-parallel workload compared to lower performing instance as shared in Novartis’ Steve Litster presentation during Intel’s Jason Waxman’s keynote at re: Invent conference on November 2013 http://www.youtube.com/watch?v=Y04LEoIVRKY
3 Presented at the IDC Directions 2013 conference, “Cloud Decision Economics: Key Business Value Issues That
Will Influence Cloud Purchasing” presentation by Randy Perry, VP, Business Value Strategy, March 2013
4 Research paper presented at the HotCloud 2012 conference, “Exploiting Hardware Heterogeneity within the Same
Instance Type of Amazon EC2″ www.usenix.org/system/files/conference/hotcloud12/hotcloud12-final40.pdf
5 2012 Cisco Whitepaper “Cloud Harmony Performance Benchmark: Select High Performing Public Cloud to Increase Economic Benefits.”
New ‘Intel® Cloud Technology’ Program Exposes Cloud Service Capabilities for Better Customer Experience and Value NEWS HIGHLIGHTS Intel unveils the “Powered by Intel® Cloud Technology” badge with 16 leading cloud service providers (CSPs), now representing more than $3.5 billion1 in cloud services revenue expected in 2014. The program help users identify the underlying technology andbenefits … Continued
The post Intel Joins Forces with Cloud Service Providers Around the World to Reveal What’s Inside Their Datacenters appeared first on Intel Newsroom.
Latest Software Products Include Intel® Graph Builder v2.0, Intel® Distribution for Apache Hadoop 3.0 and New Toolkit for Better Data Management
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SANTA CLARA, Calif., Dec. 17, 2013 – Intel Corporation today announced several updates to its datacenter software products that provide enhanced security and performance for big data management as well as a suite of tools that simplify deployment of machine learning algorithms and advanced analytics, including graph analysis. The announcements include the release of Intel® Graph Builder for Apache Hadoop* software v2.0, Intel® Distribution for Apache Hadoop software 3.0, Intel® Analytics Toolkit for Apache Hadoop software and the Intel® Expressway Tokenization Broker.
“Some of the leading data-driven companies have invested heavily to create and implement their own big data analytics solutions,” said Boyd Davis, vice president and general manager of Intel’s Datacenter Software Division. “Intel is bringing this capability to market by providing software that is more secure and easier to use so that companies of all sizes can more easily uncover actionable insight in their data.”
Simplifying Analytics to Quickly Uncover Actionable Insight
Graphs analytics enables organizations to quickly find patterns in networks of linked information – known as graphs. Intel Graph Builder for Apache Hadoop software v2.0 is a set of pre-built libraries that enable high-performance, automated construction of rich graph representations that can model real-world problems and support a wide variety of third party graph databases, analytic engines and visualization tools.
For example, retailers can create a graph based on information from their sales history data and their social media data to better understand the relationship between brand sentiment and purchasing habits of their customers. The Intel Graph Builder for Apache Hadoop software package will be available for the Intel Distribution in January 2014.
With the Intel Analytics Toolkit for Apache Hadoop software, Intel is enabling more organizations to embrace machine learning techniques by reducing the costs and complexities associated with implementing predictive modeling tools. The toolkit provides foundation of common algorithms such as graphs and network-based clustering which IT teams can build on and customize with domain-specific code.
The easy-to-deploy algorithms are broad enough to be applied to multiple industries including financial services, healthcare and retail. For example, an e-commerce retailer that wants to create a personalization engine to predict the behavior of customers based on their history of clickstream data can use the Intel Analytics Toolkit for Apache Hadoop software as the foundational code, adding customized features on top to save time and money.
Enhancing Security for Data Protection
Building on the industry leading performance and encryption features in previous versions, the release of the Intel Distribution for Apache Hadoop software 3.0 includes a number of security enhancements to the second generation of the Apache Hadoop architecture recently released by the open source community. The Intel Distribution for Apache Hadoop software 3.0 includes support for Apache Hadoop 2.x and YARN* with major upgrades to MapReduce*, HDFS*, Hive*, HBase*, and related components.
The Intel Distribution for Apache Hadoop software includes a number of unique security enhancements to Apache Hadoop 2.x, delivering up to 20 times faster encryption as well as decryption of data at rest, transparent encryption of data in process in HBase, MapReduce, Hive and Pig* applications as well as granular cell-level access control of data in HBase. The latest release also supports the open source implementation of the high availability feature in HDFS that removes the NameNode* as the single point of failure. The Intel® Manager for Apache Hadoop software, which simplifies deployment, configuration and monitoring of clusters, now supports YARN, Lustre* and GlusterFS* as Hadoop compatible file systems.
Improper management of data such as credit card account numbers and other personal identification information can violate compliance regulations and increase auditing costs. The new Intel® Expressway Tokenization Broker High Capacity Edition offers enterprises a simple drop-in gateway appliance that can support 1 billion tokens with high performance and cross-data center resiliency. The appliance reduces compliance risk by anonymizing and encrypting regulated data in-flight.
With its embedded high-capacity token vault, the Intel Expressway Tokenization Broker can scale with the size of big data workloads to remove data protection from compliance scope, dramatically reducing audit and compliance costs. This appliance is ideal for industries that run analytics on sensitive information and have compliance requirements such as retail for PCI-DSS, healthcare for HIPAA, financial for Sarbanes-Oxley and EU data privacy regulations.
About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.
Intel is a trademark of Intel Corporation in the United States and other countries.
* Other names and brands may be claimed as the property of others.
1 Based on Intel internal testing
Latest Software Products Include Intel® Graph Builder v2.0, Intel® Distribution for Apache Hadoop 3.0 and New Toolkit for Better Data Management NEWS HIGHLIGHTS Intel® Graph Builder for Apache Hadoop* software v2.0 helps data scientistsanalyze and model the relationships within large sets of data. Intel® Distribution for Apache Hadoop software 3.0 features a number of security … Continued
The post Intel Enhances Security, Simplifies Big Data Analytics appeared first on Intel Newsroom.
NEWS HIGHLIGHTS.
SUPERCOMPUTING CONFERENCE, Denver, Nov. 19, 2013 –Intel Corporation unveiled innovations in HPC and announced new software tools that will help propel businesses and researchers to generate greater insights from their data and solve their most vital business and scientific challenges.
“In the last decade, the high-performance computing community has created a vision of a parallel universe where the most vexing problems of society, industry, government and research are solved through modernized applications,” said Raj Hazra, Intel vice president and general manager of the Technical Computing Group. “Intel technology has helped HPC evolve from a technology reserved for an elite few to an essential and broadly available tool for discovery. The solutions we enable for ecosystem partners for the second half of this decade will drive the next level of insight from HPC. Innovations will include scale through standards, performance through application modernization, efficiency through integration and innovation through customized solutions.”
Accelerating Adoption and Innovation
From Intel® Parallel Computing Centers to Intel® Xeon Phi™ coprocessor developer kits, Intel provides a range of technologies and expertise to foster innovation and adoption in the HPC ecosystem. The company is collaborating with partners to take full advantage of technologies available today, as well as create the next generation of highly integrated solutions that are easier to program for and are more energy-efficient. As a part of this collaboration Intel also plans to deliver customized HPC products to meet the diverse needs of customers. This initiative is aimed to extend Intel’s continued value of standards-based scalable platforms to include optimizations that will accelerate the next wave of scientific, industrial, and academic breakthroughs.
During the Supercomputing Conference (SC’13), Intel unveiled how the next generation Intel Xeon Phi product (codenamed “Knights Landing”), available as a host processor, will fit into standard rack architectures and run applications entirely natively instead of requiring data to be offloaded to the coprocessor. This will significantly reduce programming complexity and eliminate “offloading” of the data, thus improving performance and decreasing latencies caused by memory, PCIe and networking.
Knights Landing will also offer developers three memory options to optimize performance.Unlike other Exascale concepts requiring programmers to develop code specific to one machine, new Intel Xeon Phi processors will provide the simplicity and elegance of standard memory programming models.
In addition, Intel and Fujitsu recently announced an initiative that could potentially replace a computer’s electrical wiring with fiber optic links to carry Ethernet or PCI Express traffic over an Intel® Silicon Photonics link. This enables Intel Xeon Phi coprocessors to be installed in an expansion box, separated from host Intel Xeon processors, but function as if they were still located on the motherboard. This allows for much higher density of installed coprocessors and scaling the computer capacity without affecting host server operations.
Several companies are already adopting Intel’s technology. For example, Fovia Medical*, a world leader in volume rendering technology, created high-definition, 3D models to help medical professionals better visualize a patient’s body without invasive surgery. A demonstration from the University of Oklahoma’s Center for Analysis and Prediction of Storms (CAPS) showed a 2D simulation of an F4 tornado, and addressed how a forecaster will be able to experience an immersive 3D simulation and “walk around a storm” to better pinpoint its path. Both applications use Intel® Xeon® technology.
High Performance Computing for Data-Driven Discovery
Data intensive applications including weather forecasting and seismic analysis have been part of the HPC industry from its earliest days, and the performance of today’s systems and parallel software tools have made it possible to create larger and more complex simulations. However, with unstructured data accounting for 80 percent of all data, and growing 15 times faster than other data1, the industry is looking to tap into all of this information to uncover valuable insight.
Intel is addressing this need with the announcement of the Intel® HPC Distribution for Apache Hadoop* software (Intel® HPC Distribution) that combines the Intel® Distribution for Apache Hadoop software with Intel® Enterprise Edition of Lustre* software to deliver an enterprise-grade solution for storing and processing large data sets. This powerful combination allows users to run their MapReduce applications, without change, directly on shared, fast Lustre-powered storage, making it fast, scalable and easy to manage.
The Intel® Cloud Edition for Lustre* software is a scalable, parallel file system that is available through the Amazon Web Services Marketplace* and allows users to pay-as-you go to maximize storage performance and cost effectiveness. The software is ideally suited for dynamic applications, including rapid simulation and prototyping. In the case of urgent or unplanned work that exceeds a user’s on-premise compute or storage performance, the software can be used for cloud bursting HPC workloads to quickly provision the infrastructure needed before moving the work into the cloud.
With numerous vendors announcing pre-configured and validated hardware and software solutions featuring the Intel Enterprise Edition for Lustre, at SC’13, Intel and its ecosystem partners are bringing turnkey solutions to market to make big data processing and storage more broadly available, cost effective and easier to deploy. Partners announcing these appliances include Advanced HPC*, Aeon Computing*, ATIPA*, Boston Ltd.*, Colfax International*, E4 Computer Engineering*, NOVATTE* and System Fabric Works*.
Intel Tops Supercomputing Top 500 List
Intel’s HPC technologies are once again featured throughout the 42nd edition of the Top500 list, demonstrating how the company’s parallel architecture continues to be the standard building block for the world’s most powerful supercomputers. Intel-based systems account for more than 82 percent of all supercomputers on the list and 92 percent of all new additions. Within a year after the introduction of Intel’s first Many Core Architecture product, Intel Xeon Phi coprocessor-based systems already make up 18 percent of the aggregated performance of all Top500 supercomputers. The complete Top500 list is available at www.top500.org.
About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.
Intel, Xeon, Xeon Phi and the Intel logo are trademarks of Intel Corporation in the United States and other countries.
* Other names and brands may be claimed as the property of others.
1 From IDC Digital Universe 2020 (2013)
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.
Optimization Notice
Intel’s compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.
Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase.
2013 Intel Global Challenge at UC Berkeley Winners Receive $100,000 in Awards
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SILICON VALLEY, Oct. 9, 2013 – Mobile Monitoring Station of Chile won the grand prize in the 2013 Intel Global Challenge at UC Berkeley, receiving a $50,000 award from the Intel Foundation. Mobile Monitoring Station invented a breakthrough system that uses portable sensors to collect valuable biomedical data about industrial workers. The Intel Global Challenge at UC Berkeley is a global business plan competition that encourages student entrepreneurs to tackle some of the world’s most pressing issues through computing technology. The competition provides a unique entrepreneurship experience by giving teams access to top venture capitalists and investors in Silicon Valley. PHOTO CREDIT: Intel/Todd Eckelman
BERKELEY, CALIF., Oct. 9, 2013 – Mobile Monitoring Station, a team of student entrepreneurs from Chile, won the 9th annual Intel Global Challenge at UC Berkeley, a global business plan competition that encourages student entrepreneurs to tackle some of the world’s most pressing issues through computing technology. The competition provides a unique entrepreneurship experience by giving teams access to top venture capitalists and investors in Silicon Valley.
Mobile Monitoring Station, comprised of team members from engineering research and development company SoluNova, Chilean mining company Codelco and the University of Chile, created a set of portable sensors that collects industrial workers’ biomedical data, such as heart rate, in real time. The sensors, which are applied directly to the workers’ clothes, transmit valuable biomedical information to devices such as smartphones, which then push the data to the cloud. The solution will be offered as a service, supplying industrial sites with the hardware and software for a monthly fee per worker. The winning team, driven by the lack of existing data on industrial workers’ exposure to health risks, expects the sensors to result in a considerable drop in health dangers in this industry.
“At Intel, we know that innovation is critical to growth for individuals, businesses and economies,” said Staci Palmer, Intel’s director of Global Strategic Initiatives and Marketing in the Corporate Affairs Group. “Through the Intel Global Challenge at UC Berkeley, students around the world gain lifelong entrepreneurship and innovation skills they can apply throughout their careers, in fields ranging from healthcare to transportation.”
The Intel Foundation awarded $100,000 total in cash prizes, including a $50,000 grand prize and three $10,000 awards for teams taking first place in the following categories: Internet, mobile and software computing; computing for social innovation; and hardware and computing. In addition, four $5,000 special awards were presented.
Innovations from the three first-prize winners included industries ranging from technology to healthcare. Gameleon of Bulgaria developed a cloud-based platform that allows anyone to create, publish, play and monetize Web games with only a browser, regardless of programming skills or experience. Karmashop of Mexico created a crowd-funding platform that allows users to customize how they receive donations and, in return, gives donors “Karma Points.” For example, through a Karmashop campaign raising money for community members affected by the recent floods in Mexico, donors have the option to contribute items including drinking water, first aid and shelter. Tensive of Italy developed implantable biomaterials for the reconstruction of large bone and tissue defects, caused by osteoporosis, trauma or tumor removal. The patented technology replicates the patient’s blood vessels and accelerates the natural regeneration of bone and tissue.
The Intel Global Challenge, held at the Haas School of Business at UC Berkeley, drew 28 teams from more than 20 countries and regions. These finalist teams were selected from more than 18,000 entries from more than 60 countries and regions around the world. Founded in 2005, the Intel Global Challenge at UC Berkeley is a joint project of Intel and the UC Berkeley Lester Center for Entrepreneurship. The competition is designed to motivate young entrepreneurs to develop innovative technologies that solve real-world challenges, build viable business models and move that technology out of university labs and into the market.
Over the past decade alone, Intel has invested more than $1 billion, and its employees have donated close to 3 million hours toward improving education in more than 60 countries. To get the latest Intel education news, visit www.intel.com/newsroom/education, join the Facebook group at www.facebook.com/Intel and follow Twitter updates at twitter.com/intelinvolved.
Mobile Monitoring Station of Chile won the grand prize in the 2013 Intel Global Challenge at UC Berkeley, receiving a $50,000 award from the Intel Foundation. Mobile Monitoring Station invented a breakthrough system that uses portable sensors to collect valuable biomedical data about industrial workers. PHOTO CREDIT: Intel/Todd Eckelman
Gameleon of Bulgaria won first place in the 2013 Intel Global Challenge at UC Berkeley, receiving a $10,000 award from the Intel Foundation. Gameleon developed a cloud-based platform for creating, playing and monetizing Web games. PHOTO CREDIT: Intel/Todd Eckelman
Karmashop of Mexico won first place in the 2013 Intel Global Challenge at UC Berkeley, receiving a $10,000 award from the Intel Foundation. Karmashop created a crowd-funding platform that allows users to customize how they receive donations. PHOTO CREDIT: Intel/Todd Eckelman
Tensive of Italy won first place in the 2013 Intel Global Challenge at UC Berkeley, receiving a $10,000 award from the Intel Foundation. Tensive invented implantable biomaterials for the reconstruction of bone and tissue. PHOTO CREDIT: Intel/Todd Eckelman
About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.
Intel is a trademark of Intel Corporation in the United States and other countries.
* Other names and brands may be claimed as the property of others.
Intel Fellow, Anthropologist Lays out Mobile Future Beyond Smartphones and Tablets
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SAN FRANCISCO, Calif., Sept 12, 2013 –There is not one mobile future, but 7 billion futures, said Intel Fellow and anthropologist Dr. Genevieve Bell at the Intel Developer Forum today. Describing how the human being has always been, and will continue to be, the ultimate mobile platform, Bell illustrated how mobile technology has historically been used to extend our bodies and physical reach, augment our deficiencies and increase our capacity to get things done.
“Mobility technology has been transforming human society for centuries. Its future will be influenced not only by the shrinking size of computing technology due to Moore’s Law, but also by global population growth,” Bell said. “Our inspiration should come not only from the invention of new technology ingredients, but also from the needs and desires of human beings. It’s not one future we are shaping – it’s 7 billion futures, and counting.”
What people want in future mobility
Bell’s work as an anthropologist at Intel has uncovered important insights into people’s desires and frustrations regarding their relationship with technology. Relying on learnings from over 250,000 interviews conducted in 45 countries, she shared with the audience of technology industry developers four global themes reflecting what people want in future mobility: technology which is truly personal, which unburdens them from some of the more annoying hassles of use, which helps people stay in the moment, and which helps people to be their better selves.
A “smart clothing” demonstration from Berlin’s Fraunhofer Institute for Reliability and Microintegration illustrated how shrinking technology will one day disappear into the objects and spaces people interact with. A bicyclist sporting a jacket with a stretchable circuitry board woven into fabric demonstrated clothing could flash bright red lights when a rider is braking.
This single example represented each of the four themes of future mobile technology. The cyclist can enjoy the personal experience of riding and stay in the flow of the moment without worrying about controlling the jacket’s functionality. The jacket also augments his body making him more visible and allowing him to safely pursue riding at all hours of the day or night.
Required technology building blocks
Bell emphasized that these human desires require that Intel and the developer community think beyond today’s mobile devices, such as smartphones and tablets, and consider a broader picture that includes infrastructure, personal data, places and people. In the future the best technology will be aware of the full context of each individual as it provides for personalized experiences. This in turn will shape the development of technology building blocks,be they silicon, operating systems, middleware, applications or services.
“This global vision requires a constant interplay between what technology makes possible and what individuals desire,” said Bell. “Intel will make the best technology and partner with leading developers worldwide to deliver this innovation from silicon to experiences.”
Truly personal mobile experiences depend on low power
Bell discussed how the mobile future will require power consumption orders of magnitude lower than is available today. As devices begin to understand people better, this will require constant sensing at low power. Underscoring the possiblities, Mike Bell, vice president of Intel’s New Devices Group, joined Dr. Bell for a demonstration of an experimental microprocessor powered by a battery made from a glass of wine. The device was able to sense, communicate and control the motion of a 3-D flower rendered on another computer.
“Low power is essential for the future of wearable devices and sensors in smart spaces, where frequent charging or power cables would be burdensome or even impossible,” said Mike Bell. “Only then can technology be truly personal and embedded into the places and spaces we inhabit and move through.”
Importance of context awareness
Middleware that helps devices understand the context in which their users are operating is another important ingredient for developers creating applications and services that offer truly personalized mobile experiences. In a demonstration of context awareness technology, a smartphone was able to detect when two individuals were in the vicinity of each other by continuously monitoring voices heard through their microphones. The information was used to create recommendations of nearby services such restaurant options – recommendations which could be tailored to the pair or to groups of individuals. For example, different choices might be suggested for a person who was near friends, rather than his or her children or co-workers.
In another demonstration, Dr. Bell showed how context-awareness might help to balance security and personal convenience. As a smartphone monitored a person’s walking patterns, it could recognize the person, and, based on this, open access to certain functions of the phone. Dr. Bell noted that this approach to security – when safely under the control of its rightful owner – is an interesting future security model for mobile devices.
In the conclusion of Dr. Bell’s presentation, Peter Biddle, the general manager of Intel Cloud Services, demonstrated a research concept for a cloud service with a dashboard to help people understand how secure their personal data is across all their devices and social networks.
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About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.
Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.
* Other names and brands may be claimed as the property of others.
From New SoCs to Optical Fiber, Intel Delivers Cloud-Optimized Innovations Across Network, Storage, Microservers, and Rack Designs
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SAN FRANCISCO, Calif., September 4, 2013 – Intel Corporation today introduced a portfolio of datacenter products and technologies for cloud service providers looking to drive greater efficiency and flexibility into their infrastructure to support a growing demand for new services and future innovation.
Server, network and storage infrastructure is evolving to better suit an increasingly diverse set of lightweight workloads, creating the emergence of microserver, cold storage and entry networking segments. By optimizing technologies for specific workloads, Intel will help cloud providers significantly increase utilization, drive down costs and provide compelling and consistent experiences to consumers and businesses.
The portfolio includes the second generation 64-bit Intel® Atom™ C2000 product family of system-on-chip (SoC) designs for microservers and cold storage platforms (code named “Avoton”) and for entry networking platforms (code named “Rangeley”). These new SoCs are the company’s first products based on the Silvermont micro-architecture, the new design in its leading 22nm Tri-Gate SoC process delivering significant increases in performance and energy efficiency, and arrives only nine months after the previous generation.
“As the world becomes more and more mobile, the pressure to support billions of devices and users is changing the very composition of datacenters,” said Diane Bryant, senior vice president and general manager of the Datacenter and Connected Systems Group at Intel. “From leadership in silicon and SoC design to rack architecture and software enabling, Intel is providing the key innovations that original equipment manufacturers, telecommunications equipment makers and cloud service providers require to build the datacenters of the future.”
Intel also introduced the Intel® Ethernet Switch FM5224 silicon which, when combined with the WindRiver Open Network Software suite, brings Software Defined Networking (SDN) solutions to servers for improved density and lower power.
Intel also demonstrated the first operational Intel Rack Scale Architecture (RSA)-based rack with Intel® Silicon Photonics Technology in combination with the disclosure of a new MXC connector and ClearCurve* optical fiber developed by Corning* with requirements from Intel. This demonstration highlights the speed with which Intel and the industry are moving from concept to functionality.
Customized, Optimized Intel® Atom™ SoCs for New and Existing Market Segments
Manufactured using Intel’s leading 22nm process technology, the new Intel Atom C2000 product family features up to eight cores, a range of 6 to 20Watts TDP, integrated Ethernet and support for up to 64 gigabytes (GB) of memory, eight times the previous generation. OVH* and 1&1, leading global web-hosting services companies, have tested Intel Atom C2000 SoCs and plan to deploy them in its entry-level dedicated hosting services next quarter. The 22 nanometer process technology delivers superior performance and performance per watt.
Intel is delivering 13 specific models with customized features and accelerators that are optimized for particular lightweight workloads such as entry dedicated hosting, distributed memory caching, static web serving and content delivery to ensure greater efficiency. The designs allow Intel to expand into new markets like cold storage and entry-level networking.
For example, the new Intel Atom configurations for entry networking address the specialized needs for securing and routing Internet traffic more efficiently. The product features a set of hardware accelerators called Intel® QuickAssist Technology that improves cryptographic performance. They are ideally suited for routers and security appliances.
By consolidating three communications workloads – application, control and packet processing – on a common platform, providers now have tremendous flexibility. They will be able to meet the changing network demands while adding performance, reducing costs and improving time-to-market.
Ericsson, a world-leading provider of communications technology and services announced that its blade-based switches used in the Ericsson Cloud System, a solution which enables service providers to add cloud capabilities to their existing networks, will sooninclude the Intel Atom C2000 SoC product family.
Microserver-Optimized Switch for Software Defined Networking
Network solutions that manage data traffic across microservers can significantly impact the performance and density of the system. The unique combination of the Intel Ethernet Switch FM5224 silicon and the WindRiver Open Network Software suite will enable the industry’s first 2.5GbE, high-density, low latency, SDN Ethernet switch solutions specifically developed for microservers. The solution enhances system level innovation, and complements the integrated Intel Ethernet controller within the Intel Atom C2000 processor. Together, they can be used to create SDN solutions for the datacenter.
Switches using the new Intel Ethernet Switch FM5224 silicon can connect up to 64 microservers, providing up to 30 percent3 higher node density. They are based on Intel Open Network Platform reference design announced earlier this year.
First Demonstration of Silicon Photonics-Powered Rack
Maximum datacenter efficiency requires innovation at the silicon, system and rack level. Intel’s RSA design helps industry partners to re-architect datacenters for modularity of components (storage, CPU, memory, network) at the rack level. It provides the ability to provision or logically compose resources based on application specific workload requirements. Intel RSA also will allow for the easier replacement and configuration of components when deploying cloud computing, storage and networking resources.
Intel today demonstrated the first operational RSA-based rack equipped with the newly announced Intel Atom C2000 processors, Intel® Xeon® processors, a top-of-rack Intel SDN-enabled switch and Intel Silicon Photonics Technology. As part of the demonstration, Intel also disclosed the new MXC connector and ClearCurve* fiber technology developed by Corning* with requirements from Intel. The fiber connections are specifically designed to work with Intel Silicon Photonics components.
The collaboration underscores the tremendous need for high-speed bandwidth within datacenters. By sending photons over a thin optical fiber instead of electrical signals over a copper cable, the new technologies are capable of transferring massive amounts of data at unprecedented speeds over greater distances. The transfers can be as fast as 1.6 terabits per second4 at lengths up to 300 meters5 throughout the datacenter.
To highlight the growing range of Intel RSA implementations, Microsoft and Intel announced a collaboration to innovate on Microsoft’s next-generation RSA rack design. The goal is to bring even better utilization, economics and flexibility to Microsoft’s datacenters.
The Intel Atom C2000 product family is shipping to customers now with more than 50 designs for microservers, cold storage and networking. The products are expected to be available in the coming months from vendors including Advantech*, Dell*, Ericsson*, HP*, NEC*, Newisys*, Penguin Computing*, Portwell*, Quanta*, Supermicro*, WiWynn*, ZNYX Networks*.
View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)
About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.
Intel, Atom, Xeon and the Intel logo are trademarks of Intel Corporation in the United States and other countries.
* Other names and brands may be claimed as the property of others.
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance.
1 Performance based on Dynamic Web Benchmark Performance: Atom S1260 (8GB, SSD, 1GbE), Score=1522. Atom C2750(32GB, SSD,10GbE), Score=11351.
2 Performance per Watt based on Dynamic Web Benchmark: Atom S1260 (8GB,SSD, 1GbE), Score=1522, est node power=20W, PPW=76.1 Atom C2730(32GB, SSD,10GbE), Score=8778, est node power=19W, PPW=462. Source: Intel Internal measurements as of August 2013. Refer to backup for additional details.
3 Based on 2.5G port count compared to the BCM56540
4 Measured per fiber bandwidth on an Agilent Bit Error Rate Tester (BERT) that included a N4960A-CJ1 controller, N4951A-H32 pattern generator and N4952A-E32 error detector. MXC connector used had 32 fibers for an actual data rate of .8 tera-bits. Mechanical models and CAD simulations show that the MXC can accommodate up to 64 fibers for a theoretical total bandwidth of 1.6 Tera-bits per second.
5 ClearCurve fiber operating at 300 meters was tested using 300 meters of new ClearCurve fiber connected to an Agilent Bit Error Rate Tester (BERT) that included a N4960A-CJ1 controller, N4951A-H32 pattern generator and N4952A-E32 error detector.
Results have been estimated based on internal Intel analysis and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance.
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Intel today outlined its strategy to re-architect the datacenter infrastructure to enable companies and end-users to benefit from an increasingly services-oriented, mobile world. The company announced additional details about its next-generation Intel® Atom™ processor C2000 product family (codenamed “Avoton” and “Rangeley”), as well as disclosed its roadmap of next-generation 14nm products for 2014 and beyond. In a step towards reaching its Rack Scale Architecture vision, Intel also announced the first commercial rack scale implementation with Rackspace* Hosting. This robust pipeline of current and future products and technologies will allow Intel to expand into new segments of the datacenter that look to transition from proprietary designs to more open, standards-based compute models. More information is available in the press kit.
New Era of Services-Oriented Datacenters Gives Opportunities for Expansion
NEWS HIGHLIGHTS
SAN FRANCISCO, Calif., July 22, 2013 – As the massive growth of information technology services places increasing demand on the datacenter, Intel Corporation today outlined its strategy to re-architect the underlying infrastructure, allowing companies and end-users to benefit from an increasingly services-oriented, mobile world.
The company also announced additional details about its next-generation Intel® Atom™ processor C2000 product family (codenamed “Avoton” and “Rangeley”), as well as outlined its roadmap of next-generation 14nm products for 2014 and beyond. This robust pipeline of current and future products and technologies will allow Intel to expand into new segments of the datacenter that look to transition from proprietary designs to more open, standards-based compute models.
“Datacenters are entering a new era of rapid service delivery,” said Diane Bryant, senior vice president and general manager of the Datacenter and Connected Systems Group at Intel. “Across network, storage and servers we continue to see significant opportunities for growth. In many cases, it requires a new approach to deliver the scale and efficiency required, and today we are unveiling the near and long-term actions to enable this transformation.”
As more mobile devices connect to the Internet, cloud-based software and applications get smarter by learning from the billions of people and machines using it, thus resulting in a new era of context-rich experiences and services. It also results in a massive amount of network connections and a continuous stream of real-time, unstructured data. New challenges for networks, computing and storage are emerging as the growing volume of data is transported, collected, aggregated and analyzed in datacenters. As a result, datacenters must be more agile and service-driven than ever before, and easier to manage and operate.
The role of information technology has evolved from being a way to reduce costs and increase corporate productivity to becoming the means to deliver new services to businesses and consumers. For example, Disney* recently started providing visitors with wirelessly connected-wristbands to enhance customers’ in-park experience through real-time data analytics. Additionally, a smart traffic safety program from Bocom* in China seeks to identify traffic patterns in a city of ten million people and intelligently offers better routing options for vehicles on the road.
‘Re-Architecting’ Network, Storage and Servers
To help companies prepare for the next generation of datacenters, Intel revealed its plans to virtualize the network, enable smart storage solutions and invest in innovative rack optimized architectures.
Bryant highlighted Intel’s Rack Scale Architecture (RSA), an advanced design that promises to dramatically increase the utilization and flexibility of the datacenter to deliver new services. Rackspace Hosting*, an open cloud company, today announced the deployment of new server racks that is a step toward reaching Intel’s RSA vision, powered by Intel® Xeon® processors and Intel Ethernet controllers with storage accelerated by Intel Solid State Drives. The Rackspace design is the first commercial rack scale implementation.
The networking industry is on the verge of a transition similar to what the server segment experienced years ago. Equipping the network with open, general purpose processing capabilities provides a way to maximize network bandwidth, significantly reduce cost and provide the flexibility to offer new services. For example, with a virtualized software defined network, the time to provision a new service can be reduced to just minutes from two to three weeks with traditional networks. Intel introduced Open Network Platform reference designs to help OEMs build and deploy this new generation of networks.
Data growth is a challenge to all datacenters and transferring this large volume of data for processing within a traditional, rigid storage architecture is costly and time consuming. By implementing intelligent storage technologies and tools, Intel is helping to reduce the amount of data that needs to be stored, and is improving how data is used for new services.
Traditional servers are also evolving. To meet the diverse needs of datacenter operators who deploy everything from compute intensive database applications to consumer facing Web services that benefit from smaller, more energy-efficient processing, Intel outlined its plan to optimize workloads, including customized CPU and SoC configurations.
As part of its strategy, Intel revealed new details for the forthcoming Intel® Atom™ processors C2000 product family aimed for low-energy, high-density microservers and storage (codenamed “Avoton”), and network devices (codenamed “Rangeley”). This second generation of Intel’s 64-bit SoCs is expected to become available later this year and will be based on the company’s 22nm process technology and the innovative Silvermont microarchitecture. It will feature up to eight cores with integrated Ethernet and support for up to 64GB of memory.
The new products are expected to deliver up to four times1,3 the energy efficiency and up to seven times1,2 more performance than the first generation Intel Atom processor-based server SoCs introduced in December last year. Intel has been sampling the new Intel Atom processor server product family to customers since April and has already more than doubled the number of system designs compared to the previous generation.
Roadmap for Expansion
The move to services-oriented datacenters presents considerable opportunities for Intel to expand into new segments. To help bolster the underlying technologies that power much of the next generation of datacenters, Intel outlined its roadmap of next-generation products based on its forthcoming 14nm process technology scheduled for 2014 and beyond. These products are aimed at microservers, storage and network devices and will offer an even broader set of low-power, high-density solutions for their Web-scale applications and services.
The future products include the next generation of Intel Xeon processors E3 family (codenamed “Broadwell”) built for processor and graphic-centric workloads such as online gaming and media transcoding. It also includes the next generation of Intel Atom processor SoCs (codenamed “Denverton”) that will enable even higher density deployments for datacenter operators. Intel also disclosed an addition to its future roadmap – a new SoC designed from the ground up for the datacenter based on Intel’s next-generation Broadwell microarchitecture that follows today’s industry leading Haswell microarchitecture. This SoC will offer higher levels of performance in high density, extreme energy efficient systems that datacenter operators will expect in this increasingly services-oriented, mobile world.
View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)
About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.
Intel, Atom, Xeon and the Intel logo are trademarks of Intel Corporation in the United States and other countries.
* Other names and brands may be claimed as the property of others.
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.
For more information go to www.intel.com/performance.
1 vs Intel® Atom™ S2100. Intel Atom C2000 pre-production silicon measurements. Intel internal measurements as of July 2013.
2 Dynamic Web Benchmark: Atom S1260 (8GB,SSD,1GbE), Estimated Score=1522. Atom C2xxx (32GB, SSD,10GbE), Estimated Score=11109. Atom S1260: DBC SDP w/Intel® Atom™ S1260 (2.0GHz, 2C), Hyper-Threading Enabled, 1x8GB DDR3-1333 MHz UDIMM ECC, BIOS version D134.4, Fedora* 17, Linux Kernel 3.3.4-5fc.x86_64, Apache 2.2.22, PHP 5.4.7, Boot Drive 1x 150GB SSD, Addl Drive 2x 150GB SSD, 2xGbE, Score: 1522
Atom C2xxx: MPK SDP w/Intel® Atom™ C2xxx (8C), Turbo Disabled, 4x8GB DDR3-1600 MHz UDIMM ECC, BIOS version 18D05, Fedora* 17, Linux Kernel 3.3.4-5fc.x86_64, Apache 2.2.22, PHP 5.4.7, Boot Drive 1x150GB SSD, Addl Drive 1x 800GB SSD, 1x10GbE, Score: 11109
3 Results are estimated by Intel using the SPEC benchmark software cited and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance.
Atom™ S1260: FOR.INTEL.cpu2006.1.2.ic13.1.linux64.01june2013, Supermicro* 5017A-EF with one Intel® S1260 processor (2-core 2.0GHz), EIST Enabled, Hyper-Threading Enabled, 8GB memory (1x 8GB DDR3-1333 UDIMM ECC), 250GB SATA 7200RPM HDD, Red Hat Enterprise Linux 6.4 . Score: Estimated SPECint*int_rate_base2006=18.7. Est. Node Power=20W
Atom™ C2xxx: FOR.INTEL.cpu2006.1.2.ic13.1.linux64.01june2013, Intel® Mohon Peak Alpha platform with one Intel® Avoton processor (8-core), Turbo Boost Disabled, 16GB memory (2x 8GB DDR3-1600 UDIMM ECC), 250GB SATA 7200RPM HDD, Red Hat Enterprise Linux 6.4. Score: Estimated SPECint_rate_base2006=69, Est. Node Power=19W
Now available on the Amazon Marketplace, the Intel® Expressway API manager helps enterprises deliver new mobile apps to market faster, at lower cost, and with enterprise grade security controls. Previously, an enterprise would need to obtain and h…
Technology and Innovation Making a Better Tomorrow at Research@Intel Event
NEWS HIGHLIGHTS
SAN FRANCISCO, June 25, 2013 – Car tail lights saving lives, immersive displays allowing photos to tell their own story, personalized shopping experiences. These are just a few of the innovations presented by Intel Corporation today at its 11th annual Research@Intel event, a showcase of the most innovative new research spawned from Intel’s internal efforts and external collaborations. Justin Rattner, Intel’s chief technology officer, kicked off today’s event by highlighting some of the 20 groundbreaking research projects on exhibition today.
Supplementing its own robust and diverse research efforts, Intel Labs two years ago deployed a unique model of direct collaboration with the world’s leading academic researchers, creating a global network of seven Intel Science and Technology Centers (ISTCs) and six Intel Collaborative Research Institutes (ICRIs). Each center has built its own vibrant community of researchers to speed advances in embedded, cloud, social and secure computing, among other fields. Today’s event showcases a sample of these research advances – and many from Intel’s own labs – across these and many other sectors, including visual and context-aware computing as well as significant progress in fields such as big data.
“The majority of our research is conducted by Intel’s own researchers but we are delighted by the quality and quantity of research coming out of the ISTCs and ICRIs,” said Rattner. “Importantly, the deeply collaborative structure of these engagements is based on an open IP model benefiting not just Intel and researchers, but the high technology industry and human society at large.”
Research@Intel Demo Showcase
Demos at the Research@Intel event are housed in four different zones. These zones include:
Enriching Lives: Developing computing experiences that simplify, enhance and enrich people’s lives. This research is intended to help people be understood, expressive and free. One demonstration, titled “Be Meaningful,” using “Shelf Edge Technology (SET),” can help detect a person’s presence in a store and create a more meaningful, personalized shopping experience. If a car needs an air filter, for example, SET could use the vehicle’s service records to alert the owner about the need for a specific filter when the owner enters an auto parts store. If a person has peanut allergies, SET could warn of potentially dangerous products. If a person plans to cook salmon for dinner, SET could recommend wines to best compliment the dish.
The Data Society: Unlocking the power of data for everyone. In addition to pushing the boundaries of what institutions can do with big data, Intel Labs has put an emphasis on the exploration of meaningful data exchange among individuals. Researchers are looking at ways to adapt the digital infrastructure to allow people to better capture, move and work with digital information easily and effectively. In a demonstration titled, “Vibrant Data Communities,” Intel Labs researchers combine public and personal data with context-aware algorithms to identify and present the most useful information to individuals. For example, air quality sensors in a neighborhood could help steer a person clear of pollen hotspots in during allergy season.
Intelligent Everything: Innovations that transform inanimate objects by adding sensing capabilities, helping enable sustainable and smart living experiences. In one demonstration, researchers are working on easy-to-use tools to automate contextual cues with already-existing sensors so that a home behaves usefully in response to events and a family’s unique needs. The demonstration shows how to easily link a Web camera and a music system to act as a home security system and to link a Web camera that receives contextual cues from a baby in a crib and an alarm by the parents’ bed to act as a baby monitor.
Tech Essentials: Technology building blocks – including circuits, architecture and software – that provide a foundation for all of the areas above. For example, the “Protecting Sensor Data” demonstration uses Intel hardware and software to prevent malicious parties for accessing personal information recorded by cameras, microphones and GPS locators embedded in mobile devices.
To get the latest Intel Innovation news, visit www.intel.com/newsroom/research, and join the conversation on Facebook and Twitter.
About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.
Intel is a trademark of Intel Corporation in the United States and other countries.
* Other names and brands may be claimed as the property of others.
New Intel® Enterprise Edition for Lustre* Software Designed to Simplify Big Data Management, Storage
NEWS HIGHLIGHTS
SANTA CLARA, Calif., June. 12, 2013 – The amount of available data is growing at exponential rates and there is an ever-increasing need to move, process and store it to help solve the world’s most important and demanding problems. Accelerating the implementation of big data solutions, Intel Corporation announced the Intel® Enterprise Edition for Lustre* software to make performance-based storage solutions easier to deploy and manage.
Businesses and organizations of all sizes are increasingly turning to high-performance computing (HPC) technologies to store and process big data workloads due to its performance and scalability advantages. Lustre is an open source parallel distributed file system and key storage technology that ties together data and enables extremely fast access. Lustre has become the popular choice for storage in HPC environments for its ability to support tens of thousands of client systems and tens of petabytes of storage with access speeds well over 1 terabyte per second. That is the equivalent to downloading all “Star Wars”* and all “Star Trek”* movies and television shows in Blu-Ray* format in one-quarter of a second.
“Enterprise users are looking for cost-effective and scalable tools to efficiently manage and quickly access large volumes of data to turn valuable information into actionable insight,” said Boyd Davis, vice president and general manager of Intel’s Datacenter Software Division. “The addition of the Intel Enterprise Edition for Lustre to our big data software portfolio will help make it easier and more affordable for businesses to move, store and process data quickly and efficiently.”
The Intel Enterprise Edition for Lustre software is a validated and supported distribution of Lustre featuring management tools as well as a new adaptor for the Intel® Distribution for Apache Hadoop*. This new offering provides enterprise-class reliability and performance to take full advantage of storage environments with worldwide service, support, training and development provided experienced Lustre engineers at Intel.
The Intel® Manager for Lustre provides a consistent view of what is happening inside the storage system regardless of where the data is stored or what type of hardware is used. This tool enables IT administrators to easily manage tasks and reporting, provides real-time system monitoring as well as the ability to quickly troubleshoot. IT departments are also able to streamline management, shorten the learning curve and lower operational expenses resulting in time and resource savings, better risk mitigation and improved business decision-making.
When paired with the Intel® Distribution for Apache Hadoop, the Intel Enterprise Edition for Lustre software allows Hadoop to be run on top of Lustre, significantly improving speed in which data can be accessed and analyzed. This allows users to access data files directly from the global file system at faster rates and speeds up analytics time, providing more productive use of storage assets as well as simpler storage management.
As part of the company’s commitment to drive innovation and enable the open source community, Intel will contribute development and support as well as community releases to the development of Lustre. With veteran Lustre engineers and developers working at Intel contributing to the code, Lustre will continue its growth in both high-performance computing and commercial environments and is poised to enter new enterprise markets including financial services, data analytics, pharmaceuticals, and oil and gas.
The Intel Enterprise Edition for Lustre will be available in early in the third quarter of this year.
About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.
Intel is a trademark of Intel Corporation in the United States and other countries.
* Other names and brands may be claimed as the property of others.
Today Intel introduced the new Intel® Xeon® processor E3-1200 v3 product family based on Haswell microarchitecture and the company’s 22nm manufacturing process. When deployed in cloud data center environments, the new Intel Xeon processors wil…
Reference Designs Built to Improve the Flexibility and Economics of Networks
NEWS HIGHLIGHTS
SANTA CLARA, Calif., April 17, 2013 – Three strategic reference architectures that will enable the IT and telecom industries to accelerate hardware and software development for software-defined networking (SDN) and network function virtualization (NFV) were announced today by Intel Corporation at the Open Networking Summit conference.
These reference architectures, aimed for the telecommunications, cloud data center and enterprise data center infrastructure market segments, combine open standards for SDN and NFV with industry-leading Intel hardware and software to enable networks to be more agile and intelligent so they can adapt to changing market dynamics. Integrating SDN and NFV on standard x86 platforms allows lowering the acquisition and management costs as well as enabling new innovative services never before possible in networking infrastructure.
“SDN and NFV are critical elements of Intel’s vision to transform the expensive, complex networks of today to a virtualized, programmable, standards-based architecture running commercial off-the-shelf hardware,” said Rose Schooler, vice president of Intel Architecture Group and general manager of Intel’s Communications and Storage Infrastructure Group. “The reference designs announced today enable a new phase in the evolution of the network and represent Intel’s commitment to driving an open environment that fosters business agility and smart economics.”
Data centers and network infrastructure providers are under constant pressure to support new, revenue-generating services in the public and private cloud, yet the costs of building the infrastructure are often too high to do so. The reference designs and development kits are an important part of Intel’s strategy to enable the industry to move toward open, standards-based technologies such as SDN and NFV. In doing so, telecommunications and cloud service providers will be better able to reduce capital and operating expenses while also delivering new services for revenue growth.
SDN and NFV are complementary networking technologies poised to transform how networks are designed, deployed and managed across data center and telecom infrastructure environments. By separating control and data planes, SDN allows the network to be programmed and managed externally at much larger and more dynamic scale for better traffic control across the entire datacenter. NFV allows service providers to virtualize and manage networking functions such as firewall, VPN or intrusion detection service as virtual applications running on a high-volume x86-based server.
Many ISVs, OEMs and service providers are building innovative solutions on top of Intel’s switch reference architecture, including ATT Foundry*, Big Switch Network*, Chunghwa Telecom*, HP*, NEC*, NTT Data*, Quanta*, Super Micro and VMware*.
“By decoupling the network from underlying hardware and enabling a new network architecture based on industry-standard x86 technology, network virtualization can transform the operational model of networking to help customers dramatically lower operational and capital expenses,” said Allwyn Sequeira, vice president, Networking and Security, VMware. “VMware and Intel have built a strong relationship driving server virtualization on x86 platforms, and we are pleased to be working together to continue this transformation through network virtualization to enable the software-defined data center.”
“We share Intel’s vision of enabling the network transformation with SDN and NFV across the telecom industry,” said Atsuo Kawamura, General Manager Telecom Carrier Business Unit, 1st Carrier Services Division, NEC Corporation. “We are excited to work with Intel to design with the Intel DPDK Accelerated Open vSwitch into our virtual Evolved Packet Core to deliver industry leading packet throughput and performance on Intel architecture.”
The Intel® Open Network Platform Switch Reference Design
Codenamed “Seacliff Trail,” the Intel® Open Network Platform (ONP) Switch Reference Design is based on scalable Intel processors, Intel® Ethernet Switch 6700 series and Intel® Communications Chipset 89xx series, and is available now. The ONP Switch Reference Design will include Wind River Open Network Software (ONS), an open and fully customizable network switching software stack using Wind River Linux. Wind River ONS allows for key networking capabilities such as advanced tunneling as well as modular, open control plane and management interface supporting SDN standards such as OpenFlow and Open vSwitch. Common, open programming interfaces allow for automated network management, and coordination between the server switching elements and network switches enabling more cost-effective, secure, efficient and extensible services.
The Intel® Data Plane Development Kit (Intel® DPDK) Accelerated Open vSwitch
Network architectures have traditionally been optimized for large packet throughput to meet the needs of enterprise end-point applications. Intel is executing a project aimed at improving small packet throughput and workload performance that can be achieved on the Open vSwitch using the Intel DPDK. Intel is specifically re-creating the kernel forwarding module (data plane) to take advantage of the Intel® DPDK library. The Intel® DPDK Accelerated Open vSwitch is planned to initially be released with the Intel® ONP Server Reference Design in the third quarter of this year.
The Intel® Open Network Platform Server Reference Design
This server reference platform, codenamed “Sunrise Trail,” is based on the Intel® Xeon® processor, Intel 82599 Ethernet Controller and Intel Communications Chipset 89xx series. The ONP Server Reference Design enables virtual appliance workloads on standard Intel architecture servers using SDN and NFV open standards for datacenter and telecom. Wind River Open Network Software includes an Intel DPDK Accelerated Open vSwitch, fast packet acceleration and deep packet inspection capabilities, as well as support for open SDN standards such as OpenFlow, Open vSwitch and OpenStack. The project is in development now: the first alpha series is slated to be available in the second half of this year.
About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.
Intel, the Intel logo and Intel Xeon are trademarks of Intel Corporation in the United States and other countries.
* Other names and brands may be claimed as the property of others.
Intel announced today the Intel® Expressway Service Gateway has validated interoperability with RSA® Data Protection Manager as part of the Secured by RSA ® Certified Partner Program. The interoperable solution helps existing RSA customers who are tier 2 retailers or e-tailers address PCI compliance mandates with a zero impact gateway proxy that effectively removes apps from PCI compliance scope. The gateway proxy is designed to manage encryption, network security, and data tokenization with RSA Data Protection Manager that is engineered to provide enhanced management features like granular application permissions, full key and token lifecycle management for end-to-end data security and lower the total cost of ownership. Get more information on Intel’s cloud security and PCI Compliance solutions.
San Jose, Calif., Feb. 25, 2013 – Altera Corporation and Intel Corporation today announced that the companies have entered into an agreement for the future manufacture of Altera FPGAs on Intel’s 14 nm tri-gate transistor technology. These next-generation products, which target ultra high-performance systems for military, wireline communications, cloud networking, and compute and storage applications, will enable breakthrough levels of performance and power efficiencies not otherwise possible.
“Altera’s FPGAs using Intel 14 nm technology will enable customers to design with the most advanced, highest-performing FPGAs in the industry,” said John Daane, president, CEO and chairman of Altera. “In addition, Altera gains a tremendous competitive advantage at the high end in that we are the only major FPGA company with access to this technology.”
Altera’s next-generation products will now include 14nm, in addition to previously announced 20nm technologies, extending the company’s tailored product portfolio that meets myriad customer needs for performance, bandwidth and power efficiency across diverse end applications.
“We look forward to collaborating with Altera on manufacturing leading-edge FPGAs, leveraging Intel’s leadership in process technology,” said Brian Krzanich, chief operating officer, Intel. “Next-generation products from Altera require the highest performance and most power-efficient technology available, and Intel is well positioned to provide the most advanced offerings.”
Adding this world-class manufacturer to Altera’s strong foundation of leading-edge suppliers and partners furthers the company’s ability to deliver on the promise of silicon convergence; to integrate hardware and software programmability, microprocessors, digital signal processing, and ASIC capability into a single device; and deliver a more flexible and economical alternative to traditional ASICs and ASSPs.
About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.
About Altera
Altera (NASDAQ: ALTR) is a leading provider of programmable logic solutions that enable system and semiconductor companies to rapidly and cost effectively innovate, differentiate and win in their markets. Find out more about Altera’s FPGAs, SoCs, CPLDs and ASICs at www.altera.com. Follow Altera via Facebook, RSS and Twitter, and subscribe to product update emails and newsletters.
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