Foveros

Intel Hybrid Processors: Uncompromised PC Experiences for Innovative Form Factors Like Foldables, Dual Screens

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What’s New: Today, Intel launched Intel® Core™ processors with Intel® Hybrid Technology, code-named “Lakefield.” Leveraging Intel’s Foveros 3D packaging technology and featuring a hybrid CPU architecture for power and performance scalability, Lakefield processors are the smallest to deliver Intel Core performance and full Windows compatibility across productivity and content creation experiences for ultra-light and innovative … Continued

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Up Close with Lakefield – Intel’s Chip with Award-Winning Foveros 3D Tech

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The fingernail-size Intel chip with Foveros technology is a first-of-its kind. With Foveros, processors are built in a totally new way: not with the various IPs spread out flat in two dimensions, but with them stacked in three dimensions. Think of a chip designed as a layer cake (a 1-millimeter-thick layer cake) versus a chip with … Continued

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Microsoft Unveils First Lakefield Device and New Surface Lineup with 10th Gen Intel Core

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What’s New: Today, at a launch event in New York City, Microsoft previewed the Surface Neo, a category-defining device co-engineered with Intel. The dual-screen device will be powered by Intel’s unique processor, code-named “Lakefield,” that features an industry-first architecture combining a hybrid CPU with Intel’s Foveros 3D packaging technology. It offers device-makers more flexibility to … Continued

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At Hot Chips, Intel Pushes ‘AI Everywhere’

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What’s New: At Hot Chips 2019, Intel revealed new details of upcoming high-performance artificial intelligence (AI) accelerators: Intel® Nervana™ neural network processors, with the NNP-T for training and the NNP-I for inference. Intel engineers also presented technical details on hybrid chip packaging technology, Intel® Optane™ DC persistent memory and chiplet technology for optical I/O. “To get … Continued

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Intel Unveils New Tools in Its Advanced Chip Packaging Toolbox

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What’s New: This week at SEMICON West in San Francisco, Intel engineering leaders provided an update on Intel’s advanced packaging capabilities and unveiled new building blocks, including innovative uses of EMIB and Foveros together and a new Omni-Directional Interconnect (ODI) technology. When combined with Intel’s world-class process technologies, new packaging capabilities will unlock customer innovations and deliver the … Continued

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2019 Investor Meeting: Intel Previews Design Innovation; 10nm CPU Ships in June; 7nm Product in 2021

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Today, Wall Street analysts are gathered at Intel headquarters in Santa Clara for the company’s 2019 Investor Meeting, which features executive keynotes by Intel CEO Bob Swan and business unit leaders. At the meeting, Dr. Murthy Renduchintala, Intel’s chief engineering officer and group president of the Technology, Systems Architecture and Client Group, announced that Intel … Continued

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2019 CES: Intel Advances PC Experience with New Platforms, Technologies and Industry Collaboration

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Today at CES 2019 in Las Vegas, Intel unveiled the next wave of PC innovation that will advance the PC experience to help power every person’s greatest contribution, including: Details on our highly integrated platform that will feature our upcoming first volume 10nm PC processor, code-named “Ice Lake” Preview of a hybrid 10nm CPU architecture with Foveros 3D packaging, … Continued

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Video: Intel Previews New Hybrid CPU Architecture with Foveros 3D Packaging

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At CES 2019, Intel previewed a new client platform, code named “Lakefield,” featuring the first iteration of its new innovative Foveros 3D packaging technology. This hybrid CPU architecture enables combining different pieces of IP that might have previously been discrete into a single product with a smaller motherboard footprint, which allows OEMs more flexibility for … Continued

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Images: New Intel Architectures and Technologies Target Expanded Market Opportunities

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» Download all images Photo 1: People attending Intel Architecture Day on Tuesday, Dec. 11, 2018, experience demos showing Intel’s latest technology and architecture innovations. (Credit: Intel Corporation) Photo 2: People attending Intel Architecture Day on Tuesday, Dec. 11, 2018, experience demos showing Intel’s latest technology and architecture innovations. (Credit: Intel Corporation) Photo 3: At … Continued

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New Intel Architectures and Technologies Target Expanded Market Opportunities

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» Download all images At Intel’s recent Architecture Day, Raja Koduri, Intel’s senior vice president of Core and Visual Computing, outlined a strategic shift for the company’s design and engineering model. This shift combines a series of foundational building blocks that leverage a world-class portfolio of technologies and intellectual property (IP) within the company. Architecture … Continued

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Fact Sheet: New Intel Architectures and Technologies Target Expanded Market Opportunities

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» Download all images SANTA CLARA, Calif., Dec. 12, 2018 – At Intel “Architecture Day,” top executives, architects and fellows revealed next-generation technologies and discussed progress on a strategy to power an expanding universe of data-intensive workloads for PCs and other smart consumer devices, high-speed networks, ubiquitous artificial intelligence (AI), specialized cloud data centers and … Continued

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