The technology industry by definition drives change – it’s what we do. Our lives evolve with each new invention, product or technology that comes to market. At Intel, we thrive on change and do our part to accelerate it. One device that has seen tremendous change is the personal computer. It is one of the … Continued
The post The PC: The Ultimate Darwinian Device appeared first on Intel Newsroom.
At Computex 2016 in Taipei, Taiwan, Intel will showcase how boundaries of computing are expanding as billions of smart and connected devices use the transformational power of the cloud to deliver new experiences, data-rich services and breakthrough insights to people and businesses around the world. Computex is May 31 to June 4, 2016, in Taipei, … Continued
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By Brian Krzanich Last week I shared how Intel is making broad changes to accelerate our transformation by aligning every segment of our business – our people, our places and our projects – to our strategy. Our strategy itself is about transforming Intel from a PC company to a company that powers the cloud and … Continued
The post Brian Krzanich: Our Strategy and The Future of Intel appeared first on Intel Newsroom.
The 2016 Intel Developers Forum in Shenzhen, China, opened April 13. The gathering of developers who will bring the next generations of amazing experiences to life ran two days. Three Intel executives presented keynote addresses during the conference: Ian Yang, Intel Corporate vice president and president of Intel China Diane Bryant, senior vice president and general … Continued
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Today, business analytics company Sisense announced its unique In-Chip* Analytics is powered by the 6th Generation Intel® Core™ vPro™ processor to make business intelligence and analytics rapidly accessible for business users. This technology combination provides increased processing speed to handle large and disparate data sets to keep pace with the evolving analytics landscape. For more on … Continued
The post Chip Shot: Intel Helps Sisense Make BI and Analytics Accessible via 6th Generation Intel® Core™ vPro™ Processor appeared first on Intel Newsroom.
NEWS HIGHLIGHTS Intel® Xeon® processor E5-2600 v4 product family delivers the foundation for modern, software-defined clouds. New Intel® SSDs, including Intel’s first 3D NAND drives optimized for cloud and enterprise workloads, deliver fast, dependable data access. Collaborations with leading cloud software and solution providers, new industry programs help accelerate businesses’ access to enterprise-ready, easy-to-deploy cloud … Continued
The post Intel Makes Move to the Cloud Faster, Easier appeared first on Intel Newsroom.
NEWS HIGHLIGHTS Only 42 percent of surveyed cybersecurity professionals report using shared cyber threat intelligence. Survey respondents perceive the greatest barriers to cyber threat intelligence sharing are corporate policies (54 percent), industry regulations (24 percent) and a lack of information on how it would be used (24 percent). McAfee Labs threat trend analysis finds new … Continued
The post McAfee Labs Report Finds Only 42 Percent of Surveyed Cybersecurity Professionals Use Shared Threat Intelligence appeared first on Intel Newsroom.
By Wendell Brooks Nearly every business is being revolutionized by data and the ability to capture, connect, analyze and interact with it. One example that Intel is especially excited about is how data is re-inventing the way people consume and interact with sports media. It is one aspect of what Intel CEO Brian Krzanich calls … Continued
The post Blog: Intel Acquires Replay Technologies for Immersive Sports appeared first on Intel Newsroom.
Celebrating the 10th season, Intel Extreme Masters returns to Katowice, Poland, as the world will watch the best professional players compete for over US$600,000. Intel will be present to show the best in technology and announce new initiatives that will enrich and grow gaming and eSports through the next decade. Intel Experience Zone What: Come … Continued
The post Intel to Bring the Best in Gaming to the World Stage at Flagship Intel Extreme Masters appeared first on Intel Newsroom.
CES®, Las Vegas, Jan. 5, 2016 – Intel Corporation today showcased the vast power of technology to deliver new and amazing experiences throughout daily life. From the digitization of sports, to advances in health and wellness, to unleashing human creativity through music, art, robotics and invention, the company announced a number of collaborations, products and … Continued
The post Intel Brings Amazing Experiences to Life at Consumer Electronics Show appeared first on Intel Newsroom.
This image shows the vertical fins of Intel’s revolutionary tri-gate transistors. The Institute of Electrical and Electronics Engineers (IEEE) is awarding Intel its 2016 IEEE Corporate Innovation Award for “pioneering the use of high-k metal gate and tri-gate transistor technologies in high-volume manufacturing.” Intel was the first to design, develop and manufacture products at high-volume … Continued
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Technology is at the forefront of bringing transformation to almost every aspect of life. At CES 2016, Intel Corporation will show amazing experiences made possible by technology in a wide array of consumer passions – from sports and gaming to health and fitness, entertainment and more. Intel at CES 2016 Keynote Full Replay Intel at … Continued
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Intel CEO Brian Krzanich played a charity League of Legends match against Texas technology billionaire Mark Cuban at the Intel Extreme Masters eSports tournament in San Jose, California on Nov. 21, 2015. The match between Krzanich and Cuban raised $38K for The Cybersmile Foundation. Watch the highlight video from the match to see some of … Continued
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Intel® Scalable System Framework and Intel® Omni-Path Fabric Drive Expanded Use of HPC Systems to More Industries, Workloads
AUSTIN, Texas, Nov. 16, 2015 – Intel Corporation today announced several advancements to its Intel® Scalable System Framework (Intel® SSF) that promise to bring high performance computing (HPC) capabilities and benefits to more industries and new workloads. As a foundational element of the Intel SSF, Intel introduced the Intel® Omni-Path Architecture (Intel® OPA), a new HPC-optimized fabric technology that makes the performance of HPC clusters more accessible to a broader variety of users.
Once reserved only for governments and academia to solve the most complex computational problems, like genome sequencing and climate research, HPC is transforming more industries with new workloads such as big data analytics. More and more, traditional sectors, like healthcare and financial services, are demanding supercomputer-like capabilities to gain real-time insights from increasingly large and complex data sets. As Intel innovations expand HPC capabilities and lower the barriers to adoption, it predicts HPC will become mainstream.
“We’re entering a new era in which supercomputing is being transformed from a tool for a specific problem to a general tool for many,” said Charlie Wuischpard, vice president and general manager of HPC Platform Group at Intel. “System-level innovations in processing, memory, software and fabric technologies are enabling system capabilities to be designed and optimized for different usages, from traditional HPC to the emerging world of big data analytics and everything in between. We believe the Intel Scalable System Framework is the path forward for designing and delivering the next generation of systems for the ‘HPC everywhere’ era.”
Intel SSF is an advanced architectural approach designed to enable more scalable, flexible and balanced HPC systems. Intel SSF will help to simplify the procurement, deployment and management of HPC systems, broadening the accessibility of HPC to more industries and workloads such as data-driven analytics, visualization and machine learning.
The Intel SSF architecture helps run these divergent workloads that stress different parts of the system – compute, memory, I/O – by enabling innovations that optimize the performance of a variety of workloads to be managed in a consistent way. Intel SSF also provides a consistent platform for HPC system deployments in cloud environments.
News Highlights
SC15 HPC Matters Plenary
Diane Bryant, senior vice president and general manager of Intel’s Data Center Group, will deliver the opening HPC Matters plenary presentation taking place at SC15 on Monday, Nov. 16, at 5:30 p.m. For more information or to view a replay of the presentation, visit: http://supercomputing_intel.tri-digital.com.
Support Resources
About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.
Intel, the Intel logo and Intel Xeon Phi are trademarks of Intel Corporation in the United States and other countries.
*Other names and brands may be claimed as the property of others.
Cost reduction scenarios described are intended as examples of how a given Intel- based product, in the specified circumstances and configurations, may affect future costs and provide cost savings. Circumstances will vary. Intel does not guarantee any costs or cost reduction.
Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with your system manufacturer or retailer or learn more at www.intel.com.
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit www.intel.com/performance.
Optimization Notice: Intel’s compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.
Notice Revision #20110804
1 Assumes a 750-node cluster, and number of switch chips required is based on a full bisectional bandwidth (FBB) Fat-Tree configuration. Intel® OPA uses one fully populated 768-port director switch, and Mellanox EDR solution uses a combination of 648-port director switches and 36-port edge switches. Mellanox component pricing from www.kernelsoftware.com, with prices as of Nov. 3, 2015. Compute node pricing based on Dell PowerEdge R730 server from www.dell.com, with prices as of May 26, 2015. Intel® OPA pricing based on estimated reseller pricing based on expected Intel MSRP pricing, to be available on ark.intel.com in November 2015.
2 Assumes 750-node cluster, and number of switch chips required is based on a full bisectional bandwidth (FBB) Fat-Tree configuration. Intel® OPA uses one fully populated 768-port director switch, and Mellanox EDR solution uses a combination of director switches and edge switches. Mellanox power data based on Mellanox CS7500 Director Switch, Mellanox SB7700/SB7790 Edge switch, and Mellanox ConnectX-4 VPI adapter card installation documentation posted on www.mellanox.com as of Nov. 1, 2015. Intel OPA power data based on product briefs posted on www.intel.com as of Nov. 16, 2015. Intel® OPA pricing based on estimated reseller pricing based on expected Intel MSRP pricing, to be available on ark.intel.com in November 2015.
Intel® Scalable System Framework and Intel® Omni-Path Fabric Drive Expanded Use of HPC Systems to More Industries, Workloads
AUSTIN, Texas, Nov. 16, 2015 – Intel Corporation today announced several advancements to its Intel® Scalable System Framework (Intel® SSF) that promise to bring high performance computing (HPC) capabilities and benefits to more industries and new workloads. As a foundational element of the Intel SSF, Intel introduced the Intel® Omni-Path Architecture (Intel® OPA), a new HPC-optimized fabric technology that makes the performance of HPC clusters more accessible to a broader variety of users.
Once reserved only for governments and academia to solve the most complex computational problems, like genome sequencing and climate research, HPC is transforming more industries with new workloads such as big data analytics. More and more, traditional sectors, like healthcare and financial services, are demanding supercomputer-like capabilities to gain real-time insights from increasingly large and complex data sets. As Intel innovations expand HPC capabilities and lower the barriers to adoption, it predicts HPC will become mainstream.
“We’re entering a new era in which supercomputing is being transformed from a tool for a specific problem to a general tool for many,” said Charlie Wuischpard, vice president and general manager of HPC Platform Group at Intel. “System-level innovations in processing, memory, software and fabric technologies are enabling system capabilities to be designed and optimized for different usages, from traditional HPC to the emerging world of big data analytics and everything in between. We believe the Intel Scalable System Framework is the path forward for designing and delivering the next generation of systems for the ‘HPC everywhere’ era.”
Intel SSF is an advanced architectural approach designed to enable more scalable, flexible and balanced HPC systems. Intel SSF will help to simplify the procurement, deployment and management of HPC systems, broadening the accessibility of HPC to more industries and workloads such as data-driven analytics, visualization and machine learning.
The Intel SSF architecture helps run these divergent workloads that stress different parts of the system – compute, memory, I/O – by enabling innovations that optimize the performance of a variety of workloads to be managed in a consistent way. Intel SSF also provides a consistent platform for HPC system deployments in cloud environments.
News Highlights
SC15 HPC Matters Plenary
Diane Bryant, senior vice president and general manager of Intel’s Data Center Group, will deliver the opening HPC Matters plenary presentation taking place at SC15 on Monday, Nov. 16, at 5:30 p.m. For more information or to view a replay of the presentation, visit: http://supercomputing_intel.tri-digital.com.
Support Resources
About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.
Intel, the Intel logo and Intel Xeon Phi are trademarks of Intel Corporation in the United States and other countries.
*Other names and brands may be claimed as the property of others.
Cost reduction scenarios described are intended as examples of how a given Intel- based product, in the specified circumstances and configurations, may affect future costs and provide cost savings. Circumstances will vary. Intel does not guarantee any costs or cost reduction.
Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with your system manufacturer or retailer or learn more at www.intel.com.
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit www.intel.com/performance.
Optimization Notice: Intel’s compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.
Notice Revision #20110804
1 Assumes a 750-node cluster, and number of switch chips required is based on a full bisectional bandwidth (FBB) Fat-Tree configuration. Intel® OPA uses one fully populated 768-port director switch, and Mellanox EDR solution uses a combination of 648-port director switches and 36-port edge switches. Mellanox component pricing from www.kernelsoftware.com, with prices as of Nov. 3, 2015. Compute node pricing based on Dell PowerEdge R730 server from www.dell.com, with prices as of May 26, 2015. Intel® OPA pricing based on estimated reseller pricing based on expected Intel MSRP pricing, to be available on ark.intel.com in November 2015.
2 Assumes 750-node cluster, and number of switch chips required is based on a full bisectional bandwidth (FBB) Fat-Tree configuration. Intel® OPA uses one fully populated 768-port director switch, and Mellanox EDR solution uses a combination of director switches and edge switches. Mellanox power data based on Mellanox CS7500 Director Switch, Mellanox SB7700/SB7790 Edge switch, and Mellanox ConnectX-4 VPI adapter card installation documentation posted on www.mellanox.com as of Nov. 1, 2015. Intel OPA power data based on product briefs posted on www.intel.com as of Nov. 16, 2015. Intel® OPA pricing based on estimated reseller pricing based on expected Intel MSRP pricing, to be available on ark.intel.com in November 2015.
Intel® Scalable System Framework and Intel® Omni-Path Fabric Drive Expanded Use of HPC Systems to More Industries, Workloads
AUSTIN, Texas, Nov. 16, 2015 – Intel Corporation today announced several advancements to its Intel® Scalable System Framework (Intel® SSF) that promise to bring high performance computing (HPC) capabilities and benefits to more industries and new workloads. As a foundational element of the Intel SSF, Intel introduced the Intel® Omni-Path Architecture (Intel® OPA), a new HPC-optimized fabric technology that makes the performance of HPC clusters more accessible to a broader variety of users.
Once reserved only for governments and academia to solve the most complex computational problems, like genome sequencing and climate research, HPC is transforming more industries with new workloads such as big data analytics. More and more, traditional sectors, like healthcare and financial services, are demanding supercomputer-like capabilities to gain real-time insights from increasingly large and complex data sets. As Intel innovations expand HPC capabilities and lower the barriers to adoption, it predicts HPC will become mainstream.
“We’re entering a new era in which supercomputing is being transformed from a tool for a specific problem to a general tool for many,” said Charlie Wuischpard, vice president and general manager of HPC Platform Group at Intel. “System-level innovations in processing, memory, software and fabric technologies are enabling system capabilities to be designed and optimized for different usages, from traditional HPC to the emerging world of big data analytics and everything in between. We believe the Intel Scalable System Framework is the path forward for designing and delivering the next generation of systems for the ‘HPC everywhere’ era.”
Intel SSF is an advanced architectural approach designed to enable more scalable, flexible and balanced HPC systems. Intel SSF will help to simplify the procurement, deployment and management of HPC systems, broadening the accessibility of HPC to more industries and workloads such as data-driven analytics, visualization and machine learning.
The Intel SSF architecture helps run these divergent workloads that stress different parts of the system – compute, memory, I/O – by enabling innovations that optimize the performance of a variety of workloads to be managed in a consistent way. Intel SSF also provides a consistent platform for HPC system deployments in cloud environments.
News Highlights
SC15 HPC Matters Plenary
Diane Bryant, senior vice president and general manager of Intel’s Data Center Group, will deliver the opening HPC Matters plenary presentation taking place at SC15 on Monday, Nov. 16, at 5:30 p.m. For more information or to view a replay of the presentation, visit: http://supercomputing_intel.tri-digital.com.
Support Resources
About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.
Intel, the Intel logo and Intel Xeon Phi are trademarks of Intel Corporation in the United States and other countries.
*Other names and brands may be claimed as the property of others.
Cost reduction scenarios described are intended as examples of how a given Intel- based product, in the specified circumstances and configurations, may affect future costs and provide cost savings. Circumstances will vary. Intel does not guarantee any costs or cost reduction.
Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with your system manufacturer or retailer or learn more at www.intel.com.
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit www.intel.com/performance.
Optimization Notice: Intel’s compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.
Notice Revision #20110804
1 Assumes a 750-node cluster, and number of switch chips required is based on a full bisectional bandwidth (FBB) Fat-Tree configuration. Intel® OPA uses one fully populated 768-port director switch, and Mellanox EDR solution uses a combination of 648-port director switches and 36-port edge switches. Mellanox component pricing from www.kernelsoftware.com, with prices as of Nov. 3, 2015. Compute node pricing based on Dell PowerEdge R730 server from www.dell.com, with prices as of May 26, 2015. Intel® OPA pricing based on estimated reseller pricing based on expected Intel MSRP pricing, to be available on ark.intel.com in November 2015.
2 Assumes 750-node cluster, and number of switch chips required is based on a full bisectional bandwidth (FBB) Fat-Tree configuration. Intel® OPA uses one fully populated 768-port director switch, and Mellanox EDR solution uses a combination of director switches and edge switches. Mellanox power data based on Mellanox CS7500 Director Switch, Mellanox SB7700/SB7790 Edge switch, and Mellanox ConnectX-4 VPI adapter card installation documentation posted on www.mellanox.com as of Nov. 1, 2015. Intel OPA power data based on product briefs posted on www.intel.com as of Nov. 16, 2015. Intel® OPA pricing based on estimated reseller pricing based on expected Intel MSRP pricing, to be available on ark.intel.com in November 2015.
Intel® Scalable System Framework and Intel® Omni-Path Fabric Drive Expanded Use of HPC Systems to More Industries, Workloads
AUSTIN, Texas, Nov. 16, 2015 – Intel Corporation today announced several advancements to its Intel® Scalable System Framework (Intel® SSF) that promise to bring high performance computing (HPC) capabilities and benefits to more industries and new workloads. As a foundational element of the Intel SSF, Intel introduced the Intel® Omni-Path Architecture (Intel® OPA), a new HPC-optimized fabric technology that makes the performance of HPC clusters more accessible to a broader variety of users.
Once reserved only for governments and academia to solve the most complex computational problems, like genome sequencing and climate research, HPC is transforming more industries with new workloads such as big data analytics. More and more, traditional sectors, like healthcare and financial services, are demanding supercomputer-like capabilities to gain real-time insights from increasingly large and complex data sets. As Intel innovations expand HPC capabilities and lower the barriers to adoption, it predicts HPC will become mainstream.
“We’re entering a new era in which supercomputing is being transformed from a tool for a specific problem to a general tool for many,” said Charlie Wuischpard, vice president and general manager of HPC Platform Group at Intel. “System-level innovations in processing, memory, software and fabric technologies are enabling system capabilities to be designed and optimized for different usages, from traditional HPC to the emerging world of big data analytics and everything in between. We believe the Intel Scalable System Framework is the path forward for designing and delivering the next generation of systems for the ‘HPC everywhere’ era.”
Intel SSF is an advanced architectural approach designed to enable more scalable, flexible and balanced HPC systems. Intel SSF will help to simplify the procurement, deployment and management of HPC systems, broadening the accessibility of HPC to more industries and workloads such as data-driven analytics, visualization and machine learning.
The Intel SSF architecture helps run these divergent workloads that stress different parts of the system – compute, memory, I/O – by enabling innovations that optimize the performance of a variety of workloads to be managed in a consistent way. Intel SSF also provides a consistent platform for HPC system deployments in cloud environments.
News Highlights
SC15 HPC Matters Plenary
Diane Bryant, senior vice president and general manager of Intel’s Data Center Group, will deliver the opening HPC Matters plenary presentation taking place at SC15 on Monday, Nov. 16, at 5:30 p.m. For more information or to view a replay of the presentation, visit: http://supercomputing_intel.tri-digital.com.
Support Resources
About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.
Intel, the Intel logo and Intel Xeon Phi are trademarks of Intel Corporation in the United States and other countries.
*Other names and brands may be claimed as the property of others.
Cost reduction scenarios described are intended as examples of how a given Intel- based product, in the specified circumstances and configurations, may affect future costs and provide cost savings. Circumstances will vary. Intel does not guarantee any costs or cost reduction.
Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with your system manufacturer or retailer or learn more at www.intel.com.
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit www.intel.com/performance.
Optimization Notice: Intel’s compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.
Notice Revision #20110804
1 Assumes a 750-node cluster, and number of switch chips required is based on a full bisectional bandwidth (FBB) Fat-Tree configuration. Intel® OPA uses one fully populated 768-port director switch, and Mellanox EDR solution uses a combination of 648-port director switches and 36-port edge switches. Mellanox component pricing from www.kernelsoftware.com, with prices as of Nov. 3, 2015. Compute node pricing based on Dell PowerEdge R730 server from www.dell.com, with prices as of May 26, 2015. Intel® OPA pricing based on estimated reseller pricing based on expected Intel MSRP pricing, to be available on ark.intel.com in November 2015.
2 Assumes 750-node cluster, and number of switch chips required is based on a full bisectional bandwidth (FBB) Fat-Tree configuration. Intel® OPA uses one fully populated 768-port director switch, and Mellanox EDR solution uses a combination of director switches and edge switches. Mellanox power data based on Mellanox CS7500 Director Switch, Mellanox SB7700/SB7790 Edge switch, and Mellanox ConnectX-4 VPI adapter card installation documentation posted on www.mellanox.com as of Nov. 1, 2015. Intel OPA power data based on product briefs posted on www.intel.com as of Nov. 16, 2015. Intel® OPA pricing based on estimated reseller pricing based on expected Intel MSRP pricing, to be available on ark.intel.com in November 2015.
Intel® Scalable System Framework and Intel® Omni-Path Fabric Drive Expanded Use of HPC Systems to More Industries, Workloads AUSTIN, Texas, Nov. 16, 2015 – Intel Corporation today announced several advancements to its Intel® Scalable System Framework (Intel® SSF) that promise to bring high performance computing (HPC) capabilities and benefits to more industries and new workloads. … Continued
The post Intel Architects High Performance Computing System Designs to Bring Power of Supercomputing Mainstream appeared first on Intel Newsroom.
At the upcoming opening of the Alan Turing Institute (ATI), Intel and ATI will announce a long term strategic partnership and investments to further the role of high-performance computing and data sciences in the UK. Through the development of researc…
At the upcoming opening of the Alan Turing Institute (ATI), Intel and ATI will announce a long term strategic partnership and investments to further the role of high-performance computing and data sciences in the UK. Through the development of researc…